AD5593R Datasheet by Analog Devices Inc.

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ANALOG DEVICES A05593R \ MW mw—«f» E : 1 : GP .7::\°—( 7 )7 ’—°
8-Channel, 12-Bit, Configurable ADC/DAC
with On-Chip Reference, I
2
C Interface
Data Sheet
AD5593R
Rev. D
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FEATURES
8-channel, configurable ADC/DAC/GPIO
Configurable as any combination of
8 12-bit DAC channels
8 12-bit ADC channels
8 general-purpose I/O pins
Integrated temperature sensor
16-lead TSSOP and LFCSP and 16-ball WLCSP packages
I2C interface
APPLICATIONS
Control and monitoring
General-purpose analog and digital I/O
GENERAL DESCRIPTION
The AD5593R has eight input/output (I/O) pins, which can be
independently configured as digital-to-analog converter (DAC)
outputs, analog-to-digital converter (ADC) inputs, digital outputs,
or digital inputs. When an I/O pin is configured as an analog
output, it is driven by a 12-bit DAC. The output range of the
DAC is 0 V to VREF or 0 V to 2 × VREF. When an I/O pin is
configured as an analog input, it is connected to a 12-bit ADC
via an analog multiplexer. The input range of the ADC is 0 V to
VREF or 0 V to 2 × VREF. The I/O pins can also be configured to
be general-purpose, digital input or output (GPIO) pins. The
state of the GPIO pins can be set or read back by accessing the
GPIO write data register and GPIO read configuration registers,
respectively, via an I2C write or read operation.
The AD5593R has an integrated 2.5 V, 20 ppm/°C reference that
is turned off by default and an integrated temperature indicator
that gives an indication of the die temperature. The temperature
value is read back as part of an ADC read sequence.
The AD5593R is available in 16-lead TSSOP and LFCSP, as well
as a 16-ball WLCSP, and operates over a temperature range of
−40°C to +105°C.
Table 1. Related Products
Product Description
AD5592R AD5593R equivalent with SPI interface
AD5592R-1 AD5593R equivalent with SPI interface and VLOGIC pin
FUNCTIONAL BLOCK DIAGRAM
RESET
V
REF
I/O7
I/O0
GPIO7
GPIO0
T/H
SEQUENCER
V
DD
V
LOGIC
GND
SCL
SDA
A0
TEMPERATURE
INDICATOR
DAC
REGISTER
INPUT
REGISTER DAC 7
DAC
REGISTER
INPUT
REGISTER DAC 0
AD5593R
MUX
12-BIT
SUCCESSIVE
APPROXIMATION
ADC
POWER-ON
RESET
I
2
C
INTERFACE
LOGIC
2.5V
REFERENCE
12507-001
Figure 1.
AD5593R Data Sheet
Rev. D | Page 2 of 33
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Timing Characteristics ................................................................ 6
Absolute Maximum Ratings ............................................................ 7
Thermal Resistance ...................................................................... 7
ESD Caution .................................................................................. 7
Pin Configuration and Function Descriptions ............................. 8
Typical Performance Characteristics ........................................... 11
Terminology .................................................................................... 16
Theory of Operation ...................................................................... 18
DAC Section ................................................................................ 18
ADC Section ............................................................................... 18
GPIO Section .............................................................................. 20
Internal Reference ...................................................................... 20
Reset Function ............................................................................ 20
Temperature Indicator ............................................................... 20
Serial Interface ................................................................................ 21
Write Operation.......................................................................... 21
Read Operation........................................................................... 21
Pointer Byte ................................................................................. 23
Control Registers ........................................................................ 23
General-Purpose Control Register .......................................... 24
Configuring the AD5593R ........................................................ 25
DAC Write Operation ................................................................ 26
DAC Readback ............................................................................ 26
ADC Operation .......................................................................... 27
GPIO Operation ......................................................................... 29
Power-Down/Reference Control .............................................. 30
Reset Function ............................................................................ 30
Applications Information .............................................................. 31
Microprocessor Interfacing ....................................................... 31
AD5593R to ADSP-BF537 Interface ........................................ 31
Layout Guidelines....................................................................... 31
Outline Dimensions ....................................................................... 32
Ordering Guide .......................................................................... 33
REVISION HISTORY
12/2018—Rev. C to Rev. D
Changes to Temperature Indicator Section ................................. 20
Changes to Ordering Guide .......................................................... 33
4/2017—Rev. B to Rev. C
Changes to Reset Function Section .............................................. 30
Changes to Ordering Guide .......................................................... 33
1/2016—Rev. A to Rev. B
Added 16-Lead LFCSP ....................................................... Universal
Added VLOGIC Parameter and ILOGIC Parameter, Table 2 ............... 5
Added Figure 4 and Table 7; Renumbered Sequentially ............. 9
Added Calculating ADC Input Current Section and Figure 33 .... 20
Changes to Temperature Indicator Section ................................. 21
Changes to Figure 34 ...................................................................... 22
Changes to Figure 35 and Figure 36 ............................................. 23
Changes to Figure 37 ...................................................................... 24
Change to DAC Readback Section ............................................... 27
Changes to ADC Operation Section ............................................ 28
Changes to Outline Dimensions ................................................... 33
Changes to Ordering Guide .......................................................... 34
10/2014—Rev. 0 to Rev. A
Added 16-Ball WLCSP ...................................................... Universal
Changes to Gain Error Parameter, Table 1 ..................................... 3
Changes to Table 5 ............................................................................. 7
Added Figure 4 and Table 7; Renumbered Sequentially .............. 9
Change to ADC Section ................................................................ 17
Changes to Reset Function Section and Temperature
Indicator Section ............................................................................ 19
Changes to Reset Function Section, Table 24, and Table 25 .......... 27
Added Figure 41, Outline Dimensions ........................................ 29
Updated Outline Dimensions ....................................................... 29
Changes to Ordering Guide .......................................................... 29
8/2014—Revision 0: Initial Version
Data Sheet AD5593R
Rev. D | Page 3 of 33
SPECIFICATIONS
VDD = 2.7 V to 5.5 V, VREF = 2.5 V (internal), TA = TMIN to TMAX, unless otherwise noted.
Table 2.
Parameter Min Typ Max Unit Test Conditions/Comments
ADC PERFORMANCE
f
IN
= 10 kHz sine wave
Resolution 12 Bits
Input Range1 0 VREF V ADC range select bit = 0
0 2 × VREF V ADC range select bit = 1
Integral Nonlinearity (INL) −2 +2 LSB
Differential Nonlinearity (DNL) −1 +1 LSB
Offset Error ±5 mV
Gain Error 0.3 % FSR
Track Time (tTRACK)2 500 ns
Conversion Time (tCONV)2 2 µs
Signal to Noise Ratio (SNR)3 69 dB VDD = 2.7 V, input range = 0 V to VREF
67 dB VDD = 5.5 V, input range = 0 V to VREF
61 dB VDD = 5.5 V, input range = 0 V to 2 × VREF
Signal-to-Noise + Distortion (SINAD)
Ratio
69 dB VDD = 2.7 V, input range = 0 V to VREF
67 dB VDD = 3.3 V, input range = 0 V to VREF
60 dB VDD = 5.5 V, input range = 0 V to 2 × VREF
Total Harmonic Distortion (THD) −91 dB VDD = 2.7 V, input range = 0 V to VREF
−89
dB
V
DD
= 3.3 V, input range = 0 V to V
REF
−72 dB VDD = 5.5 V, input range = 0 V to 2 × VREF
Spurious Free Dynamic Range (SFDR) 91 dB VDD = 2.7 V, input range = 0 V to VREF
91 dB VDD = 3.3 V, input range = 0 V to VREF
72 dB VDD = 5.5 V, input range = 0 V to 2 × VREF
Aperture Delay2 15 ns VDD = 3 V
12 ns VDD = 5 V
Aperture Jitter2 50 ps
Channel-to-Channel Isolation −95 dB fIN = 5 kHz
Full Power Bandwidth 8.2 MHz At 3 dB
1.6 MHz At 0.1 dB
DAC PERFORMANCE4
Resolution 12 Bits
Output Range 0 VREF V DAC range select bit = 0
