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Technology Zones feature suppliers, products, and resources in MCU, Lighting, Sensor, Wireless, Power, and Energy Harvesting application areas.
Quick Dive Information on the Latest Product Additions and New Components.
A soft and compliant gap filling material, Bergquist's Gap Pad HC 5.0 has a thermal conductivity of 5.0 W/m-K and delivers outstanding thermal performance with very low compression stress.
Henkel Loctitie introduces their GC 3W solder paste that provides exceptional results in aqueous cleaning systems without the addition of saponifiers or co-solvents.
The first-ever temperature stable solder paste, Henkel LOCTITE’s GC 10 solder paste is stable at 26.5°C for one year and at temperatures of up to 40°C for one month.
The Sil-Pad® 900S insulation material features thermal impedance of 0.61°C-in2/W (@50 psi) for applications including power supplies.
Q-Pad® 3 glass-reinforced grease replacement thermal interface can be installed prior to soldering and cleaning.
Gap Pad® 1500 unreinforced gap-filling material features thermal conductivity of 1.5 W/m-K and conformable, low-hardness.
The Sil-Pad® K-10 Kapton-based insulator offers good cut-through properties and excellent thermal performance.
Gap Pad® VO ultra soft for filling air gaps features thermal conductivity of 1.0 W/m-K and is designed for low-stress applications.
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