Heat Sinks

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish
507102B00000G HEATSINK TO-220 EXT CAP 2W Boyd Laconia, LLC	15,248 In Stock	1 : $0.73000 Bag	Hat Section 5070	Bag	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	0.700" (17.78mm)	1.750" (44.45mm)	-	0.500" (12.70mm)	4.0W @ 40°C	5.00°C/W @ 200 LFM	15.60°C/W	Aluminum	Black Anodized
507222B05300G HEAT SINK Boyd Laconia, LLC	1,147 In Stock	1 : $1.57000 Bulk	Hat Section 5070	Bulk	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	0.375" (9.53mm)	1.750" (44.45mm)	-	1.470" (37.34mm)	-	-	-	Aluminum	Black Anodized
507002B00000G HEATSINK TO-220 BLK Boyd Laconia, LLC	754 In Stock	1 : $2.82000 Bag	Hat Section 5070	Bag	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	0.700" (17.78mm)	1.750" (44.45mm)	-	0.375" (9.52mm)	2.0W @ 40°C	5.00°C/W @ 500 LFM	15.60°C/W	Aluminum	Black Anodized
507222B00000G HEATSINK TO-220 DUAL 10W Boyd Laconia, LLC	0 In Stock Check Lead Time	1 : $4.08000 Bag	Hat Section 5070	Bag	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	1.470" (37.34mm)	1.750" (44.45mm)	-	0.375" (9.52mm)	8.0W @ 70°C	3.00°C/W @ 200 LFM	9.60°C/W	Aluminum	Black Anodized
507002B05300G BOARD LEVEL HEAT SINK Boyd Laconia, LLC	0 In Stock	Active	Hat Section 5070	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	0.700" (17.78mm)	1.750" (44.45mm)	-	0.375" (9.52mm)	2.0W @ 40°C	5.00°C/W @ 500 LFM	15.60°C/W	Aluminum	Black Anodized
506902B00000G BOARD LEVEL HEAT SINK Boyd Laconia, LLC	0 In Stock	Active	Hat Section 5070	Bulk	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	0.700" (17.78mm)	1.250" (31.75mm)	-	0.375" (9.52mm)	1.0W @ 20°C	6.00°C/W @ 600 LFM	20.00°C/W	Aluminum	Black Anodized

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Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.