45984-001 Prod Spec Datasheet by Molex

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D molexfi' C REVISION: ECR/ECN INFORMATION: TITLE: SHEET N0. EC No: w INTERCONNECT SYSTEMS DOCUMENT NUMBER: CREATED / REVISED BY: CHECKED BY: ‘ APPROVED BY:
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
PRODUCT SPECIFICATION FOR
LOW PROFILE HYBRID (LPH)
INTERCONNECT SYSTEMS
SHEET No.
G
EC No:
177250
1 of 14
DATE:
2018/5/25
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
PS-45984-001
ALIN06
JZENG
KHLIM
FILENAME: PS75431r0.DOC
PRODUCT SPECIFICATION FOR
LOW PROFILE HYBRID (LPH)
INTERCONNECT SYSTEM
D 1 2 3 REVISION. ECR/ECN INFORMATION. TITLE. SHEET No. EC No. % INTERCONNECT SYSTEMS DOCUMENT NUMBER. CREATED / REVISED EV. CHECKED BY. APPROVED BY.
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
PRODUCT SPECIFICATION FOR
LOW PROFILE HYBRID (LPH)
INTERCONNECT SYSTEMS
SHEET No.
G
EC No:
177250
2 of 14
DATE:
2018/5/25
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
PS-45984-001
ALIN06
JZENG
KHLIM
FILENAME: PS75431r0.DOC
1.0 SCOPE
This specification covers the performance requirements and test methods for the following
products listed by series numbers:
45984-**** LPH Receptacle Assembly
45985-**** LPH Plug Assembly
1. The Low Profile Header (LPH) interconnect system consists of a right angle plug and a right
angle receptacle header. Each can be configured with 4 to 10 power contacts and 12 to 40
signal contacts. Additional options include guides and board mounting pegs. Receptacle can
also mate to 1.57±0.15 mm / .062”±.006” thick card edge. Both plug and receptacle
connectors are through-hole solder into printed circuit boards and provide co-planer mate-
ability. For wave soldering, it is recommended to use interference peg design
(Diameter is 3.30mm) or use fixture to hold the part down during soldering.
When mounting the connector into PCB by manual operation, it is required to press two side of the
connector with even force on the connector to insure the connector can be inserted into PCB
smoothly.
2.0 PRODUCT DESCRIPTION
2.1 PRODUCT NAMES
LPH Right Angle Receptacle Header Assembly Series 45984
LPH Right Angle Plug Header Assembly Series 45985
2.2 DIMENSIONS, MATERIALS, PLATINGS AND MARKINGS
Dimensions: See individual sales drawings.
Material: RoHs compliant materials (LCP for housings, copper alloy for terminals).
Plating: Gold on mating surfaces and tin the PC tail with nickel under-plating overall.
2.3 SAFETY AGENCY APPROVALS
UL File Number: E29179
CSA File Number: LR19980
3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS
Refer to the appropriate sales drawings and other sections of this specification for the
necessary referenced documents and specifications.
D molex“ C 4 Connector Rating Ber UL-1977 Apglication Voltage Guideline REVISION. ECR/ECN INFORMATION. TITLE. SHEET No. EC No. % INTERCONNECT SYSTEMS DOCUMENT NUMBER. CREATED / REVISED EV. CHECKED BY. APPROVED BY.
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
PRODUCT SPECIFICATION FOR
LOW PROFILE HYBRID (LPH)
INTERCONNECT SYSTEMS
SHEET No.
G
EC No:
177250
3 of 14
DATE:
2018/5/25
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
PS-45984-001
ALIN06
JZENG
KHLIM
FILENAME: PS75431r0.DOC
3.1 See sales drawings and the other sections of this specifications for the necessary
referenced documents and specification.
3.2 Assembly Drawings: SD-45984-***, SD-45985-***
4.0 RATINGS
4.1 VOLTAGE
250 Volts AC (RMS)/DC (Power)
30 Volts DC (Signal)
Connector Rating per UL-1977
Connector voltage rating meets the connector approval level defined by UL 1977, Sect.
11 for spacing per table 11.1. Example: 1.2 mm for ≥ 250 volt; 3.2 mm for ≤ 250 volt.
