Microcontrollers, Microprocessor, FPGA Modules

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Module/Board Type	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
OSD3358-512M-BSM IC MODULE CORTEX-A8 1GHZ 512MB Octavo Systems LLC	0 In Stock Check Lead Time	1 : $60.05000 Tray	OSD335x	Tray	Active	MPU Core	ARM® Cortex®-A8, AM3358	NEON™ SIMD	1GHz	-	512MB	256-BGA	0.830" L x 0.830" W (21.00mm x 21.00mm)	0°C ~ 85°C
OSD3358-512M-ISM IC MODULE CORTEX-A8 1GHZ 512MB Octavo Systems LLC	0 In Stock Check Lead Time	1 : $63.07000 Tray	OSD335x	Tray	Active	MPU Core	ARM® Cortex®-A8, AM3358	NEON™ SIMD	1GHz	-	512MB	256-BGA	0.830" L x 0.830" W (21.00mm x 21.00mm)	-40°C ~ 85°C
OSD32MP157C-512M-BAA SIP ARM CORTEX STM32MP157C Octavo Systems LLC	549 In Stock	1 : $69.78000 Tray	OSD32MP15x	Tray	Active	MPU Core	Arm® Dual Cortex®-A7, Arm® Cortex®-M4	NEON™ SIMD	650MHz, 209MHz	-	512MB	302-BGA	0.709" L x 0.709" W (18.00mm x 18.00mm)	0°C ~ 85°C
OSD32MP157C-512M-IAA SIP ARM CORTEX STM32MP157C Octavo Systems LLC	168 In Stock	1 : $71.71000 Tray	OSD32MP15x	Tray	Active	MPU Core	Arm® Dual Cortex®-A7, Arm® Cortex®-M4	NEON™ SIMD	650MHz, 209MHz	-	512MB	302-BGA	0.709" L x 0.709" W (18.00mm x 18.00mm)	-40°C ~ 85°C
BS2-IC IC MOD PIC16C57C 20MHZ 32B 2KB Parallax Inc.	222 In Stock	1 : $75.46000 Bulk	BASIC Stamp®	Bulk	Active	MCU Core	PIC16C57C	-	20MHz	2KB EEPROM	32B	-	1.200" L x 0.600" W (30.00mm x 15.00mm)	0°C ~ 70°C
OSD3358-1G-ISM IC MODULE CORTEX-A8 1GHZ 1GB Octavo Systems LLC	0 In Stock Check Lead Time	1 : $80.85000 Tray	OSD335x	Tray	Active	MPU Core	ARM® Cortex®-A8, AM3358	-	1GHz	-	1GB	256-BGA	0.830" L x 0.830" W (21.00mm x 21.00mm)	-40°C ~ 85°C
XP1001000-05R IC MOD DSTNI-EX 25MHZ 256KB Lantronix, Inc.	8,556 In Stock	1 : $87.58000 Tray	XPort®	Tray	Active	MPU Core	DSTni-EX	XPort AR	25MHz	512KB	256KB	RJ45	1.330" L x 0.640" W (33.90mm x 16.25mm)	-40°C ~ 85°C
OSD3358-512M-ICB IC MOD CORTEX-A8 1GHZ 512MB 4GB Octavo Systems LLC	183 In Stock	1 : $88.08000 Tray	OSD335x	Tray	Active	MPU Core	ARM® Cortex®-A8, AM3358	NEON™ SIMD	1GHz	4GB	512MB	400-BGA	1.060" L x 1.060" W (27.00mm x 27.00mm)	-40°C ~ 85°C
XP1001000M-05R IC MOD DSTNI-EX 25MHZ 256KB Lantronix, Inc.	3,367 In Stock	1 : $89.77000 Tray	XPort®	Tray	Active	MPU Core	DSTni-EX	XPort AR	25MHz	512KB	256KB	RJ45	0.570" L x 0.720" W (14.50mm x 18.30mm)	-40°C ~ 85°C
XP1002000-05R IC MOD DSTNI-EX 25MHZ 256KB Lantronix, Inc.	1,969 In Stock	1 : $85.05000 Tray	XPort®	Tray	Active	MPU Core	DSTni-EX	XPort AR	25MHz	512KB	256KB	RJ45	0.570" L x 0.720" W (14.50mm x 18.30mm)	-40°C ~ 85°C
XPP1003000-04R IC MODULE IPV6 16MB Lantronix, Inc.	1,052 In Stock	1 : $104.88000 Tray	XPort® Pro	Tray	Not For New Designs	MPU Core	IPv6	XPort® Pro	-	16MB	16MB	RJ45	0.630" L x 1.330" W (16.00mm x 33.90mm)	-40°C ~ 85°C
XPP1002000-02R IC MODULE IPV6 16MB Lantronix, Inc.	407 In Stock	1 : $104.88000 Tray	XPort® Pro	Tray	Not For New Designs	MPU Core	IPv6	XPort® Pro	-	16MB	16MB	RJ45	0.630" L x 1.330" W (16.00mm x 33.90mm)	-40°C ~ 85°C
MOD54415-100IR IC MOD COLDFIRE 250MHZ 64MB NetBurner Inc.	368 In Stock	1 : $180.14000 Bulk	ColdFire®	Bulk	Active	MCU, Ethernet Core	ColdFire 54415	-	250MHz	32MB	64MB	RJ-45, 2x50 Header	2.950" L x 2.000" W (74.90mm x 50.80mm)	-40°C ~ 85°C
