NFM18CC102R1C3x Ref Sheet Datasheet by Murata Electronics

View All Related Products | Download PDF Datasheet
C :mwmu a)EquwaIem 0mm Inplll \—/ om pul (I) (3) em) (I) X" n Pals-in! 5.Package 4! 'F F
NFM18CC102R1C3_ (0603, 1000pF, DC16V)
_: packaging code Reference Sheet
1.Scope
  
2.MURATA Part NO. System
(Ex.)
3. Type & Dimensions
a)Equivalent Circuit
(Unit:mm)
4.Rated value
5.Package
Product specifications in this catalog are as of Dec.7,2017,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
Insulation
Resistance
mark
Packaging Unit
(7) Packaging
This product specification is applied to 3 Terminals Low ESL Chip Multilayer Ceramic Capacitorss (EMIFIL) used for General Electronic equipment.
(3) Nominal
Capacitance
(5)
DC Rated
Voltage
i
0.4±0.1
j
0.2±0.1
3 Terminals Low ESL Chip Multilayer Ceramic Capacitors (EMIFIL) for General Purpose
Specifications and Test Methods
(Operating /Storage Temp. Range)
-55 to 125 °C / -55 to 125 °C
300mΩmax.
1000 pF
DC
Resistance
1000MΩmin.
DC 16 V
(1)-1 L
(1)-2 W
T
e
g
D
f180mm Reel
PAPER W8P4
4000 pcs./Reel
1.6±0.1
0.8±0.1
0.6±0.1
0.25±0.1
0.2 min.
(1)L/W
Dimensions (2)Features (3)Nominal
Capacitance (4)Characteristics (5)DC Rated Voltage (6)Electrode (7)Packaging Code
NFM 18 CC 102 R1C 3 D
NFM18CC102R1C3-01 1
Electrical Performance
No Specification Test Method
1 Capacitance Shown in Rated value. Frequency
(Cap.) 22 to 47pF : 1±0.1MHz
100 to 22000pF : 1±0.1kHz
Voltage : 1±0.2V(rms)
2Voltage : Rated Voltage
Time : 2 minutes max.
3 DC Resistance Measured with 100mA max.
4 Withstanding Voltage Products shall not be damaged.
Test Voltage : Rated Voltage x 300%
Time : 1 to 5 s
Charge Current : 50mA max.
5Operating Temperature Shown in Rated value. Includes self-heating
6Storage Temperature
Standard Testing Condition
< Unless otherwise specified >
< In case of doubt >
Temperature : Ordinary Temp. / 15 °C to 35 °C Temperature: 20 °C ± 2 °C
Humidity: Ordinary Humidity / 25 %(RH) to 85 %(RH)
Humidity: 60 %(RH) to 70 %(RH)
Atmospheric pressure: 86 kPa to 106 kPa
SPECIFICATIONS AND TEST METHODS
Item
Insulation
Resistance(I.R.)
JEMCPS-02209D 2
Table I loo la ZZDDDpF 48:4 bburs Table 2 Table 3
Mechanical Performance
No Specification Test Method
1Appearance and
Appearance:No defects or abnormalities. Appearance:Visual inspection.
Dimensions
Dimensions:Within the specified dimensions. Dimensions:Using Measuring instrument of dimension.
2Solderability Flux : Solution of rosin ethanol 25(mass)%
Pre-heat : 150±10°C, 60 to 90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 240±3°C
Immersion Time : 3±1s
Immersion and emersion rates : 25mm/s
3 Resistance to
Meet Table 1. Flux : Solution of rosin ethanol 25(mass)%
soldering heat
Table 1 Pre-heat : 150±10°C, 60 to 90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270±5°C
Immersion Time : 10±1s
Immersion and emersion rates : 25mm/s
Initial values : About 100 to 22000pF,
measured after heat treatment (150+0/-10 °C,1hour) and
exposure in the room condition for 48±4 hours.
Then measured after exposure in the room condition for
following hours.
22 to 47pF : 24±2 hours
100 to 22000pF : 48±4 hours
4Bending Strength
Meet Table 2. It shall be soldered on the glass-epoxy substrate(t=1.0mm).
Table 2 Deflection : 2mm
Keeping Time : 30s
(in mm)
5 Drop
It shall be dropped on concrete or steel board.
Method : Free fall
Height : 1m
Attitude from which the product is dropped : 3 directions
6Bonding Strength
It shall be soldered on the glass-epoxy substrate.
Applying Force (F) : 9.8N
Applying Time : 30s
(in mm)
7 Vibration Meet Table 3.
It shall be soldered on the glass-epoxy substrate.
Table 3 Oscillation Frequency : 10 to 2000 to 10Hz for 20 minutes.
Total amplitude 1.5 mm or Acceleration amplitude 196m/s2
whichever is smaller.
Time : A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 hours)
Initial values : About 100 to 22000pF,
measured after heat treatment (150+0/-10 °C,1hour)
and exposure in the room condition for 48±4 hours.
Then measured after exposure in the room condition for
following hours.
      22 to 47pF : 24±2 hours
      100 to 22000pF : 48±4 hours
SPECIFICATIONS AND TEST METHODS
Item
Electrodes shall be at least 90% covered with
new solder coating.
Products shall be no failure after tested.
The Number of Time : 3 times for each direction
(Total 9 times)
The electrodes shall be no failure after tested.
45
R340
F
Deflection
45 Product
Pressure jig
0.4
0.6
1.6
0.5
Appearance
No damaged
Cap. Change
Within ±7.5%
I.R.
Meet the initial rated value.
Rdc
22 to 2200pF
0.5max.
22000pF
0.05max.
Appearance
No damaged
Cap. Change
Within ±7.5%
Rdc
22 to 2200pF
0.5max.
22000pF
0.05max.
Appearance
No damaged
Capacitance
Meet the initial rated value.
Rdc
22 to 2200pF
0.5max.
22000pF
0.05max.
JEMCPS-02209D 3
common {or 48:4 hams common {or 48:4 hams Table 4 common {or 48:4 hams common {or 48:4 hams Var 48:4 hams common {or 48:4 hams common {or 48:4 hams
Environment Performance
It shall be soldered on the glass-epoxy substrate.
No Specification Test Method
1 Temperature Cycling Meet Table 1.
1 Cycle
  1 step : -55+0/-3 / 30+3/-0 min
  2 step : Room Temperature / within 3 min
  3 step : +125+3/-0 / 30+3/-0 min
  4 step : Room Temperature / within 3 min
Total of 10 cycles
Initial values : About 100 to 22000pF, measured after heat
treatment(150+0/-10°C,1hour) and exposure in the room
condition for 48±4 hours.
Then measured after exposure in the room condition for
following hours.
       22 to 47pF : 24±2 hours
      100 to 22000pF : 48±4 hours
About 100 to 22000pF, If it’s doubt, measured after heat
treatment (150+0/-10 °C,1hour) and exposure in the room
condition for 48±4 hours.
2 Humidity Meet Table 4. Temperature : 40±2°C
Table 4 Humidity : 90 to 95%(RH)
Time : 500+24/-0 hours
Initial values : About 100 to 22000pF,measured after heat
treatment (150+0/-10 °C,1hour), and exposure in the room
condition for 48±4 hours.
