Showing
1 - 7
of 7
Compare
Mfr Part #
Price
Stock
Supplier
Mfr
Min Qty
DK Part #
Series
Package
Part Status
Proto Board Type
Package Accepted
Number of Positions
Pitch
Board Thickness
Material
Size / Dimension
DIP-ADAPTER-EVM
MODULE EVAL DIP ADAPTER
$16.56000
147 - Immediate
53 - Factory
Texas InstrumentsTexas Instruments
1
296-35646-ND
-
Box
ActiveSMD to Plated Through HoleMSOP, SC70, SOIC, SOT23, SOT563, TSSOP6----
14-24-LOGIC-EVM
DEVELOPMENT SPECIALIZED
$16.56000
105 - Immediate
485 - Factory
Texas InstrumentsTexas Instruments
1
296-53129-ND
-
Box
ActiveSMD to Plated Through HoleSOIC, TSSOP-----
EVM-LEADED1
EVALUATION MODULE
$16.56000
50 - Immediate
10 - Factory
Texas InstrumentsTexas Instruments
1
296-49030-ND
-
Bulk
ActiveSMD to DIP------
5-8-LOGIC-EVM
LOGIC EVAL BOARD
$16.56000
77 - Immediate
447 - Factory
Texas InstrumentsTexas Instruments
1
296-5-8-LOGIC-EVM-ND
-
Box
ActiveSMD to Plated Through HoleSC-70, SOT-23, SOT-583, SSOP, VSSOP8----
$33.11000
5 - Immediate
243 - Factory
Texas InstrumentsTexas Instruments
1
296-SMALL-AMP-DIP-EVM-ND
-
Box
ActiveSMD to DIPDPW-5, DCN-8, DDF-8, DSG-8, RUG-10, RUC-14, RGY-14, RTE-1616----
EVM-LEADLESS1
EVALUATION MODULE
$16.56000
13 - Immediate
418 - Factory
Texas InstrumentsTexas Instruments
1
296-EVM-LEADLESS1-ND
-
Bulk
ActiveSMD to DIP------
$16.56000
15 - Immediate
21 - Factory
Texas InstrumentsTexas Instruments
1
296-QFN16-DIP-EVM-ND
-
Box
ActiveSMD to DIPQFN16----
Showing
1 - 7
of 7

Adapter, Breakout Boards


Products in this family provide increased convenience of access to the electrical contacts of a connector, integrated circuit, or similar device by providing interconnection between a component placement area (typically for a fine-pitch, surface mounted integrated circuit) and an interconnect area typically having a much larger distance between pin centers. A common application is accommodating the use of solderless breadboards as a prototyping method for components that are not available in breadboard-compatible packaging.