XC6121,2,3,4 Series Datasheet by Torex Semiconductor Ltd

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1/26
X
C
6121
/
X
C
6122
XC6123/XC6124 Series
Voltage Detector with Watchdog Function and ON/OFF Control (VDF=1.6V~5.0V)
0
2.0
4.0
6.0
8.0
10.0
12.0
14.0
0123456
Input Voltage: VIN (V)
Supply Current: I SS (μA)
6121~X6124(V
DF
=2.7
Ta=85℃
Ta=-40℃
Ta=25℃
GENERAL DESCRIPTION
The XC6121/XC6122/XC6123/XC6124 series is a group of high-precision, low current consumption voltage detectors with
watchdog functions incorporating CMOS process technology. The series consist of a reference voltage source, delay circuit,
comparator, and output driver. With the built-in delay circuit, the series do not require any external components to output
signals with release delay time. The output type is VDFL low when detected. The EN/ENB pin can control ON and OFF of the
watchdog functions. By setting the EN/ENB pin to low or high level, the watchdog function can be OFF while the voltage
detector remains operation. Since the EN/ENB pin of the XC6122 and XC6124 series is internally pulled up to the VIN pin or
pulled down to the VSS pin, these series can be used with the EN/ENB pin left open when the watchdog functions is used. The
detect voltages are internally fixed 1.6V ~ 5.0V in increments of 0.1V, using laser trimming technology. Six watchdog timeout
periods are available in a range from 50ms to 1.6s. Five release delay times are available in a range from 3.13ms to 400ms.
FEATURES
Detect Voltage Range : 1.6V ~ 5.0V, +2%
(
0.1V increments
)
H
y
steresis Width : VDFL x 5%
(
TYP.
)
Operating Voltage Range : 1.0V ~ 6.0V
Detect Voltage Temperature
Characteristics
: +100ppm/OC (TYP.)
Output Confi
g
uration : N-channel open drain
Watchdog Pin : Watchdog input
If watchdog input maintains ‘H’ o
r
‘L within the watchdog timeout
period, a reset signal is output
from the RESETB pin.
EN/ENB Pin : When the EN/ENB pin voltage is
set to low or high level, the
watchdog function is forced off.
Release Delay Time : 400ms, 200ms, 100ms, 50ms,
3.13ms (TYP.)
Watchdog Timeout Period : 1.6s, 800ms, 400ms, 200ms,
100ms, 50ms (TYP.)
Operating
A
mbient Temperature
Packages
Environmentally Friendly
: -40~ +85
: SOT-25, USP-6C
: EU RoHS Compliant, Pb Free
PPLICATIONS
Microprocessor watchdog monitoring
and reset circuits
Memory battery backup circuits
System power-on reset circuits
Power failure detection
TYPICAL APPLICATION CIRCUIT TYPICAL PERFORMANCE
CHARACTERISTICS
Supply Current vs. Input Voltage
ETR0209-011b
vw [-1 WD VSS 1-1 H ENIENB RESETB El l‘I NC RESETB VSS EN/ENB
2/26
XC6121/XC6122/XC6123/XC6124
Series
PIN NUMBER PIN NAME FUNCTION
SOT-25 USP-6C
1 4 RESETB Reset Output
2 5 VSS Ground
3 2 EN/ENB Watchdog ON/OFF Control
4 1 WD Watchdog
5 6 VIN Power Input
- 3 NC No Connection
PIN CONFIGURATION
SOT-25
(TOP VIEW)
USP-6C
(BOTTOM VIEW)
* The dissipation pad for the USP-6C package should be
solder-plated in reference mount pattern and metal masking
so as to enhance mounting strength and heat release. If
the pad needs to be connected to other pins, it should be
connected to the VSS (No. 5) pin.
PIN ASSIGNMENT
XCG121’?‘ TOIREX
3/26
XC6121/XC6122/XC6123/XC6124
Series
SERIES
RESET OUTPUT
HYSTERESIS
EN/ENB PIN FUNCTION
VDFL (RESETB) (*1) VDFH (RESET) EN/ENB Input
Logic (*2)
Pull-Up or Down
Resistor
XC6121 N-channel open drain -
Available:
VDFL x 5% (TYP.)
EN With No Pull-Up
Resistor
XC6122 N-channel open drain - EN With Pull-Up
Resistor
XC6123 N-channel open drain - ENB With No Pull-Down
Resistor
XC6124 N-channel open drain - ENB With Pull-Down
Resistor
(*1) The output type of RESETB is set to L level at the time of detection.
(*2) EN input logic: The watchdog function turns on when the EN pin becomes high level.
ENB input logic: The watchdog function turns on when the ENB pin becomes low level.
DESIGNATOR ITEM SYMBOL DESCRIPTION
Release Delay Time(*1)
A 3.13ms (TYP.)
C 50ms (TYP.)
D 100ms (TYP.)
E 200ms (TYP.)
F 400ms (TYP.)
Watchdog Timeout Period
2 50ms (TYP.)
3 100ms (TYP.)
