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Mfr Part #
Price
Stock
Supplier
Mfr
Min Qty
DK Part #
Series
Package
Part Status
Type
Size / Dimension
Usable Temperature Range
Color
Thermal Conductivity
Features
Shelf Life
Storage/Refrigeration Temperature
A16872-03
TPUTTY 403 180CC CARTRIDGE
$146.38000
81 - Immediate
Laird Technologies - Thermal MaterialsLaird Technologies - Thermal Materials
1
926-1855-ND
Tputty™ 403
Bulk
ActiveLiquid Gap Filler180cc Cartridge-49°F ~ 302°F (-45°C ~ 150°C)White2.30W/m-KLow Outgassing (ASTM E595)24 Months-
A16872-04
TPUTTY 403 360CC CARTRIDGE
$226.27000
34 - Immediate
Laird Technologies - Thermal MaterialsLaird Technologies - Thermal Materials
1
926-1856-ND
Tputty™ 403
Bulk
ActiveLiquid Gap Filler360cc Cartridge-49°F ~ 302°F (-45°C ~ 150°C)White2.30W/m-KLow Outgassing (ASTM E595)24 Months-
A16872-02
TPUTTY 403 75CC CARTRIDGE
$96.75000
69 - Immediate
Laird Technologies - Thermal MaterialsLaird Technologies - Thermal Materials
1
926-1854-ND
Tputty™ 403
Bulk
ActiveLiquid Gap Filler75cc Cartridge-49°F ~ 302°F (-45°C ~ 150°C)White2.30W/m-KLow Outgassing (ASTM E595)24 Months-
TPUTTY 403 SYRINGE 30CC
TPUTTY 403 SYRINGE 30CC
$71.14000
12 - Immediate
Laird Technologies - Thermal MaterialsLaird Technologies - Thermal Materials
1
926-A16872-09-ND
Tputty™ 403
Bulk
ActiveLiquid Gap Filler30cc Syringe-49°F ~ 302°F (-45°C ~ 150°C)White2.30W/m-KLow Outgassing (ASTM E595)--
TPUTTY 403 600CC CARTRIDGE
TPUTTY 403 600CC CARTRIDGE
$366.89875
0 - Immediate
Laird Technologies - Thermal MaterialsLaird Technologies - Thermal Materials
8
Non-Stock
A16872-05-ND
Tputty™ 403
Bulk
ActiveLiquid Gap Filler600cc Cartridge-49°F ~ 302°F (-45°C ~ 150°C)White2.30W/m-KLow Outgassing (ASTM E595)24 Months-
TPUTTY 403 20 KG 5 GAL PAIL
TPUTTY 403 20 KG 5 GAL PAIL
Active
0 - Immediate
Laird Technologies - Thermal MaterialsLaird Technologies - Thermal Materials
-
Non-Stock
A16872-01-ND
Tputty™ 403
Bulk
ActiveLiquid Gap Filler5 gal Pail-49°F ~ 302°F (-45°C ~ 150°C)White2.30W/m-KLow Outgassing (ASTM E595)--
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Thermal - Adhesives, Epoxies, Greases, Pastes


Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.