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Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
TS391SNL50 | ||
|---|---|---|
Digi-Key Part Number | TS391SNL50-ND | |
Manufacturer | ||
Manufacturer Product Number | TS391SNL50 | |
Description | THERMALLY STABLE SOLDER PASTE NO | |
Manufacturer Standard Lead Time | 3 Weeks | |
Detailed Description | Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 1.76 oz (50g) | |
| Customer Reference | ||
| Datasheet | Datasheet | |
Product Attributes
Type | Description | Select |
|---|---|---|
Category | ||
Mfr | Chip Quik Inc. | |
Series | - | |
Package | Bulk | |
Product Status | Active | |
Type | Solder Paste | |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | |
Diameter | - | |
Melting Point | 423 ~ 428°F (217 ~ 220°C) | |
Flux Type | No-Clean | |
Wire Gauge | - | |
Mesh Type | 4 | |
Process | Lead Free | |
Form | Jar, 1.76 oz (50g) | |
Shelf Life | 12 Months | |
Shelf Life Start | Date of Manufacture | |
Storage/Refrigeration Temperature | 68°F ~ 77°F (20°C ~ 25°C) | |
Shipping Info | - | |
Base Product Number |
Documents & Media
| Resource Type | Link |
|---|---|
| Datasheets | TS391SNL50 |
| MSDS Material Safety Datasheet | TS391SNL50 SDS |
| Featured Product | Thermally Stable Solder Paste |
| HTML Datasheet | TS391SNL50 |
Environmental & Export Classifications
| Attribute | Description |
|---|---|
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| REACH Status | REACH Unaffected |
| ECCN | EAR99 |
| HTSUS | 3810.10.0000 |
All prices are in CAD
Bulk
| Qty | Unit Price | Ext Price |
|---|---|---|
| 1 | $25.86000 | $25.86 |
Additional Resources
| Attribute | Description |
|---|---|
| Standard Package | 1 |
Canada