4 200ms (TYP.)
5 400ms (TYP.)
6 1.6s (TYP.)
7 800ms (TYP.)
③④ Detect Voltage 16 ~ 50 Detect voltage
ex.) 4.5V: ③⇒4, ④⇒5
⑤⑥-⑦(*2) Packages
(Order Unit)
MR SOT-25 (3,000/Reel)
MR-G SOT-25 (3,000/Reel)
ER USP-6C (3,000/Reel)
ER-G USP-6C (3,000/Reel)
PRODUCT CLASSIFICATION
Selection Guide
Ordering Information
XC6121①②③④⑤⑥-⑦(*2): N-channel Open Drain Output (RESETB), EN Pin: No Pull-Up Resistor
XC6122①②③④⑤⑥-⑦(*2): N-channel Open Drain Output (RESETB), EN Pin: Pull-Up Resistor
XC6123①②③④⑤⑥-⑦(*2): N-channel Open Drain Output (RESETB), ENB Pin: No Pull-Down Resistor
XC6124①②③④⑤⑥-⑦(*2): N-channel Open Drain Output (RESETB), ENB Pin: Pull-Down Resistor
(*1) Please set the release delay time shorter than or equal to the watchdog timeout period.
ex.) XC6121D327MR or XC6121D627MR
(*2) The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant.
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4/26
XC6121/XC6122/XC6123/XC6124
Series
BLOCK DIAGRAMS
XC6121 Series
XC6122 Series
N-ch Open Drain Output
N-ch Open Drain Output
ENB WD éFMD H—L stE mm anc ma mam VIN 4+ X 4: T : R1 ENB WD H—L Hui mm mm: c RWD ;L ma mam RESETB fifi A{j fig V55 mm“: ‘; RESETB “x. *: mmc V53 Emmy TOIREX
5/26
XC6121/XC6122/XC6123/XC6124
Series
BLOCK DIAGRAMS (Continued)
XC6123 Series
XC6124 Series
N-ch Open Drain Output
N-ch Open Drain Output
6/26
XC6121/XC6122/XC6123/XC6124
Series
PARAMETER SYMBOL RATINGS UNITS
Input Voltage
VIN VSS -0.3 ~ 7.0 V
VEN/VENB VSS-0.3VIN+0.37.0 V
VWD VSS -0.3 ~ 7.0 V
Output Current IRBOUT 20 mA
Output Voltage VRESETB VSS -0.3 ~ 7.0 V
Power Dissipation SOT-25 Pd 250 mW
USP-6C 120
Operating Ambient Temperature Topr -40 ~ +85 OC
Storage Temperature Tstg -55 ~ +125 OC
A
BSOLUTE MAXIMUM RATINGS
Ta=2 5OC
empera re an Characlemsfics Tapr-V as Del Vang Wamhda Timeoul P Vang Wamhda Timeoul P Vang TOIREX
7/26
XC6121/XC6122/XC6123/XC6124
Series
PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITS CIRCUIT
Detect Voltage VDFL VEN=VSS VDFL(T)
×0.98 VDFL(T) VDFL(T)
× 1.02 V
Hysteresis Width VHYS V
EN=VSS VDFL
×0.02
VDFL
× 0.05
VDFL
× 0.08 V
Supply Current (*1) ISS WD=OPEN
VIN=VDFL(T)×0.9V - 5 11
μA VIN=VDFL(T)×1.1V - 10 16
VIN=6.0V - 12 18
Operatin
g
Volta
g
e VIN 1.0 - 6.0 V
Output Current IRBOUT N-ch.
VDS=0.5V
VIN=1.0V 0.15 0.5 -
mA
VIN=2.0V (VDFL(T)> 2.0V) 2.0 2.5 -
VIN=3.0V (VDFL(T) >3.0V) 3.0 3.5 -
VIN=4.0V (VDFL(T) >4.0V) 3.5 4.0 -
Temperature
Characteristics
VDFL /
Top
r
VDFL
-40OC < Topr < 85 OC - +100 - ppm/
OC
Release Delay Time
(VDFL<1.8V) tDR
Time until VIN is increased from
1.0V to 2.0V
and attains to the release time level,
and the Reset output pin releases.
2.00 3.13 5.00
ms
37 50 63
75 100 125
150 200 250
300 400 500
Release Delay Time
(VDFL>1.9V) tDR
Time until VIN is increased from
1.0V to (VDFL x 1.1V)
and attains to the release time level,
and the Reset output pin releases.
2.00 3.13 5.00
ms
37 50 63
75 100 125
150 200 250
300 400 500
Detect Delay Time tDF
Time until VIN is decreased from 6.0V to
1.0V and attains to the detect voltage
level, and the Reset output pin detects
while the WD pin left open.
