Boyd Laconia, LLC Heat Sinks

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish
507302B00000G HEATSINK TO-220 2.5W LOW PROFILE Boyd Laconia, LLC	45,724 In Stock	1 : $0.52000 Bulk	-	Bulk	Active	Board Level	TO-220	Bolt On	Square, Fins	0.750" (19.05mm)	0.750" (19.05mm)	-	0.380" (9.65mm)	2.5W @ 60°C	10.00°C/W @ 200 LFM	24.00°C/W	Aluminum	Black Anodized
577002B00000G HEAT SINK TO-220 .250" COMPACT Boyd Laconia, LLC	13,035 In Stock	1 : $1.20000 Bag	-	Bag	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	0.750" (19.05mm)	0.520" (13.21mm)	-	0.250" (6.35mm)	1.5W @ 50°C	10.00°C/W @ 500 LFM	32.00°C/W	Aluminum	Black Anodized
576802B03900G HEATSINK TO220 CLIPON W/TAB.75" Boyd Laconia, LLC	9,972 In Stock	1 : $1.40000 Bulk	-	Bulk	Active	Board Level, Vertical	TO-220, TO-262	Clip and PC Pin	Rectangular, Fins	0.750" (19.05mm)	0.500" (12.70mm)	-	0.500" (12.70mm)	1.0W @ 30°C	7.00°C/W @ 400 LFM	27.30°C/W	Aluminum	Black Anodized
576802B04000G HEAT SINK VERT PLUG-IN TO-220 Boyd Laconia, LLC	20,936 In Stock	1 : $1.45000 Bulk	-	Bulk	Active	Board Level, Vertical	TO-220, TO-262	Clip and PC Pin	Rectangular, Fins	0.750" (19.05mm)	0.500" (12.70mm)	-	0.500" (12.70mm)	1.0W @ 30°C	7.00°C/W @ 400 LFM	27.30°C/W	Aluminum	Black Anodized
577202B00000G HEAT SINK TO-220 .500" COMPACT Boyd Laconia, LLC	8,664 In Stock	1 : $1.62000 Bag	-	Bag	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	0.750" (19.05mm)	0.520" (13.21mm)	-	0.500" (12.70mm)	1.5W @ 40°C	10.00°C/W @ 200 LFM	24.40°C/W	Aluminum	Black Anodized
577102B00000G HEAT SINK TO-220 .375" COMPACT Boyd Laconia, LLC	13,700 In Stock	1 : $1.75000 Bag	-	Bag	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	0.750" (19.05mm)	0.520" (13.21mm)	-	0.375" (9.52mm)	3.0W @ 80°C	12.00°C/W @ 200 LFM	25.90°C/W	Aluminum	Black Anodized
375424B00034G HEATSINK PIN-FIN W/TAPE Boyd Laconia, LLC	4,219 In Stock	1 : $2.06000 Bulk	-	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	0.598" (15.19mm)	0.598" (15.19mm)	-	0.252" (6.40mm)	-	17.60°C/W @ 200 LFM	62.50°C/W	Aluminum	Black Anodized
531102B02500G HEATSINK TO-220 W/PINS 1.5"TALL Boyd Laconia, LLC	21,551 In Stock	1 : $2.68000 Bulk	-	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.500" (38.10mm)	1.375" (34.93mm)	-	0.500" (12.70mm)	7.0W @ 70°C	3.00°C/W @ 500 LFM	10.40°C/W	Aluminum	Black Anodized
513102B02500G HEATSINK TO-220 W/PINS 1.5"TALL Boyd Laconia, LLC	18,921 In Stock	1 : $2.86000 Bulk	-	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.500" (38.10mm)	1.375" (34.93mm)	-	0.500" (12.70mm)	8.0W @ 80°C	3.00°C/W @ 500 LFM	11.00°C/W	Aluminum	Black Anodized
507002B00000G HEATSINK TO-220 BLK Boyd Laconia, LLC	2,644 In Stock	1 : $2.97000 Bag	Hat Section 5070	Bag	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	0.700" (17.78mm)	1.750" (44.45mm)	-	0.375" (9.52mm)	2.0W @ 40°C	5.00°C/W @ 500 LFM	15.60°C/W	Aluminum	Black Anodized
581002B02500G HEATSINK TO-220 PWR BLK W/PINS Boyd Laconia, LLC	11,223 In Stock	1 : $3.16000 Bulk	-	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.000" (25.40mm)	0.640" (16.26mm)	-	0.640" (16.26mm)	2.5W @ 50°C	4.00°C/W @ 500 LFM	17.40°C/W	Aluminum	Black Anodized
374124B00035G HEATSINK BGA W/ADHESIVE TAPE Boyd Laconia, LLC	6,074 In Stock	1 : $3.17000 Bulk	-	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	0.906" (23.01mm)	0.906" (23.01mm)	-	0.709" (18.00mm)	2.0W @ 50°C	7.40°C/W @ 200 LFM	23.40°C/W	Aluminum	Black Anodized
