Mezalok HSLF XMC Connectors

TE Connectivity’s (TE) Mezalok high-speed low-force (HSLF) XMC connectors are designed for mezzanine applications for rugged embedded computing interconnects. The connectors utilize a rugged dual-point contact system that meets the qualification requirements of legacy Mezalok high-speed connectors. The connectors are available in 60, 114, and 320 positions with stack height options of 10 mm, 12 mm, 17 mm, and 18 mm. Mezalok high-speed low-force XMC connectors meet the same rugged standards as listed in VITA 47 and VITA 72. The 114-position connector is compliant with VITA 61 and additional positions and stack heights are available. These high-speed low-force connectors feature a wide operating temperature range, excellent thermal stability, and data rates to 32+ Gb/s, with VITA 42.3 pinout.

Benefits

• Unmating force reduction: 47%
• Mating force reduction: 32%
• Rugged dual-point contact system
• Maintains ball grid array (BGA) PCB attachment and supports standard surface-mount processing
• Designed for highly rugged performance rating, meeting legacy Mezalok specification
• Testing to VITA 72 working group environment
• Thermal stability for reliable solder joints, testing to 2000 thermal cycles, -55°C to +125°C
• Compliant with VITA 61 and 42 standards; Mezalok high-speed low-force socket assemblies are intermateable with legacy Mezalok pin connectors
• Multiple positions and stack heights available