- 5.5 33 μs
VDFL
Leakage Current ILEAK VIN=6.0V, VRESETB=6.0V - 0.01 0.1 μA
Watchdog
Timeout Period
(VDFL<1.8V)
tWD
Time until VIN increases form
1.0V to 2.0V and
the Reset output pin is released to go
into the detection state. (WD=OPEN)
37 50 63
ms
75 100 125
150 200 250
300 400 500
600 800 1000
1200 1600 2000
Watchdog
Timeout Period
(VDFL>1.9V)
tWD
Time until VIN increases from
1.0V to (VDFLx1.1V)
and the Reset output pin is released to
go into the detection state. (WD=OPEN)
37 50 63
ms
75 100 125
150 200 250
300 400 500
600 800 1000
1200 1600 2000
ELECTRICAL CHARACTERISTICS
Ta=2 5 OC
¥ V N=6.0V. Waxchdog Waxchdog Waxchdog EN/ENB VENBH EN/ENB VENBL EN Pull-up ENE Pull»down
8/26
XC6121/XC6122/XC6123/XC6124
Series
PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITS CIRCUIT
Watchdog
Minimum Pulse Width tWDIN
VIN=6.0V,
Apply pulse from 6.0V to 0V to the WD
pin.
300 - - ns
Watchdog
High Level Voltage VWDH VIN=VDFL x 1.1V ~ 6.0V VIN x 0.7 - 6 V
Watchdog
Low Level Voltage VWDL VIN=VDFL x 1.1V ~ 6.0V 0 - VIN x 0.3 V
Watchdog
Pull-down Resistance RWD VWD=6V, RWD=VWD/IWD 300 600 900 kΩ
EN/ENB
High Level Voltage VENH/VENBH VIN=VDFL x 1.1V ~ 6.0V 1.3 - VIN V
EN/ENB
Low Level Voltage VENL/VENBL VIN=VDFL x 1.1V ~ 6.0V 0 - 0.35 V
EN Pull-up
Resistance (*2) REN VIN=6.0V, VEN=0V, REN=VIN / IEN
1.0 1.6 2.4 MΩ
ENB Pull-down
Resistance (*3) RENB VIN=6.0V, VENB=6V, RENB=VENB / IENB
NOTE:
* In case where no EN/ENB pin’s condition written in the test condition field, VEN=VIN and VENB=VSS.
** VDFL(T)=Setting detect voltage value
(*1) The condition when the watchdog pin is ON.
The EN/ENB pin is CMOS input. For the XC6122 (pull-up resistor) and XC6124 (pull-down resistor),
supply current increases in the following values when the watchdog function is OFF.
XC6122 SeriesVIN-VEHL/1.6MΩ(TYP.
XC6124 SeriesVEHBH/1.6MΩ(TYP.
(*2) For the XC6122 series only.
(*3) For the XC6124 series only.
ELECTRICAL CHARACTERISTICS (Continued) Ta=2 5 OC
TOIREX
9/26
XC6121/XC6122/XC6123/XC6124
Series
OPERATIONAL EXPLANATION
The XC6121/6122/6123/6124 series compare, using the error amplifier, the voltage of the internal voltage reference source
with the voltage divided by R1, R2 and R3 connected to the VIN pin. The resulting output signal from the error amplifier
activates the watchdog logic, delay circuit and the output driver. When the VIN pin voltage gradually falls and finally reaches
the detect voltage, the RESETB pin output goes from high to low in the case of the VDFL type ICs.
<RESETB / RESET Pin Output Signal>
* VDFL (RESETB) type - output signal: Low when detected.
The RESETB pin output goes from high to low whenever the VIN pin voltage falls below the detect voltage. The RESETB pin
remains low for the release delay time (tDR) after the VIN pin voltage reaches the release voltage. If neither rising nor falling
signals are applied to the WD pin within the watchdog timeout period, the RESETB pin output remains low for the release
delay time (tDR), and thereafter the RESET pin outputs high level signal.
<Hysteresis>
When the internal comparator output is high, the NMOS transistor connected in parallel to R3 is turned ON, activating the
hysteresis circuit. The difference between the release and detect voltages represents the hysteresis width, as shown by the
following calculations:
VDFL (detect voltage) = (R1+R2+R3) x Vref / (R2+R3)
VDR (release voltage) = (R1+R2) x Vref / (R2)
VHYS (hysteresis width) =VDR-VDFL (V)
VDR > VDFL
* Please refer to the block diagrams for R1, R2, R3 and Vref.
* Hysteresis width is selectable from VDFL x 0.05V (TYP.).
<Watchdog (WD) Pin>
The series use a watchdog timer to detect malfunction or “runaway” of the microprocessor. If neither rising nor falling signals
are applied from the microprocessor within the watchdog timeout period, the RESETB pin output maintains the detection state
for the release delay time (tDR), and thereafter the RESETB pin outputs low to high signal. The watchdog pin is pulled down
to the VSS internally. When the watchdog pin is not connected, A reset signal comes out after the watchdog timeout period.
Six watchdog timeout period settings (tWD) are available in 1.6s, 800ms, 400ms, 200ms, 100ms, and 50ms.