0 2 × VREF V DAC range select bit = 1
INL −1 +1 LSB
DNL −1 +1 LSB
Offset Error
−3
mV
Offset Error Drift2 8 µV/°C
Gain Error ±0.2 % FSR Output range = 0 V to VREF
±0.1 % FSR Output range = 0 V to 2 × VREF
Zero Code Error 0.65 2 mV
Total Unadjusted Error (TUE) ±0.03 ±0.25 % FSR Output range = 0 V to VREF
±0.015 ±0.1 % FSR Output range = 0 V to 2 × VREF
Capacitive Load Stability 2 nF RLOAD = ∞
10 nF RLOAD = 1 kΩ
Resistive Load 1 k
Short-Circuit Current 25 mA
DC Crosstalk2 −4 +4 µV Single channel, full-scale output change
DC Output Impedance 0.2
DC Power Supply Rejection Ratio (PSRR)2 0.15 mV/V DAC code = midscale, VDD = 3 V ± 10% or 5 V ± 10%
Load Impedance at Rails5 25
AD5593R Data Sheet
Rev. D | Page 4 of 33
Parameter Min Typ Max Unit Test Conditions/Comments
Load Regulation 200 µV/mA VDD = 5 V ± 10%, DAC code = midscale, −10 mA ≤ IOUT
+10 mA
200 µV/mA VDD = 3 V ± 10%, DAC code = midscale, −10 mA ≤ IOUT
+10 mA
Power-Up Time 7 µs Exiting power-down mode, VDD = 5 V
AC SPECIFICATIONS
Slew Rate 1.25 V/µs
Settling Time 6 µs
DAC Glitch Impulse 2 nV-sec
DAC to DAC Crosstalk 1 nV-sec
Digital Crosstalk
0.1
nV-sec
Analog Crosstalk 1 nV-sec
Digital Feedthrough 0.1 nV-sec
Multiplying Bandwidth 240 kHz DAC code = full scale, output range = 0 V to 2 × VREF
Output Voltage Noise Spectral Density 200 nV/Hz DAC code = midscale, output range = 0 V to 2 × VREF,
measured at 10 kHz
SNR 81 dB
SFDR 77 dB
SINAD 74 dB
Total Harmonic Distortion −76 dB
REFERENCE INPUT
VREF Input Voltage 1 VDD V
DC Leakage Current −1 +1 µA No I/Ox pins configured as DACs
VREF Input Impedance 12 kΩ DAC output range = 0 V to 2 × VREF
24 kΩ DAC output range = 0 V to VREF
REFERENCE OUTPUT
VREF Output Voltage 2.495 2.5 2.505 V
VREF Temperature Coefficient 20 ppm/°C
Capacitive Load Stability
5
μF
R
LOAD
= 2 k
Output Impedance 0.15 VDD = 2.7 V
0.7 VDD = 5 V
Output Voltage Noise 10 µV p-p 0.1 Hz to 10 Hz
Density 240 nV/√Hz At ambient, f = 1 kHz, CL = 10 nF
Line Regulation 20 µV/V At ambient, sweeping VDD from 2.7 V to 5.5 V
10 µV/V At ambient, sweeping VDD from 2.7 V to 3.3 V
Load Regulation
Sourcing 210 µV/mA At ambient, −5 mA ≤ load current ≤ +5 mA
Sinking 120 µV/mA At ambient, −5 mA ≤ load current ≤ +5 mA
Output Current Load Capability ±5 mA VDD ≥ 3 V
GPIO OUTPUT
ISOURCE and ISINK 1.6 mA
Output Voltage
High, VOH VDD − 0.2 V ISOURCE = 1 mA
Low, VOL 0.4 V ISOURCE = 1 mA
GPIO INPUT
Input Voltage
High, VIH VDD × 0.7 V
Low, VIL VDD × 0.3 V
Input Capacitance 20 pF
Hysteresis 0.2 V
Input Current ±1 µA
Data Sheet AD5593R
Rev. D | Page 5 of 33
Parameter Min Typ Max Unit Test Conditions/Comments
LOGIC INPUTS
Input Voltage
High, VINH 0.7 × VLOGIC V
Low, VINL 0.3 × VLOGIC V
Input Current, IIN −1 +0.01 +1 µA
Input Capacitance, CIN 10 pF
LOGIC OUTPUT (SDA)
Output High Voltage, VOH VLOGIC − 0.2 V ISOURCE = 200 µA; VDD = 2.7 V to 5.5 V
Output Low Voltage, VOL 0.4 V ISINK = 200 µA
Floating-State Output Capacitance 10 pF
TEMPERATURE SENSOR2
Resolution 12 Bits
Operating Range −40 +105 °C
Accuracy ±3 °C
Track Time 5 µs ADC buffer enabled
20 µs ADC buffer disabled
POWER REQUIREMENTS
VDD 2.7 5.5 V
IDD 2.7 Digital inputs = 0 V or VDD
Power-Down Mode 3.5 µA
Normal Mode
VDD = 5 V 1.6 mA I/O0 to I/O7 are DACs, internal reference, gain = 2
1 mA I/O0 to I/O7 are DACs, external reference, gain = 2
2.4 mA I/O0 to I/O7 are DACs and sampled by the ADC,
internal reference, gain = 2
1.1 mA I/O0 to I/O7 are DACs and sampled by the ADC,
external reference, gain = 2
1 mA I/O0 to I/O7 are ADCs, internal reference, gain = 2
0.75
mA
I/O0 to I/O7 are ADCs, external reference, gain = 2
0.5 mA I/O0 to I/O7 are general-purpose outputs
0.5 mA I/O0 to I/O7 are general-purpose inputs
VDD = 3 V 1.1 mA I/O0 to I/O7 are DACs, internal reference, gain = 1
1 mA I/O0 to I/O7 are DACs, external reference, gain = 1
1.1 mA I/O0 to I/O7 are DACs and sampled by the ADC,
internal reference, gain = 1
0.78 mA I/O0 to I/O7 are DACs and sampled by the ADC,
external reference, gain = 1
0.75 mA I/O0 to I/O7 are ADCs, internal reference, gain = 1
0.5 mA I/O0 to I/O7 are ADCs, external reference, gain = 1
0.45 mA I/O0 to I/O7 are general-purpose outputs
0.45 mA I/O0 to I/O7 are general-purpose inputs
V
LOGIC
1.8
DD
V
ILOGIC 3.5 μA
1 When using the internal ADC buffer, there is a dead band of 0 V to 5 mV.
2 Guaranteed by design and characterization; not production tested.
3 All specifications expressed in decibels are referred to full-scale input, FSR, and tested with an input signal at 0.5 dB below full scale, unless otherwise specified.
4 DC specifications tested with the outputs unloaded, unless otherwise noted. Linearity calculated using a reduced code range of 8 to 4085. An upper dead band of
10 mV exists when VREF = VDD.
5 When drawing a load current at either rail, the output voltage headroom with respect to that rail is limited by the 25typical channel resistance of the output
devices. For example, when sinking 1 mA, the minimum output voltage = 25 × 1 mA = 25 mV (see Figure 26 and Figure 27).
/ /f/\ Mafia ”A L
AD5593R Data Sheet
Rev. D | Page 6 of 33
TIMING CHARACTERISTICS
All input signals are specified with tR = tF = 1 ns/V (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2; VDD = 2.7 V to
5.5 V, 1.8 V ≤ VLOGIC ≤ VDD; 2.5 V ≤ VREF ≤ VDD; all specifications TMIN to TMAX, unless otherwise noted.
Table 3.
Parameter1 Min Typ Max Unit Conditions/Comments
t1 2.5 µs SCL cycle time
t2 0.6 µs tHIGH, SCL high time
t3 1.3 µs tLOW, SCL low time
t4 0.6 µs tHD,STA, start/repeated start condition hold time
t5 100 ns tSU,DAT, data setup time
t62 0.9 µs tHD,DAT, data hold time
t7 0.6 µs tSU,STA, setup time for repeated start
t8 0.6 µs tSU,STO, stop condition setup time
t9 1.3 µs tBUF, bus free time between a stop and a start condition
t10 300 ns tR, rise time of SCL and SDA when receiving
0 ns tR, rise time of SCL and SDA when receiving (CMOS compatible)
t11 250 ns tF, fall time of SDA when transmitting
0 ns tF, fall time of SDA when receiving (CMOS compatible)
300 ns tF, fall time of SCL and SDA when receiving
20 + 0.1CB3 ns tF, fall time of SCL and SDA when transmitting
CB3 400 pF Capacitive load for each bus line
1 Guaranteed by design and characterization; not production tested.
2 A master device must provide a hold time of at least 300 ns for the SDA signal (referred to the VIH min of the SCL signal) to bridge the undefined region of the falling
edge of SCL.
3 CB is the total capacitance of one bus line in pF. tR and tF are measured between 0.3 VDD and 0.7 VDD.
Timing Diagram
START
CONDITION REPEATED
START
CONDITION
STOP
CONDITION
SDA
SCL
t
9
t
3
t
10
t
4
t
6
t
5
t
2
t
11
t
7
t
4
t
1
t
8
12507-002
Figure 2. 2-Wire Serial Interface Timing Diagram
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Data Sheet AD5593R
Rev. D | Page 7 of 33
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted. Transient currents of up to
100 mA do not cause SCR latch-up.
Table 4.
Parameter Rating
VDD to GND −0.3 V to +7 V
VLOGIC to GND −0.3 V to +7 V
Analog Input Voltage to GND −0.3 V to VDD + 0.3 V
Digital Input Voltage to GND −0.3 V to VLOGIC + 0.3 V
Digital Output Voltage to GND −0.3 V to VLOGIC +0.3 V
VREF to GND −0.3 V to VDD +0.3 V
Operating Temperature Range −40°C to +105°C
Storage Temperature Range −65°C to +150°C
Junction Temperature (TJ max) +150°C
Lead Temperature JEDEC industry-standard
Soldering J-STD-020
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 5. Thermal Resistance
Package Type θJA Unit
16-Lead TSSOP 112 °C/W
16-Lead LFCSP 137 °C/W
16-ball WLCSP 60 °C/W
ESD CAUTION
RESET
AD5593R Data Sheet
Rev. D | Page 8 of 33
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
A0
V
DD
I/O0
I/O3
I/O2
I/O1
RESET
SDA
GND
I/O7
I/O4
V
REF
V
LOGIC
I/O5
I/O6
SCL
AD5593R
TOP VIEW
(Not to Scale)
12507-003
Figure 3. 16-Lead TSSOP Pin Configuration
Table 6. 16-Lead TSSOP Pin Function Descriptions
Pin No. Mnemonic Description
1 RESET Asynchronous Reset Pin. Tie this pin high for normal operation. When this pin is brought low, the AD5593R is reset
to its default configuration.
2 A0 Address Input. Sets the LSB of the 7-bit slave address.
3 VDD Power Supply Input. The AD5593R can operate from 2.7 V to 5.5 V. Decouple the supply with a 0.1 µF capacitor to GND.
4 to 7,
10 to 13
I/O0 to I/O7 Input/Output 0 Through Input/Output 7. These pins can be independently configured as DACs, ADCs, or general-
purpose digital inputs or outputs. The function of each pin is determined by programming the appropriate bits in
the configuration registers.
8 VREF Reference Input/Output. When the internal reference is enabled, the 2.5 V reference voltage is available on the VREF pin. A
0.1 µF capacitor connected from the VREF pin to GND is recommended to achieve the specified performance from the
AD5593R. When the internal reference is disabled, an external reference must be applied to this pin. The voltage
range for the external reference is 1 V to VDD.
9 VLOGIC Interface Power Supply. The voltage on this pin ranges from 1.8 V to 5.5 V.
14 GND Ground Reference Point for All Circuitry.
15 SDA Serial Data Input. This pin is used in conjunction with the SCL line to clock data in to or out of the input shift register. SDA
is a bidirectional, open-drain line that must be pulled to the VLOGIC supply with an external pull-up resistor.
