UBA2014 Datasheet by NXP USA Inc.

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1. General description
The IC is a monolithic integrated circuit for driving electronically ballasted fluorescent
lamps, with mains voltages up to 277 V (RMS) (nominal value).
The circuit is made in a 650 V Bipolar CMOS DMOS (BCD) power-logic process.
It provides the drive function for the two discrete power MOSFETs.
Besides the drive function, the IC also includes the level-shift circuit, the oscillator
function, a lamp voltage monitor, a current control function, a timer function and
protections.
2. Features
nAdjustable preheat time
nAdjustable preheat current
nCurrent controlled operating
nSingle ignition attempt
nAdaptive non-overlap time control
nIntegrated high-voltage level-shift function
nPower-down function
nProtection against lamp failures or lamp removal
nCapacitive mode protection
3. Applications
nThe circuit topology enables a broad range of ballast applications at different mains
voltages for driving lamp types from T8, T5, PLC, T10, T12, PLL and PLT, for example.
UBA2014
600 V driver IC for HF fluorescent lamps
Rev. 04 — 16 October 2008 Product data sheet
UBA2014_4 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 04 — 16 October 2008 2 of 19
NXP Semiconductors UBA2014
600 V driver IV for HF fluorescent lamps
4. Quick reference data
5. Ordering information
Table 1. Quick reference data
V
DD
=13V; V
FVDD
V
SH
= 13 V; T
amb
=25
°
C; all voltages are referenced to GND; see test circuit of Figure 8; unless
otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Start-up state
VDD(stop) oscillator stop supply
voltage 8.6 9.1 9.6 V
VDD(start) oscillator start supply
voltage 12.4 13.0 13.6 V
IDD(start) oscillator start-up supply
current VDD <V
DD(start) - 170 200 µA
High-voltage supply
VHS high-side supply voltage IHS <30µA - - 570 V
Reference voltage
VVREF reference voltage IL=10µA 2.86 2.95 3.04 V
Voltage controlled oscillator
fmax maximum bridge frequency 90 100 110 kHz
fmin minimum bridge frequency 38.9 40.5 42.1 kHz
High-side output driver
Io(source) output source current VGH VSH = 0 V 135 180 235 mA
Io(sink) output sink current VGH VSH = 13 V 265 330 415 mA
Preheat current sensor
Vph preheat voltage 0.57 0.60 0.63 V
Lamp voltage sensor
Vlamp(fail) lamp fail voltage 0.77 0.81 0.85 V
Vlamp(max) maximum lamp voltage 1.44 1.49 1.54 V
Average current sensor
Voffset offset voltage VCSP =V
CSN = 0 V to 2.5 V 2 0 +2 mV
gmtransconductance f = 1 kHz 1900 3800 5700 µA/mV
Preheat timer
tph preheat time CCT = 330 nF;
RIREF =33k1.6 1.8 2.0 s
VOL LOW-level output voltage - 1.4 - V
VOH HIGH-level output voltage - 3.6 - V
Table 2. Ordering information
Type number Package
Name Description Version
UBA2014T SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
UBA2014P DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1
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UBA2014_4 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 04 — 16 October 2008 3 of 19
NXP Semiconductors UBA2014
600 V driver IV for HF fluorescent lamps
6. Block diagram
Fig 1. Block diagram
mgw579
DRIVER
LOGIC
LEVEL
SHIFTER
BOOTSTRAP
FREQUENCY
CONTROL
AVERAGE
CURRENT
SENSOR
CSP
15
GH
10
FVDD
9
CSN
16
LOGIC
LAMP
VOLTAGE
SENSOR
VOLTAGE
CONTROLLED
OSCILLATOR
REFERENCE
CURRENT
I
V
GL
LS
DRIVER
HS
DRIVER
6
SH
11
ACM
12
PREHEAT TIMER STATE LOGIC
reset state
start-up state
preheat state
ignition state
burn state
hold state
power-down state
SUPPLY
VDD VREF
reset
VDD(L)
Vpd
reference
voltages
digital
analog supply (5 V)
3 V
714
LOGIC
COUNTER
1
4
CT
IREF
3
CF
13
LVS
2
CSW
5
GND
Vlamp(fail) Vlamp(max)
ANT/CMD
UBA2014
PCS
8
PCS
LOGIC
jjjjjjjj U EEEEEEEE jjjjjjjj EEEEEEEE
UBA2014_4 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 04 — 16 October 2008 4 of 19
NXP Semiconductors UBA2014
600 V driver IV for HF fluorescent lamps
7. Pinning information
