BCM352x125y300A00 Datasheet by Vicor Corporation

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BCM352x125y300A00
BCM® Bus Converter Rev 2.0 vicorpower.com
Page 1 of 21 08/2016 800 927.9474
BCM® Bus Converter
Isolated Fixed Ratio DC-DC Converter
S
NRTL
CU
S
CUS
®
Features & Benefits
352VDC – 12.5VDC 300W Bus Converter
High efficiency (>95%) reduces
system power consumption
High power density (1000W/in3) reduces
power system footprint by >40%
“Full Chip” VI Chip® package enables surface mount,
low impedance interconnect to system board
Contains built-in protection features against:
nUndervoltage
nOvervoltage
nOvercurrent
nShort Circuit
nOvertemperature
Provides enable/disable control,
internal temperature monitoring
ZVS/ZCS Resonant Sine Amplitude Converter topology
Can be paralleled to create multi-kW arrays
Typical Application
High End Computing Systems
Automated Test Equipment
High Density Power Supplies
Description
The VI Chip® Bus Converter is a high efficiency (>95%) Sine
Amplitude ConverterTM (SACTM) operating from a 330 to 365VDC
primary bus to deliver an isolated ratiometric output voltage from
11.79 to 13.04VDC. The SAC offers a low AC impedance beyond
the bandwidth of most downstream regulators, meaning that
input capacitance normally located at the input of a regulator
can be located at the input to the SAC. Since the K factor of the
BCM352x125y300A00 is 1/28, that capacitance value can be
reduced by a factor of 784x, resulting in savings of board area,
materials and total system cost.
The BCM352F125y300A00 is provided in a VI Chip package
compatible with standard pick-and-place and surface mount
assembly processes. The VI Chip package provides flexible thermal
management through its low junction-to-case and junction-to-
board thermal resistance. With high conversion efficiency the
BCM352x125y300A00 increases overall system efficiency and
lowers operating costs compared to conventional approaches.
Typical Application
For Storage and Operating Temperatures see Section 6.0 General Characteristics
Part Numbering
Product Ratings
VIN = 352V (330 – 365V) POUT = up to 300W
VOUT = 12.5V (11.79 – 13.04V)
(no load)K = 1/28
Product Number Package Style (x) Product Grade (y)
BCM352x125y300A00 F = J-Lead T = -40° to 125°C
T = Through hole
SW1
enable / disable
switch
F1
VC1 1µF
IN
PC
TM
-OUT
+OUT
-IN
+IN
BCM®
POL
POL
POL
POL (8)
VOUT
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BCM352x125y300A00
-IN
PC
RSV
TM
+IN
-OUT
+OUT
-OUT
+OUT
Bottom View
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
43 21
A
B
C
D
E
H
J
K
L
M
N
P
R
T
Pin Configuration
Pin Descriptions
Pin Number Signal Name Type Function
A1-E1, A2-E2 +IN INPUT POWER Positive input power terminal
L1-T1, L2-T2 –IN INPUT POWER
RETURN Negative input power terminal
H1, H2 TM OUTPUT Temperature monitor, input side referenced signal
J1, J2 RSV NC No connect
K1, K2 PC OUTPUT/INPUT Enable and disable control, input side referenced signal
A3-D3, A4-D4,
J3-M3, J4-M4 +OUT OUTPUT POWER Positive output power terminal
E3-H3, E4-H4,
N3-T3, N4-T4 –OUT OUTPUT POWER
RETURN Negative output power terminal
Control Pin Specifications
See Using the Control Signals PC, TM for more information.
PC (BCM Primary Control)
The PC pin can enable and disable the BCM module. When held
below VPC_DIS the BCM shall be disabled. When allowed to
float with an impedance to –IN of greater than 50kΩ the
module will start. When connected to another BCM PC pin
(either directly, or isolated through a diode), the BCM modules
will start simultaneously when enabled. The PC pin is capable of
being either driven high by an external logic signal or internal
pull up to 5V (operating).
TM (BCM Temperature Monitor)
The TM pin monitors the internal temperature of the BCM module
within an accuracy of ±5°C. It has a room temperature setpoint of
~3.0V and an approximate gain of 10mV/°C. It can source up to
10A and may also be used as a “Power Good” flag to verify that
the BCM module is operating.
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Absolute Maximum Ratings
The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause permanent damage to the device.