Then measured after exposure in the room condition for
following hours.
      22 to 47pF : 24±2 hours
      100 to 22000pF : 48±4 hours
About 100~22000pF, If it’s doubt, measured after heat
treatment (150+0/-10 °C,1hour) and exposure in the room
condition for 48±4 hours.
3 Heat Life Temperature : 125±2°C
Test Voltage : Rated Voltage x 200%
Charge Current : 50mA max.
Time : 1000+48/-0 hours
Initial values : About 100 to 22000pF,measured after voltage
treatment (Maximum Operating Temperature±2°C, Rated
Voltage x 200%, 1hour) and exposure in the room condition
for 48±4 hours.
Then measured after exposure in the room condition for
following hours.
       22 to 47pF : 24±2 hours
      100 to 22000pF : 48±4 hours
4 Cold Resistance Temperature : -55±2°C
Time : 500+24/-0 hours
Initial values : About 100 to 22000pF,measured after heat
treatment (150+0/-10 °C,1hour), and exposure in the room
condition for 48±4 hours.
Then measured after exposure in the room condition for
following hours.
      22 to 47pF : 24±2 hours
      100 to 22000pF : 48±4 hours
About 100 to 22000pF, If it’s doubt, measured after heat
treatment (150+0/-10 °C,1hour) and exposure in the room
condition for 48±4 hours.
SPECIFICATIONS AND TEST METHODS
Item
Appearance
No damaged
Cap. Change
Within ±12.5%
I.R.
Meet the initial rated value.
Rdc
22 to 2200pF
0.5max.
22000pF
0.05max.
Appearance
No damaged
Cap. Change
Within ±12.5%
I.R.
Meet the initial rated value.
Rdc 1,2
22 to 2200pF
0.5 max.
22000pF
0.05 max.
JEMCPS-02209D 4
1 Appearance and Dimenswons (Emm-wide paper tape) (m mm) 2 Specificatmn of Tapmg <1) packmg="" nuarmty="" (standard="" unantmy)="" 4000="" pee.="" reel="" (2)="" packmg="" method="" (3)="" sprocket="" ho‘e="" the="" sprocket="" ho‘es="" are="" to="" the="" fight="" as="" the="" tape="" ‘5="" pul‘ed="" toward="" the="" user="" (4)="" base="" tape="" and="" top="" tape="" (5)="" cawty="" there="" snau="" not="" be="" burr="" in="" the="" cavity="" (5)="" mwssmg="" components="" number="" 3="" pul‘="" strength="" of="" top="" tape="" 5nrmn="" (xonly="" for="" nfm1eps.="" snmin)="" 4="" peehng="" offfcrce="" of="" top="" tape="" 0="" in="" to="" can="" (mmimum="" mate="" ‘5="" twee»="" speed="" of="" peeling="" off="" 300="" mm="" mm="" ”/'="" 5="" dimensions="" of="" leader-lave.="" trai‘er="" and="" ree‘="" there="" she”="" be="" \eader—tape="" (top="" tape="" and="" empty="" tape)="" and="" trawler-tape="" (empty="" tape)="" as="" mom.="" (in="" mm)="">
1. Appearance and Dimensions (8mm-wide paper tape)
(in mm)
2. Specification of Taping
(1) Packing quantity (standard quantity)
4000 pcs. / reel
(2) Packing Method
Products shall be packaged in the cavity of the base tape and sealed by top tape and bottom tape.
(3) Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Base tape and Top tape
The base tape and top tape have no spliced point.
(5) Cavity
There shall not be burr in the cavity.
(6) Missing components number
3. Pull Strength of Top Tape
5Nmin.(※Only for NFM18PS, 8Nmin.)
4. Peeling off force of top tape
0.1N to 0.6N (minimum value is typical)
Speed of Peeling off : 300 mm / min
5. Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (top tape and empty tape) and trailer-tape (empty tape) as follows.
(in mm)
P A C K A G I N G
NFM18 Type
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,and are not continuous.
The specified quantity per reel is kept.
F
165 to 180 degree Top tape
Bottom tape Base tape
f
1.5±
4.0±0.1
1.85±0.1
2.0±0.05
3.5±0.05 1.75±0.1
8.0±0.3
0.1
0
1.00.1
4.0±0.1
0.9max.
Direction of feed
Sporocket Hole
a
Empty tape
190 min.
Leader
Trailer
Top tape
2.0±0.5
f
13.0±0.2
f
21.0±0.8
f
18
f
60±
9±
13±1.4
1
0
0
3
Direction of feed
210 min.
160 min.
1
0
Label
Chip thickness
(T)
Dimension
(a)
0.8
1.1max
0.6
0.9max
JEMCPP-02231A 5
ItmRata Please contact us oelore using our products for the applications listed below which require especially high reliability lor the prevention of delects which might directly cause damage to the third party's lile, body or property. Aircralt equipment Aerospace equipment Undersea equipment Power plant control equipment Medical equipment Transportation equipmerit(vehicles.trains,ships,etc.) Trailic signal equipment Disaster prevention / crime prevention equipment Data-processing equipment Application of similar complexity and/or reliability requirements to the applications listed in the above. Storage and Operation condition may be allected by the storage conditions.Please use them promptly alter delivery. Room Temperature ol +5 to +40 arid a Relative Humidity of 20% to 70%. High temperature and humidity conditions and/or prolonged storage may cause deterioration of the packaging materials. It more than six months have elapsed since delivery, check packaging. mounting, etc. before use.
Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
  for the prevention of defects which might directly cause damage to the third party's life, body or property.
   ①Aircraft equipment Aerospace equipment Undersea equipment Power plant control equipment
   ⑤Medical equipment Transportation equipment(vehicles,trains,ships,etc.) Traffic signal equipment
   ⑧Disaster prevention / crime prevention equipment Data-processing equipment
   ⑩Application of similar complexity and/or reliability requirements to the applications listed in the above.
Storage and Operation condition
1. The performance of 3 Terminals Low ESL Chip Multilayer Ceramic Capacitors (EMIFIL) (henceforth just “capacitors”)
  may be affected by the storage conditions.Please use them promptly after delivery.
1-1. Maintain appropriate storage for the capacitors using the following conditions:
Room Temperature of +5 to +40 and a Relative Humidity of 20% to 70%.
High temperature and humidity conditions and/or prolonged storage may cause deterioration of the packaging
 
materials. If more than six months have elapsed since delivery, check packaging, mounting, etc. before use.
In addition, this may cause oxidation of the electrodes. If more than one year has elapsed since delivery,
also check the solderability before use.
1-2. Corrosive gas can react with the termination (external) electrodes or lead wires of capacitors, and result
in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas (e.g.,hydrogen
sulfide, sulfur dioxide, chlorine, ammonia gas etc.).
1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused
by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and electrical
performance may deteriorate. Do not store capacitors under direct sunlight or in high huimidity conditions.
Rating
1.Temperature Dependent Characteristics
1. The electrical characteristics of the capacitor can change with temperature.
1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature
changes. The following actions are recommended in order to ensure suitable capacitance values.
(1) Select a suitable capacitance for the operating temperature range.
(2) The capacitance may change within the rated temperature.