7.1 Pinning
7.2 Pin description
Fig 2. Pin configuration (SO16) Fig 3. Pin configuration (DIP16)
UBA2014T
CT CSN
CSW CSP
CF VREF
IREF LVS
GND ACM
GL SH
VDD GH
PCS FVDD
001aad405
1
2
3
4
5
6
7
8
10
9
12
11
14
13
16
15
UBA2014P
CT CSN
CSW CSP
CF VREF
IREF LVS
GND ACM
GL SH
VDD GH
PCS FVDD
001aad486
1
2
3
4
5
6
7
8
10
9
12
11
14
13
16
15
Table 3. Pin description
Symbol Pin Description
CT 1 preheat timer output
CSW 2 input of voltage controlled oscillator
CF 3 voltage controlled oscillator output
IREF 4 internal reference current input
GND 5 ground
GL 6 gate output for the low-side switch
VDD 7 low-voltage supply
PCS 8 preheat current sensor input
FVDD 9 floating supply voltage; supply for high-side switch
GH 10 gate output for the high-side switch
SH 11 source for the high-side switch
ACM 12 capacitive mode input
LVS 13 lamp voltage sensor input
VREF 14 reference voltage output
CSP 15 positive input for the average current sensor
CSN 16 negative input for the average current sensor
UBA2014_4 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 04 — 16 October 2008 5 of 19
NXP Semiconductors UBA2014
600 V driver IV for HF fluorescent lamps
8. Functional description
8.1 Start-up state
Initial start-up can be achieved by charging the low-voltage supply capacitor C7
(see Figure 8) via an external start-up resistor. Start-up of the circuit is achieved under the
condition that both half bridge transistors TR1 and TR2 are non-conductive. The circuit
will be reset in the start-up state. If the low-voltage supply (VDD) reaches the value of
VDD(start) the circuit will start oscillating. A DC reset circuit is incorporated in the High-Side
(HS) driver. Below the lockout voltage at the FVDD pin the output voltage (VGH VSH) is
zero. The voltages at pins CF and CT are zero during the start-up state.
8.2 Oscillation
The internal oscillator is a Voltage Controlled Oscillator (VCO) circuit which generates a
sawtooth waveform between the VCF(high) level and 0 V. The frequency of the sawtooth is
determined by capacitor CCF, resistor RIREF, and the voltage at pin CSW. The minimum
and maximum switching frequencies are determined by RIREF and CCF; their ratio is
internally fixed. The sawtooth frequency is twice the half bridge frequency. The UBA2014
brings the transistors TR1 and TR2 into conduction alternately with a duty cycle of
approximately 50 %. An overview of the oscillator signal and driver signals is illustrated in
Figure 4. The oscillator starts oscillating at fmax. During the first switching cycle the
Low-Side (LS) transistor is switched on. The first conducting time is made extra long to
enable the bootstrap capacitor to charge.
8.3 Adaptive non-overlap
The non-overlap time is realized with an Adaptive Non-overlap circuiT (ANT). By using an
adaptive non-overlap circuit, the application can determine the duration of the non-overlap
time and make it optimum for each frequency; see Figure 4. The non-overlap time is
determined by the slope of the half bridge voltage, and is detected by the signal across
resistor R16 which is connected directly to pin ACM. The minimum non-overlap time is
internally fixed. The maximum non-overlap time is internally fixed at approximately 25 %
of the bridge period time. An internal filter of 30 ns is included at the ACM pin to increase
the noise immunity.
8.4 Timing circuit
A timing circuit is included to determine the preheat time and the ignition time. The circuit
consists of a clock generator and a counter.
The preheat time is defined by CCT and RIREF and consists of 7 pulses at CCT; the
maximum ignition time is 1 pulse at CCT. The timing circuit starts operating after the
start-up state, as soon as the low supply voltage (VDD) has reached VDD(start) or when a
critical value of the lamp voltage (Vlamp(fail)) is exceeded. When the timer is not operating
CCT is discharged to 0 V at 1 mA.