16 SCL Serial Clock Line. This pin is used in conjunction with the SDA line to clock data in to or out of the 16-bit input register.
Emma RESET
Data Sheet AD5593R
Rev. D | Page 9 of 33
GND
I/O7
I/O6
I/O5
V
DD
I/O1
I/O0
I/O2
I/O3
V
REF
V
LOGIC
I/O4
A0
RESET
SCL
SDA
12507-004
12
11
10
1
3
49
2
6
5
7
8
16
15
14
13
AD5593R
TOP VIEW
(Not to Scale)
Figure 4. 16-Lead LFCSP Pin Configuration
Table 7. 16-Ball LFCSP Pin Function Descriptions
Pin No. Mnemonic Description
1 VDD Power Supply Input. The AD5593R operates from 2.7 V to 5.5 V. Decouple the supply with a 0.1 µF capacitor to GND.
2 to 5, 8 to 11 I/O0 to I/O7 Input/Output 0 through Input/Output 7. These pins can be independently configured as DACs, ADCs, or general-
purpose digital inputs or outputs. The function of each pin is determined by programming the appropriate
bits in the configuration registers.
6 VREF Reference Input/Output. When the internal reference is enabled, the 2.5 V reference voltage is available on the
pin. A 0.1 µF capacitor connected from the VREF pin to GND is recommended to achieve the specified performance
from the AD5593R. When the internal reference is disabled, an external reference must be applied to this pin.
The voltage range for the external reference is 1 V to VDD.
7 VLOGIC Interface Power Supply. The voltage ranges from 1.8 V to 5.5 V.
12 GND Ground Reference Point for All Circuitry.
13 SDA Serial Data Input. This pin is used in conjunction with the SCL line to clock data into or out of the input shift register.
SDA is a bidirectional, open-drain line that must be pulled to the VLOGIC supply with an external pull-up resistor.
14 SCL Serial Clock Line. This is pin used in conjunction with the SDA line to clock data into or out of the 16-bit input
register.
15 RESET Asynchronous Reset Pin. Tie this pin high for normal operation. When this pin is brought low, the AD5593R is
reset to its default configuration.
16 A0 Address Input. This pin sets the LSB of the 7-bit slave address.
SDA SCL RESET
AD5593R Data Sheet
Rev. D | Page 10 of 33
TOP VIEW
(BALL SIDE DOWN)
Not to Scale
1
A
B
C
D
2 3 4
BALLA1
INDICATOR
SDA SCL A0
V
DD
I/O0
I/O3 I/O2 I/O1
RESET
GND I/O7
I/O4 V
REF
V
LOGIC
I/O5
I/O6
12507-201
Figure 5. 16-Ball WLCSP Pin Configuration
Table 8. 16-Ball WLCSP Pin Function Descriptions
Pin No. Mnemonic Description
A3 RESET Asynchronous Reset Pin. Tie this pin high for normal operation. When this pin is brought low, the AD5593R is
reset to its default configuration.
A4 A0 Address Input. Sets the LSB of the 7-bit slave address.
B4 VDD Power Supply Input. The AD5593R can operate from 2.7 V to 5.5 V. Decouple the supply with a 0.1 µF capacitor to GND.
B3, C4, C3,
C2, D1, D4,
C1, B2
I/O0 to I/O7 Input/Output 0 through Input/Output 7. These pins can be independently configured as DACs, ADCs, or general-
purpose digital inputs or outputs. The function of each pin is determined by programming the appropriate bits
in the configuration registers.
D3 VREF Reference Input/Output. When the internal reference is enabled, the 2.5 V reference voltage is available on the
pin. A 0.1 µF capacitor connected from the VREF pin to GND is recommended to achieve the specified performance
from the AD5593R. When the internal reference is disabled, an external reference must be applied to this pin.
The voltage range for the external reference is 1 V to VDD.
D2 VLOGIC Interface Power Supply. The voltage ranges from 1.8 V to 5.5 V.
B1 GND Ground Reference Point for All Circuitry.
A1 SDA Serial Data Input. This pin is used in conjunction with the SCL line to clock data into or out of the input shift register.
SDA is a bidirectional, open-drain line that must be pulled to the VLOGIC supply with an external pull-up resistor.
A2 SCL Serial Clock Line. This is used in conjunction with the SDA line to clock data into or out of the 16-bit input register.
Data Sheet AD5593R
Rev. D | Page 11 of 33
TYPICAL PERFORMANCE CHARACTERISTICS
INL (LSB)
ADC CODE
–0.2
0
0.2
0.4
0.6
0.8
1.0
01000 2000 3000 4000
12507-102
Figure 6. ADC INL; VDD = 5.5 V
DNL (LSB)
ADC CODE
–0.5
–0.4
–0.3
–0.2
–0.1
0
0.1
0.2
0.3
0.4
0.5
01000 2000 3000 4000
12507-103
Figure 7. ADC DNL; VDD = 5.5 V
INL (LSB)
ADC CODE
–0.5
–0.4
–0.3
–0.2
–0.1
0
0.1
0.2
0.3
0.4
0.5
01000 2000 3000 4000
12507-104
Figure 8. ADC INL; VDD = 2.7 V
DNL (LSB)
ADC CODE
–0.5
–0.4
–0.3
–0.2
–0.1
0
0.1
0.2
0.3
0.4
0.5
01000 2000 3000 4000
12507-105
Figure 9. ADC DNL; VDD = 2.7 V
NUMBER OF OCCURRENCES
ADC CODE
0
5000
10000
15000
20000
25000
30000
35000
2528 2529 2530
VDD = 2.7V
SAMPLES = 60000
VIN = 1.5V
GAIN = 1
EXTERNAL
REFERENCE = 2.5V
12507-100
Figure 10. Histogram of ADC Codes; VDD = 2.7 V
NUMBER OF OCCURRENCES
ADC CODE
0
5000
10000
15000
20000
25000
30000
35000 V
DD
= 5.5V
SAMPLES = 60000
V
IN
= 1.5V
GAIN = 1
EXTERNAL REFERENCE = 2.5V
2520 2521 2522 2523 2524 2525 2526
12507-101
Figure 11. Histogram of Codes; VDD = 5.5 V
AD5593R Data Sheet
Rev. D | Page 12 of 33
ADC BANDWIDTH (dB)
FREQUENCY (Hz)
1k 10k 100k 1M 10M 100M
–6
–5
–4
–3
–2
–1
0
1V
DD
= 3V/5V
12507-124
Figure 12. ADC Bandwidth
INL (LSB)
DAC CODE
–1.0
–0.5
0
0.5
1.0
01024 2048 3072 4095
12507-130
Figure 13. DAC INL
DNL (LSB)
DAC CODE
–1.0
–0.5
0
0.5
1.0
01024 2048 3072 4095
12507-127
Figure 14. DAC DNL
GLITCH (nV-sec)
DAC CODE
–4
–2
0
2
4
01024 2048 3072 4095
12507-126
Figure 15. DAC Adjacent Code Glitch
V
OUT
(V)
TIME (µs)
–10 010 20
2.490
2.495
2.500
2.505
2.510
12507-115
Figure 16. DAC Digital to Analog Glitch (Rising)
V
OUT
(V)
TIME (µs)
–10 010 20
2.490
2.495
2.500
2.505
2.510
12507-116
Figure 17. DAC Digital to Analog Glitch (Falling)
WM .M
Data Sheet AD5593R
Rev. D | Page 13 of 33
V
OUT
(V)
TIME (µs)
–10 –5 0 5 10
2.42
2.44
2.46
2.48
2.50
2.52
2.54
2.56
2.58
12507-119
Figure 18. DAC Settling Time (100 Code Change, Rising Edge)
V
OUT
(V)
TIME (µs)
–10 –5 0 5 10
2.42
2.44
2.46
2.48
2.50
2.52
2.54
2.56
2.58
12507-120
Figure 19. DAC Settling Time (100 Code Change, Falling Edge)
V
OUT
(V)
TIME (µs)
0.50
2.00
1.75
1.50
1.25
1.00
0.75
012345
R
L
= 2kΩ
C
L
= 200pF
12507-131
Figure 20. DAC Settling Time, Output Range = 0 V to VREF
V
OUT
(V)
TIME (µs)
1.0
4.0
3.5
3.0
2.5
2.0
1.5
012345
R
L
= 2kΩ
C
L
= 200pF
12507-132
Figure 21. DAC Settling Time, Output Range = 0 V to 2 × VREF
V
OUT
(V)
TIME (µs)
–5 0 5 10 15
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0nF LOAD
10nF LOAD
22nF LOAD
47nF LOAD
12507-121
Figure 22. DAC Settling Time vs. Capacitive Load
V
OUT
(µV p-p)
TIME (Seconds)
–200
–150
–100
–50
0
50
100
150
200
0 4 8
2 6 10
12507-109
Figure 23. DAC 1/f Noise with External Reference
usn (nvmz) I w 1L,» A wvw éf/
AD5593R Data Sheet
Rev. D | Page 14 of 33
V
OUT
(µV p-p)
TIME (Seconds)
–200
–150
–100
–50
0
50
100
150
200
0482610
12507-110
Figure 24. DAC 1/f Noise with Internal Reference
NSD (nV/Hz)
FREQUENCY (Hz)
0
500
1000
1500
2000
2500
10 1k 100k100 10k 1M
FULL-SCALE
3/4 SCALE
MID-SCALE
1/4 SCALE
ZERO SCALE
12507-112
Figure 25. DAC Output Noise Spectral Density
OUTPUT VOLTAGE (V)
LOAD CURRENT (mA)
0
5
4
3
2
1
–30 –20 –10 010 20 30
FULL-SCALE
3/4 SCALE
1/2 SCALE
1/4 SCALE
ZERO SCALE
12507-133
Figure 26. DAC Output Sink and Source Capability,
Output Range = 0 V to VREF
OUTPUT VOLTAGE (V)
LOAD CURRENT (mA)
–1
0
6
5
4
3
2
1
–30 –20 –10 010 20 30
FULL-SCALE
3/4 SCALE
1/2 SCALE
1/4 SCALE
ZERO SCALE
12507-134
Figure 27. DAC Output Sink and Source Capability,
Output Range = 0 V to 2 × VREF
M WW’
Data Sheet AD5593R
Rev. D | Page 15 of 33
V
OUT
(µV p-p)
TIME (Seconds)
–20
–15
–10
–5
0
5
10
15
20
0482610
12507-111
Figure 28. Internal Reference 1/f Noise
NSD (nV/Hz)
FREQUENCY (Hz)
0
200
400
600
800
1000
1200
10 1k 100k100 10k 1M
12507-113
Figure 29. Reference Noise Spectral Density
V
REF
(V)
V
DD
(V)
12507-200
2.7 3.0 3.3 3.6 3.9 4.2 4.5 4.8 5.1 5.4
2.4995
2.4997
2.4999
2.5001
2.5003
2.5005
Figure 30. Reference Line Regulation
AD5593R Data Sheet
Rev. D | Page 16 of 33
TERMINOLOGY
ADC Integral Nonlinearity (INL)
For the ADC, INL is the maximum deviation from a straight
line passing through the endpoints of the ADC transfer function.