Parameter Comments Min Max Unit
+IN to –IN -1.0 400 V
+IN/-IN TO +OUT/-OUT (hipot) 4242 V
+IN/-IN TO +OUT/-OUT (working) 500 V
+OUT to –OUT -1 16 V
PC to –IN -0.3 20 V
TM to –IN -0.3 7 V
Temperature during reflow 245 ºC
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BCM352x125y300A00
Electrical Specifications
Specifications apply over all line and load conditions, unless otherwise noted; boldface specifications apply over the temperature range of
-40°C TJ 125°C (T-Grade); all other specifications are at TJ = 25ºC unless otherwise noted.
Attribute Symbol Conditions / Notes Min Typ Max Unit
Powertrain
Voltage range VIN_DC 330 352 365 V
dV / dt dVIN / dt 1V/µs
Quiescent power PQPC connected to –IN 230 370 mW
No load power dissipation PNL
VIN = 352V 7.1 10 W
VIN = 330V to 365V 15
Inrush current peak IINR_P
VIN = 365V, COUT = 1000µF,
POUT = 300W 24.5 A
DC input current IIN_DC At POUT = 300W 1A
Transformation ratio K K = VOUT / VIN, at no load 1/28 V/V
Output power (average) POUT_AVG
VIN = 352VDC 300
W
VIN = 330 - 365VDC 282
Output power (peak) POUT_PK VIN = 352VDC , 10ms max, POUT_AVG 300W 450 W
Output voltage VOUT No load 11.79 13.04 V
Output current (average) IOUT_AVG POUT_AVG 300W 26 A
Efficiency (ambient) hAMB
VIN = 352V, POUT = 300W 94.2 95.3
%
VIN = 330V to 365V, POUT = 300W 94
Efficiency (hot) hHOT VIN = 352V, POUT = 300W; TJ = 100°C 93.3 94.6 %
Efficiency (over load range) h20% 60W < POUT < POUT Max 90 %
Output resistance
ROUT_COLD TJ = -40°C 7 10 14
mΩROUT_AMB TJ = 25°C 10 12.5 18
ROUT_HOT TJ = 125°C 14 16.5 25
Load capacitance COUT 1000 µF
Switching frequency FSW 2.13 2.25 2.37 MHz
Ripple frequency FSW_RP 4.26 4.5 4.74 MHz
Output voltage ripple VOUT_PP COUT = 0µF, POUT = 300W, VIN = 352V, 200 400 mV
VIN to VOUT (application of VIN) TON1 VIN = 352V, CPC = 0 460 390 620 ms
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BCM352x125y300A00
Electrical Specifications (Cont.)
Specifications apply over all line and load conditions, unless otherwise noted; boldface specifications apply over the temperature range of
-40°C TJ 125°C (T-Grade); all other specifications are at TJ = 25ºC unless otherwise noted.
Attribute Symbol Conditions / Notes Min Typ Max Unit
Protection
Input overvoltage lockout threshold VIN_OVLO+ 380 387 400 V
Input overvoltage recovery threshold VIN_OVLO- 366 383 390 V
Input undervoltage recovery
threshold VIN_UVLO+ 295 310 325 V
Input undervoltage lockout
threshold VIN_UVLO- 270 295 325 V
Output overcurrent trip threshold IOCP VIN = 352V, 25ºC 32 42 52 A
Short circuit protection trip threshold ISCP 60 A
Short circuit protection response
time TSCP 1.2 µs
Thermal shutdown threshold TJ_OTP 125 130 135 °C
0
50
100
150
200
250
300
350
400
450
500
11.4011.90 12.4012.90
Output Voltage (V)
Output Power (W)
P (ave) P (pk) < 10ms
Figure 1 — Safe operating area
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Attribute Symbol Conditions / Notes Min Typ Max Unit
PC
PC voltage (operating) VPC 4.7 55.3 V
PC voltage (enable) VPC_EN 22.5 3V
PC voltage (disable) VPC_DIS 1.95 V
PC source current (start up) IPC_EN 50 100 300 µA
PC source current (operating) IPC_OP 23.5 5mA
PC internal resistance RPC_SNK Internal pull down resistor 50 150 400 kΩ
PC capacitance (internal) CPC_INT 1000 pF
PC capacitance (external) CPC_EXT External capacitance delays PC enable time 1000 pF
External PC resistance RPC Connected to –VIN 50 kΩ
PC external toggle rate RPC_TOG 1Hz
PC to VOUT with PC released TON2 VIN = 352V, pre-applied, CPC = 0, COUT = 0 50 100 150 µs
PC to VOUT, disable PC TPC_DIS VIN = 352V, pre-applied, CPC = 0, COUT = 0 4 10 µs
TM
TM accuracy ACTM -5 +5 ºC
TM gain ATM 10 mV / ºC
TM source current ITM 100 µA
TM internal resistance RTM_SNK 25 40 50 kΩ
External TM capacitance CTM 50 pF
TM voltage ripple VTM_PP CTM = 0µF, VIN = 365V, POUT = 300W 50 100 200 mV
Electrical Specifications (Cont.)