UBA2014_4 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 04 — 16 October 2008 6 of 19
NXP Semiconductors UBA2014
600 V driver IV for HF fluorescent lamps
8.5 Preheat state
After starting at fmax, the frequency decreases until the momentary value of the voltage
across sense resistor R14 reaches the internally fixed preheat voltage level (pin PCS). At
crossing the preheat voltage level, the output current of the
Preheat Current Sensor (PCS) circuit discharges the capacitor CCSW, thus raising the
frequency. The preheat time begins at the moment that the circuit starts oscillating. During
the preheat time the Average Current Sensor (ACS) circuit is disabled. An internal filter of
30 ns is included at pin PCS to increase the noise immunity.
8.6 Ignition state
After the preheat time the ignition state is entered and the frequency will sweep down due
to charging of the capacitor at pin CSW with an internally fixed current; see Figure 5.
During this continuous decrease in frequency, the circuit approaches the resonant
frequency of the load. This will cause a high voltage across the load, which normally
ignites the lamp. The ignition voltage of a lamp is designed above the Vlamp(fail) level. If the
lamp voltage exceeds the Vlamp(fail) level the ignition timer is started.
8.7 Burn state
If the lamp voltage does not exceed the Vlamp(max) level the voltage at pin CSW will
continue to increase until the clamp level at pin CSW is reached; see Figure 5. As a
consequence the frequency will decrease until the minimum frequency is reached.
When the frequency reaches its minimum level it is assumed that the lamp has ignited and
the circuit will enter the burn state. The ACS circuit will be enabled. As soon as the
averaged voltage across sense resistor R14, measured at pin CSN, reaches the reference
level at pin CSP, the average current sensor circuit will take over the control of the lamp
current. The average current through R14 is transferred to a voltage at the voltage
controlled oscillator and regulates the frequency and, as a result, the lamp current.
8.8 Lamp failure mode
8.8.1 During ignition state
If the lamp does not ignite, the voltage level increases. When the lamp voltage exceeds
the Vlamp(max) level, the voltage will be regulated at the Vlamp(max) level; see Figure 6.
When the Vlamp(fail) level is crossed the ignition timer has already started. If the voltage at
pin LVS is above the Vlamp(fail) level at the end of the ignition time the circuit stops
oscillating and is forced into the Power-down mode. The circuit will be reset only when the
supply voltage is powered down.
8.8.2 During burn state
If the lamp fails during normal operation, the voltage across the lamp will increase and the
lamp voltage will exceed the Vlamp(fail) level; see Figure 7. At that moment the ignition timer
is started. If the lamp voltage increases further it will reach the Vlamp(max) level. This forces
the circuit to reenter the ignition state and results in an attempt to re-ignite the lamp. If
during restart the lamp still fails, the voltage remains high until the end of the ignition time.
At the end of the ignition time the circuit stops oscillating and the circuit will enter the
Power-down mode.
UBA2014_4 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 04 — 16 October 2008 7 of 19
NXP Semiconductors UBA2014
600 V driver IV for HF fluorescent lamps
8.9 Power-down mode
The Power-down mode will be entered if, at the end of the ignition time, the voltage at
pin LVS is above Vlamp(fail). In the Power-down mode the oscillator will be stopped and
both TR1 and TR2 will be non-conductive. The VDD supply is internally clamped. The
circuit is released from the Power-down mode by lowering the low-voltage supply below
VDD(reset).
8.10 Capacitive mode protection
The signal across R16 also gives information about the switching behavior of the half
bridge. If, after the preheat state, the voltage across the ACM resistor (R16) does not
exceed the VCMD level during the non-overlap time, the Capacitive Mode Detection (CMD)
circuit assumes that the circuit is in the capacitive mode of operation. As a consequence
the frequency will directly be increased to fmax. The frequency behavior is decoupled from
the voltage at pin CSW until CCSW has been discharged to zero.
8.11 Charge coupling
Due to parasitic capacitive coupling to the high voltage circuitry all pins are burdened with
a repetitive charge injection. Given the typical application the pins IREF and CF are
sensitive to this charge injection. For charge coupling of approximately 8 pC, a safe
functional operation of the IC is guaranteed, independent of the current level.