The end points of the transfer function are zero scale, a point
that is 1 LSB below the first code transition, and full scale, a
point that is 1 LSB above the last code transition.
ADC Differential Nonlinearity (DNL)
For the ADC, DNL is the difference between the measured and the
ideal 1 LSB change between any two adjacent codes in the ADC.
Offset Error
Offset error is the deviation of the first code transition (00 …
000) to (00 … 001) from the ideal, that is, AGND + 1 LSB.
Gain Error
Gain error is the deviation of the last code transition (111 …
110) to (111 … 111) from the ideal (that is, VREF − 1 LSB) after
the offset error has been adjusted out.
Channel-to-Channel Isolation
Channel-to-channel isolation is a measure of the level of
crosstalk between channels. It is measured by applying a full-
scale 5 kHz sine wave signal to all nonselected ADC input
channels and determining how much that signal is attenuated in
the selected channel. This specification is the worst case across
all ADC channels for the AD5593R.
ADC Power Supply Rejection Ratio (PSRR)
For the ADC, variations in power supply affect the full-scale
transition, but not the converter linearity. Power supply rejection is
the maximum change in the full-scale transition point due to a
change in power supply voltage from the nominal value.
Track-and-Hold Acquisition Time
The track-and-hold amplifier goes into track mode when the
ADC sequence register has been written to. The track and hold
amplifier goes into hold mode when the conversion starts (see
Figure 37). Track-and-hold acquisition time is the minimum time
required for the track-and-hold amplifier to remain in track
mode for its output to reach and settle to within ±1 LSB of the
applied input signal, given a step change to the input signal.
Signal-to-(Noise + Distortion) Ratio (SINAD)
SINAD is the measured ratio of signal to (noise + distortion) at
the output of the analog-to-digital converter. The signal is the
rms amplitude of the fundamental. Noise is the sum of all non-
fundamental signals up to half the sampling frequency (fS/2),
excluding dc. The ratio is dependent on the number of quantization
levels in the digitization process; the more levels, the smaller the
quantization noise. The theoretical SINAD for an ideal N-bit
converter with a sine wave input is given by
Signal-to-(Noise + Distortion) (dB) = 6.02N + 1.76
Thus, for a 12-bit converter, this is 74 dB.
ADC Total Harmonic Distortion (THD)
THD is the ratio of the rms sum of harmonics to the
fundamental. For the AD5593R, it is defined as
( )
1
65432
V
VVVVV
THD
22222
log20dB ++++
×=
where V1 is the rms amplitude of the fundamental and V2, V3,
V4, V5, and V6 are the rms amplitudes of the second through the
sixth harmonics.
Peak Harmonic or Spurious Noise
Peak harmonic or spurious noise is defined as the ratio of the
rms value of the next largest component in the ADC output
spectrum (up to fS/2 and excluding dc) to the rms value of the
fundamental. Normally, the value of this specification is
determined by the largest harmonic in the spectrum, but for
ADCs where the harmonics are buried in the noise floor, it is a
noise peak.
DAC Relative Accuracy or Integral Nonlinearity (INL)
For the DAC, relative accuracy or integral nonlinearity is a
measurement of the maximum deviation, in LSBs, from a
straight line passing through the endpoints of the DAC transfer
function. A typical INL vs. code plot is shown in Figure 13.
DAC Differential Nonlinearity (DNL)
For the DAC, differential nonlinearity is the difference between
the measured change and the ideal 1 LSB change between any
two adjacent codes. A specified differential nonlinearity of
±1 LSB maximum ensures monotonicity. This DAC is
guaranteed monotonic by design. A typical DNL vs. code plot
can be seen in Figure 14.
Zero Code Error
Zero code error is a measurement of the output error when zero
code (0x000) is loaded to the DAC register. Ideally, the output is
0 V. The zero code error is always positive in the AD5593R
because the output of the DAC cannot go below 0 V due to a
combination of the offset errors in the DAC and the output
amplifier. Zero code error is expressed in mV.
Gain Error
Gain error is a measure of the span error of the DAC. It is the
deviation in slope of the DAC transfer characteristic from the
ideal expressed as % of FSR.
Offset Error
Offset error is a measure of the difference between VOUT (actual)
and VOUT (ideal) expressed in mV in the linear region of the
transfer function. Offset error can be negative or positive.
Offset Error Drift
Offset error drift is a measurement of the change in offset error
with a change in temperature. It is expressed in µV/°C.
Data Sheet AD5593R
Rev. D | Page 17 of 33
DAC DC Power Supply Rejection Ratio (PSRR)
For the DAC, PSRR indicates how the output of the DAC is
affected by changes in the supply voltage. PSRR is the ratio of
the change in VOUT to a change in VDD for full-scale output of
the DAC. It is measured in mV/V. VREF is held at 2 V, and VDD is
varied by ±10%.
Output Voltage Settling Time
Output voltage settling time is the amount of time it takes for
the output of a DAC to settle to a specified level for a ¼ to ¾
full-scale input change and is measured from the rising edge of
SDA that generates the stop condition.
Digital-to-Analog Glitch Impulse
Digital-to-analog glitch impulse is the impulse injected into the
analog output when the input code in the DAC register changes
state. It is normally specified as the area of the glitch in nV-sec,
and is measured when the digital input code is changed by 1 LSB at
the major carry transition (0x7FF to 0x800) (see Figure 16 and
Figure 17).
Digital Feedthrough
Digital feedthrough is a measure of the impulse injected into the
analog output of the DAC from the digital inputs of the DAC,
but is measured when the DAC output is not updated. It is
specified in nV-sec, and measured with a full-scale code change
on the data bus, that is, from all 0s to all 1s and vice versa.
Reference Feedthrough
Reference feedthrough is the ratio of the amplitude of the signal
at the DAC output to the reference input when the DAC output
is not being updated. It is expressed in dB.
Noise Spectral Density (NSD)
NSD is a measurement of the internally generated random
noise. Random noise is characterized as a spectral density
(nV/√Hz). It is measured by loading the DAC to midscale and
measuring noise at the output. It is measured in nV/√Hz. A plot
of noise spectral density is shown in Figure 25.
DC Crosstalk
DC crosstalk is the dc change in the output level of one DAC in
response to a change in the output of another DAC. It is
measured with a full-scale output change on one DAC (or soft
power-down and power-up) while monitoring another DAC kept
at midscale. It is expressed in μV.
DC crosstalk due to load current change is a measure of the
impact that a change in load current on one DAC has to
another DAC kept at midscale. It is expressed in μV/mA.
Digital Crosstalk
Digital crosstalk is the glitch impulse transferred to the output
of one DAC at midscale in response to a full-scale code change
(all 0s to all 1s and vice versa) in the input register of another
DAC. It is measured in standalone mode and is expressed in
nV-sec.
Analog Crosstalk
Analog crosstalk is the glitch impulse transferred to the output
of one DAC due to a change in the output of another DAC. It is
first measured by loading one of the input registers with a full-
scale code change (all 0s to all 1s and vice versa). Then it is
measured by executing a software LDAC and monitoring the
output of the DAC whose digital code was not changed. The area of
the glitch is expressed in nV-sec.
DAC-to-DAC Crosstalk
DAC-to-DAC crosstalk is the glitch impulse transferred to the
output of one DAC due to a digital code change and subsequent
analog output change of another DAC. It is measured by loading
the attack channel with a full-scale code change (all 0s to all 1s
and vice versa), using the write to and update commands while
monitoring the output of the victim channel that is at midscale.
The energy of the glitch is expressed in nV-sec.
Multiplying Bandwidth
The amplifiers within the DAC have a finite bandwidth. The
multiplying bandwidth is a measure of this finite bandwidth. A
sine wave on the reference (with full-scale code loaded to the
DAC) appears on the output. The multiplying bandwidth is the
frequency at which the output amplitude falls to 3 dB below the
input.
DAC Total Harmonic Distortion (THD)
For the DAC, THD is the difference between an ideal sine wave
and its attenuated version using the DAC. The sine wave is used
as the reference for the DAC, and the THD is a measurement of
the harmonics present on the DAC output. It is measured in dB.
Voltage Reference Temperature Coefficient (TC)
Voltage reference TC is a measure of the change in the reference
output voltage with a change in temperature. The voltage
reference TC is calculated using the box method, which defines
the TC as the maximum change in the reference output over a
given temperature range expressed in ppm/°C, as follows:
6
)(
)()( 10
RangeTempV
VV
TC
NOMREF
MINREFMAXREF
where:
VREF(MAX) is the maximum reference output measured over the
total temperature range.
VREF(MIN) is the minimum reference output measured over the
total temperature range.
VREF(NOM) is the nominal reference output voltage, 2.5 V.
Temp Rang e is the specified temperature range of −40°C to
+105°C.
«r [ cum «V
AD5593R Data Sheet
Rev. D | Page 18 of 33
THEORY OF OPERATION
The AD5593R is an 8-channel, configurable analog and digital
I/O port. The AD5593R has eight pins that can be independently
configured as a 12-bit DAC output channel, a 12-bit ADC input
channel, a digital input pin, or a digital output pin.
