Sensors, Transducers | Image Sensors, Camera

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Mfr Part #	Price	Stock	Supplier	Mfr	Min Qty	DK Part #	Series	Package	Part Status	Type	Pixel Size	Active Pixel Array	Frames per Second	Voltage - Supply	Package / Case	Supplier Device Package	Operating Temperature

NOIV2SN1300A-QDC IC IMAGE SENSOR 1.3MP 48LLC Datasheet	$238.22000	95 - Immediate	onsemi	onsemi	1	NOIV2SN1300A-QDCOS-ND	-	Tray	Active	CMOS	4.8µm x 4.8µm	1280H x 1024V	150	1.8V, 3.3V	168-CPGA	168-PGA	-40°C ~ 85°C (TJ)
S204SP THERMAL IMAGE KIT 200X150 35DEG Datasheet	$731.25000	38 - Immediate	Seek Thermal	Seek Thermal	1	2126-S204SP-ND	Mosaic Core	Box	Active	Thermal	12µm x 12µm	200H x 150V	9	3.3V ~ 5V	Module	Module	-10°C ~ 60°C
S309SP THERMAL CORE STARTER KIT Datasheet	$731.25000	28 - Immediate	Seek Thermal	Seek Thermal	1	2126-S309SP-ND	Mosaic Core	Box	Active	Thermal	12µm x 12µm	320H x 240V	9	3.3V ~ 5V	Module	Module	-10°C ~ 60°C
OVM7692-RAAA SENSOR IMAGE Datasheet	$19.75000	6,863 - Immediate	OmniVision Technologies Inc	OmniVision Technologies Inc	1	884-1028-2-ND 884-1028-1-ND 884-1028-6-ND	CameraCubeChip™, OmniPixel3-HS™	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	CMOS with Processor	1.75µm x 1.75µm	640H x 480V	30	2.8V	25-CSP	-	-30°C ~ 70°C (TJ)
AR0521SR2M09SURA0-DP1 5MP 1/2 CIS SO Datasheet	$22.97000	148 - Immediate	onsemi	onsemi	1	AR0521SR2M09SURA0-DP1-ND	-	Tray	Active	-	-	-	-	-	-	-	-
EPC660-CSP68-007 IC TOF IMAGER 320X240 Datasheet	$98.00778	108 - Immediate	ESPROS Photonics AG	ESPROS Photonics AG	9	2199-EPC660-CSP68-007-ND	-	Tray	Active	CCD	20µm x 20µm	320H x 240V	158	2.25V ~ 3.63V	68-XFBGA, CSPBGA	68-CSP (9.7x8.66)	-40°C ~ 85°C
OVM7692-RYAA SENSOR IMAGE Datasheet	$20.74000	3,393 - Immediate	OmniVision Technologies Inc	OmniVision Technologies Inc	1	884-1027-2-ND 884-1027-1-ND	CameraCubeChip™, OmniPixel3-HS™	Tape & Reel (TR) Cut Tape (CT)	Active	CMOS with Processor	1.75µm x 1.75µm	640H x 480V	30	2.8V	25-CSP	-	-30°C ~ 70°C (TJ)
AR0144CSSM00SUKA0-CPBR2 1MP 1/4 CIS SO Datasheet	$40.00600	1,575 - Immediate	onsemi	onsemi	5	AR0144CSSM00SUKA0-CPBR2OS-ND	-	Tray	Active	CMOS	3µm x 3µm	1280H x 800V	60	-	69-WFBGA, CSPBGA	69-ODCSP (5.55x5.57)	-
OPT8320NBP IC IMAGE SENSOR TOF 3D 56COG Datasheet	$81.84000	391 - Immediate	Texas Instruments	Texas Instruments	1	296-43355-ND	-	Tray	Active	3D Time of Flight	30µm x 30µm	80H x 60V	1000	1.7V ~ 3.6V	56-VFBGA	56-COG (8.07x5.36)	0°C ~ 70°C (TA)
MLX90640ESF-BAA-000-TU SENSOR DGTL -40C-85C TO39 Datasheet	$84.87000	1,730 - Immediate	Melexis Technologies NV	Melexis Technologies NV	1	MLX90640ESF-BAA-000-TU-ND	-	Bulk	Active	Thermal	-	32H x 24V	-	2.9V ~ 3.6V	TO-205AD, TO-39-3 Metal Can	TO-39	-40°C ~ 85°C
AR0330CS1C12SPKA0-CR IMAGE SENSOR Datasheet	$28.17000	3,926 - Immediate	onsemi	onsemi	1	AR0330CS1C12SPKA0-CROS-ND	-	Tray	Active	CMOS	2.2µm x 2.2µm	2304H x 1536V	30	1.7V ~ 1.9V, 2.4V ~ 3.1V	61-WFBGA, CSPBGA	61-ODCSP (6.28x6.65)	-30°C ~ 70°C (TJ)
TR-EVO-15M-USB TERARANGER EVO 15M USB Datasheet	$93.79000	30 - Immediate	Terabee SAS	Terabee SAS	1	3074-TR-EVO-15M-USB-ND	-	Bag	Active	3D Time of Flight	-	-	240	4.75V ~ 5.25V	Module	-	-
108011 4208 X 3120, 30 FPS, COLOR Datasheet	$154.82000	27 - Immediate	Basler Inc.	Basler Inc.	1	2938-108011-ND	-	Box	Active	CMOS	1.1µm x 1.1µm	4208H x 3120V	30	4.5V ~ 5.5V	Module	-	0°C ~ 50°C