Exception taken for spacing less than those specified are permitted, if the device
complies with the requirements in the dielectric voltage withstanding test per Sect. 17.
Application Voltage Guideline
For application voltage requirements please refer to UL-60950 or other applicable
standards, the creepage & clearance also needs to be determined based upon
pads/traces on the PCB.
4.2 CURRENT **
When tested in accordance with EIA-364-TP70:
(Tested to 30deg.C max. rise above ambient)
Ckt. Size
4
6
8
10
Current
30 Amperes
27 Amperes
23 Amperes
20 Amperes
Signal Contact: 1 Ampere per contact
** Current rating is application dependent. Above rating is for reference only. Appropriate
de-rating is required per ambient conditions, copper weight of PCB needed to achieve
thermal balance, gross heating from adjacent components, and other factors that
influence connector performance.
4.2.1 CURRENT INTERRUPTION
D molex“ C Low Profile Hybrid Temperature Rise Vs. Current / + _._ I REVISION. ECR/ECN INFORMATION. TITLE. SHEET No. EC No. % INTERCONNECT SYSTEMS DOCUMENT NUMBER. CREATED / REVISED BY. CHECKED BY. APPROVED BY.
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
PRODUCT SPECIFICATION FOR
LOW PROFILE HYBRID (LPH)
INTERCONNECT SYSTEMS
SHEET No.
G
EC No:
177250
4 of 14
DATE:
2018/5/25
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
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ALIN06
JZENG
KHLIM
FILENAME: PS75431r0.DOC
30 Amps @ 48 Vdc Power
1.0 Amp @ 30 Vdc - Signal
0.0
10.0
20.0
30.0
40.0
50.0
60.0
70.0
80.0
90.0
100.0
110.0
10.0 20.0 30.0 40.0
Current (Amps)
T-Rise - Deg. C
8 Circuit Max.
4 Circuit Max.
Low Profile Hybrid
Temperature Rise vs. Current
8 Circuit & 4 Circuit Max.
4 oz. Copper PCB
D Low Profile Hybrid Temperature Rise Vs. Current ) + REVISION. ECR/ECN INFORMATION. TITLE. SHEET N0. EC N0. % INTERCONNECT SYSTEMS DOCUMENT NUMBER. CREATED / REVISED BY. CHECKED BY. APPROVED BY.
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
PRODUCT SPECIFICATION FOR
LOW PROFILE HYBRID (LPH)
INTERCONNECT SYSTEMS
SHEET No.
G
EC No:
177250
5 of 14
DATE:
2018/5/25
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
PS-45984-001
ALIN06
JZENG
KHLIM
FILENAME: PS75431r0.DOC
0.0
10.0
20.0
30.0
40.0
50.0
60.0
70.0
80.0
90.0
100.0
110.0
10.0 20.0 30.0 40.0
Current (Amps)
T-Rise - Deg. C
8 Circuit Max
4 Circuit Max
Low Profile Hybrid
Temperature Rise vs. Current
8 Circuit & 4 Circuit Max.
10 oz. Copper PCB
D molexfi' C Low Prolile H hrid Vollaflg Dion Vs. Curran! B Cicuil 5 4 cicml 4 oz, Copper PCB 0 024 0.022 0020 0.0I8 OOIG 00“ Doll +8 Cicmt +4 Cicufl 0.010 Von-9o mop . Volu (wIBulk) éé \ 0002 0.000 10 O 20 o 30 o Curmm (mus) 400 REVISION: ECR/ECN INFORMATION: EC No: DATE: DOCUMENT NUMBER: TITLE: INTERCONNECT SYSTEMS CREATED / REVISED BY: CHECKED BY: SHEET N0. APPROVED BY:
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
PRODUCT SPECIFICATION FOR
LOW PROFILE HYBRID (LPH)
INTERCONNECT SYSTEMS
SHEET No.
G
EC No:
177250
6 of 14
DATE:
2018/5/25
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
PS-45984-001
ALIN06
JZENG
KHLIM
FILENAME: PS75431r0.DOC
D Low Prolile Hybrid Voltage Drag Vs. Current / + + /r / 5 REVISION. ECR/ECN INFORMATION. TITLE. SHEET N0. EC No. DATE. INTERCONNECT SYSTEMS DOCUMENT NUMBER. CREATED / REVISED EV. CHECKED BY. APPROVED BY.