Specifications apply over all line and load conditions, unless otherwise noted; boldface specifications apply over the temperature range of
-40°C TJ 125°C (T-Grade); all other specifications are at TJ = 25ºC unless otherwise noted.
=5: :5:
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Timing Diagram
12
34
56
VUVLO+
PC
5 V
3 V
LL • K
A: TON1
B: TOVLO*
C: Max recovery time
D:TUVLO
E: TON2
F: TOCP
G: TPC–DIS
H: TSSP**
1: Controller start
2: Controller turn off
3: PC release
4: PC pulled low
5: PC released on output SC
6: SC removed
VOUT
TM
3 V @ 27°C
0.4 V
VIN
3 V 5 V
2.5 V
500mS
before retrial
VUVLO
A
B
E
H
ISSP
IOUT
IOCP
G
F
D
C
VOVLO+
VOVLO
VOVLO+
NL
Notes:
Timing and voltage is not to scale
– Error pulse width is load dependent
*Min value switching off
**From detection of error to power train shutdown
C
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BCM352x125y300A00
Attribute Symbol Conditions / Notes Typ Unit
No load power PNL VIN = 352V, PC enabled 7.1 W
Inrush current peak INR_P COUT = 1000µF, POUT = 300W 2 A
Efficiency (ambient) hVIN = 352V, POUT = 300W 95.3 %
Efficiency (hot – 100ºC) hVIN = 352V, POUT = 300W 94.6 %
Output resistance (-40ºC) ROUT_C VIN = 352V 10 mΩ
Output resistance (25ºC) ROUT_R VIN = 352V 12.5 mΩ
Output resistance (100ºC) ROUT_H VIN = 352V 16.5 mΩ
Output voltage ripple VOUT_PP COUT = 0µF, POUT = 300W @ VIN = 352V, VIN = 352V 200 mV
VOUT transient voltage (positive) VOUT_TRAN+ IOUT_STEP = 0 – 25A, ISLEW > 10A/µs 380 mV
VOUT transient voltage (negative) VOUT_TRAN- IOUT_STEP = 25 – 0A, ISLEW > 10A/µs 380 mV
Undervoltage lockout response time TUVLO 60 µs
Output overcurrent response time TOCP 32 < IOCP < 52A 4.62 ms
Overvoltage lockout response time TOVLO 47 µs
TM voltage (ambient) VTM_AMB TJ @ 27ºC 3 V
Application Characteristics
All specifications are at TJ = 25ºC unless otherwise noted. See associated figures for general trend data
W m
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Application Characteristics
The following values, typical of an application environment, are collected at TCASE = 25ºC unless otherwise noted. See associated figures for general trend data.
0
2
4
6
8
10
12
330 335 340 345 350355 360365
Input Voltage (V)
Power Dissipation (W
)
-40ºC 25ºC 100ºC
93.0
93.5
94.0
94.5
95.0
95.5
96.0
-40 -20 0 20 40 60 80 100
Case Temperature (°C)
Efficiency (%)
330V 352V 365V
VIN:
62
66
70
74
78
82
86
90
94
98
0510 15 20 25 30
Output Load (A)
Efficiency (%)
330V 352V 365V
VIN:
Figure 2 No load power dissipation vs. Vin Figure 3 Full load efficiency vs. temperature; Vin
Figure 4 Efficiency at TCASE = -40°C
78
80
82
84
86
88
90
92
94
96
98
0510 15 20 25 30
Output Load (A)
Efficiency (%)
330V 352V 365V
VIN:
Figure 6 — Efficiency at TCASE = 25°C
0510 15 20 25 30
Output Load (A)
7
9
11
13
15
17
19
21
Power Dissipation (W
)
330V 352V 365V
VIN:
Figure 5 Power dissipation at TCASE = -40°C
0510 15 20 25 30
Output Load (A)
5
7
9
11
13
15
17
19
Power Dissipation (W
)
330V 352V 365V
VIN:
Figure 7 Power dissipation at TCASE = 25°C
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BCM352x125y300A00
Application Characteristics (Cont.)
