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NSP-35 One-Part Liquid Thermal Gap Filler

One-part, fully-cured, non-silicone gap filler from t-Global

Image of t-Global Technology's NSP-35 One-Part Liquid Thermal Gap FillerNSP-35 is a one-part, fully-cured, non-silicone gap filler from t-Global. It can be easily dispensed using standard industrial dispensing equipment and can be used to fill gaps over a wide range of tolerances.

Its unique formulation makes it highly conformable, form stable in application and produces virtually no compressive forces on solder joints or delicate components. It has a thermal conductivity of 3.5 W/mk.

Features
  • One-part, fully-cured materials offer significant lower total cost of ownership than two-part systems
  • Materials do not need curing
  • Increased floor space utilization
  • Reduced energy costs
  • Reduced process time
  • Reduced dispensing equipment costs
  • Ease of handling
  • Reduced stock and inventory
  • Reduced complexity
  • Ease of rework
Applications
  • Automotive
  • Telecom
  • Consumer electronics
  • LED
  • Solutions which require large area and volume and automated dispensing

NSP-35 One-Part Liquid Thermal Gap Filler

ImageManufacturer Part NumberDescriptionAvailable Quantity
THERMAL NON-SILICONE PUTTY 4OZTG-NSP35-4OZTHERMAL NON-SILICONE PUTTY 4OZ5 - ImmediateView Details
THERMAL NON-SILICONE PUTTY 1LBTG-NSP35-1LBTHERMAL NON-SILICONE PUTTY 1LB43 - ImmediateView Details
Published: 2014-09-19