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
PRODUCT SPECIFICATION FOR
LOW PROFILE HYBRID (LPH)
INTERCONNECT SYSTEMS
SHEET No.
G
EC No:
177250
7 of 14
DATE:
2018/5/25
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
PS-45984-001
ALIN06
JZENG
KHLIM
FILENAME: PS75431r0.DOC
Low Profile Hybrid
Voltage Drop Vs. Current
8 Circuit & 4 Circuit
10 oz. Copper PCB
0.000
0.002
0.004
0.006
0.008
0.010
0.012
0.014
0.016
0.018
0.020
0.022
0.024
10.0 20.0 30.0 40.0
Current (Amps)
Voltage Drop - Volts (w/Bulk)
4 Circuit
8 Circuit
4.3 TEMPERATURE
Operating: -40°C to +105°C (including T-rise from applied current)
Non-operating: -40°C to +105°C
4.4 DURABILITY
250 Cycles
5.0 QUALIFICATION
Laboratory conditions and sample selection are in accordance with EIA-364-1000
D 6 REVISION. ECR/ECN INFORMATION. TITLE. SHEET No. EC No. % INTERCONNECT SYSTEMS DOCUMENT NUMBER. CREATED / REVISED EV. CHECKED BY. APPROVED BY.
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
PRODUCT SPECIFICATION FOR
LOW PROFILE HYBRID (LPH)
INTERCONNECT SYSTEMS
SHEET No.
G
EC No:
177250
8 of 14
DATE:
2018/5/25
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
PS-45984-001
ALIN06
JZENG
KHLIM
FILENAME: PS75431r0.DOC
6.0 PERFORMANCE
6.1 ELECTRICAL PERFORMANCE
DESCRIPTION
TEST CONDITION
REQUIREMENT
CONTACT
RESISTANCE
(LOW LEVEL)
(EIA-364-23)
Mate connectors,
apply maximum
voltage of 20mV and
a current of 100 mA
Maximum Change:
Signal Contact: 15 milliohm
Power Contact: 0.75 milliohm
CONTACT
RESISTANCE
(@ RATED CURRENT)
Mate connectors,
apply maximum
voltage of 20mV at
the rated current.
Maximum Change:
Signal Contact: 15 milliohm
Power Contact: 0.75 milliohm
INSULATION
RESISTANCE
(EIA-364-21)
Apply 500 VDC
between adjacent
terminals or ground.
5,000 megaohms
minimum
DIELECTRIC
WITHSTANDING
VOLTAGE
(EIA-364-20)
Apply 1500 VDC for
1 minute between
adjacent terminals or
ground.
No breakdown
TEMPERATURE RISE
Mate connectors
Measure T-Rise
@ Rated Current
After 96 Hours.
30 C T-Rise
D molex“ C REVISION. ECR/ECN INFORMATION. TITLE. SHEET No. EC No. % INTERCONNECT SYSTEMS DOCUMENT NUMBER. CREATED / REVISED EV. CHECKED BY. APPROVED BY.
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
PRODUCT SPECIFICATION FOR
LOW PROFILE HYBRID (LPH)
INTERCONNECT SYSTEMS
SHEET No.
G
EC No:
177250
9 of 14
DATE:
2018/5/25
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
PS-45984-001
ALIN06
JZENG
KHLIM
FILENAME: PS75431r0.DOC
6.2 MECHANICAL PERFORMANCE
ITEM
TEST CONDITION
REQUIREMENT
MATING FORCE,
SINGLE CIRCUIT
(EIA-364-37)
Mate connectors at a rate of
25 +/- 6 mm per minute.
110 g per signal pin
700 g per Power Contact
(Maximum Values)
UNMATING FORCE,
SINGLE CIRCUIT
(EIA-364-37)
Unmate connectors at a rate
of 25 +/- 6 mm per minute.
15 g per signal pin
150 g per Power Contact
(Minimum Values)
DURABILITY W/O
ENVIRONMENT
(EIA-364-09)
Mate connectors 250 cycles
at a maximum rate of 10
cycles per minute.
