Showing
1 - 4
of 4
Compare
Mfr Part #
Price
Stock
Supplier
Mfr
Min Qty
DK Part #
Series
Package
Part Status
Type
Size / Dimension
Usable Temperature Range
Color
Thermal Conductivity
Features
Shelf Life
Storage/Refrigeration Temperature
65-02-TC50-0180
THERM-A-GAP TC50 5.2W/M-K 180CC
$262.71000
67 - Immediate
Parker ChomericsParker Chomerics
1
1944-1097-ND
THERM-A-GAP™ TC50
Bulk
ActiveSilicone Putty180cc Cartridge-67°F ~ 392°F (-55°C ~ 200°C)Gray5.00W/m-KLow Outgassing (ASTM E595)18 Months-
65-00-TC50-0300
THERM-A-GAP TC50 5.2W/M-K 300CC
$421.39000
174 - Immediate
Parker ChomericsParker Chomerics
1
1944-1098-ND
THERM-A-GAP™ TC50
Bulk
ActiveSilicone Putty300cc Cartridge-67°F ~ 392°F (-55°C ~ 200°C)Gray5.00W/m-KLow Outgassing (ASTM E595)18 Months-
65-00-TC50-0010
THERM-A-GAP TC50 5.2W/M-K 10CC
$57.79000
99 - Immediate
Parker ChomericsParker Chomerics
1
1944-1138-ND
THERM-A-GAP™ TC50
Bulk
ActiveSilicone Putty10cc Syringe-67°F ~ 392°F (-55°C ~ 200°C)Gray5.00W/m-KLow Outgassing (ASTM E595)18 Months-
65-02-TC50-0030
THERM-A-GAP TC50 5.2W/M-K 30CC
$69.94000
0 - Immediate
Parker ChomericsParker Chomerics
1
1944-1139-ND
THERM-A-GAP™ TC50
Bulk
ActiveSilicone Putty30cc Syringe-67°F ~ 392°F (-55°C ~ 200°C)Gray5.00W/m-KLow Outgassing (ASTM E595)18 Months-
Showing
1 - 4
of 4

Thermal - Adhesives, Epoxies, Greases, Pastes


Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.