Winbond Electronics Corporation
HyperRAM™ - Best DRAM choice for IoT application
For IoT applications, various design considerations such as low cost, low power consumption, and computing efficiency must be met in order to gain widespread adoption in the market. From the perspective of overall system design and product life, HyperRAM™ has become an ideal choice for emerging IoT devices.
QspiNAND with Ultra-fast Write Speed: A New Option for Over-the-Air Updating of Automotive Code
The automotive market is already fully committed to supporting OTA updating in new models. Winbond QspiNAND and OctalNAND Flash offer cost, speed and production efficiency benefits for automotive manufacturers to consider the new options of automotive coding needed applications.
Winbond HyperRAM™ & SpiStack® and Renesas RZ/A2M Accelerate the Construction of Embedded Artificial Intelligence (AI) Systems
Winbond HyperRAM™ and SpiStack® (NOR+NAND) can be operated with Renesas’ RZ/A2M Arm®-based microprocessors (MPUs). Customers of the RZ/A2M can benefit from Winbond’s long-term supply for various types of external memory, including DRAM, NOR Flash, and NAND Flash which are currently the mainstream of embedded systems.
About Winbond Electronics Corporation
Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.
Winbond is headquartered in Central Taiwan Science Park (CTSP) and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and new Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.