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Epoxy Encapsulating and Potting Compound

Thermally conductive epoxy encapsulating and potting compound 832TC

Image of MG Chemicals' Thermally Conductive Epoxy Encapsulating & Potting Compound100% solids. MG Chemicals formulated with undiluted Bis F resin for superior physical properties, and pigmented with high purity aluminum oxide pigment to provide excellent thermal conductivity at reasonable cost. Pigmented black for excellent thermal absorption and emission.

Features

  • Provides superior protection from impact, shock, conductivity, moisture, abuse, chemicals, and analysis
  • Two part epoxy, with a 1 to 1 mixing ratio by volume
  • Two hour working time
  • Suitable for large production runs
  • Cures in 2 days at room temperature or one hour at 65°C
Published: 2009-02-25