MLCC End Term, Tech Note Datasheet by Vishay Vitramon

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— VISHAYa V rush Pb \ Z’ 7 mlcc@vlsh y om www.v|shay.com/doc745034 mlcc@v\shay.com mlcc@vlshay.com mlcc@v|shay.com
VISHAY VITRAMON
Ceramic Capacitors Tech Note TN-0029
Vishay Vitramon MLCC End Termination
www.vishay.com
Revision: 18-Aug-16 1Document Number: 45063
For technical questions, contact: mlcc@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TECHNICAL NOTE
By Eli Bershadsky and Dmitry Kan
Notes
(1) Case sizes 1111, 1210 to 1812 with a thickness > 0.049" (1.24 mm) and case sizes 1825 and larger should NOT be wave soldered.
(2) Termination code “E” is for conductive epoxy assembly, contact mlcc@vishay.com for availability.
(3) CDR, DSCC, and MIL-PRF-123 part numbers only.
(4) CDR “U” termination code: Base metallization-barrier metal-solder coated (tin/lead alloy, with a minimum of 4 % lead).
Solder has a melting point of + 200 °C or less. Solder coat thickness is a minimum of 60 microinches.
• Solder iron techniques are not recommended. For more information on soldering visit www.vishay.com/doc?45034.
• Contact mlcc@vishay.com with respect to specific part number requirements.
(5) Terminations code “F” and “M” may exhibit high wetting angles and lower fillet heights as compared to barrier plate terminations such as
X-term. Contact mlcc@vishay.com with respect to specific requirements.
(6) For “C” termination solder coverage should be at least 90 % of the terminal critical areas in soldering.
(7) MIL-PRF-123 part numbers only.
TERMINATION CODE
FROM PART NUMBERING
TERMINATION
DEFINITION
ACCEPTED ASSEMBLY
METHODS
F, M (3) Fired, thick film, silver / palladium Conductive epoxy / reflow solder (5)
E (2) Fired, thick film, silver / palladium Conductive epoxy
N Fired, thick film, non magnetic material Conductive epoxy
C (6) Copper with an outer layer of 100 % tin plate matte finish
for multi-solder mounting
Wave solder (1) / reflow solder /
vapor phase reflow
W (3), X, Y (3) Fired, thick film silver, covered by 100 % nickel barrier plate with an outer
layer of 100 % tin plate matte finish for multi-solder mounting
Wave solder (1) / reflow solder /
vapor phase reflow
L, S (7), Z (3)
Fired, thick film silver, cover by 100 % nickel barrier plate with an
outer layer of tin / lead plate matte finish with a minimum of 4 % lead
for multi-solder mounting
Wave solder (1) / reflow solder /
vapor phase reflow
U (4)
Fired, thick film silver, cover by 100 % nickel barrier plate with an
outer layer of tin / lead plate finish matte with a minimum of 4 % lead
for solder coat
Wave solder (1) / reflow solder /
vapor phase reflow
B
Fired, thick film silver, cured thick film polymer silver, covered by
100 % nickel barrier plate with an outer layer of 100 % tin plate
matte finish for multi-solder mounting
Wave solder (1) / reflow solder /
vapor phase reflow
Ag:
silver
Sn: 100 % tin
plate matte finish
(W, X, Y) or Sn / Pb
tin / lead plate
matte finish with
a minimum of
4 % lead (L, S, Z)
Ni:
nickel
plate
barrier
Figure 2
Termination codes:
L, S, W, X, Y, Z
Sn / Pb solder
coat finish with
minimum of
4 % lead
Figure 3
Termination code: U
Ni:
nickel
plate
barrier
Ag:
silver
AgPd:
silver-
palladium
Figure 1
Termination
codes: F, M, E
Sn: 100 %
tin plate
matte finish
Figure 6
Termination code: C
Cu:
copper
barrier
Ag:
silver
Figure 4
Termination code: B
Ni:
nickel
plate
barrier
Polymer
Sn: 100 %
tin plate
matte finish
Ag:
silver
Non-
magnetic
Figure 5
Termination
code: N
VISHAY. m‘cc@wshay,com www.v\shay,com/doc?91000
Vishay Vitramon MLCC End Termination
Tech Note TN-0029
www.vishay.com Vishay Vitramon
TECHNICAL NOTE
Revision: 18-Aug-16 2Document Number: 45063
For technical questions, contact: mlcc@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Notes
Element definition: Ag = silver, Pd = palladium, Ni = nickel, Sn = tin, Pb = lead
n/a = not applicable
MLCC END TERMINATION PHYSICAL CHARACTERISTICS
P/N
TERM
CODE
THICK FILM END
TERMINATION
BARRIER
TERMINATION TERMINATION FINISH
MATERIAL THICKNESS
(INCHES)
Ni PLATE
THICKNESS
(MICROINCHES)
Sn PLATE
THICKNESS
(MICROINCHES)
Sn/Pb PLATE
THICKNESS
(MICROINCHES)
Sn/Pb
SOLDER COAT
THICKNESS
(MICROINCHES)
CONTENT
OF LEAD
F, M Ag / Pd 0.001 min. n/a n/a n/a n/a n/a
E Ag / Pd 0.001 min. n/a n/a n/a n/a n/a
N Ag / Pd 0.0012 min. n/a n/a n/a n/a n/a
C Ag 0.001 min. n/a 100 min. n/a n/a n/a
W, X, Y Ag 0.001 min. 50 min. 100 min. n/a n/a n/a
L, S, Z Ag 0.001 min. 50 min. n/a 100 min. n/a 4 % min.
U Ag 0.001 min. 50 min. n/a n/a 60 min. 4 % min.
B Polymer 0.003 min. 50 min. 100 min. n/a n/a n/a

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