S209SP S209SP, STARTER KIT, 200X150, 16 Datasheet	$680.44000	30 - Immediate	Seek Thermal	Seek Thermal	1	2126-S209SP-ND	Mosaic Core	Box	Active	Thermal	12µm x 12µm	200H x 150V	9	3.3V ~ 5V	Module	Module	-10°C ~ 60°C
S219SPX S219SPX, STARTER KIT, 206X156, 1 Datasheet	$724.58000	29 - Immediate	Seek Thermal	Seek Thermal	1	2126-S219SPX-ND	Mosaic Core	Box	Active	Thermal	12µm x 12µm	200H x 150V	32	3.3V ~ 5V	Module	Module	-10°C ~ 60°C
S202SP S202SP, STARTER KIT, 200X150, 61 Datasheet	$686.70000	49 - Immediate	Seek Thermal	Seek Thermal	1	2126-S202SP-ND	Mosaic Core	Box	Active	Thermal	12µm x 12µm	200H x 150V	9	3.3V ~ 5V	Module	Module	-10°C ~ 60°C
S214SPX S214SPX, STARTER KIT, 200X150, 3 Datasheet	$731.25000	30 - Immediate	Seek Thermal	Seek Thermal	1	2126-S214SPX-ND	Mosaic Core	Box	Active	Thermal	12µm x 12µm	200H x 150V	32	3.3V ~ 5V	Module	Module	-10°C ~ 60°C
S216SPX THERMAL IMAGING KIT 200X150, 21D Datasheet	$932.60000	30 - Immediate	Seek Thermal	Seek Thermal	1	2126-S216SPX-ND	Mosaic Core	Box	Active	Thermal	12µm x 12µm	200H x 150V	32	3.3V ~ 5V	Module	Module	-10°C ~ 60°C
MS202SP THERMAL IMAGING KIT 200X150, 61D Datasheet	$875.79000	29 - Immediate	Seek Thermal	Seek Thermal	1	2126-MS202SP-ND	Micro Core	Box	Active	Thermal	12µm x 12µm	200H x 150V	9	3.3V ~ 5V	Module	Module	0°C ~ 65°C
S316SPX THERMAL IMAGING KIT 320X240, 35D Datasheet	$932.60000	29 - Immediate	Seek Thermal	Seek Thermal	1	2126-S316SPX-ND	Mosaic Core	Box	Active	Thermal	12µm x 12µm	320H x 240V	27	3.3V ~ 5V	Module	Module	-10°C ~ 60°C
MS201SP THERMAL IMAGING KIT 200X150, 90D Datasheet	$932.60000	28 - Immediate	Seek Thermal	Seek Thermal	1	2126-MS201SP-ND	Micro Core	Box	Active	Thermal	12µm x 12µm	200H x 150V	9	3.3V ~ 5V	Module	Module	0°C ~ 65°C
S206SP THERMAL IMAGING KIT 200X150, 21D Datasheet	$932.60000	28 - Immediate	Seek Thermal	Seek Thermal	1	2126-S206SP-ND	Mosaic Core	Box	Active	Thermal	12µm x 12µm	200H x 150V	9	3.3V ~ 5V	Module	Module	-10°C ~ 60°C
S306SP THERMAL IMAGING KIT 320X240, 35D Datasheet	$932.60000	25 - Immediate	Seek Thermal	Seek Thermal	1	2126-S306SP-ND	Mosaic Core	Box	Active	Thermal	12µm x 12µm	320H x 240V	9	3.3V ~ 5V	Module	Module	-10°C ~ 60°C
OV02746-H34A-Z IMAGE SENSOR	$15.73000	158 - Immediate	OmniVision Technologies Inc	OmniVision Technologies Inc	1	884-OV02746-H34A-Z-ND	-	Tray	Active	-	-	-	-	-	-	-	-
EPC611-CSP24-001 IC TIME-OF-FLIGHT Datasheet	$22.57000	405 - Immediate	ESPROS Photonics AG	ESPROS Photonics AG	1	2199-EPC611-CSP24-001TR-ND 2199-EPC611-CSP24-001CT-ND 2199-EPC611-CSP24-001DKR-ND	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	3D Time of Flight	8µm x 8µm	8H X 8V	8000	8V ~ 9V	-	-	-40°C ~ 85°C

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Image Sensors, Camera

Products in the image sensor and camera family are component or module-level devices used to electronically capture visual information in the visible and/or infrared spectrums. Consisting of an array of photosensitive elements connected to a shared control and interface mechanism, available products include those adapted to common still image and video capture as well as more specialized applications such as thermal and spatial imaging.