Maximum Change:
Signal Contact: 15 milliohm
Power Contact: 0.75
milliohm
NORMAL
FORCE
Apply perpendicular force
to terminal at rate of
25 +/- 6mm per minute
90 g per signal pin
300 g per Power Contact
(Nominal Values)
Maximum
connector(with pegs)
mounting force into
PCB
Mounting connectors at a
rate of 25 +/- 6 mm per
minute.
Both pegs should be
inserted into PCB at the
same time with even force
instead of slanted or one
sided insertion
Interference peg: 11000 g.
(Maximum Values)
D REVISION. ECR/ECN INFORMATION. TITLE. SHEET No. EC No. % INTERCONNECT SYSTEMS DOCUMENT NUMBER. CREATED / REVISED EV. CHECKED BY. APPROVED BY.
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
PRODUCT SPECIFICATION FOR
LOW PROFILE HYBRID (LPH)
INTERCONNECT SYSTEMS
SHEET No.
G
EC No:
177250
10 of 14
DATE:
2018/5/25
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
PS-45984-001
ALIN06
JZENG
KHLIM
FILENAME: PS75431r0.DOC
6.3 ENVIRONMENTAL PERFORMANCE
ITEM
TEST CONDITION
REQUIREMENT
VIBRATION
(EIA-364-28)
Mate connectors and
vibrate per EIA-364-
28, test condition D,
15 minutes each axis
Maximum Change:
Signal Contact: 15 milliohm
Power Contact: 0.75 milliohm
THERMAL
SHOCK
(EIA-364-32)
Mate connectors,
expose to 5 cycles
from 55 deg. C to 85
deg. C per EIA-364-
TP-32
Maximum Change:
Signal Contact: 15 milliohm
Power Contact: 0.75 milliohm
TEMPERATURE
LIFE
(EIA-364-17)
Mate Connectors,
expose to 180 hours
at 105 °C Per EIA-
364-17 Method A
Maximum Change:
Signal Contact: 15 milliohm
Power contact: 0.75 milliohm
CYCLIC TEMPERATURE
& HUMIDITY
(EIA-364-31)
Mate connectors:
expose to 24 cycles
from 25 °C / 80% RH
to 65 °C / 50% RH
Maximum Change:
Signal Contact: 15 milliohm
Power Contact: 0.75 milliohm
MIXED
FLOWING
GAS
168 hours unmated,
72 hours mated,
per EIA-364-65
Class IIA
Maximum Change:
Signal Contact: 15 milliohm
Power Contact: 0.75 milliohm
SOLDER RESISTENCE
(Wave)
Submerge terminal
tails in solder.
Dwell: 2.0 +/- 0.5 sec.
Solder Temp: 260o C
Max.
Visual: No damage to insulator
material
D molex“ C Time to Peak —> Temperatura Temperature Time at Peak Temperature Peak Yemneramre Rama Ram Peak Temneramre cam Dawn Rama Ram Liq idus Yemveralwa Preheat I'emperalme Ramp Rate 1m at mum Tam pmmre Preheat Tam Denture Txme i Within 5 “c olPeak m." ”WWW . m. : mm mm a 3‘— Lmumus _.i Temperamre N REVISION. ECR/ECN \NFORMATION. T‘TLE. SHEET N0. EC N0. % INTERCONNECT SYSTEMS DOCUMENT NUMBE . CREATED / REVISED EV. CHECKED BY. APPROVED BY.
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
PRODUCT SPECIFICATION FOR
LOW PROFILE HYBRID (LPH)
INTERCONNECT SYSTEMS
SHEET No.
G
EC No:
177250
11 of 14
DATE:
2018/5/25
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JZENG
KHLIM
FILENAME: PS75431r0.DOC
6.4 SOLDERING PROFILE
(This profile is per JEDEC J-STD-020D.1 and it is for guide line only; please see
notes for additional information)
Notes:
1. Temperature indicated refers to the PCB surface temperature at solder tail area.
2. Connector can withstand up to 3 reflow cycles with a cool-down to room temperature in-between.
Description
Requirement
Average Ramp Rate
3°C/sec Max
Preheat Temperature
150°C Min to 200°C Max
Preheat Time
60 to 180 sec
Ramp to Peak
3°C/sec Max
Time over Liquids (217°C)
60 to 150 sec
Peak Temperature
260 +0/-5°C
Time within 5°C of Peak
20 to 40 sec
Ramp - Cool Down
6°C/sec Max
Time 25°C to Peak
8 min Max
D molex“ C REVISION. ECR/ECN INFORMATION. TITLE. SHEET No. EC No. % INTERCONNECT SYSTEMS DOCUMENT NUMBER. CREATED / REVISED EV. CHECKED BY. APPROVED BY.
