Heat Sinks

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish

302NN HEATSINK COMPACT Wakefield-Vette	0 In Stock Check Lead Time	140 : $60.89043 Bulk	302	Bulk	Active	Board Level, Vertical	Stud Mounted Semiconductor Cases	Press Fit	Rectangular, Fins	2.000" (50.80mm)	1.500" (38.10mm)	-	2.000" (50.80mm)	15.0W @ 50°C	1.80°C/W @ 250 LFM	-	Aluminum Alloy	Black Anodized
302M HEATSINK COMPACT Wakefield-Vette	0 In Stock	Active	302	Bulk	Active	Board Level, Vertical	Stud Mounted Semiconductor Cases	Press Fit	Rectangular, Fins	2.000" (50.80mm)	1.500" (38.10mm)	-	2.000" (50.80mm)	15.0W @ 50°C	1.80°C/W @ 250 LFM	-	Aluminum Alloy	Black Anodized
302MM HEATSINK COMPACT Wakefield-Vette	0 In Stock	Active	302	Bulk	Active	Board Level, Vertical	Stud Mounted Semiconductor Cases	Press Fit	Rectangular, Fins	2.000" (50.80mm)	1.500" (38.10mm)	-	2.000" (50.80mm)	15.0W @ 50°C	1.80°C/W @ 250 LFM	-	Aluminum Alloy	Black Anodized
302N HEATSINK COMPACT Wakefield-Vette	0 In Stock	Active	302	Bulk	Active	Board Level, Vertical	Stud Mounted Semiconductor Cases	Press Fit	Rectangular, Fins	2.000" (50.80mm)	1.500" (38.10mm)	-	2.000" (50.80mm)	15.0W @ 50°C	1.80°C/W @ 250 LFM	-	Aluminum Alloy	Black Anodized

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Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.