Heat Sinks

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish
110991327 HEAT SINK KIT FOR RASPBERRY PI 4 Seeed Technology Co., Ltd	10,191 In Stock	1 : $1.57000 Bulk	-	Bulk	Active	Top Mount Kit	Raspberry Pi 4B	Adhesive	-	-	-	-	-	-	-	-	Aluminum	-
HSB05-171711 HEAT SINK, BGA, 17 X 17 X 11.5 M Same Sky (Formerly CUI Devices)	778 In Stock	1 : $1.83000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.669" (17.00mm)	0.669" (17.00mm)	-	0.453" (11.50mm)	3.1W @ 75°C	8.40°C/W @ 200 LFM	23.91°C/W	Aluminum Alloy	Black Anodized
V2269E1 CPU HEATSINK, CROSS CUT, AL6063, Assmann WSW Components	1,616 In Stock	1 : $1.92000 Tray	-	Tray	Active	Top Mount	-	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	0.787" (20.00mm)	0.787" (20.00mm)	-	0.354" (9.00mm)	-	-	27.00°C/W	Aluminum Alloy	Black Anodized
TGH-0170-01 ALUMINIUM HEAT SINK 17X17MM t-Global Technology	642 In Stock	1 : $3.37000 Bulk	TGH	Bulk	Active	Top Mount	-	-	Square, Pin Fins	0.669" (17.00mm)	0.669" (17.00mm)	-	0.374" (9.50mm)	-	-	-	Aluminum	Black Anodized
TGH-0300-03 ALUMINIUM HEAT SINK 30X30MM t-Global Technology	176 In Stock	1 : $5.86000 Bulk	TGH	Bulk	Active	Top Mount	-	-	Square, Pin Fins	1.181" (30.00mm)	1.181" (30.00mm)	-	0.472" (12.00mm)	-	-	-	Aluminum	-
HSB01-080808 HEAT SINK, BGA, 8.5 X 8.5 X 8 MM Same Sky (Formerly CUI Devices)	255 In Stock	1 : $1.21000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.335" (8.50mm)	0.335" (8.50mm)	-	0.315" (8.00mm)	1.9W @ 75°C	16.00°C/W @ 200 LFM	39.10°C/W	Aluminum Alloy	Black Anodized
FIT0506 PURE COPPER HEATSINK PACK OF 5 ( DFRobot	96 In Stock	1 : $7.15000 Bulk	LattePanda	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Included)	Rectangular	0.520" (13.20mm)	0.480" (12.19mm)	-	0.189" (4.80mm)	-	-	-	Copper	-
HSB02-101007 HEAT SINK, BGA, 10 X 10 X 7 MM Same Sky (Formerly CUI Devices)	0 In Stock Check Lead Time	1 : $1.11000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.394" (10.00mm)	0.394" (10.00mm)	-	0.275" (7.00mm)	2.0W @ 75°C	16.50°C/W @ 200 LFM	37.90°C/W	Aluminum Alloy	Black Anodized
HSB03-141406 HEAT SINK, BGA, 14 X 14 X 6 MM Same Sky (Formerly CUI Devices)	0 In Stock Check Lead Time	1 : $1.22000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.551" (14.00mm)	0.551" (14.00mm)	-	0.236" (6.00mm)	2.1W @ 75°C	15.80°C/W @ 200 LFM	35.98°C/W	Aluminum Alloy	Black Anodized

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Heat sinks are thermal management components designed to dissipate heat from high-power electronic devices and prevent overheating. Their core function is based on the principles of conduction, and convection, transferring heat from a heat source—such as a CPU, power transistor, or BGA package—to the surrounding air or a coolant. By increasing the surface area in contact with cooling media, heat sinks help maintain safe temperature levels and protect component reliability and performance.

Most heat sinks are made of aluminum or copper, materials known for their high thermal conductivity. Aluminum heat sinks are lightweight and cost-effective, ideal for general-purpose cooling solutions, while copper heat sinks offer better conductivity for high-performance or space-constrained applications. Finned and extrusion-style heat sinks use strategically shaped surfaces to maximize exposure to air, enhancing natural or forced convection. Cross-cut designs further improve airflow and thermal dispersion. In advanced applications, heat pipes, liquid cooling, or graphite spreaders may be used to rapidly move heat away from the source. For compact or passive systems, passive heat exchangers rely entirely on natural airflow without the use of fans.

Proper thermal contact between the heat sink and device is critical—thermal interface materials (TIMs) such as thermal paste, pads, or solder are used to fill microscopic gaps and reduce thermal resistance. When selecting a heat sink, consider the thermal output of the component, available space, airflow conditions, and the thermal resistance of the system.