Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level
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Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level
374324B00035G
374324B00035G

374324B00035G

DigiKey Part Number
HS318-ND
Manufacturer
Manufacturer Product Number
374324B00035G
Description
HEATSINK BGA W/ADHESIVE TAPE
Manufacturer Standard Lead Time
14 Weeks
Customer Reference
Detailed Description
Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level
Datasheet
 Datasheet
Product Attributes
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Category
Length
1.063" (27.00mm)
Mfr
Width
1.063" (27.00mm)
Series
Fin Height
0.394" (10.00mm)
Packaging
Box
Power Dissipation @ Temperature Rise
3.0W @ 90°C
Part Status
Active
Thermal Resistance @ Forced Air Flow
9.30°C/W @ 200 LFM
Type
Board Level
Thermal Resistance @ Natural
30.60°C/W
Package Cooled
Material
Attachment Method
Thermal Tape, Adhesive (Included)
Material Finish
Black Anodized
Shape
Square, Pin Fins
Base Product Number
Environmental & Export Classifications
Product Questions and Answers
Additional Resources
In-Stock: 2,482
Check for Additional Incoming Stock
Non-Cancelable/Non-Returnable
All prices are in CAD
Box
QuantityUnit PriceExt Price
1$4.08000$4.08
10$3.60800$36.08
25$3.43680$85.92
50$3.31300$165.65
100$3.19330$319.33
250$3.04152$760.38
756$2.86769$2,167.97
1,512$2.76372$4,178.74
5,292$2.58502$13,679.93
Manufacturers Standard Package