When you use a high dielectric constant type capacitor in a circuit that needs a tight (narrow) capacitance
tolerance (e.g., a time-constant circuit), please carefully consider the temperature characteristics, and
carefully confirm the various characteristics in actual use conditions and the actual system.
!
JEMCPC-05776B 6
2.Measurement of Days tance 3A2]! 11 Voltage AEEIied Current Typical Voltage Applied lo lhe DC capaoilor DC Voltage DC Vollage+AC AC Vollage Pulse Vollage T TUWM l T“ l l l l . (E Maximum possible applied vollage) The ourrenl llowmg belween lhe terminals ol a capacitor shall be less than or equal to the raled current Using the capaCilor beyond this range could lead lo excessive heat 41192 at AEEIied Voltage and Self-healing Temgeralure when measuring at an ambienl lemperature ol 25°C.
2.Measurement of Capacitance
1. Measure capacitance with the voltage and frequency specified in the product specifications.
1-1. The output voltage of the measuring equipment may decrease occasionally when capacitance is high.
Please confirm whether a prescribed measured voltage is impressed to the capacitor.
1-2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage applied.
Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit.
3.Applied Voltage , Applied Current
1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called out in the specifications.
1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage.
(1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the rated DC voltage.
When AC voltage or pulse voltage is applied, the peak-to-peak voltage shall not exceed the rated DC voltage.
(2) Abnormal voltages (surge voltage, static electricity, pulse voltage, etc.) shall not exceed the rated DC voltage.
Typical Voltage Applied to the DC capacitor
DC Voltage DC Voltage+AC AC Voltage Pulse Voltage
(EMaximum possible applied voltage.)
1-2. Influence of over voltage
Over voltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown
of the internal dielectric layers .
The time duration until breakdown depends on the applied voltage and the ambient temperature.
2. The capacitors also have rated currents.
  The current flowing between the terminals of a capacitor shall be less than or equal to the rated current.
  Using thecapacitor beyond this range could lead to excessive heat.
4.Type of Applied Voltage and Self-heating Temperature
1.Confirm the operating conditions to make sure that no large current is flowing into the capacitor due to the
continuous application of an AC voltage or pulse voltage.
When a DC rated voltage product is used in an AC voltage circuit or a pulse voltage circuit, the AC current
or pulse current will flow into the capacitor; therefore check the self-heating condition.
Please confirm the surface temperature of the capacitor so that the temperature remains within the upper limits
of the operating temperature, including the rise in temperature due to self-heating. When the capacitor is
used with a high-frequency voltage or pulse voltage, heat may be generated by dielectric loss.
<Applicable to Rated Voltage of less than 100VDC>
The load should be contained so that the self-heating of the capacitor body remains below 20°C ,
 when measuring at an ambient temperature of 25°C.
Caution
!
E
E
E
E
0
0
0
0
JEMCPC-05776B 7
5. DC Voltage and AC Voltage Charact Please consider the DC voltage characteristics when a capacitor is selected lor use in a DC circuit. Please conlirm the following in order to secure the capacitance. Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit. 6. Cagac' nce Ag' 9 7.Vibration and Shock at another printed circuit board should not be allowed to hit the capacitor in order to avoid
5. DC Voltage and AC Voltage Characteristic
1. The capacitance value of a high dielectric constant type capacitor changes depending on the DC voltage applied.
Please consider the DC voltage characteristics when a capacitor is selected for use in a DC circuit.
1-1. The capacitance of ceramic capacitors may change sharply depending on the applied voltage.
Please confirm the following in order to secure the capacitance.
(1) Determine whether the capacitance change caused by the applied voltage is within the allowed range .
(2) In the DC voltage characteristics, the rate of capacitance change becomes larger as voltage increases,
even if the applied voltage is below the rated voltage.
When a high dielectric constant type capacitor is used in a circuit that requires a tight (narrow) capacitance tolerance
(e.g., a time constant circuit), please carefully consider the voltage characteristics, and confirm the various characteristics
in the actual operating conditions of the system.
2. The capacitance values of high dielectric constant type capacitors changes depending on the AC voltage applied.
Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit.
6. Capacitance Aging
1. The high dielectric constant type capacitors have an Aging characteristic in which the capacitance value decreases
with the passage of time.
When you use a high dielectric constant type capacitors in a circuit that needs a tight (narrow) capacitance tolerance
(e.g., a time-constant circuit), please carefully consider the characteristics of these capacitors, such as their aging,
voltage, and temperature characteristics. In addition, check capacitors using your actual appliances
at the intended environment and operating conditions.
7.Vibration and Shock
1. Please confirm the kind of vibration and/or shock, its condition, and any generation of resonance.
Please mount the capacitor so as not to generate resonance, and do not allow any impact on the terminals.
2. Mechanical shock due to being dropped may cause damage or
a crack in the dielectric material of the capacitor.
Do not use a dropped capacitor because the quality and reliability
may be deteriorated.
3. When printed circuit boards are piled up or handled, the corner
 of another printed circuit board
should not be allowed to hit the capacitor in order to avoid
a crack or other damage to the capacitor.
Caution
Floor
Crack
Mounting printed circuit board
Crack
!
JEMCPC-05776B 8
Soldering and Mounting 1.Moun ng Po on 1-1.Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending ol the board. [Component Direction] Locate chip horizonlal lo lhe ©D:U->D:U and carefully check lhe self-heating ol lhe capacitor belore using If there is signilicant heal radialion from other components, it could lower lhe insulalion resistance ol lhe capacitor or produce excessive heat.
Soldering and Mounting
1.Mounting Position
1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during flexing
or bending the printed circuit board.
1-1.Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board.
  [Component Direction]
Locate chip horizontal to the
direction in which stress acts.
(Bad Example) (Good Example)
[Chip Mounting Close to Board Separation Point]
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface.
A > D *1
(2) Add slits in the board separation part.
A > B
(3) Keep the mounting position of the component away from the board separation surface.
A > C
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
[Mounting Capacitors Near Screw Holes]
When a capacitor is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the capacitor in a position as far away from the screw holes as possible.
 
2. If you mount the capacitor near components that generate heat, take note of the heat from the other components
  and carefully check the self-heating of thecapacitor before using.
 If there is significant heat radiation from other components, it could lower the insulation resistance of the capacitor
  or produce excessive heat.
Caution
Contents of Measures
Screw Hole Recommended
!
1C
1B
1A
Perforation
Slit
A
B
C
D
1A
JEMCPC-05776B 9
2.lnlormalion before Mounting . ainlenance of (he Mounlin ick and lace Machine [I ncorrect] Ef¥flfllzfl\ [Correcl] / E\ /E
2.Information before Mounting
1. Do not re-use capacitors that were removed from the equipment.
2. Confirm capacitance characteristics under actual applied voltage.
3. Confirm the mechanical stress under actual process and equipment use.
4. Confirm the rated capacitance, rated voltage and other electrical characteristics before assembly.
5. Prior to use, confirm the solderability of capacitors that were in long-term storage.
6. Prior to measuring capacitance, carry out a heat treatment for capacitors that were in long-term storage.
7.The use of Sn-Zn based solder will deteriorate the reliability of the MLCC.
Please contact our sales representative or product engineers on the use of Sn-Zn based solder in advance.