0
50
100
150
200
250
0510 15 20 25 30
Ripple (mVPK-PK)
Load Current (A)
VIN:352V
Figure 11 Vripple vs. Iout: No external Cout, board mounted
module, scope setting : 20MHz analog BW
78
80
82
84
86
88
90
92
94
96
98
0510 15 20 25 30
Output Load (A)
Efficiency (%)
330V 352V 365V
VIN:
Figure 8 — Efficiency at TCASE = 100°C
8
9
10
11
12
13
14
15
16
17
18
-40 -20 020406080100
Temperature (°C)
ROUT (mΩ)
2.6A 26A
IOUT:
Figure 10 — ROUT vs. temperature; nominal input
0510 15 20 25 30
Output Load (A)
5
7
9
11
13
15
17
19
21
Power Dissipation (W
)
330V 352V 365V
VIN:
Figure 9 Power dissipation at TCASE = 100°C
Figure 13 — VIN to VOUT start up wave form
Figure 12 — PC to VOUT start up wave form
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BCM352x125y300A00
Figure 15 0A 25A transient response: Cin = 330µF,
Iin measured prior to Cin , no external Cout
Figure 14 Output voltage and input current ripple;
VIN = 352V, 300W, no COUT
Figure 17 PC disable wave form; VIN = 352V, COUT = 1000µF,
full load
Figure 16 25A 0A transient response: Cin = 330µF,
Iin measured prior to Cin , no external Cout
Application Characteristics (Cont.)
VICOR
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BCM352x125y300A00
General Characteristics
All specifications are at TJ = 25ºC unless otherwise noted. See associated figures for general trend data.
Attribute Symbol Conditions / Notes Min Typ Max Unit
Mechanical
Length L 32.4 / [1.27] 32.5 / [1.28] 32.6 / [1.29] mm / [in]
Width W 21.7 / [0.85] 22.0 / [0.87] 22.3 / [0.89] mm / [in]
Height H 6.48 / [0.255] 6.73 / [0.265] 6.98 / [0.275] mm / [in]
Volume Vol No heat sink 4.81 / [0.295] cm3/ [in3]
Footprint F No heat sink 7.3 / [1.1] cm3/ [in3]
Power density PDNo heat sink 1017 W/in3
62 W/cm3
Weight W 14 / [0.5] g / [oz]
Lead Finish
Nickel 0.51 2.03
µm
Palladium 0.02 0.15
Gold 0.003 0.05
Thermal
Operating temperature TJ-40 125 °C
Storage temperature TST -40 125 °C
Thermal impedance øJC Junction to case 1.1 1.5 °C/W
Thermal capacity 9 Ws/°C
Assembly
Peak compressive force
applied to case (Z-axis) No J-lead support 5 6 lbs
ESD Withstand
ESDHBM
Human Body Model,
JEDEC JESD 22-A114C.01 1500
VDC
ESDMM
Machine Model,
JEDEC JESD 22-A115-A 400
Soldering
Peak temperature during reflow MSL 4 (Datecode 1528 and later) 245 °C
Peak time above 217°C 150 s
Peak heating rate during reflow 1.5 3 °C/s
Peak cooling rate post reflow 1.5 6 °C/s
Safety
Working voltage (IN – OUT) VIN_OUT 500 VDC
Isolation voltage (hipot) VHIPOT 4242 VDC
Isolation capacitance CIN_OUT Unpowered unit 500 660 800 pF
Isolation resistance RIN_OUT 10 MΩ
MTBF MIL HDBK 217F, 25°C, GB 4.2 MHrs
Agency approvals / standards
cTUVus
cURus
CE Marked for Low Voltage Directive and ROHS recast directive, as applicable.
VICOR
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Using the Control Signals PC, TM
Primary Control (PC) pin can be used to accomplish the
following functions:
n
Delayed start: At start up, PC pin will source a constant
10A current to the internal RC network. Adding an external
capacitor will allow further delay in reaching the 2.5V threshold
for module start.
n
Synchronized start up: In an array of parallel modules, PC
pins should be connected to synchronize start up across
units. While every controller has a calibrated 2.5V reference
on PC comparator, many factors might cause different timing in
turning on the 100µA current source on each module, i.e.:
– Different V
IN
slew rate
– Statistical component value distribution
By connecting all PC pins, the charging transient will be shared
and all the modules will be enabled synchronously.
n
Auxiliary voltage source: Once enabled in regular
operational conditions (no fault), each BCM module
PC provides a regulated 5V, 2mA voltage source.
n
Output disable: PC pin can be actively pulled down in order
to disable the module. Pull down impedance shall be lower
than 400Ω and toggle rate lower than 1Hz.
n
Fault detection flag: The PC 5V voltage source is internally
turned off as soon as a fault is detected. After a minimum
disable time, the module tries to re-start, and PC voltage is
re-enabled. For system monitoring purposes (microcontroller
interface) faults are detected on falling edges of PC signal.
n
Note that PC doesn’t have current sink capability (only 150kΩ
typical pull down is present), therefore, in an array, PC line will
not be capable of disabling all the modules if a fault occurs on
one of them.
