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101800F00000G
THERMAL PASTE
$24.19000
108 - Immediate
Aavid, Thermal Division of Boyd CorporationAavid, Thermal Division of Boyd Corporation
1
101800F00000G-ND
Sil-Free™
Bulk
ActiveNon-Silicone Compound2 oz Tube-40°F ~ 392°F (-40°C ~ 200°C)White0.79W/m-K-60 Months-
THERMAL PASTE
THERMAL PASTE
$81.45580
0 - Immediate
Aavid, Thermal Division of Boyd CorporationAavid, Thermal Division of Boyd Corporation
50
Non-Stock
102100F00000G-ND
Sil-Free™
Bulk
ActiveNon-Silicone Compound16 oz Jar-40°F ~ 392°F (-40°C ~ 200°C)White0.79W/m-K-60 Months-
THERMAL PASTE
THERMAL PASTE
$97.29000
0 - Immediate
Aavid, Thermal Division of Boyd CorporationAavid, Thermal Division of Boyd Corporation
25
Non-Stock
101700F00000G-ND
Sil-Free™
Bulk
ActiveNon-Silicone Compound1.5 oz Syringe-40°F ~ 392°F (-40°C ~ 200°C)White0.79W/m-K-60 Months-
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Thermal - Adhesives, Epoxies, Greases, Pastes


Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.