The function of each pin is determined by programming the
ADC, DAC, or GPIO configuration registers as appropriate.
DAC SECTION
The AD5593R contains eight 12-bit DACs. Each DAC consists
of a string of resistors followed by an output buffer amplifier.
Figure 31 shows a block diagram of the DAC architecture.
DAC REGISTER
REF (+)
V
REF
I/Ox
GND
REF (–)
RESISTOR
STRING
OUTPUT
AMPLIFIER
12507-011
Figure 31. DAC Channel Architecture Block Diagram
The DAC channels share a single DAC range bit (see Bit D4 in
Table 13) that sets the output range to 0 V to VREF or 0 V to 2 ×
VREF. Because the range bit is shared by all channels, it is not
possible to set different output ranges on a per channel basis.
The input coding to the DAC is straight binary. Therefore, the
ideal output voltage is given by
N
REF
OUT
D
VGV 2
where:
G = 1 for an output range of 0 V to VREF or G = 2 for an output
range of 0 V to 2 × VREF.
VREF is the voltage on the VREF pin.
D is the decimal equivalent of the binary code (0 to 4095) that is
loaded to the DAC register.
N = 12.
Resistor String
The simplified segmented resistor string DAC structure is
shown in Figure 32. The code loaded to the DAC register
determines the switch on the string that is connected to the
output buffer.
Because each resistance in the string has the same value, R, the
string DAC is guaranteed monotonic.
TO OUTPUT
AMPLIFIER
R
R
R
R
R
12507-012
Figure 32. Resistor String
DAC Output Buffer
The output buffer is designed as an input/output rail-to-rail
buffer. The output buffer can drive 2 nF capacitance with a 1 kΩ
resistor in parallel. The slew rate is 1.25 V/μs with a ¼ to ¾
scale settling time of 6 μs. By default, the DAC outputs update
directly after data has been written to the input register. The
LDAC register delays the updates until additional channels have
been written to if required. See the LDAC Mode Operation
section for more information.
ADC SECTION
The ADC section is a fast, 12-bit, single-supply ADC with a
conversion time of 2 μs. The ADC is preceded by a multiplexer
that switches selected I/O pins to the ADC. A sequencer is
included to switch the multiplexer to the next selected channel
automatically. Channels are selected for conversion by writing
to the ADC sequence register. When the write to the ADC
sequence register has completed, the first channel in the
conversion sequence is put into track mode. Each channel can
track the input signal for a minimum of 500 ns. The conversion is
initiated on the rising edge of the clock for the acknowledge
(ACK) that occurs after the slave address (see Figure 37).
Each conversion takes 2 μs. The ADC has a range bit (ADC
range select in the general-purpose control register, see Bit D5 in
Table 13) that sets the input range as 0 V to VREF or 0 V to 2 ×
VREF. All input channels share the same range. The output
coding of the ADC is straight binary. It is possible to set each
I/Ox pin as both a DAC and an ADC. In this case, the primary
function is that of the DAC. If the pin is selected for inclusion in
an ADC conversion sequence, the voltage on the pin is converted
and made available via the serial interface. This allows the DAC
voltage to be monitored.
Data Sheet AD5593R
Rev. D | Page 19 of 33
Calculating ADC Input Current
The current flowing into the I/Ox pins configured as ADC inputs
varies with sampling rate (fS), the voltage difference between
successive channels (VDIFF), and whether buffered or unbuffered
mode is used. Figure 33 shows a simplified version of the ADC
input structure. When a new channel is selected for conversion,
5.8 pF must be charged to or discharged from the voltage that
on the previously selected channel. The time required for the
charge or discharge depends on the voltage difference between
the two channels. This dependence affects the input impedance
of the multiplexer and, therefore, the input current flowing into
the I/Ox pins.
In buffered mode, Switch S1 is open and Switch S2 is closed. In
buffered mode, the U1 buffer directly drives the 23.1 pF capacitor
and the charging time of the capacitors is negligible. In unbuffered
mode, Switch S1 is closed and Switch S2 is closed. In unbuffered
mode, the 23.1 pF capacitor must be charged from the I/Ox
pins; this charging contributes to the input current. For
applications where the ADC input current is too high, an external
input buffer may be required. The choice of buffer is a function
of the particular application.
Calculate the input current for buffered mode as follows:
fS × C × VDIFF + 1 nA
where:
fS is the ADC sample rate in Hz.
C is the sampling capacitance in farads.
VDIFF is the voltage change between successive channels.
Calculate the input current for buffered mode as follows:
fS × C × VDIFF
where 1 nA is the dc leakage current associated with unbuffered
mode.
The input current for the ADC in buffered mode, where
I/O0 = 0.5 V, I/O1 = 2 V, and fS = 10 kHz, is as follows:
(10,000 × 5.8 × 10−12 × 1.5) + 1 nA = 88 nA
Under the same conditions, the ADC input current in unbuffered
mode is as follows:
(10,000 × 28.9 × 10−12 × 1.5) = 433.5 nA
U1
5.8pF
I/O0
I/O7
COMPARATOR
CONTROL
LOGIC
MUX
S1
S2
S3
S4
23.1pF
300Ω
12507-033
Figure 33. ADC Input Structure
3R has H RES}; 1‘ 1 ( 1 1 1 11 1 ( 1 RESE 1‘ RESE 1‘ RESE 1‘
AD5593R Data Sheet
Rev. D | Page 20 of 33
GPIO SECTION
Each of the eight I/Ox pins can be configured as a general-purpose
digital input or output pin by programming the GPIO control
register. When an I/Ox pin is configured as an output, the pin can
be set high or low by programming the GPIO write data register.
Logic levels for general-purpose outputs are relative to VDD and
GND. When an I/Ox pin is configured as an input, its status can be
determined by reading the GPIO read configuration register. When
an I/Ox pin is set as an output, it is possible to read its status by also
setting it as an input pin. When reading the status of the I/Ox pins
set as inputs the status of an I/Ox pin set as both and input and
output pin is also returned.
INTERNAL REFERENCE
The AD5593R contains an on-chip 2.5 V reference. The reference is
powered down by default and is enabled by setting Bit D9 in the
power-down/reference control register to 1. When the on-chip
reference is powered up, the reference voltage appears on the
VREF pin and may be used as a reference source for other
components. When the internal reference is used, it is
recommended to decouple VREF to GND using a 100 nF capacitor.
It is recommended that the internal reference be buffered before
using it elsewhere in the system. When the reference is powered
down, an external reference must be connected to VREF. Suitable
external reference sources for the AD5593R include the AD780,
AD1582, ADR431, REF193, and ADR391.
RESET FUNCTION
The AD5593R has an asynchronous RESET pin. For normal
operation, RESET is tied high. A falling edge on RESET resets
all registers to their default values and reconfigures the I/O pins
to their default values (85 kΩ pull-down resistor to GND). The
reset function takes 250 µs maximum; do not write new data to
the AD5593R during this time. The AD5593R has a software
reset that performs the same function as the RESET pin. The
reset function is activated by writing 0x0F to the pointer byte
and 0x0D and 0xAC to the most significant and least significant
bytes, respectively.
TEMPERATURE INDICATOR
The AD5593R contains an integrated temperature indicator that
can be read to provide an estimation of the die temperature.
This can be used in fault detection where a sudden rise in die
temperature may indicate a fault condition, such as a shorted
output. Temperature readback is enabled by setting Bit D8 in
the ADC sequence register. The temperature result is then
added to the ADC sequence. The temperature result has an
address of 0b1000 and care must be taken that this result is not
confused with the readback from DAC0. The temperature
conversion takes 5 µs with the ADC buffer enabled and 20 µs
when the buffer is disabled. Calculate the temperature using the
following formulae:
For ADC gain = 1,
Temperature (°C) =
( )
( )
( )
( )
0.5/ 4095
25 2.654 2.5
REF
REF
ADC Code V
V
−×
+×/
For ADC gain = 2,
Temperature (°C) =
( )
( )
( )
( )
( )
0.5 2 4095
25 1.327 2.5
REF
REF
ADC Code V
V
− /× ×
+×/
The range of codes returned by the ADC when reading from
the temperature indicator is approximately 645 to 1035,
corresponding to a temperature between −40°C to +105°C. The
accuracy of the temperature indicator is typically 3°C when
averaged over five samples.
mu W beg W n.
Data Sheet AD5593R
Rev. D | Page 21 of 33
SERIAL INTERFACE
The AD5593R has a 2-wire, I2C-compatible serial interface
(refer to The I2C -Bus Specification, Version 2.1, January 2000).
The AD5593R is connected to an I2C bus as a slave device
under the control of a master device. See Figure 2 for a timing
diagram of a typical write sequence. The AD5593R supports
standard mode (100 kHz) and fast mode (400 kHz). Support is
not provided for 10-bit addressing and general call addressing.
The AD5593R has a 7-bit slave address; its six MSBs are set to
001000. The LSB is set by the state of the A0 address pin, which
determines the state of the A0 bit. The facility to change the
logic level of the A0 pin before a read or write operation allows
the user to incorporate multiple AD5593R devices on one bus.
The 2-wire serial bus protocol operates as follows: the master
initiates data transfer by establishing a start condition when a
high-to-low transition on the SDA line occurs while SCL is
high. The following byte is the address byte, which consists of
the 7-bit slave address. The slave address corresponding to the
transmitted address responds by pulling SDA low during the
ninth clock pulse (this is termed the acknowledge bit). At this
stage, all other devices on the bus remain idle while the selected
device waits for data to be written to or read from its shift register.
Data is transmitted over the serial bus in sequences of nine
clock pulses (eight data bits followed by an acknowledge bit).
The transitions on the SDA line must occur during the low
period of SCL and remain stable during the high period of SCL.
When all data bits have been read or written, a stop condition is
established.
In write mode, the master pulls the SDA line high during the
10th clock pulse to establish a stop condition. In read mode, the
master issues a no acknowledge for the ninth clock pulse (that
is, the SDA line remains high). The master brings the SDA line
low before the 10th clock pulse and then high during the 10th
clock pulse to establish a stop condition.