Temperature Monitor (TM) pin provides a voltage proportional
to the absolute temperature of the converter control IC.
It can be used to accomplish the following functions:
n
Monitor the control IC temperature: The temperature in
Kelvin is equal to the voltage on the TM pin scaled
by 100. (i.e. 3.0V = 300K = 27ºC). It is important to remember
that VI Chip
®
products are multi-chip modules, whose
temperature distribution greatly vary for each part number
as well with input/output conditions, thermal management
and environmental conditions. Therefore, TM cannot be used to
thermally protect the system.
n
Fault detection flag: The TM voltage source is internally
turned off as soon as a fault is detected. After a minimum
disable time, the module tries to re-start, and TM voltage
is re-enabled.
VICOR
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Sine Amplitude Converter™ Point of Load Conversion
The Sine Amplitude Converter (SAC™) uses a high frequency
resonant tank to move energy from input to output. The resonant
LC tank, operated at high frequency, is amplitude modulated as
a function of input voltage and output current. A small amount
of capacitance embedded in the input and output stages of the
module is sufficient for full functionality and is key to achieving
power density.
The BCM352x125y300A00 SAC can be simplified into the
preceeding model.
At no load:
VOUT = VIN • K (1)
K represents the “turns ratio” of the SAC.
Rearranging Eq (1):
K = VOUT (2)
VIN
In the presence of load, VOUT is represented by:
VOUT = VIN • K – IOUT • ROUT (3)
and IOUT is represented by:
IOUT = IIN – IQ (4)
K
ROUT represents the impedance of the SAC, and is a function of the
RDSON of the input and output MOSFETs and the winding resistance
of the power transformer. IQ represents the quiescent current of
the SAC control, gate drive circuitry, and core losses.
The use of DC voltage transformation provides additional
interesting attributes. Assuming that ROUT = 0Ω and IQ = 0A, Eq. (3)
now becomes Eq. (1) and is essentially load independent, resistor R
is now placed in series with VIN.
The relationship between VIN and VOUT becomes:
VOUT = (VIN – IIN • R) • K (5)
Substituting the simplified version of Eq. (4)
(IQ is assumed = 0A) into Eq. (5) yields:
VOUT = VIN • K – IOUT • R • K2 (6)
R
SAC
K = 1/32
Vin
Vout
+
Vin Vout
R
SAC™
K = 1/28
Figure 19 K = 1/28 Sine Amplitude Converter
with series input resistor
Figure 18 — VI Chip® module DC model
+
+
VOUT
VIN
V•I
K
+
+
IOUT
IQ
ROUT
IIN
K • IOUT K • VIN
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This is similar in form to Eq. (3), where ROUT is used to represent
the characteristic impedance of the SAC™. However, in this case a
real R on the input side of the SAC is effectively scaled by K2 with
respect to the output.
Assuming that R = 1Ω, the effective R as seen from the secondary
side is 1.28mΩ, with K = 1/28.
A similar exercise should be performed with the additon of a
capacitor or shunt impedance at the input to the SAC. A switch in
series with VIN is added to the circuit. This is depicted in Figure 20.
A change in VIN with the switch closed would result in a change in
capacitor current according to the following equation:
IC(t) = C dVIN (7)
dt
Assume that with the capacitor charged to VIN, the switch is
opened and the capacitor is discharged through the idealized SAC.
In this case,
IC = IOUT • K (8)
substituting Eq. (1) and (8) into Eq. (7) reveals:
IOUT = C
dVOUT (9)
K2 dt
The equation in terms of the output has yielded a K2 scaling factor
for C, specified in the denominator of the equation.
A K factor less than unity results in an effectively larger
capacitance on the output when expressed in terms of the input.
With a K = 1/28 as shown in Figure 20, C = 1µF would appear as
C = 784µF when viewed from the output.