<EN Pin>
In case where the watchdog function is not used, When the EN pin input driven to low level, only the watchdog function is
forced off while the detect voltage circuit remains operation. For using the watchdog function, the EN pin should be used in
high level. Even after the input voltage and the EN pin voltage are driven back high, the RESETB pin output maintains the
detection state for the release delay time (TDR). (Refer to the TIMING CHART 1-.) The watchdog function recovers
immediately when the input voltage becomes higher than the release voltage and the EN pin voltage driven from low to high
level. (Refer to the TIMING CHART 1-.) A diode, which is an input protection element, is connected between the EN pin
and VIN pin. Therefore, if the EN pin is applied voltage that exceeds VIN, the current will flow to VIN through the diode. For
avoiding any damage to the IC, please use this IC within the stated maximum ratings (VSS -0.3 ~ VIN +0.3) on the EN pin.
<ENB Pin>
In case where the watchdog function is not used, when the ENB pin input driven to high level, only the watchdog function is
forced off while the detect voltage circuit remains operation. For using the watchdog function, the ENB pin should be used in
low level. Even after the input voltage and the ENB pin voltage are driven back low, the RESETB pin output maintains the
detection state for the release delay time (tDR). (Refer to the TIMING CHART 2-.) The watchdog function recovers
immediately when the input voltage becomes higher than the release voltage and the ENB pin voltage driven from high to low
level. (Refer to the TIMING CHART 2-.) A diode, which is an input protection element, is connected between the ENB pin
and VIN pin. Therefore, if the ENB pin is applied voltage that exceeds VIN, the current will flow to VIN through the diode. For
avoiding any damage to the IC, please use this IC within the stated maximum ratings (VSS -0.3 ~ VIN +0.3) on the ENB pin.
<Release Delay Time>
Release delay time (tDR) is the time that elapses from when the VIN pin reaches the release voltage, or when the watchdog
timeout period expires with no rising signal applied to the WD pin, until the RESETB pin output is released from the detection
state. Five release delay time (tDR) watchdog timeout period settings are available in 400ms, 200ms, 100ms, 50ms, and
3.13ms.
<Detect Delay Time>
Detect Delay Time (tDF) is the time that elapses from when the VIN pin voltage falls to the detect voltage until the RESETB pin
output goes into the detection state.
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10/26
XC6121/XC6122/XC6123/XC6124
Series
TIMING CHARTS
tDF (N-ch Open Drain Output, Rpull=100kΩ)
1. XC6121/XC6122 Series (EN products)
N-ch Open Drain Output (Rpull=100kΩ)
Hysteresis Width
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11/26
XC6121/XC6122/XC6123/XC6124
Series
TIMING CHARTS (Continued)
tDF (N-ch Open Drain Output, Rpull=100kΩ)
2. XC6123/XC6124 Series (ENB products)
N-ch Open Drain Output (Rpull=100kΩ)
Hysteresis Width
VW Pm Wave ram Twn Two END ”a... ‘ WD Pm Wave Faun No veschon me No reammn me LMAX Bonus) VMAX 909nm ——a RESETD Pm Wave Form TM Tn» 5ND _—‘——_
12/26
XC6121/XC6122/XC6123/XC6124
Series
NOTES ON USE
1. Please use this IC within the stated maximum ratings. For temporary, transitional voltage drop or voltage rising
phenomenon, the IC is liable to malfunction should the ratings be exceeded.
2. When a resistor is connected between the VIN pin and the input, the VIN voltage drops while the IC is operating and a
malfunction may occur as a result of the IC’s through current.
3. In order to stabilize the IC’s operations, please ensure that the VIN pin’s input frequency’s rise and fall times are more than
1 μ s/V.
4. Noise at the power supply may cause a malfunction of the watchdog operation or the voltage detector. In such case,
please strength VIN and GND lines. Also, please connect a capacitor such as 0.22μF between the VIN pin and the GND pin
and evaluate the device on the actual board carefully before use.
5. Protecting against a malfunction while the watchdog time out period, an ignoring time (no reaction time) occurs to the rise
and fall times. Referring to the figure below, the ignoring time (no reaction time) lasts for 900μs at maximum. (refer to the
Figure1 below)
6. The EN pin of the XC6121 series is not internally pulled up. When using the watchdog function, please drive the VEN pin
in high level. The EN pin of the XC6122 series is internally pulled up. The watchdog function can be used even the EN
pin left open. The ENB pin of the XC6123 series is not internally pulled down. When using the watchdog function,
please drive the VENB pin in low level. The ENB pin of the XC6124 series is internally pulled down. The watchdog function
can be used even the ENB pin left open.
7. Torex places an importance on improving our products and its reliability.
However, by any possibility, we would request user fail-safe design and post-aging treatment on system or equipment.