3.Maintenance of the Mounting (pick and place) Machine
1. Make sure that the following excessive forces are not applied to the capacitors.
Check the mounting in the actual device under actual use conditions ahead of time.
1-1. In mounting the capacitors on the printed circuit board, any bending force against them shall be kept
to a minimum to prevent them from any damage or cracking. Please take into account the following precautions
and recommendations for use in your process.
(1) Adjust the lowest position of the pickup nozzle so as not to bend the printed circuit board.
  [Incorrect]
  [Correct]
2.Dirt particles and dust accumulated in the suction nozzle and suction mechanism prevent the nozzle from
moving smoothly. This creates excessive force on the capacitor during mounting, causing cracked chips.
Also, the locating claw, when worn out, imposes uneven forces on the chip when positioning, causing cracked chips.
The suction nozzle and the locating claw must be maintained, checked and replaced periodically.
Caution
!
Board Guide
Board
Suction Nozzle
Deflection
Support Pin
JEMCPC-05776B 10
4- Rellow Soldering Temperamve["c) Table 1 Series swam Temperaimevc Recommended Conoilions soldering time must be within the range shown above Drop in solder wettability Solder voids ~Possible occurrence ol whiskering Drop in bonding strenglh Drop in self-alignmenl propenies ~Possible occurrence ol lombstones and/or shifting on lhe land patterns ol lhe circuit board This makes lhe chip more susceplible to mechanical and lhermal stress on lhe board and may cause the chips lo crack.
4-1.Reflow Soldering
1. When sudden heat is applied to the components, the [Standard Conditions for Reflow Soldering]
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both the components and the PCB.
Preheating conditions are shown in table 1. It is required to
keep the temperature differential between the solder and
the components surface (ΔT) as small as possible.
2. When components are immersed in solvent after mounting,
be sure to maintain the temperature difference (ΔT)
between the component and the solvent within the range
shown in the table 1.
[Allowable Reflow Soldering Temperature and Time]
Table 1
Series
NFM
In the case of repeated soldering, the accumulated
Recommended Conditions
soldering time must be within the range shown above.
Lead Free Solder: Sn-3.0Ag-0.5Cu
3. When a capacitor is mounted at a temperature lower than the peak reflow temperature recommended by the
solder manufacturer, the following quality problems can occur. Consider factors such as the placement of
peripheral components and the reflow temperature setting to prevent the capacitor’s reflow temperature from
dropping below the peak temperature specified. Be sure to evaluate the mounting situation beforehand and
verify that none of the following problems occur.
Drop in solder wettability
Solder voids
Possible occurrence of whiskering
Drop in bonding strength
Drop in self-alignment properties
Possible occurrence of tombstones and/or shifting on the land patterns of the circuit board
4. Optimum Solder Amount for Reflow Soldering
4-1. Overly thick application of solder paste results in a excessive solder fillet height.
This makes the chip more susceptible to mechanical and thermal stress on the board and may cause the chips to crack.
4-2. Too little solder paste results in a lack of adhesive strength on the termination, which may result in chips breaking loose
from the PCB.
4-3. Please confirm that solder has been applied smoothly to the termination.
Peak Temperature
240 to 260
Atmosphere
Air or N2
Caution
Chip Dimension(L/W) Code
Temperature Differential
15/JM/18/21/3D/31/41
ΔT190
Lead Free Solder
!
Temperature()
Peak Temperature
Soldering
Gradual
Cooling
Preheating
ΔT
60-120 seconds
30-60 seconds
Time
190
170
150
220
Soldering Temperature()
Soldering Time(s)
280
270
260
250
240
230
220
0
30
60
120
90
JEMCPC-05776B 11
100 m 150pm : NFM15/JM/18/21/3D/31 100 m 200pm : NFM41 I ».;. 07s _ II ‘5‘ 1.2 1.2 0.05 185 I J“ I '33‘. 12 26
[Guideline of solder paste thickness]
 100 to 150μm : NFM15/JM/18/21/3D/31
 100 to 200μm : NFM41
(in mm)
NFM15CC/15PC NFMJMPC
NFM18CC/18PC NFM18PS
NFM21CC/21PC NFM21PS NFM3DCC/3DPC
NFM31PC/31KC NFM41CC/41PC
Make sure not to impose any abnormal mechanical shocks to the PCB.
Caution
Inverting the PCB
!
0.5
0.9
1.4
0.3
0.95
JEMCPC-05776B 12
4-2.Flow Soldering [Standard Condmons for Flow Suldenng] Table 2 Series ~—‘l l—«l Prehealmg condilxons are shown in table 2. ll l5 required to Snldenng melatuveCC Recommended Conditxons 5. Oplxmum Solder Amuunl lor Flow Soldering
4-2.Flow Soldering
1. Do not apply flow soldering to chips not listed in Table 2.
     [Standard Conditions for Flow Soldering]
Table 2
Series
NFM
2. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both of the components and the PCB.
Preheating conditions are shown in table 2. It is required to
[Allowable Flow Soldering Temperature and Time]
keep the temperature differential between the solder and
the components surface (ΔT) as low as possible.
3. Excessively long soldering time or high soldering
temperature can result in leaching of the terminations,
causing poor adhesion or a reduction in capacitance value
due to loss of contact between the inner electrodes and terminations.
4. When components are immersed in solvent after mounting,
be sure to maintain the temperature differential (ΔT)
between the component and solvent within the range
shown in the table 2. In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.
Recommended Conditions
Lead Free Solder: Sn-3.0Ag-0.5Cu
5. Optimum Solder Amount for Flow Soldering
5-1. The top of the solder fillet should be lower than the
thickness of the components. If the solder amount is
excessive, the risk of cracking is higher during
board bending or any other stressful condition.
Soldering Peak Temperature
250 to 260
Atmosphere
Air or N2
Preheating Peak Temperature
140 to 160
Caution
Chip Dimension(L/W) Code
Temperature Differential
3D/31/41
ΔT150
Lead Free Solder
!
Soldering mperature()
Soldering Time(s)
280
270
260
250
240
230
220
0
10
20
40
30
Temperature()
Soldering
Peak
Temperature
Preheating
Peak
Temperature
30-90 seconds
Preheating
5 seconds max.
Time
Gradual
Cooling
Soldering
ΔT
Up to Chip Thickness
Adhesive
in section
JEMCPC-05776B 13
4-3.Correclion 0| Soldered Portion Table 3 2-1. ll the distance lrom the hot air outlet ol the spot heater to the component is too close, cracks may occur due to Table 4 Distance 5mm or more Hot Air Application angle 45” "Figure 1 Hot Air Temperature Nozzle Outlet 400°C max. Less than 10 seconds Application Time (3216M / 1206 size or smaller) Less than 30 seconds (4516M / 1806 size) Onehole Nozz E an Angle ol during board bending or any other stressful condition.
4-3.Correction of Soldered Portion
When sudden heat is applied to the capacitor, distortion caused by the large temperature difference occurs internally,
and can be the cause of cracks. Capacitors also tend to be affected by mechanical and thermal stress depending
on the board preheating temperature or the soldering fillet shape, and can be the cause of cracks.
Please refer to "1. PCB Design" or "3. Optimum solder amount" for the solder amount and the fillet shapes.
1. Correction with a Soldering Iron
1-1. In order to reduce damage to the capacitor, be sure to preheat the capacitor and the mounting board.