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
PRODUCT SPECIFICATION FOR
LOW PROFILE HYBRID (LPH)
INTERCONNECT SYSTEMS
SHEET No.
G
EC No:
177250
12 of 14
DATE:
2018/5/25
CREATED / REVISED BY:
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JZENG
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FILENAME: PS75431r0.DOC
3. Actual reflow profile also depends on equipment, solder paste, PCB thickness, and other components on the
board. Please consult your solder paste & reflow equipment manufacturer for their recommendations to adopt
a suitable process.
7.0 TEST SEQUENCE
7.1 Reliability Test Sequences (per EIA-364-1000 Test Groups 1, 2, and 3):
Sample Preparation
Test Group 1
Sample Preparation
Test Group 2
Sample Preparation
Test Group 3
|
|
|
Initial Low Level
Contact Resistance
(LLCR)
Initial Low Level
Contact Resistance
(LLCR)
Initial Low Level
Contact Resistance
(LLCR)
|
|
|
Durability
Durability
Durability
|
|
|
LLCR
Thermal
Shock
Temperature Life
96 hours @ 105C
|
|
|
Temperature Life
180 hours @ 105C
LLCR
LLCR
|
|
|
LLCR
Cyclic Temperature
And Humidity
Vibration
|
|
|
Reseating
LLCR
LLCR
|
|
LLCR
Reseating
|
LLCR
D molex“ C REVISION. ECR/ECN INFORMATION. TITLE. SHEET No. EC No. % INTERCONNECT SYSTEMS DOCUMENT NUMBER. CREATED / REVISED EV. CHECKED BY. APPROVED BY.
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
PRODUCT SPECIFICATION FOR
LOW PROFILE HYBRID (LPH)
INTERCONNECT SYSTEMS
SHEET No.
G
EC No:
177250
13 of 14
DATE:
2018/5/25
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
PS-45984-001
ALIN06
JZENG
KHLIM
FILENAME: PS75431r0.DOC
7.1 Reliability Test Sequences (per EIA-364-1000 Test Groups 4, 5, and 7)
Sample Preparation
Test Group 4
Sample Preparation
Test Group 5
Sample Preparation
Test Group 7
|
|
Initial Low Level
Contact Resistance
(LLCR)
Initial Low Level
Contact Resistance
(LLCR)
Dielectric
Withstanding Voltage
|
|
|
Durability
Durability
Durability
|
|
|
Temperature Life
96 hours @ 105C
Temperature Life
96 Hrs @ 105C
Dielectric
Withstanding Voltage
|
|
|
LLCR
LLCR
Durability
|
|
|
Mixed Flowing Gases
7 Days Unmated
3 Days Mated
Thermal Cycling
500 Cycles
Dielectric
Withstanding Voltage
|
|
LLCR
LLCR
|
|
Thermal Disturbance
Reseating
|
|
LLCR
LLCR
|
Reseating
|
LLCR
D molex“ \_/ I:| REVISION. ECR/ECN INFORMATION. TITLE. SHEET No. EC No. % INTERCONNECT SYSTEMS DOCUMENT NUMBER. CREATED / REVISED EV. CHECKED BY. APPROVED BY.
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
PRODUCT SPECIFICATION FOR
LOW PROFILE HYBRID (LPH)
INTERCONNECT SYSTEMS
SHEET No.
G
EC No:
177250
14 of 14
DATE:
2018/5/25
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
PS-45984-001
ALIN06
JZENG
KHLIM
FILENAME: PS75431r0.DOC
7.2 Electrical Performance Test Sequence:
Sample Preparation
|
Initial Current
Profiling
|
Initial Steady State
Current 96 hrs
|
Current Cycling
240 cycles
|
Final Steady State
Current 96 hrs

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