Quick Dive Information on the Latest Product Additions and New Components.
Parker Chomerics' THERMFLOW T777 phase change material designed to completely fill interfacial air gaps and voids within electronics assemblies.
3M™ series 8926 thermally conductive interface tapes are filled with conductive ceramic particles for good converting availability, handling, and reworkability.
Parker Chomerics' THERM-A-GAP™ 974 is supplied with pressure sensitive adhesive for ease of use.
Parker Chomerics' THERM-A-GAP™ 976 features fiberglass reinforced for improved tear strength and improved rework capabilities.
Parker Chomerics' T670 thermal grease with 3.0 W/m-K thermal conductivity is ideal for applications requiring thin bond lines.
Parker Chomerics' THERM-A-FORM is a dispensable form-in-place compound designed for heat transfer without compressive force in electronics cooling applications.
Parker Chomerics' THERMFLOW T558 is designed to completely fill interfacial air gaps and voids within electronics assemblies.
Parker Chomerics' THERMFLOW T725 is designed to completely fill interfacial air gaps and voids within electronics assemblies.
Parker Chomerics' THERMATTACH® T412 provides superior thermal conductivity and exceptional bonding properties between electronic components and heatsinks.
Parker Chomerics' THERMATTACH® T411 provides bonding between electronic components and heat sinks, notably on plastic packages and low surface energy materials.
Parker Chomerics' THERMATTACH T418 offers excellent reliability when exposed to thermal, mechanical, and environmental conditioning.
Delta Superflo bearing fans are the culmination of innumerable hours of research and development that result in newly augmented mechanical structures.
Laird's SuperCool TEAs offer precise temperature control of small chambers and are available in air-to-air, direct-to-air, and liquid-to-air versions.
Sanyo Denki's San Ace C270 9B1TP and San Ace C270 9B1TS bracket-mounted centrifugal fans are available in two sizes with an air inlet integrated into the unit.
Parker Chomerics' THERM-A-GAP™ Gel 30 high performance fully cured dispensable gel requires no mixing or curing, providing superior design flexibility.
Parker Chomerics' T-Wing® thin heat spreaders permit nearly 100% adhesive contact with non-flat package surfaces, optimizing thermal and mechanical performance.
Parker Chomerics' THERM-A-GAP™ HCS10 gap-filler sheets and pads offer excellent thermal properties and the highest conformability at low clamping forces.
Parker Chomerics' CHO-THERM® T441 commercial grade thermal insulator pads are designed for use where solid thermal and electrical properties are required.
Parker Chomerics CHO-THERM® T500 thermally conductive material pads are designed for use where high thermal, dielectric, and mechanical properties are required.
Parker Chomerics' THERM-A-GAP™ 579 thermally conductive gap filler pads features a high tack surface reducing contact resistance.
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