Adapter, Breakout Boards

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Proto Board Type	Package Accepted	Number of Positions	Pitch	Board Thickness	Material	Size / Dimension
1207 SMT ADAPTERS 3 PAK 16SOIC/TSSOP Adafruit Industries LLC	762 In Stock	1 : $5.83000 Bulk	-	Bulk	Active	SMD to DIP	SOIC, TSSOP	16	-	-	-	0.800" L x 0.700" W (20.32mm x 17.78mm)
DIP-ADAPTER-EVM MODULE EVAL DIP ADAPTER Texas Instruments	194 In Stock	1 : $17.72000 Box	-	Box	Active	SMD to Plated Through Hole	MSOP, SC70, SOIC, SOT23, SOT563, TSSOP	6	-	-	-	-
PA0042 VSSOP-8 TO DIP-8 SMT ADAPTER Chip Quik Inc.	482 In Stock	1 : $4.71000 Bulk	Proto-Advantage	Bulk	Active	SMD to DIP	VSSOP	8	0.020" (0.50mm)	0.062" (1.57mm) 1/16"	FR4 Epoxy Glass	0.700" x 0.400" (17.78mm x 10.16mm)
LCQT-MSOP10 SOCKET ADAPTER MSOP TO 10DIP Aries Electronics	478 In Stock	1 : $5.24000 Bulk	Correct-A-Chip®	Bulk	Active	SMD to DIP	MSOP	10	0.100" (2.54mm)	0.062" (1.57mm) 1/16"	FR4 Epoxy Glass	0.600" L x 0.500" W (15.24mm x 12.70mm)
14-24-LOGIC-EVM DEVELOPMENT SPECIALIZED Texas Instruments	176 In Stock	1 : $17.72000 Box	-	Box	Active	SMD to Plated Through Hole	SOIC, TSSOP	-	-	-	-	-
5-8-LOGIC-EVM LOGIC EVAL BOARD Texas Instruments	34 In Stock	1 : $17.72000 Box	-	Box	Active	SMD to Plated Through Hole	SC-70, SOT-23, SOT-583, SSOP, VSSOP	8	-	-	-	-
EVM-LEADLESS1 EVALUATION MODULE Texas Instruments	13 In Stock	1 : $17.72000 Box	-	Box	Active	SMD to DIP	-	-	-	-	-	-
SOIC-ADAPTER-EVM UNPOPULATED EVALUATION MODULE FO Texas Instruments	27 In Stock	1 : $35.45000 Bulk	-	Bulk	Active	-	-	-	-	-	-	-
D-SOIC-ADAPTER-EVM UNPOPULATED EVALUATION MODULE FO Texas Instruments	14 In Stock	1 : $35.45000 Bulk	-	Bulk	Active	-	-	-	-	-	-	-
DA-MSOP10-3X3P50 MSOP-10 TO DIP ADAPTER Artekit Labs	0 In Stock Check Lead Time	Active	-		Active	SMD to DIP	MSOP	10	0.100" (2.54mm)	-	FR4 Epoxy Glass	0.555" L x 0.441" W (14.10mm x 11.20mm)

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Products in this family provide increased convenience of access to the electrical contacts of a connector, integrated circuit, or similar device by providing interconnection between a component placement area (typically for a fine-pitch, surface mounted integrated circuit) and an interconnect area typically having a much larger distance between pin centers. A common application is accommodating the use of solderless breadboards as a prototyping method for components that are not available in breadboard-compatible packaging.