374024B00035G HEATSINK BGA 23X23X10MM W/ADH Boyd Laconia, LLC	3,069 In Stock	1 : $3.19000 Bulk	-	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	0.906" (23.01mm)	0.906" (23.01mm)	-	0.394" (10.00mm)	1.0W @ 40°C	11.70°C/W @ 200 LFM	40.00°C/W	Aluminum	Black Anodized
7109D/TRG HEATSINK TO-263 (D2PK) Boyd Laconia, LLC	15,848 In Stock	1 : $3.36000 Cut Tape (CT) 125 : $2.59976 Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	Top Mount	TO-263 (D²Pak)	SMD Pad	Rectangular, Fins	0.763" (19.38mm)	1.000" (25.40mm)	-	0.450" (11.43mm)	2.0W @ 30°C	3.00°C/W @ 300 LFM	11.00°C/W	Copper	Tin
529802B02500G HEATSINK TO-220 W/PINS 1.5"TALL Boyd Laconia, LLC	9,589 In Stock	1 : $3.37000 Bulk	-	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.000" (25.40mm)	1.650" (41.91mm)	-	1.500" (38.10mm)	10.0W @ 50°C	3.00°C/W @ 200 LFM	3.70°C/W	Aluminum	Black Anodized
529701B02500G HEATSINK TO-218 SOLDER PIN Boyd Laconia, LLC	9,071 In Stock	1 : $3.48000 Bulk	-	Bulk	Active	Board Level, Vertical	TO-218	Bolt On and PC Pin	Rectangular, Fins	1.000" (25.40mm)	1.650" (41.91mm)	-	1.000" (25.40mm)	12.0W @ 70°C	4.00°C/W @ 200 LFM	5.50°C/W	Aluminum	Black Anodized
575200B00000G HEATSINK TO-92 .72" BLK Boyd Laconia, LLC	2,140 In Stock	1 : $3.60000 Bag	-	Bag	Active	Board Level, Vertical	TO-92	Press Fit	Rectangular, Fins	0.602" (15.29mm)	-	-	0.720" (18.29mm)	0.3W @ 20°C	17.50°C/W @ 400 LFM	60.00°C/W	Aluminum	Black Anodized
504102B00000G HEATSINK TO-220 PWR CLR .700" Boyd Laconia, LLC	560 In Stock	1 : $3.74000 Bag	-	Bag	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	0.701" (17.80mm)	0.779" (19.80mm)	-	0.850" (21.60mm)	2.0W @ 40°C	6.00°C/W @ 300 LFM	15.60°C/W	Aluminum	Black Anodized
504222B00000G HEATSINK TO-220 PWR CLR 1.45"10W Boyd Laconia, LLC	2,057 In Stock	1 : $3.88000 Bag	-	Bag	Active	Board Level	TO-220 (Dual)	Bolt On	Rectangular, Fins	1.450" (36.83mm)	0.780" (19.81mm)	-	0.850" (21.60mm)	4.0W @ 40°C	5.00°C/W @ 200 LFM	6.40°C/W	Aluminum	Black Anodized
374324B00035G HEATSINK BGA W/ADHESIVE TAPE Boyd Laconia, LLC	526 In Stock	1 : $4.00000 Box	37432	Box	Active	Board Level	BGA, FPGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.063" (27.00mm)	1.063" (27.00mm)	-	0.394" (10.00mm)	3.0W @ 90°C	9.30°C/W @ 200 LFM	30.60°C/W	Aluminum	Black Anodized
374424B00035G HEATSINK BGA W/ADHESIVE TAPE Boyd Laconia, LLC	868 In Stock	1 : $4.77000 Bulk	-	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.063" (27.00mm)	1.063" (27.00mm)	-	0.709" (18.00mm)	4.0W @ 80°C	6.50°C/W @ 200 LFM	20.30°C/W	Aluminum	Black Anodized
7021B-MTG HEATSINK TO-220 TAB FOLD 42.16MM Boyd Laconia, LLC	3,045 In Stock	1 : $4.83000 Bulk	-	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.450" (36.83mm)	1.750" (44.45mm)	-	0.380" (9.65mm)	6.0W @ 50°C	4.00°C/W @ 300 LFM	6.80°C/W	Aluminum	Black Anodized
6236BG HEATSINK TO-220 CLIP-ON BLACK Boyd Laconia, LLC	2,339 In Stock	1 : $5.09000 Bulk	-	Bulk	Active	Board Level, Vertical	TO-220	Clip	Rectangular, Fins	0.700" (17.78mm)	0.520" (13.21mm)	-	0.510" (12.95mm)	2.0W @ 50°C	12.00°C/W @ 300 LFM	25.00°C/W	Aluminum	Black Anodized
6025DG HEATSINK TO-220 STAGGEREDFIN TIN Boyd Laconia, LLC	4,329 In Stock	1 : $5.71000 Bulk	-	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.250" (31.75mm)	0.875" (22.22mm)	-	0.250" (6.35mm)	3.0W @ 60°C	7.00°C/W @ 400 LFM	17.90°C/W	Copper	Tin
374724B00032G HEATSINK BGA W/ADHESIVE TAPE Boyd Laconia, LLC	1,725 In Stock	1 : $5.99000 Bulk	-	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.378" (35.00mm)	1.378" (35.00mm)	-	0.709" (18.00mm)	3.0W @ 50°C	5.20°C/W @ 200 LFM	15.30°C/W	Aluminum	Black Anodized

