GRM21BR72H103KW09x Ref Sheet Datasheet by Murata Electronics

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ur Cap Change (RelTemp) (25 vs) 5.Package EMBOSSED W8P4 EMBOSSED W8P4
GRM21BR72H103KW09_ (0805, X7R:EIA, 10000pF, DC500V)
_: packaging code Reference Sheet
1.Scope
  
2.MURATA Part NO. System
(Ex.)
3. Type & Dimensions
(Unit:mm)
4.Rated value
Soldering Method
Flow / Reflow
5.Package
Product specifications in this catalog are as of Sep.13,2016,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
(3) Temperature Characteristics
(Public STD Code):X7R(EIA)
g
0.3 min.
(5) Nominal
Capacitance
mark
(4)
Rated
Voltage
Packaging Unit
DC 500 V
Temp. Range
(Ref.Temp.)
(8) Packaging
-55 to 125 °C
(25 °C)
0.7 min.
(1)-1 L
2.0±0.2
(1)-2 W
1.25±0.2
This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment.Do not use these products in any automotive power
train or safety equipment including battery chargers for electric vehicles and plugin hybrids.
(2) T
e
Chip Monolithic Ceramic Capacitor for General
Specifications and Test
Methods
(Operating
Temp. Range)
±10 %
(6)
Capacitance
Tolerance
10000 pF
1.25±0.2
-55 to 125 °C
L
f180mm Reel
EMBOSSED W8P4
3000 pcs./Reel
K
f330mm Reel
EMBOSSED W8P4
10000 pcs./Reel
(1)L/W
Dimensions
(2)T
Dimensions
(3)Temperature
Characteristics
(4)Rated
Voltage
(5)Nominal
Capacitance
(6)Capacitance
Tolerance
(8)Packaging Code
(7)Murata’s Control
Code
GRM 21 BR7 2H 103 K W09 L
GRM21BR72H103KW09-01 1
Specifications and Test Methods
No
1 Appearance No defects or abnormalities. Visual inspection.
2 Dimension Within the specified dimensions. Using calipers and micrometers.
3 Voltage proof No defects or abnormalities.
Measurement Point   : Between the terminations
Test Voltage         : DC750V(150% of the rated voltage)
Applied Time :
1 to 5 s
Charge/discharge current :
50mA max.
4 Insulation Resistance(I.R.)
C 0.01µF : 100 MΩ µF or more Measurement Point    : Between the terminations
C < 0.01µF : 10000 MΩ or more Measurement Voltage :
DC500+/-50V
Charging Time :
60+/-5s
Measurement Temperature:
Room Temperature
5 Capacitance Shown in Rated value.
Measurement Temperature:
Room Temperature
Measurement Frequency :
1.0+/-0.1kHz
6 Dissipation Factor (D.F.) 0.025 max.
Measurement Voltage :
AC1.0+/-0.2V(r.m.s.)
7
Temperature R7 : Within +/-15% (-55°C to +125°C) The capacitance change should be measured after 5 min.
Characteristics at each specified temp. stage.
of Capacitance Capacitance value as a reference is the value in step 3.
Pretreatment
Perform a heat treatment at 150+0/-10°C for 1h+/-5min and then
let sit for 24+/-2h at room condition*.
8 Vibration Appearance No defects or abnormalities. Solder the capacitor on the test substrate A shown in "Complement of Test
method”.
Capacitance Within the specified initial value. Kind of Vibration : A simple harmonic motion
10Hz to 55Hz to 10Hz (1min)
Total amplitude : 1.5mm
D.F. Within the specified initial value. This motion should be applied for a period of 2h in each 3 mutually
perpendicular directions(total of 6h).
9 Solderability 95% of the terminations is to be soldered evenly and Test Method : Solder bath method
continuously.
Flux             : Solution of rosin ethanol 25(wt)%
Preheat :
80 to 120 for 10s to 30s
Solder : Sn-3.0Ag-0.5Cu (Lead Free Solder)
Solder Temp. :
245+/-5
Immersion time : 2+/-0.5s
Immersing in speed   : 25+/-2.5mm/s.
10
Resistance Appearance No defects or abnormalities. Test Method : Solder bath method
to Solder : Sn-3.0Ag-0.5Cu (Lead Free Solder)
Soldering Capacitance Within +/-10% Solder Temp. : 260+/-5
Heat
Change Immersion time :
10+/-1s
Immersing in speed   : 25+/-2.5mm/s.
D.F. Within the specified initial value. Exposure Time : 24+/-2h at room condition*.
Preheat :
GRM31 size max.: 120 to 150 for 1 min
    
GRM32 size min. : 100 to 120 for 1 min
I.R. Within the specified initial value. and 170 to 200 for 1 min
Pretreatment
Voltage proof No defects. Perform a heat treatment at 150+0/-10°C for 1h+/-5min and then
let sit for 24+/-2h at room condition*.
*Room Condition : Temperature:15 to 35°C, Relative humidity:45 to 75%, Atmosphere pressure:86 to 106kPa
Item
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384
Step 1 2 3 4 5
Temp.(C) 25±2 -55±3 25±2 125±2 25±2
Step Temp. (°C) Time (min)
1 -55±3 30±3
2 Room Temp. 2 to 3
3 125±2 30±3
4 Room Temp. 2 to 3
c
b
a
Solder Resist
Chip Capacitor
Land
c
b
a
Solder Resist
Chip Capacitor
Land
Step
Temperature(C)
1
Reference Temp.+/-2
2
Min.Operating Temp. +/-3
3
Reference Temp. +/-2
4
Max.Operating Temp. +/-3
5
Reference Temp. +/-2
JEMCGS-03070A 2
No
11 Adhesive Strength No removal of the terminations or other defect Solder the capacitor on the test substrate A shown in "Complement of Test
of Termination should occur. method”.
Applied Direction : In parallel with the test substrate and vertical with the
capacitor side.
12 Substrate Appearance No defects or abnormalities. Solder the capacitor on the test substrate B shown in "Complement of Test
Bending test method”.
Then apply the force in the direction shown in “Test Method of Substrate
Bending test” of “Complement of Test method”.
Capacitance Within +/-12.5% Flexure     : 1mm
Change Holding Time   : 5+/-1s
Soldering Method : Reflow soldering
13
Temperature Appearance No defects or abnormalities. Fix the capacitor to the supporting Test substrate A (glass epoxy board)
Sudden Change shown in “Complement of Test method”.
Perform the 5 cycles according to the four heat treatments
Capacitance Within +/-7.5% shown in the following table.
Change
D.F. Within the specified initial value.
I.R. Within the specified initial value.
Exposure Time : 24+/-2h at room condition*.
Voltage proof No defects.
Pretreatment
Perform a heat treatment at 150+0/-10°C for 1h+/-5min and then
let sit for 24+/-2h at room condition*.
14 High Appearance No defects or abnormalities. Fix the capacitor to the supporting Test substrate A (glass epoxy board)
Temperature shown in “Complement of Test method”.
High Capacitance Within +/-15% Test Temperature :
40+/-2
Humidity Change Test Humidity : 90% to 95%RH
(Steady) Test Time : 500+24/-0h
D.F. 0.05 max. Applied Voltage : DC500V(DC Rated Voltage)
Exposure Time : 24+/-2h at room condition*.
