CLM/MLE Series Datasheet by Samtec Inc.

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RUGGED RELIABLE MICRO SOCKETS —- I- I - I - 2 EEEEEE EE EEEEEEE EEEEE EEEEEEE +
(1.00 mm) .0394" CLM, MLE SERIES
CLM –111– 02 –L –D
CLM–126–02–F–D
MLE–150–01–G–DV MLE120–01–G–DV
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
(0.28)
.011
(1.00)
.03937
(2.54)
.100
(1.00)
.03937 100 02
01
No. of positions x (1.00) .03937
+ (0.318) .0125
(2.12)
.084
(2.26)
.089
(3.81)
.150
(2.41)
.095
(5.72)
.225
x
(3.57)
.140
(3.00)
.118
(8.26) .325
by A
(0.89) .035
DIA
(1.36)
.054
(7.00)
.275
NO. PINS
PER ROW OPTIONS
102 PLATING
OPTION D
Mates with:
FTM, FTMH, MW
–P
CLM
–F
= Gold flash on
contact,
Matte Tin on tail
–L
= 10 µ" (0.25 µm)
Gold on contact,
Matte Tin on tail
02 thru 50 –BE
= Bottom Entry
(Required for bottom entry)
–K
= (3.50 mm) .138" DIA
Polyimide film Pick & Place Pad
(7 positions minimum)
–P
= Pick & Place Pad
(7 positions minimum)
PA
= Pick & Place Pad with
integral Alignment Pin
–TR
= Tape & Reel Packaging
–FR
= Full Reel Tape & Reel
(must order max. quantity per
reel; contact Samtec for
quantity breaks)
NO. PINS
PER ROW OPTIONS
101 PLATING
OPTION DV
Mates with:
FTM, FTMH, MW
MLE
–G
= 10 µ"
(0.25 µm)
Gold
02 thru 50 –A
= Alignment Pin
(3 positions minimum)
Metal or plastic at Samtec
discretion
–K
= (4.00 mm) .1575" DIA
Polyimide film Pick & Place Pad
(5 positions minimum)
–P
= Metal Pick & Place Pad
(5 positions minimum)
–TR
= Tape & Reel Packaging
(3.30)
.130
(4.32)
.170
(3.50)
.138
(6.35)
.250
x
(3.18)
.125
(0.71)
.028
(0.64)
.025
DIA
No. of positions
x (1.00) .03937 + (0.20) .008
(0.30)
.012
(1.00)
.03937
(3.07)
.121
(1.00)
.03937
100 02
01
(3.12)
.123
–P
–A
For complete specifications and
recommended PCB layouts
see www.samtec.com?CLM
or www.samtec.com?MLE
Insulator Material:
Black LCP
Contact Material:
CLM: Phosphor Bronze
MLE: BeCu
Plating:
CLM: Au or Sn
over 50 µ" (1.27 µm) Ni
MLE: Au over 10 µ"
(0.25 µm) Ni
Current Rating (CLM/FTM):
2.8 A per pin
(2 pins powered)
Current Rating (MLE/FTM):
2.9 A per pin
(2 pins powered)
Operating Temp Range:
-55 °C to +125 °C
Max Cycles:
CLM: 100 with 10 µ" (0.25 µm) Au
Voltage Rating:
MLE: 310 VAC
Insertion Depth:
CLM: Top Entry = (1.40 mm)
.055" min., Bottom Entry =
(2.41 mm) .095" min.
(Add board thickness for
correct post OAL)
MLE: (1.63 mm) .064" to
(3.18 mm) .125" with
(0.38 mm) .015" wipe,
pass-through, or
(2.44 mm) .096" minimum
for bottom entry
Normal Force:
CLM: 40 grams (0.39 N) average
RoHS Compliant:
Ye s
Lead-Free Solderable:
Ye s
SMT Lead Coplanarity:
(0.10 mm) .004" max (02-25)
(0.15 mm) .006" max (26-50)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
PA
RUGGED RELIABLE MICRO SOCKETS
APPLICATION
Pass-Thru
ALSO AVAILABLE
(MOQ Required)
Alignment pin
Other Gold plating options
For complete scope of
recognitions see
www.samtec.com/quality
RECOGNITIONS
FILE NO. E111594
SPECIFICATIONS
EXTENDED LIFE
PRODUCT
10 YEAR MFG
WITH 30 µ" GOLD
HIGH MATING
CYCLES
PIN/ROW A
04-15 (3.56)
.140
16-50 (7.11)
.280
F-219 (Rev 12MAY20)

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