Heat Sinks

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish
576802B03100G HEAT SINK HORIZ PLUG-IN TO-220 Boyd Laconia, LLC	9,558 In Stock	1 : $3.11000 Bulk	-	Bulk	Active	Board Level	TO-220, TO-262	Clip and PC Pin	Rectangular, Fins	0.750" (19.05mm)	0.500" (12.70mm)	-	0.500" (12.70mm)	1.0W @ 30°C	7.00°C/W @ 400 LFM	27.30°C/W	Aluminum	Black Anodized
6236BG HEATSINK TO-220 CLIP-ON BLACK Boyd Laconia, LLC	6,040 In Stock	1 : $5.08000 Bulk	-	Bulk	Active	Board Level, Vertical	TO-220	Clip	Rectangular, Fins	0.700" (17.78mm)	0.520" (13.21mm)	-	0.510" (12.95mm)	2.0W @ 50°C	12.00°C/W @ 300 LFM	25.00°C/W	Aluminum	Black Anodized
ATS-PCB1065 HEATSINK TO-220 CLIP-ON BLACK Advanced Thermal Solutions Inc.	1,352 In Stock	1 : $0.64000 Bulk	-	Bulk	Active	Board Level	TO-220	Clip	Rectangular, Fins	0.748" (19.00mm)	0.504" (12.80mm)	-	0.500" (12.70mm)	-	10.20°C/W @ 200 LFM	27.30°C/W	Aluminum	Black Anodized
V8508G HEATSINK TO-220 15X12.8MM Assmann WSW Components	10,673 In Stock	1 : $0.78000 Bulk	-	Bulk	Active	Board Level	TO-220	Press Fit	Rectangular, Fins	0.591" (15.00mm)	0.504" (12.80mm)	-	0.500" (12.70mm)	3.0W @ 60°C	14.00°C/W @ 200 LFM	-	Aluminum	Black Anodized

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Heat sinks are thermal management components designed to dissipate heat from high-power electronic devices and prevent overheating. Their core function is based on the principles of conduction, and convection, transferring heat from a heat source—such as a CPU, power transistor, or BGA package—to the surrounding air or a coolant. By increasing the surface area in contact with cooling media, heat sinks help maintain safe temperature levels and protect component reliability and performance.

Most heat sinks are made of aluminum or copper, materials known for their high thermal conductivity. Aluminum heat sinks are lightweight and cost-effective, ideal for general-purpose cooling solutions, while copper heat sinks offer better conductivity for high-performance or space-constrained applications. Finned and extrusion-style heat sinks use strategically shaped surfaces to maximize exposure to air, enhancing natural or forced convection. Cross-cut designs further improve airflow and thermal dispersion. In advanced applications, heat pipes, liquid cooling, or graphite spreaders may be used to rapidly move heat away from the source. For compact or passive systems, passive heat exchangers rely entirely on natural airflow without the use of fans.

Proper thermal contact between the heat sink and device is critical—thermal interface materials (TIMs) such as thermal paste, pads, or solder are used to fill microscopic gaps and reduce thermal resistance. When selecting a heat sink, consider the thermal output of the component, available space, airflow conditions, and the thermal resistance of the system.