I.R.
C 0.01µF : 10 MΩ µF or more
C < 0.01µF : 1000 MΩ or more
Pretreatment
Apply test voltage for 1h+/-5min at test temperature.
Voltage proof No defects. Remove and let sit for 24+/-2h at room condition*.
15 Durability Appearance No defects or abnormalities. Fix the capacitor to the supporting Test substrate A (glass epoxy board)
shown in “Complement of Test method”.
Test Temperature :
Max. Operating Temp. +/-3
Capacitance Within +/-15% Test Time : 1000+48/-0h
Change Applied Voltage : DC600V(120% of the rated voltage)
Charge/discharge current :
50mA max.
Exposure Time : 24+/-2h at room condition*.
D.F. 0.05 max.
Pretreatment
Apply test voltage for 1h+/-5min at test temperature.
I.R.
C 0.01µF : 10 MΩ µF or more Remove and let sit for 24+/-2h at room condition*.
C < 0.01µF : 1000 MΩ or more
Voltage proof No defects.
*Room Condition : Temperature:15 to 35°C, Relative humidity:45 to 75%, Atmosphere pressure:86 to 106kPa
Item
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384
Step 1 2 3 4 5
Temp.(C) 25±2 -55±3 25±2 125±2 25±2
10N , 10+/-1s
Step Temp. (°C) Time (min)
1 -55±3 30±3
2 Room Temp. 2 to 3
3 125±2 30±3
4 Room Temp. 2 to 3
c
b
a
Solder Resist
Chip Capacitor
Land
c
b
a
Solder Resist
Chip Capacitor
Land
Step
Temp.(C)
Time
(min)
1
Min.Operating Temp.+0/-3
30+/-3
2
Room Temp
2 to 3
3
Max.Operating Temp.+3/-0
30+/-3
4
Room Temp
2 to 3
JEMCGS-03070A 3
Complement of Test Method
1.Test substrate
The test substrate should be Substrate A or Substrate B as described in “Specifications and Test methods”.
The specimen should be soldered by the conditions as described below.
Soldering Method : Reflow soldering
Solder : Sn-3.0Ag-0.5Cu
(1) Test Substrate A
Land Dimensions
Material : Glass Epoxy Board
Thickness : 1.6mm
Thickness of copper foil : 0.035mm
(1) Test Substrate B
Material : Glass Epoxy Board
Thickness of copper foil : 0.035mm
2. Test Method of Substrate Bending test
a) Support state (b) Test state
a:+/-2 gap between support stand center and test stand
           b:+/-5 gap between support stand center and test stand center
·Material of Test stand and pressure stick
     The material shoud be a metal where a remarkable transformation and the distortion are not caused even if it is pressurized.
·Pressurizing speed
     The pressurizing speed is pressurized at the speed of about 1mm/s until the flexure reaches a regulated value.
     
Step 1 2 3 4 5
Temp.(C) 25±2 -55±3 25±2 125±2 25±2
Step Temp. (°C) Time (min)
1 -55±3 30±3
2 Room Temp. 2 to 3
3 125±2 30±3
4 Room Temp. 2 to 3
c
b
a
Solder Resist
Chip Capacitor
Land
c
b
a
Solder Resist
Chip Capacitor
Land
40
b
d
c
(f4.5)
a
100
1.6
Copper foil
Solder resist
(unit : mm)
a
45+/-2
Test Substrate B
Capacitor
Test stand
45+/-2
Support stand(f5)
50 min.
20
b
Test Substrate B
Support stand
Pressure stick
(unit : mm)
Type
Dimension (mm)
a
b
c
GRM18
1.0
3.0
1.2
GRM21
1.2
4.0
1.65
GRM31
2.2
5.0
2.0
GRM32
2.2
5.0
2.9
GRM42
3.5
7.0
2.4
GRM43
3.5
7.0
3.7
GRM52
4.5
8.0
3.2
GRM55
4.5
8.0
5.6
Type
Dimension of pettern (mm)
a
b
c
d
GRM18
1.0
3.0
1.2
1.0
GRM21
1.2
4.0
1.65
1.0
GRM31
2.2
5.0
2.0
1.0
GRM32
2.2
5.0
2.9
1.0
GRM42
3.5
7.0
2.4
1.0
GRM43
3.5
7.0
3.7
1.0
GRM52
4.5
8.0
3.2
1.0
GRM55
4.5
8.0
5.6
1.0
45
45
Pressure stick
Support
Capacitor
F
R5
L
Support
stand
JEMCGS-03070A 4
Capacxlor 05 1:3 jianJ/ro : : L _ ¥ , 025; ”"0 o 2‘: fl 0 o L,’ L 1 E151 D;:~E} a? ~ “ ‘ M ‘ ._ ,,2.5max
(Unit : mm)
Dimensions of chip
[L×W]
1.6×0.8 1.05 1.85
2.0×1.25 1.45 2.25
3.2×1.6 2.0 3.6
3.2×2.5 2.9 3.6
(b) Type B (Dimensions of chip : Apply to 4.5x2.0)
(Unit : mm)
Dimensions of chip
[L×W]
4.5×2.0 2.5 5.1
Package
(c) The sprocket holes are to the right as the Tape is pulled toward the user.
(2) Packed chips
(3) Dimensions of Tape
(a) Type A (Dimensions of chip : Apply to 1.6x0.8 , 2.0x1.25 , 3.2x1.6 , 3.2x2.5)
(1) Appearance of taping
(a) Paper Tape
Bottom Tape (Thickness: Around 50m) is attached below Base Tape with sprocket and put Top Tape
(Thickness: Around 50m) on capacitor.
(b) Plastic Tape
Cover Tape (Thickness: Around 60m) is put on capacitor on Base Tape (Blister carrier Tape).
B*
A*
B*
A*
Capacitor
f1.5+0.1/-0
8.0±0.3
2.0±0.05
4.0±0.1
1.75±0.1
3.5±0.05
A
B
4.0±0.1
(Plastic Tape)
(Paper Tape)
1.1max.
0.25±0.1
2.5max.
12.0±0.3
2.0±0.05
4.0±0.1
4.0±0.1
1.75±0.1
5.5±0.05
A
B
f1.5+0.1/-0
0.3±0.1
3.7max.
Dimensions of A,B : Nominal value
Dimensions of A,B : Nominal value
JEMCGP-03074A 5
8v 3% ss
(Unit : mm)
Dimensions of chip
[L×W]
4.5×3.2 3.6 4.9
5.7×2.8 3.2 6.1
5.7×5.0 5.4 6.1
(Unit : mm)
(Unit : mm)
Package
(6) The top tape or cover tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.
(7) Missing capacitors number within 0.1% of the number per reel or 1pc, whichever is greater, and not continuous.
(8) The top tape or cover tape and bottom tape shall not protrude beyond the edges of the tape and shall not
cover sprocket holes.
(5) Part of the leader and part of the empty tape shall be attached to the end of the tape as follows.
(c) Type C (Dimensions of chip : Apply to 4.5x3.2 to 5.7x5.0)
(4) Dimensions of Reel
A*
B*
(9) Cumulative tolerance of sprocket holes, 10 pitches : ±0.3mm.