Preheat to the temperature range shown in Table 3. A hot plate, hot air type preheater, etc. can be used for preheating.
1-2. After soldering, do not allow the component/PCB to cool down rapidly.
1-3. Perform the corrections with a soldering iron as quickly as possible. If the soldering iron is applied too long,
there is a possibility of causing solder leaching on the terminal electrodes, which will cause deterioration of the
adhesive strength and other problems.
Table 3
* Please do not rework with soldering iron for NFMJM series due to cracking concern.
* Lead Free Solder: Sn-3.0Ag-0.5Cu
* Please manage Δ T in the temperature of soldering iron and the preheating temperature.
2. Correction with Spot Heater
Compared to local heating with a soldering iron, hot air heating by a spot heater heats the overall component
and board, therefore, it tends to lessen the thermal shock. In the case of a high density mounted board,
a spot heater can also prevent concerns of the soldering iron making direct contact with the component.
2-1. If the distance from the hot air outlet of the spot heater to the component is too close, cracks may occur due to
thermal shock. To prevent this problem, follow the conditions shown in Table 4.
2-2. In order to create an appropriate solder fillet shape, it is recommended that hot air be applied at the angle shown
in Figure 1.
Table 4
Distance 5mm or more
Hot Air Application angle 45° *Figure 1
Hot Air Temperature Nozzle Outlet 400°C max.
Less than 10 seconds
Application Time (3216M / 1206 size or smaller)
Less than 30 seconds
(4516M / 1806 size) (3216M , 4516M : Metric size code)
3. Optimum solder amount when re-working with a soldering iron
3-1. If the solder amount is excessive, the risk of cracking is higher
    during board bending or any other stressful condition.
Too little solder amount results in a lack of adhesive strength
on the termination, which may result in chips breaking
loose from the PCB.
Please confirm that solder has been applied smoothly is in section
and rising to the end surface of the chip.
3-2. A soldering iron with a tip of ø3mm or smaller should be used.
It is also necessary to keep the soldering iron from touching
the components during the re-work.
3-3. Solder wire with ø0.5mm or smaller is required for soldering.
NFM
15
340 max.
150 min.
ΔT190
Air
NFM
18/21/3D/31/41
350 max.
Caution
Series
Chip Dimension
(L/W) Code
Temperature of
Soldering Iron Tip
Preheating
Temperature
Temperature
Differential(ΔT)
Atmosphere
!
One-hole Nozzle
an Angle of 45°
[Figure 1]
Solder Amount
JEMCPC-05776B 14
5.Washing 6.Eleclrical Tes! on Primed Circ i: Board 7.Prinled Circuit Board Cro in 2. Check me cropping melhod forthe prmled cxrcuit board m advance
5.Washing
Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips
or broken solder joints. Before starting your production process, test your cleaning equipment / process to insure
it does not degrade the capacitors.
6.Electrical Test on Printed Circuit Board
1. Confirm position of the support pin or specific jig, when inspecting the electrical performance of a
capacitor after mounting on the printed circuit board.
1-1. Avoid bending the printed circuit board by the pressure of a test-probe, etc.
The thrusting force of the test probe can flex the PCB, resulting in cracked chips or open solder
joints. Provide support pins on the back side of the PCB to prevent warping or flexing.
Install support pins as close to the test-probe as possible.
1-2. Avoid vibration of the board by shock when a test -probe contacts a printed circuit board.
[Not Recommended] [Recommended]
7.Printed Circuit Board Cropping
1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that
caused bending or twisting the board.
1-1. In cropping the board, the stress as shown may cause the capacitor to crack.
Cracked capacitors may cause deterioration of the insulation resistance, and result in a short.
Avoid this type of stress to a capacitor.
[Bending] [Twisting]
2. Check the cropping method for the printed circuit board in advance.
2-1. Printed circuit board cropping shall be carried out by using a jig or an apparatus (Disc separator, router
type separator, etc.) to prevent the mechanical stress that can occur to the board.
* When a board separation jig or disc separator is used, if the following precautions are not observed,
a large board deflection stress will occur and the capacitors may crack.
Use router type separator if at all possible.
Notes
Hand and nipper
separation apply a high
level of stress.
Use another method.
· Board handling
· Board bending direction
· Layout of capacitors
· Board handling
· Layout of slits
· Design of V groove
· Arrangement of blades
· Controlling blade life
Board handling
Level of stress on board
High
Medium
Medium
Low
Recommended
×
*
*
Caution
Board Separation Method
Hand Separation
Nipper Separation
(1) Board Separation Jig
Board Separation Apparatus
2) Disc Separator
3) Router Type Separator
!
Peeling
Test-probe
Support Pin
Test-probe
1A
JEMCPC-05776B 15
(Measures) [Hand Separation] rn Pnnted 2mm Dlrection ol ioad Load paint a 3} board Ii ii is difficuii Io introduce a rouier Iype separator, impiement the following measures [Cross-section Diagram] :{2 % [V-groove Design] LJ
(1) Example of a suitable jig
[In the case of Single-side Mounting]
An outline of the board separation jig is shown as follows.
Recommended example: Stress on the component mounting position can be minimized by holding the
portion close to the jig, and bend in the direction towards the side where the capacitors are mounted.
Not recommended example: The risk of cracks occurring in the capacitors increases due to large stress
being applied to the component mounting position, if the portion away from the jig is held and bent in the
direction opposite the side where the capacitors are mounted.
[Outline of jig] [Hand Separation]
[In the case of Double-sided Mounting]
Since components are mounted on both sides of the board, the risk of cracks occurring can not be avoided with the
above method. Therefore, implement the following measures to prevent stress from being applied to the components.
  (Measures)
(1) Consider introducing a router type separator.
   If it is difficult to introduce a router type separator, implement the following measures.
(Refer to item 1. Mounting Position)
(2) Mount the components parallel to the board separation surface.
(3) When mounting components near the board separation point, add slits in the separation position
near the component.
(4) Keep the mounting position of the components away from the board separation point.
(2) Example of a Disc Separator
An outline of a disc separator is shown as follows. As shown in the Principle of Operation, the top
blade and bottom blade are aligned with the V-grooves on the printed circuit board to separate the board.
In the following case, board deflection stress will be applied and cause cracks in the capacitors.
(1) When the adjustment of the top and bottom blades are misaligned, such as deviating in the top-bottom,
left-right or front-rear directions
(2) The angle of the V groove is too low, depth of the V groove is too shallow, or the V groove is misaligned
top-bottom
IF V groove is too deep, it is possible to brake when you handle and carry it. Carefully design depth of the
V groove with consideration about strength of material of the printed circuit board.
[ Outline of Machine ] [ Principle of Operation ] [ Cross-section Diagram ]
[Disc Separator]
Top Blade Top Blade Top Blade Top Blade
Bottom Blade Bottom Blade Bottom Blade Bottom Blade
[V-groove Design]
Example of Recommended
V-groove Design
Not Recommended
Left-right Misalignment
Low-Angle
Depth too Shallow
Depth too Deep
Caution
Recommended
Not recommended
Recommended
Not recommended
Top-bottom Misalignment
Left-right Misalignment
Front-rear Misalignment
Printed Circuit Board
Top Blade
V-groove
Bottom Blade
Top Blade Printed Circuit Board
V-groove
!