[Figure1]
Dav DEV TOIREX
13/26
XC6121/XC6122/XC6123/XC6124
Series
PIN NAME LOGIC CONDITIONS PIN NAME LOGIC CONDITIONS
VIN
H VIN>VDFL+VHYS
WD
H The state maintaining WD>VWDH
for more than tWD
L VIN<VDFL L The state maintaining WD<VWDL
for more than tWD
EN/ENB H VEN/VENB1.30V LH VWDLVWDH, 300nstWDINtWD
L VEN/VENB0.35V HL VWDHVWDL, 300nstWDINtWD
VIN XC6121/XC6122 XC6123/XC6124 VWD VRESETB (*2)
VEN VENB
H H L
H
Repeating detect and release (HLH)
L
OPEN
LH H
H L H *1 H
L L L
PIN LOGIC CONDITIONS
NOTE:
VDFL: Detect Voltage
VHYS: Hysteresis Range
VWDH: WD High Level Voltage
VWDL: WD Low Level Voltage
tWDIN: WD Pulse Width
tWD: WD Timeout Period
For the details of each parameter, please see the electrical characteristics.
FUNCTION CHART
NOTE:
*1: Including all logics of the WD (VWD=H, L, OPEN, HL, LH).
*2: When the VRESETB is High, the circuit is in the release state.
When the VRESETB is Low, the circuit is in the detection state.
*3: VIN=L and VEN/VENB=H can not be combined because the rated input voltage of the EN/ENB pin is Vss-0.3V to VIN+0.3V.
*4: The RESETB pin becomes indefinite operation while 0.35V<VEN/VENB<1.3V.
*5: The EN pin of the XC6121 series is not internally pulled up. When using the watchdog function, please drive the VEN pin in high
level. The EN pin of the XC6122 series is internally pulled up. The watchdog function can be used even the EN pin left open.
The ENB pin of the XC6123 series is not internally pulled down. When using the watchdog function, please drive the VENB pin in
low level. The ENB pin of the XC6124 series is internally pulled down. The watchdog function can be used even the ENB pin
left open.
RESETB VIN EN ENB RESETB WD VSS RESETB
14/26
XC6121/XC6122/XC6123/XC6124
Series
TEST CIRCUITS
Circuit
Circuit
Circuit
VDS=0.5V
VDS=6.0V when measuring
Leakage current
\OOkQ RESETB -----'> Measuvemenl wavelonu wo 100m .— V‘N RESETB ------>Measuvemen| wavelovm tN/ENB WD vss 100K 82 \flN Rtst TB ————— .0 EN/ENB wn vss TOIREX
15/26
XC6121/XC6122/XC6123/XC6124
Series
TEST CIRCUITS (Continued)
Circuit
Circuit
Circuit
RNBVWD/IWD wwwo :uv) ENE RESETB VIN WD EN/ENE VSS
16/26
XC6121/XC6122/XC6123/XC6124
Series
TEST CIRCUITS (Continued)
Circuit
Circuit
Circuit
Note: The above reference is about the EN/ENB logic operation.
Note:
XC6122 series has EN pin,
XC6124 Series has ENB pin.
VIN
VSS
EN/ENB
RESETB
WD
100kΩ
V
Measurement waveform
VIN
VSS
EN/ENB
RESETB
WD
100kΩ
A
IEN
REN=VIN/IEN
IENB
RENB=VENB/IENB
// TOIREX
17/26
XC6121/XC6122/XC6123/XC6124
Series
0
2.0
4.0
6.0
8.0
10.0
12.0
14.0
0123456
Input Voltage: V
IN
(V)
Supply Current: I
SS
(μA)
XC6121~XC6124(V
DF
=1.
Ta=85℃
Ta=-40℃
Ta=25℃
0
2.0
4.0
6.0
8.0
10.0
12.0
14.0
0123456
Input Voltage: V
IN
(V)
Supply Current: I
SS
(μA)
6121~X6124(V
DF
=2.7
Ta=85℃
Ta=-40℃
Ta=25℃
0
2.0
4.0
6.0
8.0
10.0
12.0
14.0
0123456
Input Voltage: V
IN
(V)
Supply Current: I
SS
(μA)
6121~X6124(V
DF
=5.0
Ta=85℃
Ta=-40℃
Ta=25℃
1.55
1.60
1.65
1.70
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
Detect, Release Voltage: V
DF
,V
DR
(V)
6121~X6124(V
DF
=1.6V
V
DR
V
DF
2.60
2.70
2.80
2.90
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
Detect, Release Voltage: V
DF
,V
DR
(V)
6121~C6124(VDF=2.7V
V
DF
V
DR
TYPICAL PERFORMANCE CHARACTERISTICS
1.Supply Current vs. Input Voltage
2.Detect, Release Voltage vs. Ambient Temperature
\\ \H;
18/26
XC6121/XC6122/XC6123/XC6124
Series
0
50
100
150
200
250
300
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
Release Delay Time T
DR
(ms
6121~XC6124