(10) Peeling off force : 0.1 to 0.6N in the direction shown on the follows.
f1.5+0.1/-0
8.0±0.1
12.0±0.3
2.0±0.05
4.0±0.1
1.75±0.1
A
B
5.5±0.05
Dimensions of A,B : Nominal value
Base Tape
Top Tape or Cover Tape
165 to 180°
Direction of feed
Vacant section : 190 min.
Chip-mounting unit
Vacant section : 160 min.
210 min.
0.3±0.1
3.7max.
2.0±0.5
f21±0.8
f13±0.2
13.0±1.0 : Tape width 8mm
17.0±1.0 : Tape width 12mm
9.0+1.0/-0 : Tape width 8mm
13.0+1.0/-0 : Tape width 12mm
180+0/-1.5
330+0/-3.0
60+1/-0(f180mmReel)
100+1/-0(f330mmReel)
JEMCGP-03074A 6
ItmRata Please contact us oelore using our products for the applications listed below which require especially high reliability lor the prevention of delects which might directly cause damage to the third party's lile, body or property. Aircralt equipment Aerospace equipment Undersea equipment Power plant control equipment Medical equipment Transportation equipment(vehicles.trains,ships,etct) Trailic signal equipment Disaster prevention / crime prevention equipment Data-processing equipment Application of similar complexity and/or reliability requirements to the applications listed in the above. Storage and Operation condition Room Temperature ol +5 to +40 arid a Relative Humidity of 20% to 70%.
Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
  for the prevention of defects which might directly cause damage to the third party's life, body or property.
   ①Aircraft equipment Aerospace equipment Undersea equipment Power plant control equipment
   ⑤Medical equipment Transportation equipment(vehicles,trains,ships,etc.) Traffic signal equipment
   ⑧Disaster prevention / crime prevention equipment Data-processing equipment
   ⑩Application of similar complexity and/or reliability requirements to the applications listed in the above.
Storage and Operation condition
1. The performance of chip monolithic ceramic capacitors may be affected by the storage conditions.
1-1. Store the capacitors in the following conditions:
Room Temperature of +5 to +40 and a Relative Humidity of 20% to 70%.
(1) Sunlight, dust, rapid temperature changes, corrosive gas atmosphere, or high temperature and humidity
 
conditions during storage may affect solderability and packaging performance.
Therefore, please maintain the storage temperature and humidity. Use the product within six months after receipt ,
as prolonged storage may cause oxidation of the terminations (outer electrodes).
(2) Please confirm solderability before using after six months.
Store the capacitors without opening the original bag.
Even if the storage period is short, do not exceed the specified atmospheric conditions.
1-2. Corrosive gas can react with the termination (external) electrodes or lead wires of capacitors, and result
in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas (e.g.,hydrogen
sulfide, sulfur dioxide, chlorine, ammonia gas etc.).
1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused
by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and
electrical performance may deteriorate. Do not store capacitors under direct sunlight or in high huimidity
conditions
!
JEMCGC-03007A 7
Rating 1.Temgeralure Degendem Characlerislics 2.Measuremem of Gaga nce 3.AEElied Voltage Typlcal Voltage Applled lo lhe DC capacxlor DC Voltage DC Vollage+AC AC Vollage Pulse Vullage T TUVUb T TH l l l l . (E Maximum possible applled vollage)
Rating
1.Temperature Dependent Characteristics
1. The electrical characteristics of the capacitor can change with temperature.
1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature
changes. The following actions are recommended in order to ensure suitable capacitance values.
(1) Select a suitable capacitance for the operating temperature range.
(2) The capacitance may change within the rated temperature.
When you use a high dielectric constant type capacitor in a circuit that needs a tight (narrow) capacitance
tolerance (e.g., a time-constant circuit), please carefully consider the temperature characteristics, and
carefully confirm the various characteristics in actual use conditions and the actual system.
2.Measurement of Capacitance
1. Measure capacitance with the voltage and frequency specified in the product specifications.
1-1. The output voltage of the measuring equipment may decrease occasionally when capacitance is high.
Please confirm whether a prescribed measured voltage is impressed to the capacitor.
1-2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage applied.
Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit.
3.Applied Voltage
1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called out in the specifications.
1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage.
(1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the rated DC voltage.
When AC voltage or pulse voltage is applied, the peak-to-peak voltage shall not exceed the rated DC voltage.
(2) Abnormal voltages (surge voltage, static electricity, pulse voltage, etc.) shall not exceed the rated DC voltage.
Typical Voltage Applied to the DC capacitor
DC Voltage DC Voltage+AC AC Voltage Pulse Voltage
(EMaximum possible applied voltage.)
1-2. Influence of over voltage
Over voltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown
of the internal dielectric layers .
The time duration until breakdown depends on the applied voltage and the ambient temperature.
2. Use a safety standard certified capacitor in a power supply input circuit (AC filter), as it is also necessary to
consider the withstand voltage and impulse withstand voltage defined for each device.
Caution
!
E
E
E
E
0
0
0
0
JEMCGC-03007A 8
41er ol Applied Voltage and Sell-heating Temperature when measuring at an ambient temperature of 25%). In addition, use a K thermocoupie at mm mm with less heat capacity when measuring, and measure in a condition where there is ho ellect from the radiant 5. DC Voltage and AC Voltage Charact (2) In the DC voltage characteristics. the rate at capacitance change becomes iarger as voltageihcreases. even if the appiied voltage is beiow the rated voltage. when a high dielectric constant type capacitor is used in 6. Capac' nce Ag' 9 1. The high dielectric constant type capacitors have an Aging characteristic in which the capacitance vaiue decreases 7.Vibration and shock at another printed circuit board should not be aiiowed to hit the capacitor in order to avoid
4.Type of Applied Voltage and Self-heating Temperature
1.Confirm the operating conditions to make sure that no large current is flowing into the capacitor due to the
continuous application of an AC voltage or pulse voltage.
When a DC rated voltage product is used in an AC voltage circuit or a pulse voltage circuit, the AC current
or pulse current will flow into the capacitor; therefore check the self-heating condition.
Please confirm the surface temperature of the capacitor so that the temperature remains within the upper limits
of the operating temperature, including the rise in temperature due to self-heating. When the capacitor is
used with a high-frequency voltage or pulse voltage, heat may be generated by dielectric loss.
<Applicable to Temperature Characteristic X7R(R7), X7T(D7)>
1-1. The load should be contained so that the self-heating of the capacitor body remains below 20°C,
when measuring at an ambient temperature of 25°C. In addition, use a K thermocouple of ø0.1mm with less
heat capacity when measuring, and measure in a condition where there is no effect from the radiant
heat of other components or air flow caused by convection. Excessive generation of heat may cause
deterioration of the characteristics and reliability of the capacitor. (Absolutely do not perform
measurements while the cooling fan is operating, as an accurate measurement may not be performed.)
5. DC Voltage and AC Voltage Characteristic
1. The capacitance value of a high dielectric constant type capacitor changes depending on the DC voltage applied.
Please consider the DC voltage characteristics when a capacitor is selected for use in a DC circuit.
1-1. The capacitance of ceramic capacitors may change sharply depending on the applied voltage. (See figure)
Please confirm the following in order to secure the capacitance.
(1) Determine whether the capacitance change caused by the applied voltage is within the allowed range .
