SiC MOSFETs in a TO-Leadless (TOLL) Package

Produits
Retour
Fabricants
Retour
Ressources
Retour
Retour
Retour
- Programmes & services
- Automatisation et contrôle
- Services de conception et d'intégration
- Solutions numériques
- Solutions IoT
- Traçage des pièces
- Services de produits
Retour
- Acheter
- Outils
- myLists
- Devis
- Produits
- Fabricants
Traçage des pièces

TechForum

Webinars

Scheme-it
Demander un devis

Présentations produits > SiC MOSFETs in a TO-Leadless (TOLL) Package

            SiC MOSFETs in a TO-Leadless (TOLL) Package
                    ROHM TOLL SiC MOSFETs offer excellent heat dissipation and high-current capability in a compact form factor
    

Image of ROHM Semiconductor SiC MOSFET in a TO-Leadless (TOLL) Package ROHM SiC MOSFETs in a compact TOLL package deliver superior performance in high-power applications. Compared to conventional TO-263 packages, the TOLL form factor reduces footprint space by approximately 26% while enabling excellent heat dissipation and high-current capability. Its low gate resistance minimizes switching losses, lowering overall power consumption and boosting efficiency. With a low-profile design that is ideal for modern slim power supplies, these devices are optimized for demanding applications such as server power supplies, PV inverters, and other next-generation industrial power solutions.

Features

Low on-resistance
Fast switching speed
Fast reverse recovery
Easy to parallel

Simple to drive
Pb-free lead plating; RoHS-compliant
MSL 1 (moisture sensitivity level)

Applications

Industrial equipment: solar inverters and power supplies for servers and data centers
Consumer equipment: general-purpose power supplies