



374324B00035G | |
|---|---|
DigiKey Part Number | HS318-ND |
Manufacturer | |
Manufacturer Product Number | 374324B00035G |
Description | HEATSINK BGA W/ADHESIVE TAPE |
Manufacturer Standard Lead Time | 14 Weeks |
Customer Reference | |
Detailed Description | Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level |
Datasheet | Datasheet |
Category | Length 1.063" (27.00mm) |
Mfr | Width 1.063" (27.00mm) |
Series | Fin Height 0.394" (10.00mm) |
Packaging Box | Power Dissipation @ Temperature Rise 3.0W @ 90°C |
Part Status Active | Thermal Resistance @ Forced Air Flow 9.30°C/W @ 200 LFM |
Type Board Level | Thermal Resistance @ Natural 30.60°C/W |
Package Cooled | Material |
Attachment Method Thermal Tape, Adhesive (Included) | Material Finish Black Anodized |
Shape Square, Pin Fins | Base Product Number |
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1 | $4.08000 | $4.08 |
| 10 | $3.60800 | $36.08 |
| 25 | $3.43680 | $85.92 |
| 50 | $3.31300 | $165.65 |
| 100 | $3.19330 | $319.33 |
| 250 | $3.04152 | $760.38 |
| 756 | $2.86769 | $2,167.97 |
| 1,512 | $2.76372 | $4,178.74 |
| 5,292 | $2.58502 | $13,679.93 |