(2) In the DC voltage characteristics, the rate of capacitance change becomes larger as voltageincreases,
even if the applied voltage is below the rated voltage. When a high dielectric constant type capacitor is used in
a circuit that requires a tight (narrow) capacitance tolerance (e.g., a time constant circuit), please carefully consider
the voltage characteristics, and confirm the various characteristics in the actual operating conditions of the system.
2. The capacitance values of high dielectric constant type capacitors changes depending on the AC voltage applied.
Please consider the AC voltage characteristics when selecting a capacitor to be used in an AC circuit.
6. Capacitance Aging
1. The high dielectric constant type capacitors have an Aging characteristic in which the capacitance value decreases
with the passage of time.
When you use a high dielectric constant type capacitors in a circuit that needs a tight (narrow) capacitance tolerance
(e.g., a time-constant circuit), please carefully consider the characteristics of these capacitors, such as their aging, voltage,
and temperature characteristics. In addition, check capacitors using your actual appliances at the intended environment
and operating conditions.
7.Vibration and Shock
1. Please confirm the kind of vibration and/or shock, its condition, and any generation of resonance.
Please mount the capacitor so as not to generate resonance, and do not allow any impact on the terminals.
2. Mechanical shock due to being dropped may cause damage or
a crack in the dielectric material of the capacitor.
Do not use a dropped capacitor because the quality and reliability
may be deteriorated.
3. When printed circuit boards are piled up or handled, the corner
 of another printed circuit board
should not be allowed to hit the capacitor in order to avoid
a crack or other damage to the capacitor.
Caution
!
Mounting printed circuit board
Crack
Crack
Floor
JEMCGC-03007A 9
Soldering and Mounting 1.Mounling Pas n 1-1.Choose a mounting posuien that minimizes the stress imposed on the chip during flexing or bending oi the board. [Component Direction] Locate chip horizontal lo the ©D:l]->D:l] 2.lnlormalion before Mountin
Soldering and Mounting
1.Mounting Position
1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during flexing
or bending the printed circuit board.
1-1.Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board.
  [Component Direction]
Locate chip horizontal to the
direction in which stress acts.
(Bad Example) (Good Example)
[Chip Mounting Close to Board Separation Point]
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface.
A > D *1
(2) Add slits in the board separation part.
A > B
(3) Keep the mounting position of the component away from the board separation surface.
A > C
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
[Mounting Capacitors Near Screw Holes]
When a capacitor is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the capacitor in a position as far away from the screw holes as possible.
 
2.Information before Mounting
1. Do not re-use capacitors that were removed from the equipment.
2. Confirm capacitance characteristics under actual applied voltage.
3. Confirm the mechanical stress under actual process and equipment use.
4. Confirm the rated capacitance, rated voltage and other electrical characteristics before assembly.
5. Prior to use, confirm the solderability of capacitors that were in long-term storage.
6. Prior to measuring capacitance, carry out a heat treatment for capacitors that were in long-term storage.
7.The use of Sn-Zn based solder will deteriorate the reliability of the MLCC.
Please contact our sales representative or product engineers on the use of Sn-Zn based solder in advance.
Caution
Contents of Measures
Screw Hole Recommended
!
1C
1B
1A
Perforation
Slit
A
B
C
D
1A
JEMCGC-03007A 10
3.M nlenance of (he Mounlin ick and lace Machine [I ncorrect] ET¥DEELZE\ [Correcl] / E\ /'E
3.Maintenance of the Mounting (pick and place) Machine
1. Make sure that the following excessive forces are not applied to the capacitors.
1-1. In mounting the capacitors on the printed circuit board, any bending force against them shall be kept
to a minimum to prevent them from any damage or cracking. Please take into account the following precautions
and recommendations for use in your process.
(1) Adjust the lowest position of the pickup nozzle so as not to bend the printed circuit board.
(2) Adjust the nozzle pressure within a static load of 1N to 3N during mounting.
  [Incorrect]
  [Correct]
2.Dirt particles and dust accumulated between the suction nozzle and the cylinder inner wall prevent
the nozzle from moving smoothly. This imposes greater force upon the chip during mounting,
causing cracked chips. Also, the locating claw, when worn out, imposes uneven forces on the chip
when positioning, causing cracked chips. The suction nozzle and the locating claw must be maintained,
checked and replaced periodically.
Caution
!
Board Guide
Board
Suction Nozzle
Deflection
Support Pin
JEMCGC-03007A 11
4- Rellow Solde rig lhe peak solder lemperalure is below the melling point of 3. When components are immersed in solvenl aller mountir Table 1 Differenlial Recommended Condilions Subsrlrg Temperaiumrc In the case ol repeated soldering, the accumulated soldering lime must be within lhe range shown above. This makes lhe chip more susceplible to mechanical and lhermal stress on lhe board and may cause the chips lo crack.
4-1.Reflow Soldering
1. When sudden heat is applied to the components, the [Standard Conditions for Reflow Soldering]
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both the components and the PCB.
Preheating conditions are shown in table 1. It is required to
keep the temperature differential between the solder and
the components surface (ΔT) as small as possible.
2. Solderability of tin plating termination chips might be
deteriorated when a low temperature soldering profile where
the peak solder temperature is below the melting point of
tin is used. Please confirm the solderability of tin plated
termination chips before use.
3. When components are immersed in solvent after mounting,
[Allowable Reflow Soldering Temperature and Time]
be sure to maintain the temperature difference (ΔT)
between the component and the solvent within the range
shown in the table 1.
Table 1
        In the case of repeated soldering, the accumulated
        soldering time must be within the range shown above.
Recommended Conditions
Pb-Sn Solder : Sn-37Pb
Lead Free Solder : Sn-3.0Ag-0.5Cu
4. Optimum Solder Amount for Reflow Soldering
4-1. Overly thick application of solder paste results in a excessive solder fillet height.
This makes the chip more susceptible to mechanical and thermal stress on the board and may cause the chips to crack.
4-2. Too little solder paste results in a lack of adhesive strength on the termination, which may result in chips breaking loose
from the PCB.
4-3. Please confirm that solder has been applied smoothly to the termination.
Make sure not to impose any abnormal mechanical shocks to the PCB.
Inverting the PCB
230 to 250°C
Lead Free Solder
240 to 260
Air or N2
Caution
Pb-Sn Solder
Peak Temperature
Air
Atmosphere
Series
G□□
Chip Dimension(L/W) Code
18/21/31
Temperature
Differential
ΔT190
G□□
32/42/43/52/55
ΔT130
!
Soldering Temperature()
Soldering Time(s)
280
270
260
250
240
230
220
0
30
60
120
90
190℃(170℃)
Temperature ()
220℃(200)
170℃(150℃)
150℃(130℃)
ΔT
60 - 120 s 30 - 60 s
Time
Preheating
Peak Temperature Gradual
Cooling
Soldering
Temperature
Incase of Lead Splder
( ):In case of Pb-Sn Solder
JEMCGC-03007A 12
4-2.Flow Solde ng Table 2 Series Prenealing condillons are shown in table 2. II is required to lemperalure can resull in leaching ol lne lerminations, Recommended Conditlons Salderlng mperamreCC [Standard Condiliens for Flow Soldenng] 5. Opllmum Solder Amounl lor Flow Soldering
4-2.Flow Soldering
1. Do not apply flow soldering to chips not listed in Table 2.
     [Standard Conditions for Flow Soldering]
Table 2
Series
G□□
2. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both of the components and the PCB.
