200-TFBGA
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200-TFBGA
200-TFBGA
Winbond AI Solutions

W66AP6NBQAFJ

DigiKey Part Number
256-W66AP6NBQAFJ-ND
Manufacturer
Winbond Electronics
Manufacturer Product Number
W66AP6NBQAFJ
Description
IC DRAM 1GBIT LVSTL 200TFBGA
Manufacturer Standard Lead Time
24 Weeks
Customer Reference
Detailed Description
SDRAM - Mobile LPDDR4 Memory IC 1Gbit LVSTL_11 1.6 GHz 3.6 ns 200-TFBGA (10x14.5)
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Mfr
Winbond Electronics
Series
-
Packaging
Tray
Part Status
Active
Memory Type
Volatile
Memory Format
DRAM
Technology
SDRAM - Mobile LPDDR4
Memory Size
1Gbit
Memory Organization
64M x 16
Memory Interface
LVSTL_11
Clock Frequency
1.6 GHz
Write Cycle Time - Word, Page
18ns
Access Time
3.6 ns
Voltage - Supply
1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature
-40°C ~ 105°C (TC)
Mounting Type
Surface Mount
Package / Case
200-TFBGA
Supplier Device Package
200-TFBGA (10x14.5)
Base Product Number
W66AP6
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In-Stock: 127
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Quantity
All prices are in CAD
Tray
QuantityUnit PriceExt Price
1$9.33000$9.33
10$8.68800$86.88
25$8.42680$210.67
50$8.22920$411.46
144$7.92813$1,141.65
288$7.73278$2,227.04
576$7.53970$4,342.87
1,008$7.38587$7,444.96
Manufacturers Standard Package
Note: Due to DigiKey value-add services the packaging type may change when product is purchased at quantities beneath the standard package.