T-Wing® Thin Heat Spreaders

Parker Chomerics' T-Wing thin heat spreaders provide a low cost, effective means of cooling high-density integrated circuit devices by conducting heat away from key components. T-Wing spreaders consist of 5 oz. (0.007 inch/0.18 mm thick) flexible copper foil between electrically insulating films. High strength silicone pressure-sensitive adhesive (PSA) provides a strong bond to the heat-generating component. The compliant nature of these thermal wing heat spreaders permits nearly 100% adhesive contact with non-flat package surfaces, optimizing thermal, and mechanical performance.

Features and Benefits

• UL 94 V-0 flammability rated
• Custom shapes available for complex designs
• Component junction temperature reduction of 10°C to 20°C
• Easily added to existing designs to lower component temperatures and improve reliability

Applications

• Microprocessors
• Memory modules
• High-speed disk drives
• Laptop PCs and other high density, handheld portable electronics

Attributes

• Lightweight (0.039 oz./in²)
• Easy peel and stick adhesion to all surfaces
• Pliability for flexibility in conformance shapes
• Low application force (<0.5 psi) minimizes risk to components
• Low profile design (0.013 in/0.33 mm) allows for use in limited space applications