Preheating conditions are shown in table 2. It is required to
[Allowable Flow Soldering Temperature and Time]
keep the temperature differential between the solder and
the components surface (ΔT) as low as possible.
3. Excessively long soldering time or high soldering
temperature can result in leaching of the terminations,
causing poor adhesion or a reduction in capacitance value
due to loss of contact between the inner electrodes and terminations.
4. When components are immersed in solvent after mounting,
be sure to maintain the temperature differential (ΔT)
between the component and solvent within the range
shown in the table 2. In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.
Recommended Conditions
Pb-Sn Solder : Sn-37Pb
Lead Free Solder : Sn-3.0Ag-0.5Cu
5. Optimum Solder Amount for Flow Soldering
5-1. The top of the solder fillet should be lower than the
thickness of the components. If the solder amount is
excessive, the risk of cracking is higher during
board bending or any other stressful condition.
Air or N2
Temperature Differential
Lead Free Solder
100 to 120
Soldering Peak Temperature
Chip Dimension(L/W) Code
18/21/31
ΔT150
250 to 260
Atmosphere
90 to 110°C
240 to 250°C
Air
Caution
Pb-Sn Solder
Preheating Peak Temperature
!
Soldering mperature()
Soldering Time(s)
280
270
260
250
240
230
220
0
10
20
40
30
Temperature()
Soldering
Peak
Temperature
Preheating
Peak
Temperature
30-90 seconds
Preheating
5 seconds max.
Time
Gradual
Cooling
Soldering
ΔT
Up to Chip Thickness
Adhesive
in section
JEMCGC-03007A 13
4-3.Correclion ol Soldered Portion Table 3 (L/W) Code Soldering Iron Tip Temperature Difierential(AT) 2-1. ll the distance lrom the hot air cullel ol the spot healer lo the component rs loo close, cracks may occur due to Table 4 Distance 5mm or more Hot Air Application angle 45” "Figure 1 Hot Air Temperature Nozzle Outlet 400°C max. Less than 10 seconds Application Time (3216M/1206 size or smaller) Less than 30 seconds (3225M / 1210 size or larger) Onehole Nozz L" Angle oi during board bending or any other stressful condition.
4-3.Correction of Soldered Portion
When sudden heat is applied to the capacitor, distortion caused by the large temperature difference occurs internally,
and can be the cause of cracks. Capacitors also tend to be affected by mechanical and thermal stress depending
on the board preheating temperature or the soldering fillet shape, and can be the cause of cracks.
Please refer to "1. PCB Design" or "3. Optimum solder amount" for the solder amount and the fillet shapes.
1. Correction with a Soldering Iron
1-1. In order to reduce damage to the capacitor, be sure to preheat the capacitor and the mounting board.
Preheat to the temperature range shown in Table 3. A hot plate, hot air type preheater, etc. can be used for preheating.
1-2. After soldering, do not allow the component/PCB to cool down rapidly.
1-3. Perform the corrections with a soldering iron as quickly as possible. If the soldering iron is applied too long,
there is a possibility of causing solder leaching on the terminal electrodes, which will cause deterioration of the
adhesive strength and other problems.
Table 3
*Applicable for both Pb-Sn and Lead Free Solder.
Pb-Sn Solder : Sn-37Pb
Lead Free Solder : Sn-3.0Ag-0.5Cu
*Please manage Δ T in the temperature of soldering iron and the preheating temperature.
2. Correction with Spot Heater
Compared to local heating with a soldering iron, hot air heating by a spot heater heats the overall component
and board, therefore, it tends to lessen the thermal shock. In the case of a high density mounted board,
a spot heater can also prevent concerns of the soldering iron making direct contact with the component.
2-1. If the distance from the hot air outlet of the spot heater to the component is too close, cracks may occur due to
thermal shock. To prevent this problem, follow the conditions shown in Table 4.
2-2. In order to create an appropriate solder fillet shape, it is recommended that hot air be applied at the angle shown
in Figure 1.
Table 4
Distance 5mm or more
Hot Air Application angle 45° *Figure 1
Hot Air Temperature Nozzle Outlet 400°C max.
Less than 10 seconds
Application Time (3216M / 1206 size or smaller)
Less than 30 seconds
(3225M / 1210 size or larger) (3216M , 3225M : Metric size code)
3. Optimum solder amount when re-working with a soldering iron
3-1. If the solder amount is excessive, the risk of cracking is higher
    during board bending or any other stressful condition.
Too little solder amount results in a lack of adhesive strength
on the termination, which may result in chips breaking
loose from the PCB.
Please confirm that solder has been applied smoothly is in section
and rising to the end surface of the chip.
3-2. A soldering iron with a tip of ø3mm or smaller should be used.
It is also necessary to keep the soldering iron from touching
the components during the re-work.
3-3. Solder wire with ø0.5mm or smaller is required for soldering.
Atmosphere
350 max.
150 min.
ΔT190
Air
Air
150 min.
280 max.
ΔT130
Chip Dimension
(L/W) Code
Temperature of
Soldering Iron Tip
Series
G□□
G□□
18/21/31
Caution
32/42/43/52/55
Preheating
Temperature
Temperature
Differential(ΔT)
!
One-hole Nozzle
an Angle of 45°
[Figure 1]
Solder Amount
JEMCGC-03007A 14
5.Washing 6.Eleclrical Tes! on Primed Circ i: Board 7.Prinled Circuit Board Cro in 2. Check me cropping melhod forthe prmled cxrcuit board m advance
5.Washing
Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips
or broken solder joints. Take note not to vibrate PCBs.
6.Electrical Test on Printed Circuit Board
1. Confirm position of the support pin or specific jig, when inspecting the electrical performance of a
capacitor after mounting on the printed circuit board.
1-1. Avoid bending the printed circuit board by the pressure of a test-probe, etc.
The thrusting force of the test probe can flex the PCB, resulting in cracked chips or open solder
joints. Provide support pins on the back side of the PCB to prevent warping or flexing.
Install support pins as close to the test-probe as possible.
1-2. Avoid vibration of the board by shock when a test -probe contacts a printed circuit board.
[Not Recommended] [Recommended]
7.Printed Circuit Board Cropping
1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that
caused bending or twisting the board.
1-1. In cropping the board, the stress as shown may cause the capacitor to crack.
Cracked capacitors may cause deterioration of the insulation resistance, and result in a short.
Avoid this type of stress to a capacitor.
[Bending] [Twisting]
2. Check the cropping method for the printed circuit board in advance.
2-1. Printed circuit board cropping shall be carried out by using a jig or an apparatus (Disc separator, router
type separator, etc.) to prevent the mechanical stress that can occur to the board.
* When a board separation jig or disc separator is used, if the following precautions are not observed,
a large board deflection stress will occur and the capacitors may crack.
Use router type separator if at all possible.
Board Separation Method
Hand Separation
Nipper Separation
(1) Board Separation Jig
Board Separation Apparatus
2) Disc Separator
3) Router Type Separator
Low
Level of stress on board
×
*
*
Notes
Hand and nipper
separation apply a high
level of stress.