WRITE OPERATION
When writing to the AD5593R, the user must begin with a start
command followed by an address byte R/W = 0), after which
the AD5593R acknowledges that it is prepared to receive data
by pulling SDA low. The AD5593R requires three bytes of data.
The first byte is the pointer byte. This byte contains information
defining the type of operation that is required of the AD5593R,
such as configuring the I/O pins and writing to a DAC. The pointer
byte is followed by the most significant byte and the least
significant byte, as shown in Figure 34. After these data bytes
are acknowledged by the AD5593R, a stop condition follows.
READ OPERATION
When reading data back from the AD5593R, the user begins
with a start command followed by an address byte (R/W = 0),
after which the DAC acknowledges that it is prepared to transmit
data by pulling SDA low. The pointer byte is then written to select
what is to be read back. A repeat start or a new I2C transmission
can then follow to read two bytes of data from the AD5593R.
Both bytes are acknowledged by the master, as shown in Figure 35.
It is also possible to perform consecutive readbacks without
having to provide interim start and stop conditions or slave
addresses. This method can be used to read blocks of
conversions from the ADC, as shown in Figure 37.
FRAME 2
POINTER BYTE
FRAME 1
SLAVE ADDRESS
1 9 91
SCL
START BY
MASTER ACK. BY
AD5593R ACK. BY
AD5593R
ACK. BY
AD5593R
ACK. BY
AD5593R
SDA R/W D7A000100 0 D6 D5 D4 D3 D2 D1 D0
1 9 91
FRAME 4
LEAST SIGNIFICANT
DATA BYTE
FRAME 3
MOST SIGNIFICANT
DATA BYTE
STOP BY
MASTER
SCL
(CONTINUED)
SDA
(CONTINUED) DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
12507-013
Figure 34. 4-Byte I2C Write
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AD5593R Data Sheet
Rev. D | Page 22 of 33
FRAME 2
POINTER BYTE
FRAME 1
SLAVE ADDRESS
FRAME 2
MOST SIGNIFICANT
DATA BYTE
FRAME 3
LEAST SIGNIFICANT
DATA BYTE
FRAME 1
SLAVE ADDRESS
START BY
MASTER ACK. BY
AD5593R ACK. BY
AD5593R
START BY
MASTER ACK. BY
AD5593R ACK. BY
MASTER
STOP BY
MASTER
STOP BY
MASTER
NACK. BY
MASTER
1 9 9
1
SCL
SDA WD7A000100 0 D6 D5 D4 D3 D2 D1 D0
1 9
SCL
(CONTINUED)
SDA
(CONTINUED)
SCL
(CONTINUED)
SDA
(CONTINUED) D7 D6 D5 D4 D3 D2 D1 D0
19 91
RD15A00
0100 0D14 D13 D12 D11 D10 D9 D8
12507-014
Figure 35. Read One 16-Bit Word
START BY
MASTER
REPEAT START
BY MASTER ACK. BY
AD5593R ACK. BY
MASTER
STOP BY
MASTER
NACK. BY
MASTER
ACK. BY
AD5593R ACK. BY
AD5593R
SCL
(CONTINUED)
SDA
(CONTINUED)
SCL
(CONTINUED)
SDA
(CONTINUED)
FRAME 2
POINTER BYTE
FRAME 1
SLAVE ADDRESS
1 9 91
SCL
SDA WD7A000100 0 D6 D5 D4 D3 D2 D1 D0
1 9
FRAME 3
LEAST SIGNIFICANT
DATA BYTE
D7 D6 D5 D4 D3 D2 D1 D0
FRAME 2
MOST SIGNIFICANT
DATA BYTE
FRAME 1
SLAVE ADDRESS
1 9 91
RD15A000100 0 D14 D13 D12 D11 D10 D9 D8
12507-015
Figure 36. Read One 16-Bit Word, Maintain Control of the Bus
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Data Sheet AD5593R
Rev. D | Page 23 of 33
START BY
MASTER ACK. BY
AD5593R ACK. BY
AD5593R
SCL
(CONTINUED)
SDA
(CONTINUED)
SCL
(CONTINUED)
SDA
(CONTINUED)
SCL
(CONTINUED)
SDA
(CONTINUED)
FRAME 2
POINTER BYTE
FRAME 1
SLAVE ADDRESS
1 9 91
SCL
SDA WD7
A000100 0 D6 D5 D4 D3 D2 D1 D0
1 9
FRAME 3
LEAST SIGNIFICANT
DATA BYTE
D7 D6 D5 D4 D3 D2 D1 D0
1 9
D15 D14 D13 D12 D11 D10 D9 D8
FRAME 4
MOST SIGNIFICANT
DATA BYTE
FRAME 2
MOST SIGNIFICANT
DATA BYTE
FRAME 1
SLAVE ADDRESS
1 9 91
REPEAT START
BY MASTER ACK. BY
AD5593R ACK. BY
MASTER
ACK. BY
MASTER ACK. BY
MASTER
RD15A000100 0 D14 D13 D12 D11 D10 D9 D8
1 9
ACK. BY
MASTER
FRAME 5
LEAST SIGNIFICANT
DATA BYTE
STOP BY
MASTER
D7 D6 D5 D4 D3 D2 D1 D0
1
ONLY APPLICABLE IF AN ADC SEQUENCE HAS BEEN SELECTED.
START OF ADC
CONVERSION
1
12507-016
Figure 37. I2C Block Read
POINTER BYTE
The pointer byte contains eight bits. Bits[D7:D4] are mode bits
that select the operation to be executed. The data contained in
Bits[D3:D0] depend on the operation required. Table 9 shows
the configuration of the pointer byte. When Bits[D7:D4] are
0b0000, the mode dependent bits (Bits[D3:D0]) select a control
register to write data to. The data written to a control register is
contained in the MSB and LSB as shown in Figure 34. The mode
dependent data bits also select which DAC is updated during a
DAC write operation and which register is selected for readback.
Table 9. Pointer Byte Configuration
D7
D6
D5
D4
D3
D2
D1
D0
Mode bits Mode dependent data bits
Table 10. Mode Bits
D7 D6 D5 D4 Description
0 0 0 0 Configuration mode
0 0 0 1 DAC write
0 1 0 0 ADC readback
0 1 0 1 DAC readback
0 1 1 0 GPIO readback
0 1 1 1 Register readback
CONTROL REGISTERS
Table 11 shows the control register map for the AD5593R. The
control registers configure the I/O pins and set various
operating parameters in the AD5593R, such as enabling the
reference, selecting the LDAC mode function, or selecting
power-down modes. The control registers are written to using
the 4-byte I2C write sequence shown in Figure 34. To write to a
control register, the mode bits (Bits[D7:D4]) of the pointer byte
are zeros. The mode dependent data bits (Bits[D3:D0]) of the
pointer byte select which control register is to be accessed. The
data to be written to the control register is contained in the
most significant and least significant data bytes. These contain a
total of 16 bits and are shown as D15 to D0 in Table 12 and
Table 13. The contents of the control registers can be read back
using the read sequence shown in Figure 35 or Figure 36.
AD5593R Data Sheet
Rev. D | Page 24 of 33
GENERAL-PURPOSE CONTROL REGISTER
The general-purpose control register enables or disables certain
functions associated with the DAC, ADC, and I/O pin configura-
tion (see Table 13). The register sets the output range of the
DAC and input range of the ADC, which sets their transfer
functions, enables/disables the ADC buffer, and enables the
precharge function (see the ADC Section for more details). The
register is also used to lock the I/O pin configuration to prevent
accidental change. When Bit D7 is set to 1, writes to the
configuration registers are ignored.
Table 11. Control Registers
Pointer Byte
[D7:D0] Register Name Description Default Value
00000000 NOP No operation 0x0000
00000010 ADC sequence register Selects ADCs for conversion 0x0000
00000011 General-purpose control register DAC and ADC control register 0x0000
00000100 ADC pin configuration Selects which pins are ADC inputs 0x0000
00000101 DAC pin configuration Selects which pins are DAC outputs 0x0000
00000110 Pull-down configuration Selects which pins have an 85 kΩ pull-down resistor to GND 0x00FF
00000111 LDAC mode Selects the operation of the load DAC 0x0000
00001000 GPIO write configuration Selects which pins are general-purpose outputs 0x0000
00001001 GPIO write data Writes data to general-purpose outputs 0x0000
00001010 GPIO read configuration Selects which pins are general-purpose inputs 0x0000
00001011 Power-down/reference control Powers down the DACs and enables/disables the reference 0x0000
00001100 Open-drain configuration Selects open-drain or push-pull for general-purpose outputs 0x0000
00001101 Three-state pins Selects which pins are three-stated 0x0000
00001110 Reserved
00001111 Software reset Resets the AD5593R 0x0000
Table 12. General-Purpose Control Register
MSB LSB
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
Reserved ADC buffer
precharge
ADC buffer
enable
Lock
configuration
Write all
DACs
ADC
range
select
DAC
range
select
Reserved
Table 13. General-Purpose Control Register Descriptions
Bits Description
D15 to D10 Reserved. Set these bits to 0.
D9 ADC buffer precharge.
0: the ADC buffer is not used to precharge the ADC. If the ADC buffer is enabled, it is always powered up (default).
1: the ADC buffer is used to precharge the ADC. If the ADC buffer is enabled, it is powered up while the conversion takes
place and then powered down until the next conversion takes place.
D8 ADC buffer enable.
0: the ADC buffer is disabled (default).
1: the ADC buffer is enabled.
D7 Lock configuration.
0: the contents of the I/O pin configuration registers can be changed (default).
1: the contents of the I/O pin configuration registers cannot be changed.
D6 Write all DACs.
0: for future DAC writes, the DAC address bits determine which DAC is written to (default).
1: for future DAC writes, the DAC address bits are ignored and all channels configured as DACs are updated with the same data.
D5 ADC range select.
0: the ADC range is 0 to VREF (default).
