Powerex is proud to introduce the 6.1 NX series of IGBTs. The 6.1 NX-series uses 6.1 generation CSTBT™ silicon, the latest in very low loss silicon IGBT technology. In addition to this silicon technology, the 6.1 NX-series modules utilize an aluminum nitride ceramic substrate which provides a very low thermal resistance interface between the silicon IGBT chips and the customer heat sink. The combination of low loss silicon and a low thermal impedance interface facilitates a very cost effective, efficient solution; less heat generated that is easy to get rid of results in smaller, lower cost heat sinks and cooling system requirements. The 6.1 generation CSTBT™ silicon has a maximum operating junction temperature of 175°C for increased operating margin. In addition, higher current density than previous generations allows for higher current operation in the same package. With the 6.1 generation NX comes the introduction of a 600A module in the NX-M package. Finally, the 6.1 NX Series IGBTs features 4000 Vrms isolation which allows them to be used in a wider range of applications than previous generations.