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Heat Sinks

Heat sinks are thermal management components designed to dissipate heat from high-power electronic devices and prevent overheating. Their core function is based on the principles of conduction, and convection, transferring heat from a heat source—such as a CPU, power transistor, or BGA package—to the surrounding air or a coolant. By increasing the surface area in contact with cooling media, heat sinks help maintain safe temperature levels and protect component reliability and performance.

Most heat sinks are made of aluminum or copper, materials known for their high thermal conductivity. Aluminum heat sinks are lightweight and cost-effective, ideal for general-purpose cooling solutions, while copper heat sinks offer better conductivity for high-performance or space-constrained applications. Finned and extrusion-style heat sinks use strategically shaped surfaces to maximize exposure to air, enhancing natural or forced convection. Cross-cut designs further improve airflow and thermal dispersion. In advanced applications, heat pipes, liquid cooling, or graphite spreaders may be used to rapidly move heat away from the source. For compact or passive systems, passive heat exchangers rely entirely on natural airflow without the use of fans.

Proper thermal contact between the heat sink and device is critical—thermal interface materials (TIMs) such as thermal paste, pads, or solder are used to fill microscopic gaps and reduce thermal resistance. When selecting a heat sink, consider the thermal output of the component, available space, airflow conditions, and the thermal resistance of the system.

Heat Sinks

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