1: the ADC range is 0 to 2 × VREF.
D4 DAC range select.
0: the DAC range is 0 to V
REF
(default).
1: the DAC range is 0 to 2 × VREF.
D3 to D0 Reserved; set these bits to 0.
Data Sheet AD5593R
Rev. D | Page 25 of 33
CONFIGURING THE AD5593R
The AD5593R I/O pins are configured by writing to a series of
pin configuration registers. The control registers are accessed
when Bits[D7:D4] are 0b0000. Bits[D3:D0] determine which
register is accessed as shown in Table 11.
On power-up, the I/O pins are configured as 85 kΩ resistors
connected to GND. The I/O channels of the AD5593R can be
configured to operate as DAC outputs, ADC inputs, digital
outputs, digital inputs, three-state, or connected to GND with
85 kΩ pull-down resistors. When configured as digital outputs,
the pins have the additional option of being configured as
push/pull or open-drain.
The I/O channels are configured by writing to the appropriate
configuration registers, as shown in Table 11. To assign a
particular function for an I/O channel, write to the appropriate
register and set the corresponding bit to 1. For example, setting
Bit D0 in the DAC configuration register configures I/O0 as a
DAC. In the event that the bit for an I/O channel is set in
multiple configuration registers, the I/O channel adopts the
function dictated by the last write operation.
The exceptions to this rule are that an I/Ox pin can be set as
both a DAC and ADC or as a digital input and output. When an
I/Ox pin is configured as a DAC and ADC, the primary
function is as a DAC and the ADC can be used to measure the
voltage being provided by the DAC. This feature can be used to
monitor the output voltage to detect short circuits or overload
conditions. Figure 38 shows an example of how to configure
I/O1 and I/O7 as DACs. When a pin is configured as both a
general-purpose input and output, the primary function is as an
output pin. This configuration allows the status of the output pin
to be determined by reading the GPIO read configuration
register.
The general-purpose control register contains a lock
configuration bit. When the lock configuration bit is set to 1,
any writes to the pin configuration registers are ignored, thus
preventing the function of the I/O pins from being changed.
The I/O pins can be reconfigured any time when the AD5593R
is in an idle state, that is, no ADC conversions are taking place
and no registers are being read back. The lock configuration bit
must also be set to 0.
Table 14. I/O Pin Configuration Registers1
D7 D6 D5 D4 D3 D2 D1 D0
I/O7 I/O6 I/O5 I/O4 I/O3 I/O2 I/O1 I/O0
1 Setting an I/O pin configuration bit to 1 after writing to a control register enables that function on the selected I/O pin.
S = START CONDITION
P = STOP CONDITION
A = ACKNOWLEDGE
A P
S A
A0b00000101 0b00000000 0b10000010
A
POINTER BYTE MOST SIGNIFICANT
DATA BYTE LEAST SIGNIFICANT
DATA BYTE
SLAVE ADDRESS + W
12507-017
Figure 38. Configuring I/O1 and I/O7 as DACs
AD5593R Data Sheet
Rev. D | Page 26 of 33
DAC WRITE OPERATION
Data is written to a DAC when the mode bits (Bits[D7:D4]) of
the pointer byte are 0b0001 (see Table 10). Bits[D2:D0]
determine which DAC is addressed. Data to be written to the
DAC is contained in the MSB and LSB, as shown in Table 17.
Data is written to the selected DAC input register. Data written
to the input register can be automatically copied to the DAC
register, if required. Data is transferred to the DAC register
based on the setting of the LDAC mode register (see Table 15).
LDAC Mode Operation
The transfer of data from an input register to a DAC register is
controlled by Bit D1 and Bit D0 of the readback and LDAC
mode register (pointer byte = 0b00000111). When the LDAC
mode bits (Bit D1 and Bit D0) are set to 00, new data is
automatically transferred from the input register to the DAC
register and the analog output updates. When the LDAC mode
bits are set to 01, data remains in the input register. This allows
writes to input registers without affecting the analog outputs.
After loading the input registers with the desired values and
setting the LDAC mode bits to 10, the values in the input
registers transfer to the DAC registers and the analog outputs
update simultaneously. The LDAC mode bits then revert to 01.
Table 15. LDAC Mode Register
D1 D0 LDAC Mode
0 0
Data written to an input register is immediately
copied to a DAC register and the DAC output
updates (default).
0 1 Data written to an input register is not copied to a
DAC register. The DAC output is not updated.
1 0 Data in the input registers is copied to the
corresponding DAC registers. When the data has
been transferred, the DAC outputs are updated
simultaneously.
1 1 Reserved.
DAC READBACK
The input register of each DAC can be read back via the I2C
interface. This can be useful to confirm that the data was received
correctly before writing to the LDAC register or simply checking
what value was last loaded to a DAC. Data can be read back
from a DAC only when no ADC conversion sequence is taking
place. A DAC input register can be read back using the sequence
shown in Figure 35 or Figure 36. The mode bits, Bits[D3:D0], of
the pointer register, 0b0101, select which DAC input register is
to be read back. When the DAC register is read back, the MSB
of the most significant data byte is a 1 to indicate that the result
is a DAC register. The next three bits (Bits[D14:D12]) contain
the DAC register address (see Table 17) and Bits[D11:D0]
contain the DAC register value. Figure 39 shows an example of
reading the input register of DAC2.
Table 16. DAC Pointer Byte Address
DAC Address D7 D6 D5 D4 D3 D2 D1 D0
DAC0 0 0 0 1 0 0 0 0
DAC1 0 0 0 1 0 0 0 1
DAC2 0 0 0 1 0 0 1 0
DAC3 0 0 0 1 0 0 1 1
DAC4 0 0 0 1 0 1 0 0
DAC5 0 0 0 1 0 1 0 1
DAC6 0 0 0 1 0 1 1 0
DAC7 0 0 0 1 0 1 1 1
Table 17. DAC Data Register
MSB LSB
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
1 DAC address 12-bit DAC data
S = START CONDITION
P = STOP CONDITION
A = ACKNOWLEDGE
RS = REPEAT START
AP
S
A
A0b01010010
0b1010XXX 0bXXXXXXX
RSA
POINTER BYTE
DACADDRESS AND
4 MSBs DAC LSBs
SLAVE ADDRESS + W ASLAVE ADDRESS + R
12507-018
Figure 39. DAC Input Register Readback
Data Sheet AD5593R
Rev. D | Page 27 of 33
ADC OPERATION
The ADC channels of the AD5593R operate as a traditional
multichannel ADC, where each serial transfer selects the next
channel for conversion. The user must write to the ADC
sequence register (see Table 19) to select the input channels to
be included in the conversion sequence before initiating any
conversions. This is done using the I2C write sequence shown in
Figure 34. When writing to the ADC sequence register, select
which channels are to be converted in sequence. The user can also
set the REP bit to have the ADC repeat conversions in the
sequence.
When the sequence register has been written to, the ADC begins to
track the first channel in the sequence. ADC data can be read
from the AD5593R using any of the three read operations shown
in Figure 35, Figure 36, and Figure 37, with the I2C block read
(Figure 37) being the most efficient.
If more than one channel is selected in the ADC sequence
register, the ADC converts all selected channels sequentially in
ascending order. Conversion is started by the rising edge of SCL
at the acknowledge (ACK) preceding the MSB (see Figure 37).
If the REP bit is set after all of the selected channels in the
sequence register have been converted, the ADC repeats the
sequence. If the REP bit is clear, the ADC clocks out the last
result on subsequent I2C reads. When ADC data is clocked out
by the serial interface, D15 = 0 to indicate that the result is ADC
data. D14 to D12 contain a 3-bit address to indicate which ADC
the data is coming from, and D11 to D0 contain the 12-bit ADC
result (see Table 20).
Figure 40 shows how to configure the AD5593R to perform
ADC conversions. In Step 1, I/O7 and I/O0 are configured as
ADCs. Step 2 writes to the ADC configuration register, sets the
REP bit, and selects ADC7 and ADC0 for inclusion in the
conversion sequence. Step 3 selects the ADCs for reading and
Step 4 begins reading the ADC results. The conversions are
repeated until a stop condition is given by the controller.
The ADC sequence can be changed by writing the new
sequence to the ADC sequence register when conversions are
not taking place. When a new sequence is written, any channels
remaining to be converted from the earlier sequence are
ignored and the ADC starts converting the first channel of the
new sequence.
To stop the ADC conversion sequence, clear the REP, TEMP,
and ADC7 to ADC0 bits in the ADC sequence register to 0.
Table 18. ADC Sequence Register
MSB
LSB
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
Reserved REP TEMP ADC7 ADC6 ADC5 ADC4 ADC3 ADC2 ADC1 ADC0
Table 19. ADC Sequence Register Descriptions
Bits Description
D15 to D10 Reserved; set this bit to 0
D9 REP: ADC sequence repeat
0 = sequence repetition disabled (default)
1 = sequence repetition enabled
D8 TEMP: include temperature indicator in ADC sequence
0 = disable temperature indicator readback (default)
1 = enable temperature indicator readback
D7 to D0 Setting these bits to 1 includes the appropriate ADC in the conversion sequence; by default no channels are included
Table 20. ADC Data Register
MSB LSB
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
0 ADC address 12-bit ADC data
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AD5593R Data Sheet
Rev. D | Page 28 of 33
12507-019
S = START CONDITION
P = STOP CONDITION
A = ACKNOWLEDGE
P
AP
SA
A
0b00000100 0b00000000 0b10000001
A
POINTER BYTE MOST SIGNIFICANT
DATA BYTE LEAST SIGNIFICANT
DATA BYTE
SLAVE ADDRESS + W
STEP1
A
SA
ADC7 RESULT (MSB) ADC7 RESULT (LSB)
A
SLAVE ADDRESS + R
STEP4
AP
SA
A
0b00000010 0b00000010 0b10000001
A
SLAVE ADDRESS + W
STEP2
P
SA
0b01000000
A
SLAVE ADDRESS + W
STEP3
A
A
ADC7 RESULT (MSB) ADC7 RESULT (LSB)
A
A
ADC0 RESULT (MSB) ADC0 RESULT (LSB)
A
A
ADC0 RESULT (MSB) ADC0 RESULT (LSB)
Figure 40. Configuring the ADC for Conversion
Table 23. GPIO Write Data Regismr Descriptions
Data Sheet AD5593R
Rev. D | Page 29 of 33
GPIO OPERATION
Each of the I/Ox pins of the AD5593R can be configured to
operate as a general-purpose, digital input or output pin. The
function of the pins is determined by writing to the appropriate
bit in the GPIO read configuration and GPIO write configuration
registers using the 4-byte I2C write shown in Figure 34.
