Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

70-3213-0810

DigiKey Part Number
70-3213-0810-ND
Manufacturer
Manufacturer Product Number
70-3213-0810
Description
SOLDER PASTE NXG1 NO CLEAN 500GM
Manufacturer Standard Lead Time
2 Weeks
Customer Reference
Detailed Description
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)
Datasheet
 Datasheet
Product Attributes
Filter Similar Products
Show Empty Attributes
Category
Mesh Type
3
Manufacturer
Kester Solder
Process
Lead Free
Series
Form
Jar, 17.64 oz (500g)
Packaging
Bulk
Shelf Life
8 Months
Part Status
Active
Shelf Life Start
Date of Manufacture
Type
Solder Paste
Storage/Refrigeration Temperature
32°F ~ 50°F (0°C ~ 10°C)
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Digi-Key Storage
Refrigerated
Melting Point
423 ~ 424°F (217 ~ 218°C)
Shipping Info
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Flux Type
No-Clean
Base Product Number
Environmental & Export Classifications
Product Questions and Answers
Additional Resources
In-Stock: 48
Check for Additional Incoming Stock
All prices are in CAD
Bulk
QuantityUnit PriceExt Price
1$365.94000$365.94
5$315.17400$1,575.87
10$295.46100$2,954.61
30$266.58900$7,997.67
50$254.08520$12,704.26
Manufacturers Standard Package