CLP Series Datasheet by Samtec Inc.

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(1.27 mm) .050" CLP SERIES
High-reliability
Tiger Claw
contacts
CLP–107–02–F–D–P
CLP–130–02–L–D
CLP–116–02–F–DH
CLP–115–02–L–D
Surface
mount
Low-profile
(2.29 mm)
.090"
(1.27 mm x 1.27 mm)
.050" x .050"
micro pitch
Suitable for pass-through
applications
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
1OTHER OPTION
PLATING
OPTION
02 thru 50
NO. PINS
PER ROW
CLP 02
Mates with:
FTSH, FTS, FW
ROW
OPTION
–D
= Double
Row
–DH
= Double
Horizontal
(Requires
FTSH–04
lead style)
For complete specifications
and recommended PCB layouts
see www.samtec.com?CLP
Insulator Material:
Black Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating:
Sn or Au over
50 µ" (1.27 µm) Ni
Current Rating (CLP/FTSH):
3.4 A per pin
(2 pins powered)
Voltage Rating:
280 VAC/395 VDC
Operating Temp Range:
-55 °C to +125 °C
Insertion Depth:
Top Entry = (1.40 mm) .055"
minimum, Bottom Entry =
(2.41 mm) .095" minimum
plus board thickness
DH Entry = (2.31 mm) .091"
to (2.67 mm) .105"
Normal Force:
60 grams (0.59 N) average
Max Cycles:
100 with 10 µ" (0.25 µm) Au
RoHS Compliant:
Ye s
–DH
PA OPTION
–D
P OPTION
If odd pins/row, alignment pins are on middle position
on centerline of the part. If even pins/row, then
alignment pins are between middle two positions.
–F
= Gold flash on contact,
Matte Tin on tail
–L
= 10 µ" (0.25 µm)
Gold on contact,
Matte Tin on tail
–G
= 10 µ" (0.25 µm) Gold
(–D only)
Note:
Some sizes, styles and
options are non-standard,
non-returnable.
LOW-PROFILE DUAL WIPE SOCKET
ALSO AVAILABLE
(MOQ Required)
Single row
Other platings
For complete scope of
recognitions see
www.samtec.com/quality
RECOGNITIONS
–BE
= Bottom Entry
(Required for bottom entry applications)
–A
= Alignment Pin
(Not available with –PA option)
(05, 06, 07, 08, 10, 12, 15, 20,
25, 30, 40 positions only)
(–DH option and other sizes. Contact Samtec.)
–K
= (4.00 mm) .157" DIA
Polyimide film Pick & Place Pad
(5 positions minimum)
–P
= Pick & Place Pad
(5 positions min. –D only)
(Not always necessary for auto placement.
See Flex Processing.)
PA
= Pick & Place Pad with Alignment Pin
(–D only)
(Not available with –A option)
–TR
= Tape & Reel
–FR
= Full Reel Tape & Reel
(must order maximum quantity per reel;
contact Samtec for quantity breaks)
FILE NO. E111594
SPECIFICATIONS
PROCESSING
Lead-Free Solderable:
Ye s
SMT Lead Coplanarity:
(0.10 mm) .004" max (02-35)
(0.15 mm) .006" max (36-50)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
EXTENDED LIFE
PRODUCT
10 YEAR MFG
WITH 30 µ" GOLD
HIGH MATING
CYCLES
F-219 (Rev 07OCT20)
HIGH-SPEED CHANNEL PERFORMANCE
Rating based on Samtec reference
channel. For full SI performance data
visit Samtec.com or contact
SIG@samtec.com Gbps
8
PIN/ROW A
04-15 (3.56) .1z40
16-50 (7.11) .280
No. of Positions
x (1.27) .050 + (0.43) .017
(1.27)
.050 (1.27)
.050
(0.41)
.016
(3.05)
.120
(4.57)
.180
(4.32)
.170
(2.54)
.100
(6.35)
.250
x
(3.18)
.125
99
100
01
02
(2.29)
.090
(3.43)
.135
(0.89)
.035 DIA
(7.00)
.275
(3.07)
.121
(1.40)
.055
(8.25)
.325
A

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