Setting Pins as Outputs
To set a pin as a general-purpose output, set the appropriate bit
in the GPIO write configuration register to 1. For example,
setting Bit D0 to 1 enables I/O0 as a general-purpose output.
The outputs can be independently configured as push/pull or
open-drain outputs. When in push/pull configuration, the
output is driven to VDD or GND as determined by the data in
the GPIO write data register. When in open-drain configuration,
the output is driven to GND when a data bit in the GPIO write
data register sets the pin low. When the pin is set high, the
output is not driven and must be pulled high by an external
resistor. This allows multiple output pins to be tied together. If
all the pins are normally high, it allows one pin to pull down the
others. This is commonly used where multiple pins are used to
trigger an alarm or interrupt pin. The state of the output pin is
controlled by setting or clearing the bits in the GPIO write data
register (pointer byte = 0b00001001). A data bit is ignored if it is
written to a location that is not configured as an output.
Table 21. GPIO Write Configuration Register Descriptions
Bits Description
D15 to D8 Reserved; set these bits to 0
D7 to D0 Select pins as GPIO outputs
D[7:0] = 1: I/O[7:0] is a general-purpose output pin
D[7:0] = 0: I/O[7:0] function is determined by the
pin configuration registers (default)
Table 22. GPIO Open-Drain Control Register Descriptions
Bits Description
D15 to D8 Reserved; set these bits to 0
D7 to D0 Sets output pins as open-drain
D[7:0] = 1: I/O[7:0] is an open-drain output pin
D[7:0] = 0: I/O[7:0] is a push/pull output pin
(default)
Table 23. GPIO Write Data Register Descriptions
Bits Description
D15 to D8 Reserved; set these bits to 0
D7 to D0 Sets the state of a GPIO output
D[7:0] = 1: I/O[7:0] is a Logic 1
D[7:0] = 0: I/O[7:0] is a Logic 0 (default)
Setting Pins as Inputs
To set an I/Ox pin as a general-purpose input, set the
appropriate bit in the GPIO read configuration register to 1. For
example, setting Bit D0 to 1 enables I/O0 as a general-purpose
input. To read the state of general-purpose inputs, set the
pointer byte to 0b01100000 (see Table 10 ) using any of the read
operations shown in Figure 35, Figure 36, and Figure 37. The
status of any I/O pin set as a general-purpose input appears in
the appropriate bit location in the least significant data byte.
Three-State Pins
The I/Ox pins can be set to three-state by writing to the three-
state configuration register (pointer byte = 0b00001101) as
shown in Table 24.
Table 24. Three-State Configuration Register Descriptions
Bits Description
D15 to D8 Reserved; set these bits to 0
D7 to D0 Set pins as three-state outputs
D[7:0] = 1: I/O[7:0] is a three-state output pin
D[7:0] = 0: I/O[7:0] function is determined by the
pin configuration registers (default)
85 kΩ Pull-Down Pins
The I/Ox pins can be connected to GND via a pull-down
resistor (85 kΩ) by setting the appropriate bits in the pull-down
configuration register (pointer byte = 00000110) as shown in
Table 25.
Table 25. Pull-Down Configuration Register Descriptions
Bits Description
D15 to D8 Reserved; set these bits to 0
D7 to D0 Set pins as weak pull-down outputs
D[7:0] = 1: I/O[7:0 is connected to GND via an 85 kΩ
pull-down resistor
D[7:0] = 0: I/O[7:0] function is determined by the
pin configuration registers (default)
AD5593R Data Sheet
Rev. D | Page 30 of 33
POWER-DOWN/REFERENCE CONTROL
The AD5593R has a power-down/reference control register
(pointer byte = 0b00001011) that reduces the power consumption
when certain functions are not needed. The power-down register
allows any channels set as DACs to be placed in a power-down
state individually. When in power-down, the DAC outputs are
three-stated. When a DAC channel is returned into normal
mode, the DAC output returns to its previous value. The internal
reference and its buffer are powered down by default and are
enabled by setting the EN_REF bit in the power-down register.
The internal reference voltage then appears at the VREF pin.
There is no dedicated power-down function for the ADC, but
the ADC is automatically powered down if none of the I/Ox
pins are selected as ADCs. The ADC powers up if a read of the
temperature indicator is initiated. The PD_ALL bit powers down
all the DACs, the reference, its buffer, and the ADC. The
PD_ALL bit also overrides the settings of Bit D9 to Bit D0.
Table 26 shows the power-down register.
RESET FUNCTION
The AD5593R can be reset to its default conditions by writing
0x0DAC to the reset register (pointer byte = 0b00001111). This
resets all registers to their default values and reconfigures the
I/Ox pins to their default values (85 kΩ pull-down to GND).
The reset function is triggered on the SCL falling edge of the eighth
bit of the least significant byte (DB0 of Frame 4 in Figure 34),
and the AD5593R does not generate an ACK signal for this byte
of data. The AD5593R has a RESET pin that performs the same
function. For normal operation, RESET is tied high. A falling
edge on RESET triggers the reset function. Both the hardware
and the software reset functions take 100 µs maximum and
there must be no activity on the SCL pin of the AD5593R
during this time.
Table 26. Power-Down Register
MSB LSB
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
0 0 0 0 0 PD_ALL EN_REF 0 PD7 PD6 PD5 PD4 PD3 PD2 PD1 PD0
Table 27. LDAC Mode Register Descriptions
Bits Bit Name Description
D15 to D11 Reserved Reserved; set these bits to 0
D10 PD_ALL 0 = the power-down states of the reference and DACs are determined by D9 and D7 to D0 (default).
1 = the reference, the DACs, and the ADC are powered down.
D9 EN_REF 0 = the reference and its buffer are powered down (default). Set this bit if an external reference is used.
1 = the reference and its buffer are powered up. The reference is available on the VREF pin.
D7 to D0 PD7 to PD0 0 = the channel is in normal operating mode (default).
1 = the channel is powered down if it is configured as a DAC.
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Data Sheet AD5593R
Rev. D | Page 31 of 33
APPLICATIONS INFORMATION
MICROPROCESSOR INTERFACING
Microprocessor interfacing to the AD5593R is via a serial bus using
a standard I2C protocol. The communications channel requires a
2-wire interface consisting of a clock signal and a data signal.
AD5593R TO ADSP-BF537 INTERFACE
The I2C interface of the AD5593R is designed to be easily
connected to industry-standard DSPs and microcontrollers.
Figure 41 shows the AD5593R connected to the Analog Devices
Blackfin® DSP. The Blackfin has an integrated I2C port that can
be connected directly to the I2C pins of the AD5593R.
ADSP-BF537
SCLSCL
SDASDA
RESETPF8
AD5593R
12507-164
Figure 41. ADSP-BF537 Interface
LAYOUT GUIDELINES
In any circuit where accuracy is important, careful consideration
of the power supply and ground return layout helps to ensure
the rated performance. The printed circuit board (PCB) on
which the AD5593R is mounted must be designed so that the
AD5593R lies on the analog plane.
The AD5593R must have ample supply bypassing of 10 μF in
parallel with 0.1 μF on each supply, located as close to the package
as possible, ideally right up against the device. The 10 μF capacitors
are the tantalum bead type. The 0.1 μF capacitor must have low
effective series resistance (ESR) and low effective series inductance
(ESI) such as the common ceramic types, which provide a low
impedance path to ground at high frequencies to handle transient
currents due to internal logic switching.
ififififii WKEX: \ UUUU L3 C 0’3 C 3 c 03 C :"nnnn J m?
AD5593R Data Sheet
Rev. D | Page 32 of 33
OUTLINE DIMENSIONS
16 9
81
PIN 1
SEATING
PLANE
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09 0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 42. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
COMPLIANT
TO
JEDEC STANDARDS MO-220-WEED.
09-03-2013-A
3.10
3.00 SQ
2.90
0.30
0.25
0.20
1
0.50
BSC
BOTTOM VIEWTOP VIEW
16
5
8
9
12
13
4
0.50
0.40
0.30
SEATING
PLANE
0.05 MAX
0.02 NOM
0.152 REF
COPLANARITY
0.08
PIN 1
INDICATOR
0.80
0.75
0.70
PKG-004132
Figure 43. 16-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body and 0.75 mm Package Height
(CP-16-32)
Dimensions shown in millimeters
Jo m f 0000 J 000 & BEGLCOECS; www.3nalog.com
Data Sheet AD5593R
Rev. D | Page 33 of 33
10-17-2012-B
A
B
C
D
0.640
0.595
0.540
SIDE VIEW
0.270
0.240
0.210
0.340
0.320
0.300
COPLANARITY
0.05
SEATING
PLANE
1
2
3
4
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
BALL A1
IDENTIFIER
0.50
BSC
1.50
REF
2.000
1.960 SQ
1.920
Figure 44. 16-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-16-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model1 Temperature Range Package Description Package Option Marking Code
AD5593RBCBZ-RL7 −40°C to +105°C 16-Ball WLCSP CB-16-3
AD5593RBCPZ-RL7 −40°C to +105°C 16-Lead LFCSP CP-16-32 DM6
AD5593RBRUZ −40°C to +105°C 16-Lead TSSOP RU-16
AD5593RBRUZ-RL7 −40°C to +105°C 16-Lead TSSOP RU-16
EVAL-AD5593RSDZ Evaluation Board
EVAL-SDP-CB1Z Controller Board
1 Z = RoHS Compliant Part.
I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
©2014–2018 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D12507-0-12/18(D)

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