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Embedded Package-on-Package (ePoP) Storage Component
Kingston's ePoP is ideal for wearables, IoT, sports, gaming, and fitness systems
Kingston’s ePoP provides a highly integrated JEDEC standard component that combines embedded multimedia card (e•MMC™) storage and low-power double data rate (LPDDR) DRAM into a package-on-package solution. ePoP is mounted directly on top of a compatible host system-on-a-chip (SoC) which reduces printed circuit board (PCB) space and ensures optimum performance. ePoP is an ideal solution for space-constrained applications such as wearables.
Features
- By mounting directly on top of a host SoC, ePoP provides an ideal solution for small form-factor applications such as wearables
- Low-power DRAM and optimized storage firmware reduce power consumption while delivering the high performance needed for battery-powered wearable applications
- Simplifies system design, reduces time-to-market, and shortens the qualification cycle
- Multiple firmware configurations are available to best fit the application requirements for performance, power, and lifespan
- Package: 221 ball FBGA type 11.5 mm x 13.0 mm x (0.9 mm ±0.1 mm, max 1.0 mm)
- Separate e•MMC and LPDRAM interfaces
- Lead-free (RoHS compliant) and halogen-free
- Operating temperature range: -25°C to +85°C
- Storage temperature range: -55°C to +125°C
- Packaged NAND Flash memory with e•MMC 5.0 interface
- Compliant with e•MMC specifications Ver.4.4, 4.41, 4.5, and 5.0
- Bus mode
- High-speed e•MMC protocol
- Provides variable clock frequencies of 0 MHz to 200 MHz (follows JEDEC specification)
- Ten-wire bus (clock, 1-bit command, and 8-bit data bus) and a hardware reset
- Supports three different data bus widths: 1 bit (default), 4 bits, and 8 bits
- Data transfer rate: up to 52 Mbyte/s (using 8 parallel data lines at 52 MHz)
- Single data rate: up to 200 Mbyte/s at HS200 (host clock at 200 MHz)
- Dual data rate: up to 104 Mbyte/s at 52 MHz
- Supports (alternate) boot operation mode to provide a simple boot sequence method
- Supports SLEEP/AWAKE (CMD5)
- Host-initiated explicit sleep mode for power saving
- Enhanced write protection with permanent and partial protection options
- Supports multiple user data partitions with enhanced user data area options
- Supports background operations and high-priority interrupt (HPI)
- Supports enhanced storage media feature for better reliability
- Operating voltage range: VCCQ = 1.8 V/3.3 V, VCC = 3.3 V
- Error-free memory access
- Internal error correction code (ECC) to protect data communication
- Internal enhanced data management algorithm
- Solid protection of sudden power failure safe-update operations for data content
- Security
- Supports secure bad block erase commands
- Enhanced write protection with permanent and partial protection options
- Quality
- RoHS compliant
- Supports field firmware update (FFU)
- Enhanced device lifetime
- Supports pre-EOL information
- Optimal size
- Supports production state awareness
Applications
- IoT
- Wearables such as smart rings, wristbands, watches and pins, body-mounted sensors, fitness trackers, smart clothing
- Augmented reality (AR) and virtual reality (VR) devices
- Healthcare and medical
- Entertainment and gaming
- Sports and fitness
ePoP Storage Component
| Image | Référence fabricant | Description | Type de montage | Taille mémoire | Organisation de la mémoire | Quantité disponible | Prix | Afficher les détails | |
|---|---|---|---|---|---|---|---|---|---|
 |  | 08EP08-N3GTC32-GA67 | IC FLASH RAM 8GB EMMC 136FBGA | Montage en surface | 8Go (NAND) | 8G x 8 | 13 - Immédiatement | $55.80 | Afficher les détails |
Date de publication : 2022-10-10
Canada