Arrays, Edge Type, Mezzanine (Board to Board)

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Connector Type	Number of Positions	Pitch	Number of Rows	Mounting Type	Features	Contact Finish	Contact Finish Thickness	Mated Stacking Heights	Height Above Board

FX10-120IP-8H(03) CONN INTERPOSER 120P STACK GOLD Hirose Electric Co Ltd	40 In Stock	1 : $14.63000 Tray	FunctionMax™ FX10	Tray	Active	Interposer	120	0.020" (0.50mm)	2	Stacking	-	Gold	30.0µin (0.76µm)	8mm ~ 10mm	-
FX10-120IP-36Q-8H(03) CONN INTERPOSER 120P STACK GOLD Hirose Electric Co Ltd	50 In Stock	1 : $11.91000 Tray 1 : $14.16000 Tray	FunctionMax™ FX10	Tray Tray	Active	Interposer	120	0.020" (0.50mm)	2	Stacking	-	Gold	30.0µin (0.76µm)	8mm ~ 10mm	-
FX10-120IP-8PH(03) CONN INTERPOSER 120P STACK GOLD Hirose Electric Co Ltd	16 In Stock	1 : $14.49000 Tray	FunctionMax™ FX10	Tray	Active	Interposer	120	0.020" (0.50mm)	2	Stacking	-	Gold	30.0µin (0.76µm)	11mm ~ 13mm	-
FX10-120IP-28D-8H(03) CONN INTERPOSER 120P STACK GOLD Hirose Electric Co Ltd	0 In Stock Check Lead Time	1 : $15.50000 Tray	FunctionMax™ FX10	Tray	Active	Interposer	120	0.020" (0.50mm)	2	Stacking	-	Gold	30.0µin (0.76µm)	8mm ~ 10mm	-
FX10-120IP-28D-8PH(03) CONN INTERPOSER 120P STACK GOLD Hirose Electric Co Ltd	0 In Stock Check Lead Time	1 : $15.50000 Tray	FunctionMax™ FX10	Tray	Active	Interposer	120	0.020" (0.50mm)	2	Stacking	-	Gold	30.0µin (0.76µm)	11mm ~ 13mm	-
FX10-120IP-36Q-8PH(03) CONN INTERPOSER 120P STACK GOLD Hirose Electric Co Ltd	0 In Stock Check Lead Time	50 : $9.72760 Tray	FunctionMax™ FX10	Tray	Active	Interposer	120	0.020" (0.50mm)	2	Stacking	-	Gold	30.0µin (0.76µm)	11mm ~ 13mm	-

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Arrays, Edge Type, Mezzanine (Board to Board)

Connectors of this type have contacts arranged in linear rows and an outline which is generally rectangular, rather than circular. They are used for creating pluggable connections directly between printed circuit boards without use of wire or cable, and can provide a large number of electrical connections in a relatively small space. For this reason they are commonly used to connect components of space-constrained systems.