Charge coupling at current levels below 50 µA will not interfere with the accuracy of the
VCS, VPCS and VACM levels.
Charge coupling at current levels below 20 µA will not interfere with the accuracy of any
parameter.
8.12 Design equations
The following design equations are used to calculate the desired preheat time, the
maximum ignition time, and the minimum and the maximum switching frequency.
(1)
(2)
(3)
(4)
Start of ignition is defined as the moment at which the measured lamp voltage crosses the
Vlamp(fail) level; see Section 8.8.
tph 1.8 CCT
330 10 9
×
--------------------------RIREF
33 103
×
--------------------
××=
tign 0.26 CCT
330 10 9
×
--------------------------RIREF
33 103
×
--------------------
××=
fmin 40.5 103
×100 10 12
×
CCF
----------------------------33 103
×
RIREF
--------------------
××=
fmax 2.5 f min
×=
UBA2014_4 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 04 — 16 October 2008 8 of 19
NXP Semiconductors UBA2014
600 V driver IV for HF fluorescent lamps
Fig 4. Oscillator and driver signals
Fig 5. Normal ignition behavior
mgw582
VCF
VGL
V(GH-SH)
0
0
0
time
0
0
VACM
Vhalfbridge
mgw583
burn state
ignition
statepreheat state
fmin detection
Timer
on
time
off
Vlamp(fail)
Vlamp(max)
Vlamp
UBA2014_4 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 04 — 16 October 2008 9 of 19
NXP Semiconductors UBA2014
600 V driver IV for HF fluorescent lamps
Fig 6. Failure mode during ignition
Fig 7. Failure mode during burn
mgw584
power-down
statepreheat state ignition
state
timer
ended
Timer
on
time
off
Vlamp(fail)
Vlamp(max)
Vlamp
mgw585
time
Timer
on
off
Vlamp(fail)
Vlamp(max)
Vlamp
power-down
stateburn state ignition
state
timer
ended
timer
started
UBA2014_4 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 04 — 16 October 2008 10 of 19
NXP Semiconductors UBA2014
600 V driver IV for HF fluorescent lamps
9. Limiting values
[1] In accordance with the human body model, i.e. equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
10. Thermal characteristics
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages referenced to GND.
Symbol Parameter Conditions Min Max Unit
VHS high-side supply voltage IHS <30µA; t<1s - 600 V
IHS <30µA - 570 V
VVDD voltage at pin VDD -14V
VACM voltage at pin ACM 5+5V
VPCS voltage at pin PCS 5+5V
VLVS voltage at pin LVS 0 5 V
VCSP voltage at pin CSP 0 5 V
VCSN voltage at pin CSN 0.3 +5 V
VCSW voltage at pin CSW 0 5 V
Tamb ambient temperature 25 +80 °C
Tjjunction temperature 25 +150 °C
Tstg storage temperature 55 +150 °C
Vesd electrostatic discharge voltage
pins FVDD, GH and SH [1] 1000 +1000 V
pins CT, CSW, CF, IREF, GL, VDD,
PCS, CSN, CSP, VREF, LVS and ACM
[1] 2500 +2500 V
Table 5. Thermal characteristics
Symbol Parameter Conditions Typ Unit
Rth(j-a) thermal resistance from junction to ambient in free air
SO16 100 K/W
DIP16 60 K/W
Rth(j-pin) thermal resistance from junction to pin in free air
SO16 50 K/W
DIP16 30 K/W
UBA2014_4 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 04 — 16 October 2008 11 of 19
NXP Semiconductors UBA2014
600 V driver IV for HF fluorescent lamps
11. Characteristics
Table 6. Characteristics
V
DD
=13V; V
FVDD
V
SH
= 13 V; T
amb
=25
°
C; all voltages referenced to GND; see test circuit of Figure 8; unless otherwise
specified.