Use another method.
· Board handling
· Board bending direction
· Layout of capacitors
· Board handling
· Layout of slits
· Design of V groove
· Arrangement of blades
· Controlling blade life
Board handling
Recommended
Caution
High
Medium
Medium
!
Peeling
Test-probe
Support Pin
Test-probe
1A
JEMCGC-03007A 15
(Measures) [Hand Separation] rn Pnnted 2mm; Dlrection oi ioad Load perm beard Ii ii is difficuii Io introduce a rouier Iype separator, impiement the following measures [Cross-section Diagram] :{2 1% [V-groove Design] LJ
(1) Example of a suitable jig
[In the case of Single-side Mounting]
An outline of the board separation jig is shown as follows.
Recommended example: Stress on the component mounting position can be minimized by holding the
portion close to the jig, and bend in the direction towards the side where the capacitors are mounted.
Not recommended example: The risk of cracks occurring in the capacitors increases due to large stress
being applied to the component mounting position, if the portion away from the jig is held and bent in the
direction opposite the side where the capacitors are mounted.
[Outline of jig] [Hand Separation]
[In the case of Double-sided Mounting]
Since components are mounted on both sides of the board, the risk of cracks occurring can not be avoided with the
above method. Therefore, implement the following measures to prevent stress from being applied to the components.
  (Measures)
(1) Consider introducing a router type separator.
   If it is difficult to introduce a router type separator, implement the following measures.
(Refer to item 1. Mounting Position)
(2) Mount the components parallel to the board separation surface.
(3) When mounting components near the board separation point, add slits in the separation position
near the component.
(4) Keep the mounting position of the components away from the board separation point.
(2) Example of a Disc Separator
An outline of a disc separator is shown as follows. As shown in the Principle of Operation, the top
blade and bottom blade are aligned with the V-grooves on the printed circuit board to separate the board.
In the following case, board deflection stress will be applied and cause cracks in the capacitors.
(1) When the adjustment of the top and bottom blades are misaligned, such as deviating in the top-bottom,
left-right or front-rear directions
(2) The angle of the V groove is too low, depth of the V groove is too shallow, or the V groove is misaligned
top-bottom
IF V groove is too deep, it is possible to brake when you handle and carry it. Carefully design depth of the
V groove with consideration about strength of material of the printed circuit board.
[ Outline of Machine ] [ Principle of Operation ] [ Cross-section Diagram ]
[Disc Separator]
Top Blade Top Blade Top Blade Top Blade
Bottom Blade Bottom Blade Bottom Blade Bottom Blade
[V-groove Design]
Depth too Shallow
Depth too Deep
Example of
Recommended
V-groove Design
Not Recommended
Left-right Misalignment
Low-Angle
Recommended
Top-bottom Misalignment
Left-right Misalignment
Front-rear Misalignment
Caution
Recommended
Not recommended
Not recommended
Printed Circuit Board
Top Blade
V-groove
Bottom Blade
Top Blade Printed Circuit Board
V-groove
!
Board Cropping Jig
V-groove
Printed Circuit Board
Printed circuit
board
Components
Load point
Direction of
load
Printed circuit
board
Component
s
Load point
Direction of load
JEMCGC-03007A 16
The router type separamr peflorms cutting by a router 8. Assembly capacimrs have been moumed on (he opposne side. Q3) Plan the work so mat the board does not bend when a ‘ l *5}— En fl} «,1
(3) Example of Router Type Separator
The router type separator performs cutting by a router
rotating at a high speed. Since the board does not
bend in the cutting process, stress on the board can
be suppressed during board separation.
When attaching or removing boards to/from the router type
separator, carefully handle the boards to prevent bending.
8. Assembly
1. Handling
If a board mounted with capacitors is held with one hand, the board may bend.
Firmly hold the edges of the board with both hands when handling.
If a board mounted with capacitors is dropped, cracks may occur in the capacitors.
Do not use dropped boards, as there is a possibility that the quality of the capacitors may be impaired.
2. Attachment of Other Components
2-1. Mounting of Other Components
Pay attention to the following items, when mounting other components on the back side of the board after
capacitors have been mounted on the opposite side.
When the bottom dead point of the suction nozzle is set too low, board deflection stress may be applied
to the capacitors on the back side (bottom side), and cracks may occur in the capacitors.
· After the board is straightened, set the bottom dead point of the nozzle on the upper surface of the board.
· Periodically check and adjust the bottom dead point.
2-2. Inserting Components with Leads into Boards
When inserting components (transformers, IC, etc.) into boards, bending the board may cause cracks in the
capacitors or cracks in the solder. Pay attention to the following.
· Increase the size of the holes to insert the leads, to reduce the stress on the board during insertion.
· Fix the board with support pins or a dedicated jig before insertion.
· Support below the board so that the board does not bend. When using multiple support pins on the board,
periodically confirm that there is no difference in the height of each support pin.
2-3. Attaching/Removing Sockets
When the board itself is a connector, the board may bend when a socket is attached or removed.
Plan the work so that the board does not bend when a socket is attached or removed.
2-4. Tightening Screws
The board may be bent, when tightening screws, etc. during the attachment of the board to a shield or
chassis. Pay attention to the following items before performing the work.
· Plan the work to prevent the board from bending.
· Use a torque screwdriver, to prevent over-tightening of the screws.
· The board may bend after mounting by reflow soldering, etc. Please note, as stress may be applied
to the chips by forcibly flattening the board when tightening the screws.
Caution
!
Suction Nozzle
Component with Leads
Socket
Screwdriver
[ Outline Drawing ] Router
JEMCGC-03007A 17
Others 1. Under Ogemion of Eguigmenl 2. Others
Others
1. Under Operation of Equipment
1-1. Do not touch a capacitor directly with bare hands during operation in order to avoid the danger of an electric shock.
1-2. Do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit).
Do not expose a capacitor to a conductive liquid, inducing any acid or alkali solutions.
1-3. Confirm the environment in which the equipment will operate is under the specified conditions.
Do not use the equipment under the following environments.
(1) Being spattered with water or oil.
(2) Being exposed to direct sunlight.
(3) Being exposed to ozone, ultraviolet rays, or radiation.
(4) Being exposed to toxic gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.)
(5) Any vibrations or mechanical shocks exceeding the specified limits.
(6) Moisture condensing environments.
1-4. Use damp proof countermeasures if using under any conditions that can cause condensation.
2. Others
2-1. In an Emergency
(1) If the equipment should generate smoke, fire, or smell, immediately turn off or unplug the equipment.
If the equipment is not turned off or unplugged, the hazards may be worsened by supplying continuous power.
(2) In this type of situation, do not allow face and hands to come in contact with the capacitor or burns may be caused
by the capacitor's high temperature.
2-2. Disposal of waste
When capacitors are disposed of, they must be burned or buried by an industrial waste vendor with the appropriate
licenses.
2-3. Circuit Design
(1) Addition of Fail Safe Function
Capacitors that are cracked by dropping or bending of the board may cause deterioration of the
insulation resistance, and result in a short. If the circuit being used may cause an electrical shock,
smoke or fire when a capacitor is shorted, be sure to install fail-safe functions, such as a fuse,
to prevent secondary accidents.