Board Cropping Jig
V-groove
Printed Circuit Board
Printed circuit
board
Components
Load point
Direction of
load
Printed circuit
board
Component
s
Load point
Direction of load
JEMCPC-05776B 16
Tne router type separamr peflorms cutting by a router B ssembly capacimrs have been moumed on (he opposne side. QB) or the bending may damage mounted components on the board. 1 Socket gia—
(3) Example of Router Type Separator
The router type separator performs cutting by a router
rotating at a high speed. Since the board does not
bend in the cutting process, stress on the board can
be suppressed during board separation.
When attaching or removing boards to/from the router type
separator, carefully handle the boards to prevent bending.
8. Assembly
1. Handling
If a board mounted with capacitors is held with one hand, the board may bend.
Firmly hold the edges of the board with both hands when handling.
If a board mounted with capacitors is dropped, cracks may occur in the capacitors.
Do not use dropped boards, as there is a possibility that the quality of the capacitors may be impaired.
2. Attachment of Other Components
2-1. Mounting of Other Components
Pay attention to the following items, when mounting other components on the back side of the board after
capacitors have been mounted on the opposite side.
When the bottom dead point of the suction nozzle is set too low, board deflection stress may be applied
to the capacitors on the back side (bottom side), and cracks may occur in the capacitors.
· After the board is straightened, set the bottom dead point of the nozzle on the upper surface of the board.
· Periodically check and adjust the bottom dead point.
2-2. Inserting Components with Leads into Boards
When inserting components (transformers, IC, etc.) into boards, bending the board may cause cracks in the
capacitors or cracks in the solder. Pay attention to the following.
· Increase the size of the holes to insert the leads, to reduce the stress on the board during insertion.
· Fix the board with support pins or a dedicated jig before insertion.
· Support below the board so that the board does not bend. When using support pins on the board,
periodically confirm that there is no difference in the height of each support pin.
2-3. Attaching/Removing Sockets and/or Connectors
Insertion and removal of sockets and connectors,etc., might cause the board to bend.
Please insure that the board does not warp during insertion and removal of sockets and connectors, etc.,
    or the bending may damage mounted components on the board.
2-4. Tightening Screws
The board may be bent, when tightening screws, etc. during the attachment of the board to a shield or
chassis. Pay attention to the following items before performing the work.
· Plan the work to prevent the board from bending.
· Use a torque screwdriver, to prevent over-tightening of the screws.
· The board may bend after mounting by reflow soldering, etc. Please note, as stress may be applied
to the chips by forcibly flattening the board when tightening the screws.
Caution
!
Suction Nozzle
Component with Leads
Socket
Screwdriver
[ Outline Drawing ] Router
JEMCPC-05776B 17
Others 1. Under Ogemion of Eguigmenl 2. Others
Others
1. Under Operation of Equipment
1-1. Do not touch a capacitor directly with bare hands during operation in order to avoid the danger of an electric shock.
1-2. Do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit).
Do not expose a capacitor to a conductive liquid, inducing any acid or alkali solutions.
1-3. Confirm the environment in which the equipment will operate is under the specified conditions.
Do not use the equipment under the following environments.
(1) Being spattered with water or oil.
(2) Being exposed to direct sunlight.
(3) Being exposed to ozone, ultraviolet rays, or radiation.
(4) Being exposed to toxic gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.)
(5) Any vibrations or mechanical shocks exceeding the specified limits.
(6) Moisture condensing environments.
1-4. Use damp proof countermeasures if using under any conditions that can cause condensation.
2. Others
2-1. In an Emergency
(1) If the equipment should generate smoke, fire, or smell, immediately turn off or unplug the equipment.
If the equipment is not turned off or unplugged, the hazards may be worsened by supplying continuous power.
(2) In this type of situation, do not allow face and hands to come in contact with the capacitor or burns may be caused
by the capacitor's high temperature.
2-2. Disposal of waste
When capacitors are disposed of, they must be burned or buried by an industrial waste vendor with the appropriate
licenses.
2-3. Circuit Design
(1) Addition of Fail Safe Function
Capacitors that are cracked by dropping or bending of the board may cause deterioration of the
insulation resistance, and result in a short. If the circuit being used may cause an electrical shock,
smoke or fire when a capacitor is shorted, be sure to install fail-safe functions, such as a fuse,
to prevent secondary accidents.
(2) This series are not safety standard certified products.
2-4. Remarks
Failure to follow the cautions may result, worst case, in a short circuit and smoking when the product is used.
The above notices are for standard applications and conditions. Contact us when the products are used in special
mounting conditions.
Select optimum conditions for operation as they determine the reliability of the product after assembly.
The data herein are given in typical values, not guaranteed ratings.
Caution
!
JEMCPC-05776B 18
Rating 1.09am ng Temgeralure 2.Atmosghere Surround gs gaseous and liguidl electrodes may result in breakdown when the capacitor is exposed lo corrosive or volatile gases or solvents 3.Piezo-eleclric Phenomenon
Rating
1.Operating Temperature
1. The operating temperature limit depends on the capacitor.
1-1. Do not apply temperatures exceeding the maximum operating temperature.
It is necessary to select a capacitor with a suitable rated temperature that will cover the operating temperature range.
It is also necessary to consider the temperature distribution in equipment and the seasonal temperature variable
factor.
1-2. Consider the self-heating factor of the capacitor
The surface temperature of the capacitor shall not exceed the maximum operating temperature including self-heating.
2.Atmosphere Surroundings (gaseous and liquid)
1. Restriction on the operating environment of capacitors.
1-1. Capacitors, when used in the above, unsuitable, operating environments may deteriorate due to the corrosion
of the terminations and the penetration of moisture into the capacitor.
1-2. The same phenomenon as the above may occur when the electrodes or terminals of the capacitor are subject
to moisture condensation.
1-3. The deterioration of characteristics and insulation resistance due to the oxidization or corrosion of terminal
  electrodes may result in breakdown when the capacitor is exposed to corrosive or volatile gases or solvents
for long periods of time.
3.Piezo-electric Phenomenon
1. When using high dielectric constant type capacitors in AC or pulse circuits, the capacitor itself vibrates
at specific frequencies and noise may be generated.
Moreover, when the mechanical vibration or shock is added to capacitor, noise may occur.
Notice
JEMCPC-05776B 19
Soldering and Mounting 1.PCB Design Pattern Forms Cf % in section in section in section in section \% in section in section
Soldering and Mounting
1.PCB Design
1. Notice for Pattern Forms
1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted
directly on the substrate.
They are also more sensitive to mechanical and thermal stresses than leaded components.
Excess solder fillet height can multiply these stresses and cause chip cracking.
When designing substrates, take land patterns and dimensions into consideration to eliminate the possibility
of excess solder fillet height.
1-2. There is a possibility of chip cracking caused by PCB expansion/contraction with heat, because stress
on a chip is different depending on PCB material and structure.When the thermal expansion coefficient
greatly differs between the board used for mounting and the chip,it will cause cracking of the chip due to
the thermal expansion and contraction. When capacitors are mounted on a fluorine resin printed circuit
board or on a single-layered glass epoxy board, it may also cause cracking of the chip for the same reason.