Symbol Parameter Conditions Min Typ Max Unit
Start-up state: pin VDD
VDD supply voltage TR1 = off; TR2 = off - - 6 V
VDD(reset) reset supply voltage TR1 = off; TR2 = off 4.5 5.5 7.0 V
VDD(stop) oscillator stop supply voltage 8.6 9.1 9.6 V
VDD(start) oscillator start supply voltage 12.4 13.0 13.6 V
VDD(hys) start-stop hysteresis supply
voltage 3.5 3.9 4.4 V
VDD(clamp) clamp supply voltage Power-down mode 10 11 12 V
IDD(start) start-up supply current VDD <V
DD(start) - 170 200 µA
IDD(pd) power-down supply current VDD = 9 V - 170 200 µA
IDD supply current fbridge = 40 kHz without gate
drive - 1.5 2.2 mA
High-voltage supply: pins GH, SH and FVDD
ILlatching current 600 V at high-voltage pins - - 30 µA
Reference voltage: pin VREF
Vref reference voltage IL=10µA 2.86 2.95 3.04 V
VVREF reference voltage stability IL=10µA;
Tamb =25°C to 150 °C-0.64 - %
Isource source current 1 - - mA
Isink sink current 1 - - mA
Zooutput impedance IL= 1 mA source - 3.0 -
Current supply: pin IREF
VIinput voltage - 2.5 - V
IIinput current 65 - 95 µA
Voltage controlled oscillator
Output: pin CSW
Vooutput control voltage 2.7 3.0 3.3 V
Vclamp clamp voltage burn state 2.8 3.1 3.4 V
Voltage controlled oscillator output: pin CF
fmax maximum frequency 90 100 110 kHz
fmin minimum frequency 38.9 40.5 42.1 kHz
fstab frequency stability Tamb =20 °C to +80 °C - 1.3 - %
tstart first output oscillator stroke time - 50 - µs
tno(min) minimum non-overlap time GH to GL 0.68 0.90 1.13 µs
GL to GH 0.75 1.00 1.25 µs
tno(max) maximum non-overlap time fbridge =40kHz [1] - 7.5 - µs
VCF(high) high-level oscillator output
voltage f=f
min - 2.5 - V
UBA2014_4 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 04 — 16 October 2008 12 of 19
NXP Semiconductors UBA2014
600 V driver IV for HF fluorescent lamps
Io(start) oscillator output start current VCF = 1.5 V 3.8 4.5 5.2 µA
Io(min) minimum oscillator output current VCF = 1.5 V - 21 - µA
Io(max) maximum oscillator output
current VCF = 1.5 V - 54 - µA
Output drivers
High-side driver output: pin GH
VOH HIGH-level output voltage Io= 10 mA 12.5 - - V
VOL LOW-level output voltage Io= 10 mA - - 0.5 V
Io(source) output source current VGH VSH = 0 V 135 180 235 mA
Io(sink) output sink current VGH VSH = 13 V 265 330 415 mA
Ron on resistance Io=10mA 323945
Roff off resistance Io=10mA 162126
Low-side driver output: pin GL
VOH HIGH-level output voltage Io= 10 mA 12.5 - - V
VOL LOW-level output voltage Io= 10 mA - - 0.5 V
Io(source) output source current VGL = 0 135 200 235 mA
Io(sink) output sink current VGL = 13 V 265 330 415 mA
Ron on resistance Io=10mA 323945
Roff off resistance Io=10mA 162126
Floating supply voltage: pin FVDD
VFVDD lockout voltage 2.8 3.5 4.2 V
IFVDD floating well supply current DC level at
VGH VSH =13V -35-µA
Bootstrap diode
Vboot bootstrap diode forward drop
voltage I=5mA 1.3 1.7 2.1 V
Preheat current sensor
Input: pin PCS
Iiinput current VPCS = 0.6 V - - 1 µA
Vph preheat voltage 0.57 0.60 0.63 V
Output: pin CSW
Io(source) output source current VCSW = 2.0 V 9.0 10 11 µA
Io(sink) output sink current VCSW = 2.0 V - 10 - µA
Adaptive non-overlap and capacitive mode detection; pin ACM
Iiinput current VACM = 0.6 V - - 1 µA
VCMDP positive capacitive mode
detection voltage 80 100 120 mV
VCMDN negative capacitive mode
detection voltage 68 85 102 mV
Table 6. Characteristics
…continued
V
DD
=13V; V
FVDD
V
SH
= 13 V; T
amb
=25
°
C; all voltages referenced to GND; see test circuit of Figure 8; unless otherwise
specified.