(2) Capacitors used to prevent electromagnetic interference in the primary AC side circuit, or as a
connection/insulation, must be a safety standard certified product, or satisfy the contents
stipulated in the Electrical Appliance and Material Safety Law. Install a fuse for each line in case of a short.
(3) This series is not safety standard certified products.
2-4. Remarks
Failure to follow the cautions may result, worst case, in a short circuit and smoking when the product is used.
The above notices are for standard applications and conditions. Contact us when the products are used in special
mounting conditions.
Select optimum conditions for operation as they determine the reliability of the product after assembly.
The data herein are given in typical values, not guaranteed ratings.
Caution
!
JEMCGC-03007A 18
Rating 1 geraling Temgeralure 2.Atmosghere Surround gs gaseous and liguidl electrodes may result in breakdown when the capacitor is exposed lo corrosive or volatile gases or solvents 3.Piezo-eleclric Phenomenon
Rating
1.Operating Temperature
1. The operating temperature limit depends on the capacitor.
1-1. Do not apply temperatures exceeding the maximum operating temperature.
It is necessary to select a capacitor with a suitable rated temperature that will cover the operating temperature range.
It is also necessary to consider the temperature distribution in equipment and the seasonal temperature variable
factor.
1-2. Consider the self-heating factor of the capacitor
The surface temperature of the capacitor shall not exceed the maximum operating temperature including self-heating.
2.Atmosphere Surroundings (gaseous and liquid)
1. Restriction on the operating environment of capacitors.
1-1. Capacitors, when used in the above, unsuitable, operating environments may deteriorate due to the corrosion
of the terminations and the penetration of moisture into the capacitor.
1-2. The same phenomenon as the above may occur when the electrodes or terminals of the capacitor are subject
to moisture condensation.
1-3. The deterioration of characteristics and insulation resistance due to the oxidization or corrosion of terminal
  electrodes may result in breakdown when the capacitor is exposed to corrosive or volatile gases or solvents
for long periods of time.
3.Piezo-electric Phenomenon
1. When using high dielectric constant type capacitors in AC or pulse circuits, the capacitor itself vibrates
at specific frequencies and noise may be generated.
Moreover, when the mechanical vibration or shock is added to capacitor, noise may occur.
Notice
JEMCGC-03007A 19
Soldering and Mounting 1.PCB Design Pattern Forms 9“ .% ,% in section in section in section in section \% in section in section E“
Soldering and Mounting
1.PCB Design
1. Notice for Pattern Forms
1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted
directly on the substrate.
They are also more sensitive to mechanical and thermal stresses than leaded components.
Excess solder fillet height can multiply these stresses and cause chip cracking.
When designing substrates, take land patterns and dimensions into consideration to eliminate the possibility
of excess solder fillet height.
1-2. There is a possibility of chip cracking caused by PCB expansion/contraction with heat, because stress
on a chip is different depending on PCB material and structure.When the thermal expansion coefficient
greatly differs between the board used for mounting and the chip,it will cause cracking of the chip due to
the thermal expansion and contraction. When capacitors are mounted on a fluorine resin printed circuit
board or on a single-layered glass epoxy board, it may also cause cracking of the chip for the same reason.
Pattern Forms
in section in section
in section in section
in section in section
Notice
Placing of Leaded
Components
after Chip Component
Lateral Mounting
Prohibited
Correct
Placing Close to Chassis
Placing of Chip
Components
and Leaded
Components
Chassis
Solder (ground)
Electrode Pattern
Solder Resist
Lead Wire
Solder Resist
Lead Wire
Soldering Iron
Solder Resist
ソ
Solder Resist
JEMCGC-03007A 20
Tab‘e 1 How So‘dering Method (UW) Code How so‘dering can un‘y be used for pruducls wilh a chxp size uf1.6x0.8mmlo 3.2x1.6mm. Tab‘e 2 Reflow So‘dering Method
2. Land Dimensions
2-1. Chip capacitors can be cracked due to the stress
of PCB bending , etc. if the land area is larger than
needed and has an excess amount of solder.
Please refer to the land dimensions in table 1
for flow soldering, table 2 for reflow soldering.
Please confirm the suitable land dimension by
evaluating of the actual SET / PCB.
Table 1 Flow Soldering Method
Flow soldering can only be used for products with a chip size of 1.6x0.8mm to 3.2x1.6mm.
(in mm)
Table 2 Reflow Soldering Method
(in mm)
<Applicable to beyond Rated Voltage of 200VDC>
2-2. Dimensions of Slit (Example)
Preparing the slit helps flux cleaning and resin coating
on the back of the capacitor.
However, the length of the slit design should be
as short as possible to prevent mechanical damage
in the capacitor.
A longer slit design might receive more severe L×W de
mechanical stress from the PCB. 1.6×0.8 - -
Recommended slit design is shown in the Table. 2.0×1.25 - -
3.2×1.6
1.02.0 3.23.7
3.2×2.5
1.02.0 4.14.6
4.5×2.0
1.02.8 3.64.1
4.5×3.2
1.02.8 4.85.3
5.7×2.8
1.04.0 4.44.9
5.7×5.0
1.04.0 6.67.1
1.8 to 2.0
1.0 to 1.2
G□□
G□□
1.8 to 2.3
2.3 to 3.0
1.4 to 1.8
1.5 to 1.7
0.9 to 1.2
55
32
3.2×2.5
31
3.2×1.6
1.4 to 1.6
b
1.6×0.8
1.2 to 1.4
0.6 to 0.8
0.6 to 0.8
1.2 to 1.4
2.1 to 2.6
G□□
G□□
52
5.7×2.8
4.0 to 4.6
3.5 to 4.8
1.4 to 1.6
43
3.0 to 3.5
5.7×5.0
4.5×3.2
4.0 to 4.6
1.2 to 1.4
4.5×2.0
2.8 to 3.4
G□□
42
0.6 to 0.7
1.0 to 1.4
G□□
G□□
2.0×1.25
0.6 to 0.8
G□□
2.0 to 2.4
1.0 to 1.2
a
Chip(L×W)
Chip Dimension
(L/W) Code
2.2 to 2.6
18
21
G□□
21
2.0×1.25
G□□
0.9 to 1.0
c
0.6 to 0.8
Series
Notice
Chip Dimension
(L/W) Code
Chip(L×W)
a
b
0.6 to 1.0
0.8 to 1.1
1.0 to 1.4
c
0.8 to 0.9
18
Series
1.6×0.8
G□□
31
3.2×1.6
1.0 to 1.1
Lan
d
Solder
Resist
L
W
Chip
Capacitor
Sli
t
d
e
c
b
a
Solder Resist
Chip Capacitor
Land
JEMCGC-03007A 21
2.Adhesive Agglicalion 5000Pa ~ 5 (500ps) min, (a‘ 25 ) Covera e Swze (LxW) (in mm) Adheswe Coverage" 1 6 x O 8 0.05mg min. 0.1m min. 0.15mg min. 3.Adhesive Curing 4.Flux “or Flow soldering} 1. An excessive amount of flux generates a large quantity m flux gas, wmch can cause a deterioration of so‘derabilityA
3. Board Design
When designing the board, keep in mind that the amount of strain which occurs will increase depending on the size
and material of the board.
