Aluminum Alloy Heat Sinks

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish

V2016B HEATSINK CPU XCUT Assmann WSW Components	49,813 In Stock 4,800 Factory	1 : $0.61000 Bulk	-	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	0.335" (8.50mm)	0.335" (8.50mm)	-	0.315" (8.00mm)	-	-	32.00°C/W	Aluminum Alloy	Black Anodized
HSE-B2111-038 HEAT SINK, EXTRUSION, TO-220, 25 CUI Devices	18,519 In Stock	1 : $0.86000 Box	HSE	Box	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	0.984" (25.00mm)	0.625" (16.00mm)	-	0.354" (9.00mm)	3.8W @ 75°C	6.12°C/W @ 200 LFM	19.74°C/W	Aluminum Alloy	Black Anodized
V2020B HEATSINK CPU XCUT Assmann WSW Components	1,050 In Stock	1 : $1.02000 Bulk	-	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	0.551" (14.00mm)	0.551" (14.00mm)	-	0.394" (10.00mm)	-	-	27.00°C/W	Aluminum Alloy	Black Anodized
HSB02-101007 HEAT SINK, BGA, 10 X 10 X 7 MM CUI Devices	5,764 In Stock	1 : $1.05000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive	Square, Pin Fins	0.394" (10.00mm)	0.394" (10.00mm)	-	0.275" (7.00mm)	2.0W @ 75°C	16.50°C/W @ 200 LFM	37.90°C/W	Aluminum Alloy	Black Anodized
V2026B HEATSINK CPU XCUT Assmann WSW Components	2,051 In Stock	1 : $1.08000 Bulk	-	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.063" (27.00mm)	1.063" (27.00mm)	-	0.236" (6.00mm)	-	-	20.00°C/W	Aluminum Alloy	Black Anodized
V2019B HEATSINK CPU XCUT Assmann WSW Components	9,272 In Stock	1 : $1.16000 Bulk	-	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	0.472" (12.00mm)	0.472" (12.00mm)	-	0.709" (18.00mm)	-	-	27.00°C/W	Aluminum Alloy	Black Anodized
HSB03-141406 HEAT SINK, BGA, 14 X 14 X 6 MM CUI Devices	1,853 In Stock	1 : $1.16000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive	Square, Pin Fins	0.551" (14.00mm)	0.551" (14.00mm)	-	0.236" (6.00mm)	2.1W @ 75°C	15.80°C/W @ 200 LFM	35.98°C/W	Aluminum Alloy	Black Anodized
V2027B HEATSINK CPU XCUT Assmann WSW Components	6,150 In Stock	1 : $1.29000 Bulk	-	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.098" (27.90mm)	1.098" (27.90mm)	-	0.441" (11.20mm)	-	-	19.00°C/W	Aluminum Alloy	Black Anodized
HSB10-232306 HEAT SINK, BGA, 23 X 23 X 6 MM CUI Devices	55 In Stock	1 : $1.32000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive	Square, Pin Fins	0.906" (23.00mm)	0.906" (23.00mm)	-	0.236" (6.00mm)	3.0W @ 75°C	9.60°C/W @ 200 LFM	25.46°C/W	Aluminum Alloy	Black Anodized
V2286B CPU HEATSINK, CROSS CUT, AL6063, Assmann WSW Components	3,427 In Stock 3,672 Factory	1 : $1.40000 Bulk	-	Bulk	Active	Top Mount	-	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	0.551" (14.00mm)	0.551" (14.00mm)	-	0.236" (6.00mm)	-	-	32.00°C/W	Aluminum Alloy	Black Anodized
HSB12-272706 HEAT SINK, BGA, 27 X 27 X 6 MM CUI Devices	1,542 In Stock	1 : $1.40000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive	Square, Pin Fins	1.063" (27.00mm)	1.063" (27.00mm)	-	0.236" (6.00mm)	3.8W @ 75°C	7.80°C/W @ 200 LFM	19.59°C/W	Aluminum Alloy	Black Anodized
HSB09-212115 HEAT SINK, BGA, 21 X 21 X 15 MM CUI Devices	2,140 In Stock	1 : $1.46000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive	Square, Pin Fins	0.827" (21.00mm)	0.827" (21.00mm)	-	0.591" (15.00mm)	4.3W @ 75°C	6.00°C/W @ 200 LFM	17.39°C/W	Aluminum Alloy	Black Anodized
HSB18-232310 HEAT SINK, BGA, 23 X 23 X 10 MM CUI Devices	5,392 In Stock	1 : $1.63000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive	Square, Pin Fins	0.906" (23.00mm)	0.906" (23.00mm)	-	0.394" (10.00mm)	3.7W @ 75°C	6.80°C/W @ 200 LFM	20.41°C/W	Aluminum Alloy	Black Anodized