Symbol Parameter Conditions Min Typ Max Unit
UBA2014_4 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 04 — 16 October 2008 13 of 19
NXP Semiconductors UBA2014
600 V driver IV for HF fluorescent lamps
[1] The maximum non-overlap time is determined by the level of the CF signal. If this signal exceeds a level of 1.25 V, the non-overlap will
end, resulting in a maximum non-overlap time of 7.5 µs at a bridge frequency of 40 kHz.
Lamp voltage sensor
Input: pin LVS
Iiinput current VLVS = 0.81 V - - 1 µA
Vlamp(fail) lamp fail voltage 0.77 0.81 0.85 V
Vlamp(fail)(hys) lamp fail hysteresis voltage 119 144 169 mV
Vlamp(max) maximum lamp voltage 1.44 1.49 1.54 V
Output: pin CT
Io(sink) output sink current VCSW =2.0V 273033µA
Io(source) ignition output source current VCSW = 2.0 V 9.0 10 11 µA
Average current sensor
Input: pins CSP and CSN
Iiinput current VCS =0V --1µA
Voffset offset voltage VCSP =V
CSN = 0 V to 2.5 V 2 0 +2 mV
gmtransconductance f = 1 kHz 1900 3800 5700 µA/mV
Output: pin CSW
Iooutput current source and sink; VCSW =2V 8595105µA
Preheat timer; pin CT
tph preheat time CCT = 330 nF;
RIREF =33k1.6 1.8 2.0 s
tign ignition time CCT = 330 nF;
RIREF =33k- 0.32 - s
Iooutput current VCT = 2.5 V 5.5 5.9 6.3 µA
VOL LOW-level output voltage - 1.4 - V
VOH HIGH-level output voltage - 3.6 - V
Vhys hysteresis voltage 2.05 2.20 2.35 V
Table 6. Characteristics
…continued
V
DD
=13V; V
FVDD
V
SH
= 13 V; T
amb
=25
°
C; all voltages referenced to GND; see test circuit of Figure 8; unless otherwise
specified.
Symbol Parameter Conditions Min Typ Max Unit
iTi“ H H EH T U 4? .1: T
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xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
UBA2014_4 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 04 — 16 October 2008 14 of 19
NXP Semiconductors UBA2014
600 V driver IV for HF fluorescent lamps
12. Application information
Fig 8. Test and application circuit
mgw586
VREF
FVDD
Z1
12 V
GH
SH
GL
PCS1
7
LVS
CSN
CSP
VDD
CT
9
10
11
6
45 3 2 14
8
ACM
12
13
16
15
CSWCFGNDIREF
C3
1 nF
C19
56 nF C17
6.8 nF
C8
330 pF
C20
68 nF
TLD36W
C22
8.2 nF
C23
100 nF
C6
1.2 nF
C10
5.6 nF
C5
100 nF
VDC
400 V
UBA2014
HIGH SIDE
DRIVER
LOW SIDE
DRIVER
BOOTSTRAP
DRIVER
CONTROL
SUPPLY
PREHEAT
TIMER
REFERENCE
CURRENT
DIVIDER
ADAPTIVE
NON-OVERLAP TIMING
AND CAPACITIVE
MODE DETECTOR
PREHEAT
CURRENT
SENSOR
LAMP
VOLTAGE
SENSOR
+
+
AVERAGE
CURRENT
SENSOR
VOLTAGE
CONTROLLED
OSCILLATOR
R2
8.2
k
R12
33 k
R5
10 k
R18
180 k
R20
220 k
R4
1 M
D4
BYD77D
Lamp
R16
1.5
R1
1 M
R10
1 M
R3
220 k
R13
150
D1
BYD77D
R8
8.2 k
F1
1A
R9
47
L1
1.9 mH
TR1
IRF820
TR2
IRF820
C2
12 nF
C14
100 pF C13
220 nF
C15
330 nF
C7
330 nF
R14
1
C24
100 nF
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UBA2014_4 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 04 — 16 October 2008 15 of 19
NXP Semiconductors UBA2014
600 V driver IV for HF fluorescent lamps
13. Package outline
Fig 9. Package outline SOT109-1 (SO16)
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
8
9
1
16
y
pin 1 index
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm
inches
1.75 0.25
0.10 1.45
1.25 0.25 0.49
0.36 0.25
0.19 10.0
9.8 4.0
3.8 1.27 6.2
5.8 0.7
0.6 0.7
0.3 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.0
0.4
SOT109-1 99-12-27
03-02-19
076E07 MS-012
0.069 0.010
0.004 0.057
0.049 0.01 0.019
0.014
0.0100
0.0075 0.39
0.38 0.16
0.15 0.05
1.05
0.041
0.244
0.228 0.028
0.020 0.028
0.012
0.01
0.25
0.01 0.004
0.039
0.016
0 2.5 5 mm
scale
SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
E@ W
UBA2014_4 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 04 — 16 October 2008 16 of 19
NXP Semiconductors UBA2014
600 V driver IV for HF fluorescent lamps
Fig 10. Package outline SOT38-1 (DIP16)
UNIT A
max. 1 2 b1cEe M
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT38-1 99-12-27
03-02-13
A
min. A
max. bmax.
