Thermal Interface Materials
3M™ thermal interface tapes, pads, and epoxies provide high thermal conductivity
Thermal interface tapes, pads, and epoxies by 3M provide high thermal conductivity by focusing on the two areas that matter most: bulk conductivity and interface conductivity. They address a crucial problem with today's low-power electronic devices – the need to dissipate the sizable amounts of heat being generated.
The thermally conductive adhesive transfer tapes provide efficient thermal transfer for a wide range of applications including bonding heat sinks, heat spreaders, IC packages, power transistors, and more. These tapes combine 3M high-performance acrylic adhesive with highly conductive ceramic particles for an extremely reliable and user-friendly thermal interface. They also offer a highly conformable construction that provides excellent wet-out on surfaces.
The thermally conductive interface pads provide high levels of conductivity for the most demanding electronics applications. They also provide excellent handling and can be die-cut to fit most applications.
The thermally conductive epoxies have a range of liquid adhesives with minimal odor and superior structural strength adhesion. The adhesive flows and fills micro-spaces on surfaces and the ultra-thin bond line helps achieve low thermal impedance. See all tape.
Digi-Key can offer you a quote on your secondary services. For more information on 3M available options or if you need assistance, contact CustomCut.3MProducts@digikey.com. Please send outline dimensional drawings to the aforementioned e-mail address.
Thermally Conductive Epoxy
|Image||Manufacturer Part Number||Description||Outline||Available Quantity|
|5592 210 MM X 300 MM 2.0 MM||THERM PAD 300MMX210MM WHITE||300.00mm x 210.00mm||29 - Immediate||View Details|
|5592 210 MM X 300 MM 1.0 MM||THERM PAD 300MMX210MM WHITE||300.00mm x 210.00mm||0||View Details|
|5592 210 MM X 300 MM 1.5 MM||THERM PAD 300MMX210MM WHITE||300.00mm x 210.00mm||0||View Details|