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- Henkel Adhesive Electronics, a division of global materials innovator, Henkel Corporation, is focused on developing next-generation materials for a variety of applications in the industrial, consumer, handheld, wearables, display and emerging electronics market sectors.
Henkel’s leading electronics brands of LOCTITE, Multicore (now sold under the LOCTITE brand) and Bergquist have long been recognized as the product brands to trust for printed circuit board assembly applications. With a broad portfolio of materials including surface mount adhesives, advanced flux chemistries, encapsulants, high performance solder solutions, conductive adhesives, thermal management materials as well as CSP underfills and board protection materials, Henkel’s advanced formulations ensure maximum processability and reliable in-field performance.
LOCTITE - The LOCTITE brand is synonymous with quality, reliability and high performance. Within the electronics sector, LOCTITE is the premier brand for Henkel’s solder, flux, underfill, surface mount adhesive, printed ink, potting, display adhesive, structural adhesive and conformal coating product lines.
Bergquist - Now part of Henkel, the Bergquist line of thermal management materials delivers superior heat control for a variety of challenging applications. Known under the well-respected brands of Gap Pad®, Gap Filler, Thermal Clad®, Sil-Pad®, Liqui-Form®and Bond-Ply®, Henkel’s comprehensive thermal materials portfolio encompasses solutions that enable effective heat management from the substrate level through to final assembly.
Multicore - Formerly Multicore and now marketed as LOCTITE, LOCTITE solder products are among the industry’s most trusted and respected interconnect materials. Decades of solder formulation innovation have earned LOCTITE solder materials numerous industry awards and have enabled the electronics market’s move to lead-free, halogen-free, high-reliability solder processes. Game-changing formulations like temperature-stable LOCTITE GC 10 and LOCTITE GC 3W solder pastes help reduce costs, improve yield and provide more stable and reliable assembly processes. The LOCTITE line of solder products includes advanced flux formulations, leaded, lead-free and halogen-free solder pastes, high-reliability alloys, solder bar, preforms, and cored and solid wire.
LOCTITE STYCAST 2850FT is a two-part, thermally conductive epoxy potting material that provides electrical insulation, thermal-shock resistance, low CTE and is available with multiple catalysts. Learn More
The LOCTITE / Multicore cored solder wire portfolio features multiple flux core technology that ensures even and consistent distribution of flux throughout the solder wire, and is available in multiple alloys and diameters. Learn More
Henkel / Bergquist’s extensive GAP PAD family provides an effective thermal interface between heat sinks and electronic devices, improving an assembly’s thermal performance and reliability. Learn More
Gap Pad HC 5.0
A soft and compliant gap filling material, Bergquist's Gap Pad HC 5.0 has a thermal conductivity of 5.0 W/m-K and delivers outstanding thermal performance with very low compression stress.
GC 3W Solder Paste
Henkel Loctitie introduces their GC 3W solder paste that provides exceptional results in aqueous cleaning systems without the addition of saponifiers or co-solvents.
GC 10 Solder Paste
The first-ever temperature stable solder paste, Henkel LOCTITE’s GC 10 solder paste is stable at 26.5°C for one year and at temperatures of up to 40°C for one month.
The Sil-Pad® 900S insulation material features thermal impedance of 0.61°C-in2/W (@50 psi) for applications including power supplies.
Q-Pad® 3 glass-reinforced grease replacement thermal interface can be installed prior to soldering and cleaning.
Gap Pad® 1500
Gap Pad® 1500 unreinforced gap-filling material features thermal conductivity of 1.5 W/m-K and conformable, low-hardness.
Phase Change Thermal Interface Materials (PCTIM)
Duration: 10 minutes
A comparison of the features and benefits of thermal grease and phase change as well as an review of the applications they are used for.
Water Washable Solder Paste Loctite GC 3W
Duration: 5 minutes
Introducing Henkel's innovative game changer water washable solder paste.
Gap Pad EMI 1
Duration: 15 minutes
Explore potential markets and applications for the Bergquist Gap Pad EMI 1.0 product.
The Loctite GC 10 Game Changer paste provides a new benchmark for the industry and addresses the performance and property advances vs. current paste technology.
Liquid Dispensed TIM
This animation demonstrates how to combine your Thermal Clad® IMS with Bergquist Liquid Dispensed TIM for an optimal thermal solution.
Publish Date: 2015-06-19
GC10 Solder Paste - LOCTITE │Another Geek Moment Product Preview
GC 10 solder paste from LOCTITE offers a temperature stable solder paste with improved solderability via improved stability, printing, and reflow.
Publish Date: 2015-05-13
Loctite GC 10
Loctite GC 10 is not only a game changer in its performance capabilities, but it will redefine the way you ship, store and handle solder paste.
Publish Date: 2015-03-05
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