HSB32-232318
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

HSB32-232318

DigiKey Part Number
2223-HSB32-232318-ND
Manufacturer
Same Sky (Formerly CUI Devices)
Manufacturer Product Number
HSB32-232318
Description
HEAT SINK, BGA, 23 X 23 X 18 MM,
Manufacturer Standard Lead Time
24 Weeks
Customer Reference
Detailed Description
Heat Sink BGA Aluminum Alloy 5.9W @ 75°C Top Mount
Datasheet
 Datasheet
EDA/CAD Models
HSB32-232318 Models
Product Attributes
Type
Description
Select All
Category
Mfr
Same Sky (Formerly CUI Devices)
Series
HSB
Packaging
Box
Part Status
Active
Type
Top Mount
Package Cooled
BGA
Attachment Method
Adhesive (Not Included)
Shape
Square, Pin Fins
Length
0.906" (23.00mm)
Width
0.906" (23.00mm)
Diameter
-
Fin Height
0.709" (18.00mm)
Power Dissipation @ Temperature Rise
5.9W @ 75°C
Thermal Resistance @ Forced Air Flow
4.40°C/W @ 200 LFM
Thermal Resistance @ Natural
12.67°C/W
Material
Aluminum Alloy
Material Finish
Black Anodized
Product Questions and Answers

See what engineers are asking, ask your own questions, or help out a member of the DigiKey engineering community

In-Stock: 456
Check for Additional Incoming Stock
Quantity
All prices are in CAD
Box
QuantityUnit PriceExt Price
1$2.16000$2.16
10$1.90500$19.05
25$1.81520$45.38
50$1.75000$87.50
100$1.68680$168.68
250$1.60664$401.66
704$1.52064$1,070.53
1,408$1.46558$2,063.54
5,632$1.36122$7,666.39
Manufacturers Standard Package
You May Also Be Interested InSee All
3 Items
HSB18-232310

HSB18-232310

HEAT SINK, BGA, 23 X 23 X 10 MM

Same Sky (Formerly CUI Devices)

$1.68000
HSB23-232325

HSB23-232325

HEAT SINK, BGA, 23 X 23 X 25 MM

Same Sky (Formerly CUI Devices)

$2.48000
374124B00035G

374124B00035G

HEATSINK BGA W/ADHESIVE TAPE

Boyd Laconia, LLC

$3.35000