1-3. Because noise is suppressed by shunting unwanted high-frequency components to the ground,
when designing a land for capacitor, design the ground pattern to be as large as possible in order to
better bring out this characteristic.
As shown in the figure below, noise countermeasures can be made more effective by using a via or etc.
to connect the ground pattern on the chip mounting surface to a larger ground pattern on the inner layer.
Pattern Forms
in section in section
in section in section
in section in section
Placing of Leaded
Components
after Chip Component
Lateral Mounting
Notice
Prohibited
Correct
Placing Close to Chassis
Placing of Chip
Components
and Leaded
Components
Chassis
Solder (ground)
Electrode Pattern
Solder Resist
Lead Wire
Solder Resist
Lead Wire
Soldering Iron
Solder Resist
ソ
Solder Resist
JEMCPC-05776B 20
- Land Pattern l:l Land Pattern |:| Solder Resist 950k]!!! Resist (m mm) Reflow Soldering Fllled vla 0.15 Smal dlameterthm hale porno; Small dlameter film hole 901 '9. o 0.05 1.2 Small diameter mm hole '01-'03 Small diameter (hm hole no.4 0!"! «N
2. Land Dimensions
Please confirm the suitable land dimension by evaluating of the actual SET / PCB.
(in mm)
Reflow Soldering
NFM21PS
Notice
Series
Land Dimensions
NFM15CC
NFM15PC
NFMJMPC
NFM18CC
NFM18PC
NFM18PS
NFM21CC
NFM21PC
NFM21PS
NFM15CC/NFM15PC
NFMJMPC
NFM18CC/NFM18PC
NFM18PS
NFM21CC/NFM21PC
0
0.25
0.5*
0.9*
1.4
0.3
0.3
0.95
Filled viaφ0.15
In case of changing the land
dimentions marked by
*,
a solder bridge between
terminations of the chip could
occur.
In this case, please contact us
before change.
JEMCPC-05776B 21
muRutn - Land Pattem l:l LandPattern l:| SolderResist + Solder ReSlSt (m mm) Rellow Soldering Cmp mounting side Small diameter Ihru hole 90.4 NFMSDPC NFM41 PC Small diameter tlru hole 90.4 mm or more an case of 10A) Small diameter mm hole 00.4 NFMSDPC l—Ll NFM41 PC (2 d Small diameterthru hole 00.4 10mm 07 more 0" caseof For example, m case of 10A, slgnal land pattern widlh 10A)
(in mm)
Reflow Soldering Chip mounting side
NFM3DCC/NFM3DPC/NFM31PC/NFM41CC/NFM41PC
a b c d e f g
NFM3DCC
NFM3DPC
1.0 1.4 2.5 4.4 1.0 2.0 2.4
NFM31PC 1.0 1.4 2.5 4.4 1.2 2.6 3.0
NFM41CC
NFM41PC
1.5 2.0 3.5 6.0 1.2 2.6 3.0
NFM31KC *1
*1 For large current design, width of signal land pattern
should be wider not less than 1mm per 1A (1mm/A).
For example, in case of 10A, signal land pattern width
should be 10mm or more.
(1mm/A*10A=10mm)
Flow Soldering Chip mounting side
NFM3DCC/NFM3DPC/NFM31PC/NFM41CC/NFM41PC
a b c d e f g
NFM3DCC
NFM3DPC
1.0 1.4 2.5 4.4 1.0 2.0 2.4
NFM31PC 1.0 1.4 2.5 4.4 1.2 2.6 3.0
NFM41CC
NFM41PC
1.5 2.0 3.5 6.0 1.2 2.6 3.0
NFM31KC *1
*1 For large current design, width of signal land pattern
should be wider not less than 1mm per 1A (1mm/A).
For example, in case of 10A, signal land pattern width
should be 10mm or more.
(1mm/A*10A=10mm)
Notice
Series
Land Dimensions
NFM3DCC
NFM3DPC
NFM31PC
NFM31KC
NFM41CC
NFM41PC
Part Number
Dimensions
Part Number
Dimensions
JEMCPC-05776B 22
depending on the sizeand material of the board. 2.ltem to be con med for Flow sorder g If you want to temporarily attach the capacitor to the board using an adhesive agent belore soldering the capacitor, lirst be sure that the conditions are appropriate lor affixing the capacitor. If the dimensions of the land, the type of adhesive,the amount of coating, the contact surface area, the curing temperature. or other conditions are inappropriate. the characteristics of the capacitor may deteriorate. (1) Selection of Adhesive Epoxy resins are a typical class of adhesive. To select the proper adhesive, consider the folloWing points. 1) There must be enough adhesive strength to prevent the component lrom loosening or slipping during the mounting process. 2) The adhesive strength must not decrease when exposed to moisture during soldering. 3) The adhesive must have good coatability and shape retention properties. 4) The adhesive must have a long pot life. 5) The curing time must be short. 6) The adhesive must not be corrosive to the exterior of the capacitor or the board. 7) The adhesive must have good insulation properties. 8) The adhesive must not emit toxic gases or otherwise be harmful to health. 9) The adhesive must be lree ol halogenated compounds. (2) Use the lollowing illustration as a guide to the amount of adhesive to apply. Chip Dimension(L/W) Code:3D/31/41 fyi \. ,I ‘. |:| . \‘i / i l \ / l Bonding agent i l Coating position of bandlng agent
3. Board Design
When designing the board, keep in mind that
the amount of strain which occurs will increase
  depending on the sizeand material of the board.
2.Item to be confirmed for Flow sordering
  If you want to temporarily attach the capacitor
  to the board using an adhesive agent before
  soldering the capacitor, first be sure that the
  conditions are appropriate for affixing the
  capacitor. If the dimensions of the land, the type of adhesive,the amount of coating, the contact surface area,
  the curing temperature, or other conditions are inappropriate, the characteristics of the capacitor may deteriorate.
1. Selection of Adhesive
1-1. Depending on the type of adhesive, there may be a decrease in insulation resistance. In addition, there is a chance
that the capacitor might crack from contractile stress due to the difference in the contraction rate of the capacitor
and the adhesive.
1-2. If there is not enough adhesive, the contact surface area is too small, or the curing temperature or curing time
are inadequate, the adhesive strength will be insufficient and the capacitor may loosen or become disconnected
during transportation or soldering. If there is too much adhesive, for example if it overflows onto the land, the result
could be soldering defects, loss of electrical connection, insufficient curing, or slippage after the capacitor is mounted.
Furthermore, if the curing temperature is too high or the curing time is too long, not only will the adhesive strength
be reduced, but solderability may also suffer due to the effects of oxidation on the terminations (outer electrodes)
of the capacitor and the land surface on the board.
 (1) Selection of Adhesive
 Epoxy resins are a typical class of adhesive. To select the proper adhesive, consider the following points.
 1) There must be enough adhesive strength to prevent the component from loosening or slipping during the
    mounting process.
 2) The adhesive strength must not decrease when exposed to moisture during soldering.
  3) The adhesive must have good coatability and shape retention properties.
  4) The adhesive must have a long pot life.
 5) The curing time must be short.
  6) The adhesive must not be corrosive to the exterior of the capacitor or the board.
  7) The adhesive must have good insulation properties.