T
DR
=100ms
0
500
1000
1500
2000
2500
3000
-50 -25 0 25 50 75 100
Ambient Temperature: Ta ()
Release Delay Time T
DR
(ms
6121~6124
T
DR
=1600m
0
5
10
15
20
25
30
0123456
VDS (V)
Output Current: I OUT (mA)
6121~X6124
Ta=25℃
VIN =1.0V
VIN =2.0V
VIN =3.0V
VIN =4.0V
VIN =5.0V
0.0
1.0
2.0
3.0
4.0
5.0
6.0
0123456
Input Voltage: VIN (V)
Output Current: I OUT (mA)
C6121~XC6124
Ta=85℃
Ta=25℃
Ta=-40℃
V
DS
=0.5V
4.90
5.00
5.10
5.20
5.30
-50 -25 0 25 50 75 100
Ambient Temperature: Ta ()
Detect, Release Voltage: V
DF
,V
DR
(V)
6121~C6124(V
DF
=5.0V
V
DR
V
DF
2.Detect, Release Voltage vs. Ambient Temperature (Continued)
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
3.Nch Driver Output Current vs. VDS 4.Driver Output Current vs. Input Voltage
5.Release Delay Time vs. Ambient Temperature
TOIREX
19/26
XC6121/XC6122/XC6123/XC6124
Series
0
50
100
150
200
250
300
-50 -25 0 25 50 75 100
Ambient Temperature: Ta ()
WD Timeout Piriod T
WD
 (ms
6121~XC6124
T
WD
=100m
0
500
1000
1500
2000
2500
3000
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
WD Timeout Piriod T
WD
 (ms
6121~6124
T
WD
=1600ms
0.0
1.0
2.0
3.0
4.0
5.0
6.0
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
WD LowLevel Threshold V
WDL
(V)
6121~XC6124
V
IN
=6.0V
V
IN
=3.0V
V
IN
=1.76V
0.0
1.0
2.0
3.0
4.0
5.0
6.0
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
WD Highlevel Threshold V
WDH
(V)
6121~XC6124
V
IN
=6.0V
V
IN
=3.0V
V
IN
=1.76V
2.6
2.8
3.0
3.2
3.4
3.6
3.8
4.0
01234567
Input Voltage: V
IN
(V)
Release Delay Time T
DR
(ms
6121~XC6124
Ta=25℃
T
DR
=3.13m
90
95
100
105
110
115
120
01234567
Input Voltage: V
IN
(V)
WD Timeout Period T
WD
 (ms
6121~6124
Ta=25℃
T
WD
=100m
6.Watchdog Timeout Period vs. Ambient Temperature
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
7.Release Delay Time vs. Input Voltage 8.Watchdog Timeout Period vs. Input Voltage
10.
Watchdo
g
Hi
g
h Level Threshould vs. Ambient Tem
p
erature
9.
Watchdog Low Level Threshould vs. Ambient Temperature
WD Timeout Period TWD (ms)
WD Timeout Period TWD (ms)
WD Timeout Period TWD (ms)
XC6121 X05122 \L \\:[‘ l
20/26
XC6121/XC6122/XC6123/XC6124
Series
300
400
500
600
700
800
900
1000
1100
-50-250 255075100
Ambient Temperature: Ta ()
WDpull-down Resistance R
WD
(kΩ)
6121~XC6124
0.0
0.6
1.2
1.8
2.4
3.0
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
EN pull-up Resistance R
EN
(MΩ)
6121~XC6122
0.0
0.6
1.2
1.8
2.4
3.0
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
ENBpull-down Resistance R
ENB
(MΩ)
6123~X6124
0.50
0.60
0.70
0.80
0.90
1.00
1.10
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
EN Highlevel Threshold V
ENH
(V)
6121~XC6122
V
IN
=6.0V
V
IN
=3.0V
V
IN
=1.76V
0.50
0.60
0.70
0.80
0.90
1.00
1.10
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
EN LowLevel Threshold V
ENL
(V)
6121
6122
V
IN
=6.0V
V
IN
=3.0V
V
IN
=1.76V
11.Watchdog Pull-Down Resistance vs. Ambient Temperature
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
13.ENB Pull-Down Resistance vs. Ambient Temperature
12.EN Pull-Up Resistance vs. Ambient Temperature
15.EN Hi
g
h Level Volta
g
e vs. Ambient Tem
p
erature
14.EN Ligh Level Voltage vs. Ambient Temperature
TOIREX
21/26
XC6121/XC6122/XC6123/XC6124
Series
0.50
0.60
0.70
0.80
0.90
1.00
1.10
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
ENB Highlevel Threshold V
ENBH
(V)
6123~XC6124
V
IN
=6.0V
V
IN
=3.0V
V
IN
=1.76V
0.50
0.60
0.70
0.80
0.90
1.00
1.10
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
ENB LowLevel Threshold V
ENBL
(V)