Low impedance is a key requirement for powering a high-
current, low-voltage load efficiently. A switching regulation stage
should have minimal impedance while simultaneously providing
appropriate filtering for any switched current. The use of a SAC
between the regulation stage and the point of load provides a
dual benefit of scaling down series impedance leading back to
the source and scaling up shunt capacitance or energy storage
as a function of its K factor squared. However, the benefits are
not useful if the series impedance of the SAC is too high. The
impedance of the SAC must be low, i.e. well beyond the crossover
frequency of the system.
A solution for keeping the impedance of the SAC low involves
switching at a high frequency. This enables small magnetic
components because magnetizing currents remain low. Small
magnetics mean small path lengths for turns. Use of low loss core
material at high frequencies also reduces core losses.
The two main terms of power loss in the BCM module are:
n No load power dissipation (PNL): defined as the power
used to power up the module with an enabled powertrain
at no load.
n Resistive loss (PROUT): refers to the power loss across
the BCM module modeled as pure resistive impedance.
PDISSIPATED = PNL + PROUT (10)
Therefore,
POUT = PIN – PDISSIPATED = PIN – PNL – PROUT (11)
The above relations can be combined to calculate the overall
module efficiency:
h = POUT = PIN – PNL – PROUT (12)
PIN PIN
= VIN • IIN – PNL – (IOUT)2 • ROUT
VIN • IIN
= 1 (PNL + (IOUT)2 • ROUT)
VIN • IIN
C
S
SAC
K = 1/32
Vin
Vout
+
Figure 20 — Sine Amplitude Converter™ with input capacitor
C
SAC™
K = 1/28
S
Vin
Vout
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Input and Output Filter Design
A major advantage of SAC™ systems versus conventional PWM
converters is that the transformers do not require large
functional filters. The resonant LC tank, operated at extreme high
frequency, is amplitude modulated as a function of input voltage
and output current and efficiently transfers charge through the
isolation transformer. A small amount of capacitance embedded
in the input and output stages of the module is sufficient for full
functionality and is key to achieve power density.
This paradigm shift requires system design to carefully evaluate
external filters in order to:
1. Guarantee low source impedance:
To take full advantage of the BCM module’s dynamic
response, the impedance presented to its input terminals
must be low from DC to approximately 5MHz. The
connection of the bus converter module to its power
source should be implemented with minimal distribution
inductance. If the interconnect inductance exceeds
100nH, the input should be bypassed with a RC damper
to retain low source impedance and stable operation.
With an interconnect inductance of 200nH, the RC damper
may be as high as 1µF in series with 0.3Ω. A single
electrolytic or equivalent low-Q capacitor may be used in
place of the series RC bypass.
2. Further reduce input and/or output voltage ripple
without sacrificing dynamic response:
Given the wide bandwidth of the module, the source
response is generally the limiting factor in the overall
system response. Anomalies in the response of the source
will appear at the output of the module multiplied by its
K factor. This is illustrated in Figures 15 and 16.
3. Protect the module from overvoltage transients imposed
by the system that would exceed maximum ratings and
cause failures:
The module input/output voltage ranges shall not be
exceeded. An internal overvoltage lockout function
prevents operation outside of the normal operating input
range. Even during this condition, the powertrain is
exposed to the applied voltage and power MOSFETs must
withstand it. A criterion for protection is the maximum
amount of energy that the input or output switches can
tolerate if avalanched.
Total load capacitance at the output of the BCM module shall not
exceed the specified maximum. Owing to the wide bandwidth
and low output impedance of the module, low-frequency bypass
capacitance and significant energy storage may be more densely
and efficiently provided by adding capacitance at the input of
the module. At frequencies <500kHz the module appears as an
impedance of ROUT between the source and load.
Within this frequency range, capacitance at the input appears as
effective capacitance on the output per the relationship
defined in Eq. 13.
COUT = CIN (13)
K2
This enables a reduction in the size and number of capacitors used
in a typical system.
Thermal Considerations
VI Chip® products are multi-chip modules whose temperature
distribution varies greatly for each part number as well as with the
input / output conditions, thermal management and environmental
conditions. Maintaining the top of the BCM352x125y300A00 case
to less than 100ºC will keep all junctions within the VI Chip module
below 125ºC for most applications.
The percent of total heat dissipated through the top surface
versus through the J-lead is entirely dependent on the particular
mechanical and thermal environment. The heat dissipated through
the top surface is typically 60%. The heat dissipated through the
J-lead onto the PCB surface is typically 40%. Use 100% top surface
dissipation when designing for a conservative cooling solution.