w
ME
e1
1.40
1.14
0.055
0.045
0.53
0.38 0.32
0.23 21.8
21.4
0.86
0.84
6.48
6.20
0.26
0.24
3.9
3.4
0.15
0.13
0.2542.54 7.62
0.3
8.25
7.80
0.32
0.31
9.5
8.3
0.37
0.33
2.2
0.087
4.7 0.51 3.7
0.15 0.021
0.015 0.013
0.009 0.010.10.020.19
050G09 MO-001 SC-503-16
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
16
1
9
8
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
(1) (1)
D(1)
Z
DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1
UBA2014_4 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 04 — 16 October 2008 17 of 19
NXP Semiconductors UBA2014
600 V driver IV for HF fluorescent lamps
14. Revision history
Table 7. Revision history
Document ID Release date Data sheet status Change notice Supersedes
UBA2014_4 20081016 Product data sheet - UBA2014_3
Modifications: Max value for VHS in Table 1 updated.
Max value for VHS in Table 4 updated.
UBA2014_3 20080815 Product data sheet - UBA2014_2
UBA2014_2 20050912 Product data sheet - UBA2014_1
UBA2014_1 20020516 Product specification - -
UBA2014_4 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 04 — 16 October 2008 18 of 19
NXP Semiconductors UBA2014
600 V driver IV for HF fluorescent lamps
15. Legal information
15.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
15.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
founded by PHILIPS
NXP Semiconductors UBA2014
600 V driver IV for HF fluorescent lamps
© NXP B.V. 2008. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 16 October 2008
Document identifier: UBA2014_4
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
17. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
5 Ordering information . . . . . . . . . . . . . . . . . . . . . 2
6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Functional description . . . . . . . . . . . . . . . . . . . 5
8.1 Start-up state . . . . . . . . . . . . . . . . . . . . . . . . . . 5
8.2 Oscillation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
8.3 Adaptive non-overlap . . . . . . . . . . . . . . . . . . . . 5
8.4 Timing circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . 5
8.5 Preheat state . . . . . . . . . . . . . . . . . . . . . . . . . . 6
8.6 Ignition state . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
8.7 Burn state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
8.8 Lamp failure mode . . . . . . . . . . . . . . . . . . . . . . 6
8.8.1 During ignition state . . . . . . . . . . . . . . . . . . . . . 6
8.8.2 During burn state . . . . . . . . . . . . . . . . . . . . . . . 6
8.9 Power-down mode . . . . . . . . . . . . . . . . . . . . . . 7
8.10 Capacitive mode protection . . . . . . . . . . . . . . . 7
8.11 Charge coupling . . . . . . . . . . . . . . . . . . . . . . . . 7
8.12 Design equations . . . . . . . . . . . . . . . . . . . . . . . 7
9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 10
10 Thermal characteristics. . . . . . . . . . . . . . . . . . 10
11 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 11
12 Application information. . . . . . . . . . . . . . . . . . 14
13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15
14 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 17
15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 18
15.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18
15.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
15.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
15.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18
16 Contact information. . . . . . . . . . . . . . . . . . . . . 18
17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

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