C6
12
~X
C6
124
V
IN
=6.0V
V
IN
=3.0V
V
IN
=1.76V
17.ENB Hi
g
h Level Volta
g
e vs. Ambient Tem
p
erature
16.ENB Low Level Voltage vs. Ambient Temperature
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
29202 .0 047g 5 E E E __ J] +' """""""" o N ~n| A 3‘: “ . .5 g z ‘1pInINDENT E 2 [Z] X E] 7, 4,. g was) “57005 g ‘ m 0. [ \ 030+005 5|, , x . _. _ H m 1| g (0.1) g 5 0.20i0.05 23 0 0 0, 35 0, 35
22/26
XC6121/XC6122/XC6123/XC6124
Series
PACKAGING INFORMATION
SOT-25
USP-6C Reference Pattern Layout USP-6C Reference Metal Mask Design
USP-6C
Unit :mm Unit :mm
2.4
2
34
5
6
1
0.45
1.0
0.05
0.05
0.45
represems prod ucl series MARK PRODUCT SERIES E x06121"“" ’ xcsrzz'm" x06123'm“ E x06124'm“ (i) represems release delay time and watchdog rimeom period XCS121Series WATCH DOG MARK REE-23E T‘MEOUT PRODUCT T‘ME PERIOD SERIES 0 3 137115 507115 XC6121A2”“ 1 3.13 ms mums xcererr" 2 3.13 ms 200m: xcerer 3 3.13 ms 400m: xcerery'" 4 3.13 ms 800m: X06121A7”“ 5 3.13 ms 1.65 X06121A6”“ a SDms 507115 x05121c2"“ 7 SDms mums x05121c3'm a SDms 200m: xcarzrcm'“ a SDms 400m: x05121c5"“ A 50m 800m: xcsrzrcr'“ E SDms 1.65 xCarzrca‘m H mums mums x05121D3'm c mums 200m: x05121D4"“ L mums 400m: x05121D5"“ D mums 800m: xcarzrm'm M mums 1.65 xCarzrDa'm E 200m: 200m: X06121E4”“ R 200m: 400m: XC6121E5”“ F 200m: 800m: X06121E7”“ S 200m: 1.65 X06121E6”“ T 400m: 400m: xcsrsza'm K 400m: 800m: XCE|2|F7“” U 400m: 1.65 xcsrsza'm EDD XCS122/X06123 MARK N P R s T u v x Y z A g A 9 B Q c D E H F K M L RE D T TOIREX
23/26
XC6121/XC6122/XC6123/XC6124
Series
MARK PRODUCT SERIES
E
XC6121******
F
XC6122******
H
XC6123******
K
XC6124******
MARK
RELEASE
DELAY
TIME
WATCH DOG
TIMEOUT
PERIOD
PRODUCT
SERIES
0 3.13ms 50ms XC6121A2****
1 3.13 ms 100ms XC6121A3****
2 3.13 ms 200ms XC6121A4****
3 3.13 ms 400ms XC6121A5****
4 3.13 ms 800ms XC6121A7****
5 3.13 ms 1.6s XC6121A6****
6 50ms 50ms XC6121C2****
7 50ms 100ms XC6121C3****
8 50ms 200ms XC6121C4****
9 50ms 400ms XC6121C5****
A 50ms 800ms XC6121C7****
B 50ms 1.6s XC6121C6****
H 100ms 100ms XC6121D3****
C 100ms 200ms XC6121D4****
L 100ms 400ms XC6121D5****
D 100ms 800ms XC6121D7****
M 100ms 1.6s XC6121D6****
E 200ms 200ms XC6121E4****
R 200ms 400ms XC6121E5****
F 200ms 800ms XC6121E7****
S 200ms 1.6s XC6121E6****
T 400ms 400ms XC6121F5****
K 400ms 800ms XC6121F7****
U 400ms 1.6s XC6121F6****
MARK
RELEASE
DELAY
TIME
WATCH DOG
TIMEOUT
PERIOD
PRODUCT
SERIES
N 3.13ms 50ms XC612*A2****
P 3.13ms 100ms XC612*A3****
R 3.13ms 200ms XC612*A4****
S 3.13ms 400ms XC612*A5****
T 3.13ms 800ms XC612*A7****
U 3.13ms 1.6s XC612*A6****
V 50ms 50ms XC612*C2****
X 50ms 100ms XC612*C3****
Y 50ms 200ms XC612*C4****
Z 50ms 400ms XC612*C5****
A 50ms 800ms XC612*C7****
B 50ms 1.6s XC612*C6****
A 100ms 100ms XC612*D3****
C 100ms 200ms XC612*D4****
B 100ms 400ms XC612*D5****
D 100ms 800ms XC612*D7****
C 100ms 1.6s XC612*D6****
D 200ms 200ms XC612*E4****
E 200ms 400ms XC612*E5****
H 200ms 800ms XC612*E7****
F 200ms 1.6s XC612*E6****
K 400ms 400ms XC612*F5****
M 400ms 800ms XC612*F7****
L 400ms 1.6s XC612*F6****
represents product series
represents release delay time and watchdog timeout period
XC6121Series XC6122/XC6123/XC6124Series
SOT25
③ ④
123
54
SOT-25
MARKING RULE
a. 1. 2. 3. 4. 5. a. 7. a. 9. A. a. C. D. E. F. H. K. L. M. N. 0.1. 2. 3. 4. 5. 6. 7. a. 9. A. B. c. D. E. F. H. K. L. M.
24/26
XC6121/XC6122/XC6123/XC6124
Series
represents production lot number
0 to 9 and A to Z and inverted 0 to 9 and A to Z repeated. (G, I, J, O, Q, W excluded.)