2.Adhesive Application
1. Thin or insufficient adhesive can cause the chips to loosen or become disconnected during flow soldering.
The amount of adhesive must be more than dimension c, shown in the drawing at right, to obtain the correct bonding
strength. The chip's electrode thickness and land thickness must also be taken into consideration.
2. Low viscosity adhesive can cause chips to slip after mounting. The adhesive must have a viscosity of
5000Pa s (500ps) min. (at 25)
3. Adhesive Coverage
Size (L×W) (in mm) Adhesive Coverage*
1.6 × 0.8 0.05mg min.
2.0 × 1.25 0.1mg min.
3.2 × 1.6 0.15mg min.
*Nominal Value
3.Adhesive Curing
1. Insufficient curing of the adhesive can cause chips to disconnect during flow soldering and causes
deterioration in the insulation resistance between the terminations due to moisture absorption.
Control curing temperature and time in order to prevent insufficient hardening.
4.Flux (for Flow soldering)
1. An excessive amount of flux generates a large quantity of flux gas, which can cause a deterioration of solderability,
so apply flux thinly and evenly throughout. (A foaming system is generally used for flow solderring.)
2. Flux containing too high a percentage of halide may cause corrosion of the terminations unless there is
sufficient cleaning. Use flux with a halide content of 0.1% max.
3. Do not use strong acidic flux.
4. Do not use water-soluble flux.*
(*Water-soluble flux can be defined as non-rosin type flux including wash-type flux and non-wash-type flux.)
Notice
Land
Adhesive
Board
Chip Capacitor
a
b
c
a=20 to 70μm
b=30 to 35μm
c=50 to 105μm
Relationship with amount of strain to the board thickness, length, width, etc.]
ε=
3PL
2Ewh2
Relationship between load and strain
When the load is constant, the following relationship can be established.
· As the distance between the supporting points (L) increases,the amount of strain also increases.
→Reduce the distance between the supporting points.
· As the elastic modulus (E) decreases, the amount of strain increases.
→Increase the elastic modulus.
· As the board width (w) decreases, the amount of strain increases.
→Increase the width of the board.
· As the board thickness (h) decreases, the amount of strain increases.
→Increase the thickness of the board.
Since the board thickness is squared, the effect on the amount of strain becomes even greater.
εStrain on center of board (μst)
LDistance between supporting points (mm)
w Board width (mm)
h Board thickness (mm)
E Elastic modulus of board (N/m2=Pa)
Y Deflection (mm)
P Load (N)
Y
P
h
w
L
JEMCGC-03007A 22
5.Flow Solde ng Set temperature and time to ensure that ieaching at the mounted on substrate. 6.Rellow solder g by this kind of solder paste 7.Wash g B.Coating 3 The naiogen system substance and organic acid are inciuded in coating material, and a Chip corrodes by the kind of Coating material. Do not use strong acid type.
5.Flow Soldering
Set temperature and time to ensure that leaching of the
terminations does not exceed 25% of the chip end
area as a single chip (full length of the edge A-B-C-D
shown at right) and 25% of the length A-B shown as
mounted on substrate.
6.Reflow soldering
The halogen system substance and organic acid are included in solder paste, and a chip corrodes
  by this kind of solder paste.
Do not use strong acid flux.
Do not use water-soluble flux.*
(*Water-soluble flux can be defined as non-rosin type flux including wash-type flux and non-wash-type flux.)
7.Washing
1. Please evaluate the capacitor using actual cleaning equipment and conditions to confirm the quality,
and select the solvent for cleaning.
2. Unsuitable cleaning solvent may leave residual flux or other foreign substances, causing deterioration of
electrical characteristics and the reliability of the capacitors.
3. Select the proper cleaning conditions.
3-1. Improper cleaning conditions (excessive or insufficient) may result in the deterioration of the performance
of the capacitors.
8.Coating
1. A crack may be caused in the capacitor due to the stress of the thermal contraction of the resin during curing process.
The stress is affected by the amount of resin and curing contraction. Select a resin with low curing contraction.
The difference in the thermal expansion coefficient between a coating resin or a molding resin and the capacitor
may cause the destruction and deterioration of the capacitor such as a crack or peeling, and lead to the deterioration
of insulation resistance or dielectric breakdown.
Select a resin for which the thermal expansion coefficient is as close to that of the capacitor as possible.
A silicone resin can be used as an under-coating to buffer against the stress.
2. Select a resin that is less hygroscopic.
Using hygroscopic resins under high humidity conditions may cause the deterioration of the insulation resistance
of a capacitor. An epoxy resin can be used as a less hygroscopic resin.
3The halogen system substance and organic acid are included in coating material, and a chip corrodes
  by the kind of Coating material. Do not use strong acid type.
Notice
A
B
D
C
Termination
(Outer Electrode)
As a Single Chip
As Mounted on Substrate
A
B
JEMCGC-03007A 23
Others 1.1ransgorla on low air temperature : -40 change at temperature air/air : -25 /+25 low air pressure :30 kPa change at air pressure :6 kPa/mint capacitors, the capacitance may change depending on the operating conditions in the actual system. which wiii aiiect the capacitance value of the capacitcrt
Others
1.Transportation
1. The performance of a capacitor may be affected by the conditions during transportation.
1-1. The capacitors shall be protected against excessive temperature, humidity and mechanical force during transportation.
(1) Climatic condition
 ・ low air temperature : -40
change of temperature air/air : -25/+25
low air pressure : 30 kPa
change of air pressure : 6 kPa/min.
(2) Mechanical condition
Transportation shall be done in such a way that the boxes are not deformed and forces are not directly passed
on to the inner packaging.
1-2. Do not apply excessive vibration, shock, or pressure to the capacitor.
(1) When excessive mechanical shock or pressure is applied to a capacitor, chipping or cracking may occur
in the ceramic body of the capacitor.
(2) When the sharp edge of an air driver, a soldering iron, tweezers, a chassis, etc. impacts strongly on the surface
of the capacitor, the capacitor may crack and short-circuit.
1-3. Do not use a capacitor to which excessive shock was applied by dropping etc.
A capacitor dropped accidentally during processing may be damaged.
2.Characteristics Evaluation in the Actual System
1. Evaluate the capacitor in the actual system,to confirm that there is no problem with the performance and specification
values in a finished product before using.
2. Since a voltage dependency and temperature dependency exists in the capacitance of high dielectric type ceramic
capacitors, the capacitance may change depending on the operating conditions in the actual system.
Therefore,be sure to evaluate the various characteristics, such as the leakage current and noise absorptivity,
which will affect the capacitance value of the capacitor.
3. In addition,voltages exceeding the predetermined surge may be applied to the capacitor by the inductance in
the actual system. Evaluate the surge resistance in the actual system as required.
Notice
JEMCGC-03007A 24
NOTE
1.Please make sure that your product has been evaluated in view of your specifications with our
product being mounted to your product.
2.Your are requested not to use our product deviating from this product specification.
3.We consider it not appropriate to include any terms and conditions with regard to the business
transaction in the product specifications, drawings or other technical documents. Therefore,
if your technical documents as above include such terms and conditions such as warranty clause,
product liability clause, or intellectual property infringement liability clause, they will be deemed to
be invalid.
!
JEMCGC-03007A 25

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