HSE-B250-04H HEAT SINK, EXTRUSION, TO-220, 25 CUI Devices	2,488 In Stock	1 : $1.68000 Box	HSE	Box	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	0.984" (25.00mm)	1.378" (35.00mm)	-	1.000" (25.40mm)	8.0W @ 75°C	3.26°C/W @ 200 LFM	13.60°C/W	Aluminum Alloy	Black Anodized
HSS03-B20-P318 HEAT SINK, STAMPING, TO-220, 41. CUI Devices	1,922 In Stock	1 : $1.81000 Box	HSS	Box	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular	1.640" (41.66mm)	1.300" (33.02mm)	-	0.470" (11.94mm)	5.5W @ 75°C	5.60°C/W @ 200 LFM	13.67°C/W	Aluminum Alloy	Black Anodized
HSS02-B20-P318 HEAT SINK, STAMPING, TO-220, 23. CUI Devices	1,594 In Stock	1 : $1.84000 Box	HSS	Box	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular	1.900" (48.26mm)	0.930" (23.62mm)	-	0.950" (24.13mm)	6.9W @ 75°C	4.80°C/W @ 200 LFM	10.90°C/W	Aluminum Alloy	Black Anodized
HSB23-232325 HEAT SINK, BGA, 23 X 23 X 25 MM CUI Devices	1,110 In Stock	1 : $2.15000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive	Square, Pin Fins	0.906" (23.00mm)	0.906" (23.00mm)	-	0.984" (25.00mm)	6.13W @ 75°C	3.80°C/W @ 200 LFM	12.23°C/W	Aluminum Alloy	Black Anodized
HSS01-B20-CP HEAT SINK, STAMPING, TO-220, 49. CUI Devices	1,176 In Stock	1 : $2.53000 Box	HSS	Box	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular	1.941" (49.31mm)	1.900" (48.26mm)	-	0.950" (24.13mm)	9.9W @ 75°C	3.70°C/W @ 200 LFM	7.59°C/W	Aluminum Alloy	Black Anodized
V2024B HEATSINK CPU XCUT Assmann WSW Components	6,083 In Stock 2,304 Factory	1 : $2.58000 Bulk	-	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.709" (18.00mm)	-	-	21.00°C/W	Aluminum Alloy	Black Anodized
HSB14-353518 HEAT SINK, BGA, 35 X 35 X 18 MM CUI Devices	1,013 In Stock	1 : $2.59000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive	Square, Pin Fins	1.378" (35.00mm)	1.378" (35.00mm)	-	0.709" (18.00mm)	8.4W @ 75°C	3.60°C/W @ 200 LFM	8.97°C/W	Aluminum Alloy	Black Anodized
HSB16-404018 HEAT SINK, BGA, 40 X 40 X 18 MM CUI Devices	268 In Stock	1 : $3.50000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive	Square, Pin Fins	1.575" (40.00mm)	1.575" (40.00mm)	-	0.709" (18.00mm)	9.4W @ 75°C	2.60°C/W @ 200 LFM	7.96°C/W	Aluminum Alloy	Black Anodized
HSB17-404025 HEAT SINK, BGA, 40 X 40 X 25 MM CUI Devices	1,117 In Stock	1 : $3.97000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive	Square, Pin Fins	1.575" (40.00mm)	1.575" (40.00mm)	-	0.984" (25.00mm)	11.7W @ 75°C	2.10°C/W @ 200 LFM	6.41°C/W	Aluminum Alloy	Black Anodized
CR101-50AE ALUMINUM HEATSINK 50MM BLK ANODI Ohmite	1,816 In Stock	1 : $6.33000 Box	CR	Box	Active	Board Level, Vertical	TO-101	3 Clips and PC Pin	Rectangular, Fins	1.969" (50.00mm)	1.969" (50.00mm)	-	-	-	-	5.30°C/W	Aluminum Alloy	Black Anodized
CR101-75AE ALUMINUM HEATSINK 75MM BLK ANODI Ohmite	1,297 In Stock	1 : $8.43000 Box	CR	Box	Active	Board Level, Vertical	TO-101	3 Clips and PC Pin	Rectangular, Fins	2.953" (75.00mm)	1.969" (50.00mm)	-	-	-	-	4.20°C/W	Aluminum Alloy	Black Anodized
CR301-75AE ALUMINUM HEATSINK 75MM BLK ANODI Ohmite	129 In Stock	1 : $11.01000 Box	CR	Box	Active	Board Level, Vertical	TO-301	2 Clips and PC Pin	Rectangular, Fins	2.953" (75.00mm)	2.362" (60.00mm)	-	-	-	-	4.50°C/W	Aluminum Alloy	Black Anodized

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Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.

Aluminum Alloy Heat Sinks

Aluminum Alloy Heat Sinks

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