MARK
DETECT
VOLTAGE
(V)
PRODUCT
SERIES
F 1.6 XC6121**16**
H 1.7 XC6121**17**
K 1.8 XC6121**18**
L 1.9 XC6121**19**
M 2.0 XC6121**20**
N 2.1 XC6121**21**
P 2.2 XC6121**22**
R 2.3 XC6121**23**
S 2.4 XC6121**24**
T 2.5 XC6121**25**
U 2.6 XC6121**26**
V 2.7 XC6121**27**
X 2.8 XC6121**28**
Y 2.9 XC6121**29**
Z 3.0 XC6121**30**
0 3.1 XC6121**31**
1 3.2 XC6121**32**
2 3.3 XC6121**33**
3 3.4 XC6121**34**
4 3.5 XC6121**35**
5 3.6 XC6121**36**
6 3.7 XC6121**37**
7 3.8 XC6121**38**
8 3.9 XC6121**39**
9 4.0 XC6121**40**
A 41 XC6121**41**
B 4.2 XC6121**42**
C 4.3 XC6121**43**
D 4.4 XC6121**44**
E 4.5 XC6121**45**
F 4.6 XC6121**46**
H 4.7 XC6121**47**
K 4.8 XC6121**48**
L 4.9 XC6121**49**
M 5.0 XC6121**50**
MARK
DETECT
VOLTAGE
(V)
PRODUCT
SERIES
H 1.6 XC612***16**
K 1.7 XC612***17**
L 1.8 XC612***18**
M 1.9 XC612***19**
N 2.0 XC612***20**
P 2.1 XC612***21**
R 2.2 XC612***22**
S 2.3 XC612***23**
T 2.4 XC612***24**
U 2.5 XC612***25**
V 2.6 XC612***26**
X 2.7 XC612***27**
Y 2.8 XC612***28**
Z 2.9 XC612***29**
0 3.0 XC612***30**
1 3.1 XC612***31**
2 3.2 XC612***32**
3 3.3 XC612***33**
4 3.4 XC612***34**
5 3.5 XC612***35**
6 3.6 XC612***36**
7 3.7 XC612***37**
8 3.8 XC612***38**
9 3.9 XC612***39**
A 4.0 XC612***40**
B 41 XC612***41**
C 4.2 XC612***42**
D 4.3 XC612***43**
E 4.4 XC612***44**
F 4.5 XC612***45**
H 4.6 XC612***46**
K 4.7 XC612***47**
L 4.8 XC612***48**
M 4.9 XC612***49**
N 5.0 XC612***50**
represents detect voltage
XC6121 Series XC6122/XC6123/XC6124 Series
MARKING RULE (Continued)
TOIREX
25/26
XC6121/XC6122/XC6123/XC6124
Series
MARK PRODUCT SERIES
P XC6121******
K XC6122******
R XC6123******
U XC6124******
MARK RELEASE DELAY TIME PRODUCT SERIES
A 3.13ms XC612*A*****
C 50ms XC612*C*****
D 100ms XC612*D*****
E 200ms XC612*E*****
F 400ms XC612*F*****
MARK WATCHDOG TIMEOUT PERIOD PRODUCT SERIES
2 50ms XC612*2*****
3 100ms XC612*3*****
4 200ms XC612*4*****
5 400ms XC612*5*****
7 800ms XC612*7*****
6 1.6s XC612*6*****
MARK
DETECT VOLTAGE (V) PRODUCT SERIES
3 3 3.3 XC612***33**
5 0 5.0 XC612***50**
MARKING RULE (Continued)
represents product series
represents release delay time
⑤ ⑥
1
2
3
6
5
4
USP6C
USP-6C
represents watchdog timeout period
④⑤ represents detect voltage
represents production lot number
0 to 9 and A to Z repeated. (G, I, J, O, Q, W excluded.)
*No character inversion used.
26/26 TOREX SEMICONDUCTOR LTD.
26/26
XC6121/XC6122/XC6123/XC6124
Series
1. The products and product specifications contained herein are subject to change without
notice to improve performance characteristics. Consult us, or our representatives
before use, to confirm that the information in this datasheet is up to date.
2. We assume no responsibility for any infringement of patents, patent rights, or other
rights arising from the use of any information and circuitry in this datasheet.
3. Please ensure suitable shipping controls (including fail-safe designs and aging
protection) are in force for equipment employing products listed in this datasheet.
4. The products in this datasheet are not developed, designed, or approved for use with
such equipment whose failure of malfunction can be reasonably expected to directly
endanger the life of, or cause significant injury to, the user.
(e.g. Atomic energy; aerospace; transport; combustion and associated safety
equipment thereof.)
5. Please use the products listed in this datasheet within the specified ranges.
Should you wish to use the products under conditions exceeding the specifications,
please consult us or our representatives.
6. We assume no responsibility for damage or loss due to abnormal use.
7. All rights reserved. No part of this datasheet may be copied or reproduced without the
prior permission of TOREX SEMICONDUCTOR LTD.

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