It is not recommended to use a VI Chip module for an extended
period of time at full load without proper heat sinking.
VICOR
BCM® Bus Converter Rev 2.0 vicorpower.com
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BCM352x125y300A00
BCM®1
R0_1
ZIN_EQ1 ZOUT_EQ1
ZOUT_EQ2
VOUT
ZOUT_EQn
ZIN_EQ2
ZIN_EQn
R0_2
R0_n
BCM®2
BCM®n
Load
DC
VIN
+
Figure 21 BCM module array
Current Sharing
The performance of the SAC topology is based on efficient
transfer of energy through a transformer without the need of
closed loop control. For this reason, the transfer characteristic
can be approximated by an ideal transformer with a positive
temperature coefficient series resistance.
This type of characteristic is close to the impedance characteristic
of a DC power distribution system both in dynamic (AC) behavior
and for steady state (DC) operation.
When multiple BCM modules of a given part number are
connected in an array they will inherently share the load current
according to the equivalent impedance divider that the system
implements from the power source to the point of load.
Some general recommendations to achieve matched array
impedances include:
n Dedicate common copper planes within the PCB
to deliver and return the current to the modules.
n Provide as symmetric a PCB layout as possible among modules
n Apply same input / output filters (if present) to each unit.
For further details see AN:016 Using BCM Bus Converters
in High Power Arrays.
Fuse Selection
In order to provide flexibility in configuring power systems
VI Chip® modules are not internally fused. Input line fusing
of VI Chip products is recommended at system level to provide
thermal protection in case of catastrophic failure.
The fuse shall be selected by closely matching system
requirements with the following characteristics:
n Current rating (usually greater than maximum current
of BCM module)
n Maximum voltage rating (usually greater than the maximum
possible input voltage)
n Ambient temperature
n Nominal melting I2t
n Recommend fuse: 2.5A Bussmann PC–Tron Fuse or 3.15A
SOC type 36CFA Fuse.
Reverse Operation
BCM modules are capable of reverse power operation. Once the
unit is started, energy will be transferred from secondary back to
the primary whenever the secondary voltage exceeds VIN • K. The
module will continue operation in this fashion for as long as no
faults occur.
The BCM352x125y300A00 has not been qualified for continuous
operation in a reverse power condition. Furthermore fault
protections which help protect the module in forward operation
will not fully protect the module in reverse operation.
Transient operation in reverse is expected in cases where there is
significant energy storage on the output and transient voltages
appear on the input. Transient reverse power operation of less than
10ms, 10% duty cycle is permitted and has been qualified to cover
these cases.
TOP VIEW (COMPONENT SIDE swarm) Bomu mm 7 g“) “3.25 , g; :E ”“1 mas-Wm 11qu an an “m“ a W \ . \ r m m a W mu: m a fi [:55] m7 (sea) ‘9" a PL ~ , u m \ Jim/7 m o 1. m ‘Mza ,7 a, y, ‘2‘ H mm m z. um an} *x ‘2‘ y, 54 ‘ (2) A m D731 (M, L mam ‘ML ML in“), mm ‘ 3m ‘2 H "9" \ 7 m mm c — mu ‘ 20 ‘2 w H: mm ’ L 3. \ ~ ‘2" m p, 4 325 < m="" mm="" mm="" o="" .="" m="" ‘2'="" y,="" m="" x="" ‘2‘="" h="" u.‘="" ”-="" hm}="" r="" v="" m="" m="" ‘="" '="" 2"“="" “0="" u,="L" 4/="" [919:="" ‘2’“="" m="" “="" m="" lam="">< u,="" ,l="" z="" ,="" m="" m="" .="" um="" .#="" a36!="" ‘25;="" l="" 3‘7="" mm="" ‘2‘="" h="" \="" an="" w="" m.="" (2m="" 1529}="" m="" (m="" a="" [5:31="" \="" i="" i="" .="" 0mm="" 1;="" m="" w"="" (caurvmnfl="" sum="" snow")="" 1="" a="" 1="" 2="" 2="" r="" mm="" m»="" e="" a="" ‘12="" 7="" -="" m="" :12="" m="" was="" ”“'="" wu="" [cm="" ,="" n="" u="" [and="" ,="" sew;="" me="" 1"="" 1—“="" +="" +="" +="" t7="" 1="" n="" m="" mm:="" mm“="" a="" pm="" a="" :—="" m.="" 111="" v="" m.="" m,="" mam="" m="" w.="" w="" r="" m.="" “h="" m="" p,="" m="" m="" recommended="" land="" pattern="" (cuupmmvr="" 51m:="" smmv)="" as="" .="" luau="" '="" p="" ‘f="" 41="" m="" m="" w="" .m="" 7="" 4m="" ‘2‘="" 7="" hm="" (7)="" m="" 7="" my="" .n="" (539;;="" um="" ,="" {="" e="" (m="" 6’96="" ‘="" .="" mu="" n="" f“="" (7)="" m="" w,="" +="" i="" \ann="" ‘="" k="" ‘="" l="" u,="" m="" w="" ‘2="" p="" t7="" ~n="" 2="" m="" m="" w="" m.="" m="" m="" i="" m="" ,="" 7n="" mu="" m="" a="" 5;;="" ‘2‘="" y,="" m="" ‘="" n="" i="" n="" e="" reeuuuzmn‘u="" mm="" paws)?”="" {cuupmm="" sun="" snmm}="" vicor’="">
BCM® Bus Converter Rev 2.0 vicorpower.com
Page 18 of 21 08/2016 800 927.9474
BCM352x125y300A00
inch
mm
NOTES:
