Bergquist

- Henkel’s BERGQUIST® brand thermal management materials include a broad range of solutions for reliability-enhancing heat dissipation within modern electronic devices. The company’s BERGQUIST GAP PAD® gap filling thermal interface materials (TIMs) are soft, compliant, pre-cut pads that reduce assembly stress while providing excellent thermal conductivity. Liquid BERGQUIST Gap Filler TIMs, which can be automatically dispensed, are ideal for applications where complex dimensions are the norm and/or high throughput is required. The expansive thermal solutions portfolio also includes SIL PAD® thermally conductive insulators, BOND PLY® thermal adhesives, HI FLOW® phase change materials and TCLAD® Insulated Metal Substrates (IMS®).

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Thermally Conductive Epoxy

Image of LOCTITE/STYCAST's Thermally Conductive Epoxy

LOCTITE STYCAST 2850FT is a two-part, thermally conductive epoxy potting material that provides electrical insulation, thermal-shock resistance, low CTE and is available with multiple catalysts. Learn More

LOCTITE / Multicore Solder Wires

Image of LOCTITE/Multicore's Solder Wire

The LOCTITE / Multicore cored solder wire portfolio features multiple flux core technology that ensures even and consistent distribution of flux throughout the solder wire, and is available in multiple alloys and diameters. Learn More

Thermal Gap Pads

Image of Henkel/Bergquist's Thermal Gap Pads

Henkel / Bergquist’s extensive GAP PAD family provides an effective thermal interface between heat sinks and electronic devices, improving an assembly’s thermal performance and reliability. Learn More

Newest Products View All (6)

Gap Pad HC 5.0

A soft and compliant gap filling material, Bergquist's Gap Pad HC 5.0 has a thermal conductivity of 5.0 W/m-K and delivers outstanding thermal performance with very low compression stress. Learn More

Sil-Pad® 900S

The Sil-Pad® 900S insulation material features thermal impedance of 0.61°C-in2/W (@50 psi) for applications including power supplies. Learn More

Q-Pad® 3

Q-Pad® 3 glass-reinforced grease replacement thermal interface can be installed prior to soldering and cleaning. Learn More

Gap Pad® 1500

Gap Pad® 1500 unreinforced gap-filling material features thermal conductivity of 1.5 W/m-K and conformable, low-hardness. Learn More

Sil-Pad® K-10

The Sil-Pad® K-10 Kapton-based insulator offers good cut-through properties and excellent thermal performance. Learn More

Gap Pad® VO Ultra Soft

Gap Pad® VO ultra soft for filling air gaps features thermal conductivity of 1.0 W/m-K and is designed for low-stress applications. Learn More

Recent PTMs View All (5)

Gap Pad EMI 1 Publish Date: 2015-11-16

Explore potential markets and applications for the Bergquist Gap Pad EMI 1.0 product.

Duration: 15 minutes
Thermal Interface Material (TIM), Gap Pad® VO Ultra Soft Publish Date: 2014-02-18

Gap Pad VO offers a thermally conductive, electrically isolating material with a wide array of secondary benefits.

Duration: 5 minutes
Thermal Interface materials (TIM) Gap Pad Key Product Characteristics Publish Date: 2013-11-04

Thermal interface materials (TIM) Gap Pad characteristics including thermal, electrical, and mechanical.

Duration: 15 minutes
Thermal Interface Materials (TIM) Gap Pad Publish Date: 2013-07-24

An electrically isolating material which provides protection between heat sinks and high voltage devices.

Duration: 5 minutes

Featured Videos View All (1)

Liquid Dispensed TIM

This animation demonstrates how to combine your Thermal Clad® IMS with Bergquist Liquid Dispensed TIM for an optimal thermal solution.

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