  8) The adhesive must not emit toxic gases or otherwise be harmful to health.
  9) The adhesive must be free of halogenated compounds.
 (2) Use the following illustration as a guide to the amount of adhesive to apply.
  Chip Dimension (L/W) Code:3D/31/41
Notice
Relationship with amount of strain to the board thickness, length, width, etc.]
ε=
3PL
2Ewh2
Relationship between load and strain
When the load is constant, the following relationship can be established.
· As the distance between the supporting points (L) increases,the amount of strain also increases.
→Reduce the distance between the supporting points.
· As the elastic modulus (E) decreases, the amount of strain increases.
→Increase the elastic modulus.
· As the board width (w) decreases, the amount of strain increases.
→Increase the width of the board.
· As the board thickness (h) decreases, the amount of strain increases.
→Increase the thickness of the board.
Since the board thickness is squared, the effect on the amount of strain becomes even greater.
εStrain on center of board (μst)
LDistance between supporting points (mm)
w Board width (mm)
h Board thickness (mm)
E Elastic modulus of board (N/m2=Pa)
Y Deflection (mm)
P Load (N)
Y
P
h
w
L
JEMCPC-05776B 23
so apply llux thirily arid evenly throughout. (A foaming system is generally used for flow solderririg.) sullicient cleaning. Use flux With a halide coritent ol 0.1% max. Please check the quality of capacitor after mounting. Set temperature and time to ensure that leaching of the mounted on substrate. @913 + fl 3.Rellow soldering Strong acidic flux can corrode the capacitor arid degrade its perlormance. 4 Was ng 5.Coating mav cause the destruction and deterioration of the caoacitor such as a crack or oeelino. arid lead to the deterioration 3 The halogen system substance and organic acid are included in coating material, and a chip corrodes by the kind of Coating material. Do not use strong acid type.
2.Flux
2-1. An excessive amount of flux generates a large quantity of flux gas, which can cause a deterioration of solderability,
  so apply flux thinly and evenly throughout. (A foaming system is generally used for flow solderring.)
2-2. Flux containing too high a percentage of halide may cause corrosion of the terminations unless there is
  sufficient cleaning. Use flux with a halide content of 0.1% max.
2-3. Strong acidic flux can corrode the capacitor and degrade its performance.
Please check the quality of capacitor after mounting.
3.Leaching of the terminations
Set temperature and time to ensure that leaching of the
terminations does not exceed 25% of the chip end
area as a single chip (full length of the edge A-B-C-D
shown at right) and 25% of the length A-B shown as
mounted on substrate.
3.Reflow soldering
The flux in the solder paste contains halogen-based substances and organic acids as activators.
  Strong acidic flux can corrode the capacitor and degrade its performance.
Please check the quality of capacitor after mounting.
4.Washing
1. Please evaluate the capacitor using actual cleaning equipment and conditions to confirm the quality,
and select the solvent for cleaning.
2. Unsuitable cleaning may leave residual flux or other foreign substances, causing deterioration of
electrical characteristics and the reliability of the capacitors.
5.Coating
1. A crack may be caused in the capacitor due to the stress of the thermal contraction of the resin during curing process.
The stress is affected by the amount of resin and curing contraction. Select a resin with low curing contraction.
The difference in the thermal expansion coefficient between a coating resin or a molding resin and the capacitor
may cause the destruction and deterioration of the capacitor such as a crack or peeling, and lead to the deterioration
of insulation resistance or dielectric breakdown.
Select a resin for which the thermal expansion coefficient is as close to that of the capacitor as possible.
A silicone resin can be used as an under-coating to buffer against the stress.
2. Select a resin that is less hygroscopic.
Using hygroscopic resins under high humidity conditions may cause the deterioration of the insulation resistance
of a capacitor. An epoxy resin can be used as a less hygroscopic resin.
3The halogen system substance and organic acid are included in coating material, and a chip corrodes
  by the kind of Coating material. Do not use strong acid type.
Notice
A
B
D
C
Termination
As a Single Chip
As Mounted on Substrate
A
B
JEMCPC-05776B 24
Others 1.1ransgorla on low air temperature : -40 change at temperature air/air : -25 /+25 low air pressure :30 kPa change at air pressure :6 kPa/mint capacitors, the capacitance may change depending on the operating conditions in the actual system. which wiii aiiect the capacitance value of the capacitcrt
Others
1.Transportation
1. The performance of a capacitor may be affected by the conditions during transportation.
1-1. The capacitors shall be protected against excessive temperature, humidity and mechanical force during transportation.
(1) Climatic condition
 ・ low air temperature : -40
change of temperature air/air : -25/+25
low air pressure : 30 kPa
change of air pressure : 6 kPa/min.
(2) Mechanical condition
Transportation shall be done in such a way that the boxes are not deformed and forces are not directly passed
on to the inner packaging.
1-2. Do not apply excessive vibration, shock, or pressure to the capacitor.
(1) When excessive mechanical shock or pressure is applied to a capacitor, chipping or cracking may occur
in the ceramic body of the capacitor.
(2) When the sharp edge of an air driver, a soldering iron, tweezers, a chassis, etc. impacts strongly on the surface
of the capacitor, the capacitor may crack and short-circuit.
1-3. Do not use a capacitor to which excessive shock was applied by dropping etc.
A capacitor dropped accidentally during processing may be damaged.
2.Characteristics Evaluation in the Actual System
1. Evaluate the capacitor in the actual system,to confirm that there is no problem with the performance and specification
values in a finished product before using.
2. Since a voltage dependency and temperature dependency exists in the capacitance of high dielectric type ceramic
capacitors, the capacitance may change depending on the operating conditions in the actual system.
Therefore,be sure to evaluate the various characteristics, such as the leakage current and noise absorptivity,
which will affect the capacitance value of the capacitor.
3. In addition,voltages exceeding the predetermined surge may be applied to the capacitor by the inductance in
the actual system. Evaluate the surge resistance in the actual system as required.
4. The effects of noise suppression can vary depending on the usage conditions, including differences in the circuit
or IC to be used, the type of noise, the shape of the pattern to be mounted, and the mounting location.
Be sure to verify the effect on the actual device in advance.
Notice
JEMCPC-05776B 25
1.Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. 2.Your are requested not to use our product deviating from this product specification. 3.We consider it not appropriate to include any terms and conditions with regard to the business transaction in the product specifications, drawings or other technical documents. Therefore, it your technical documents as above include such terms and conditions such as warranty clause, product liability clause, or intellectual property infringement liability clause, they will be deemed to be invalid.
1.Please make sure that your product has been evaluated in view of your specifications with our
product being mounted to your product.
2.Your are requested not to use our product deviating from this product specification.
3.We consider it not appropriate to include any terms and conditions with regard to the business
transaction in the product specifications, drawings or other technical documents.
Therefore, if your technical documents as above include such terms and conditions such as warranty clause,
product liability clause, or intellectual property infringement liability clause, they will be deemed to
be invalid.
NOTE
!
JEMCPC-05776B 26

Products related to this Datasheet

CAP FEEDTHRU 1000PF 20% 16V 0603
CAP FEEDTHRU 1000PF 20% 16V 0603
CAP FEEDTHRU 1000PF 20% 16V 0603