TE0725-04-72I-1-B IC MOD ARTIX-7 A100T 100MHZ 32MB Trenz Electronic GmbH	39 In Stock	1 : $294.71000 Bulk	-	Bulk	Active	-	-	-	-	-	-	-	-	-
SM-K24-XCL2GC SOM K24 KRIA ZYNQ MPSOC AMD	49 In Stock	1 : $451.46000 Bulk	Zynq® UltraScale+™ Kria™	Bulk	Active	FPGA Core	ARM® Cortex®-A53	Arm® Cortex®-R5F	533MHz, 1.333GHz	32GB eMMC	2GB	2 x 240 Pin	3.030" L x 2.360" W (77.00mm x 60.00mm)	0°C ~ 85°C (TJ)
SM-K26-XCL2GC SOM ARM A53 ZYNQ MPSOC KRIA K26 AMD	1,565 In Stock	1 : $605.68000 Box	Zynq® UltraScale+™ Kria™	Box	Active	FPGA Core	ARM® Cortex®-A53	Arm® Cortex®-R5F	533MHz, 1.333GHz	16GB eMMC, 64MB QSPI	4GB	2 x 240 Pin	3.030" L x 2.360" W (77.00mm x 60.00mm)	0°C ~ 85°C (TJ)
SM-K24-XCL2GI SOM K24 KRIA ZYNQ MPSOC AMD	81 In Stock	1 : $632.04000 Bulk	Zynq® UltraScale+™ Kria™	Bulk	Active	FPGA Core	ARM® Cortex®-A53	Arm® Cortex®-R5F	533MHz, 1.333GHz	32GB eMMC	2GB	2 x 240 Pin	3.030" L x 2.360" W (77.00mm x 60.00mm)	-40°C ~ 100°C (TJ)
TE0715-05-71I33-A IC SOC MODULE Trenz Electronic GmbH	48 In Stock	1 : $814.80000 Bulk	-	Bulk	Active	MCU, FPGA	ARM Cortex-A9	Zynq-7000 (Z-7030)	125MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
SM-K26-XCL2GI SOM ARM A53 ZYNQ MPSOC KRIA K26 AMD	2,013 In Stock	1 : $838.63000 Box	Zynq® UltraScale+™ Kria™	Box	Active	FPGA Core	ARM® Cortex®-A53	Arm® Cortex®-R5F	533MHz, 1.333GHz	16GB eMMC, 64MB QSPI	4GB	2 x 240 Pin	3.030" L x 2.360" W (77.00mm x 60.00mm)	-40°C ~ 100°C (TJ)
OSD3358-512M-BCB IC MOD CORTEX-A8 1GHZ 512MB 4GB Octavo Systems LLC	142 In Stock	1 : $85.18000 Tray	OSD335x	Tray	Active	MPU Core	ARM® Cortex®-A8, AM3358	NEON™ SIMD	1GHz	4GB	512MB	400-BGA	1.060" L x 1.060" W (27.00mm x 27.00mm)	0°C ~ 85°C
XP1001000-05R J XPORT XE, EXTENDED TEMPERATURE, Lantronix, Inc.	133 In Stock	1 : $87.58000 Bulk	XPort®	Bulk	Active	-	DSTni-EX	XPort AR	25MHz	512KB	256KB	RJ-45	1.330" L x 0.640" W (33.90mm x 16.25mm)	-40°C ~ 85°C
XPP1004000-02R IC MODULE IPV6 16MB Lantronix, Inc.	292 In Stock	1 : $93.22000 Tray	XPort® Pro	Tray	Not For New Designs	MPU Core	IPv6	XPort® Pro Lx6	-	16MB	16MB	RJ45	0.630" L x 1.330" W (16.00mm x 33.90mm)	-40°C ~ 85°C
XPDNC2000-01 IC MOD DSTNI-EX 25MHZ 256KB Lantronix, Inc.	390 In Stock	1 : $90.73000 Box	XPort® Direct+™	Box	Not For New Designs	MPU Core	DSTni-EX	XPort Direct+	25MHz	512KB	256KB	RJ45	1.250" L x 1.700" W (31.80mm x 43.30mm)	-40°C ~ 85°C
SCM-20260N-C SITCORE SCM20260N SOM GHI Electronics, LLC	224 In Stock	1 : $100.23000 Tray	-	Tray	Active	MPU Core	SITCore	-	480MHz	16MB	32MB	-	-	-40°C ~ 85°C
XPP100200S-02R IC MODULE IPV6 16MB Lantronix, Inc.	44 In Stock	1 : $112.36000 Box	XPort® Pro	Box	Not For New Designs	MPU Core	IPv6	XPort® Pro	-	16MB	16MB	RJ45	0.630" L x 1.330" W (16.00mm x 33.90mm)	-40°C ~ 85°C

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Products in the modular embedded processor family integrate a microcontroller, microprocessor, digital signal processor, FPGA, or other such computational device together with support components such as memory, power management, timing, and other items necessary for their operation. They are suitable and intended for integration into an end product, and offer product developers access to modern computational and interface capabilities without necessity of high speed hardware design experience.