1. DIMENSIONS ARE .
2. UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X / [.XX] = +/-0.25 / [.01]; .XX / [.XXX] = +/-0.13 / [.005]
3. PRODUCT MARKING ON TOP SURFACE
DXF and PDF files are available on vicorpower.com
inch
mm
NOTES:
1. DIMENSIONS ARE .
2. UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X / [.XX] = +/-0.25 / [.01]; .XX / [.XXX] = +/-0.13 / [.005]
3. PRODUCT MARKING ON TOP SURFACE
DXF and PDF files are available on vicorpower.com
inch
mm
NOTES:
1. DIMENSIONS ARE .
2. UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X / [.XX] = +/-0.25 / [.01]; .XX / [.XXX] = +/-0.13 / [.005]
3. PRODUCT MARKING ON TOP SURFACE
DXF and PDF files are available on vicorpower.com
inch
mm
NOTES:
1. DIMENSIONS ARE .
2. UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X / [.XX] = +/-0.25 / [.01]; .XX / [.XXX] = +/-0.13 / [.005]
3. PRODUCT MARKING ON TOP SURFACE
DXF and PDF files are available on vicorpower.com
J-Lead Package Recommended Land Pattern
mm
(inch)
J-Lead Package Mechanical Drawing
e72-015 ‘ S a S a [295.an ‘K “ w n m m ,5”; W “5 m a m [m m n X\ f [Sm gas m H m A ,fm, 0 [ea 4920 ‘\ «‘27 w [M m a \ 7 “m m A flu) W, m y a #555, m a my ‘ L a, =L \ 799 307 2 P mm X xlsvav ‘1' ”L Hm” m mm fin” m, 225 a + 0 mm x i + ' i w (21H m” 'c ,7 i i 7, ‘ mm mm 2° WLJ 7 “‘1 mm A m m H mm , 5,1 mm V m m “a J H:il2nsl W W <0 am="" ml="" mu="" gamma="" ,w="" w="" nee)="" [:23]="" m="" rj="" ,x="" am="" mm="" w="" a="" \="" ”5"="" «we="" m="" a="" m="" a="" use)="" 1="" l="" 7="" h="" fl="" 2*="" ”f="" \‘zn="" ‘3'="" w="" m="" h="" law="" [507!="" ‘1‘”="" asa)="" ‘="" u="" ‘="" “7‘="" m="" a="" m“="" a="" e="" e="" e="" a="" 1="" 9="" :="" ‘="" 3",="" mm="" swam:="" j="" ise="" s="" l‘="" zs="" (mm="" .m;="" m="" mm="" mm="" 2="" h="" 2="" g="" w="" vsns}="" 2’="" ”l="" k="" as;="" a="" j="" ”0="" (2)="" pl="" a="" 2m="" ’0="" ,7="" [duo]="" u="" l="" lam="" (21a="" 521="" ‘="" f="" mu="" ‘1="" n="" n="" f="" ‘="" b="" m="" pl="" (:57;="" m="" m="" l="" (mm)="" «="" m="" vicor="">
BCM® Bus Converter Rev 2.0 vicorpower.com
Page 19 of 21 08/2016 800 927.9474
BCM352x125y300A00
TOP VIEW ( COMPONENT SIDE )
BOTTOM VIEW
NOTES:
1. DIMENSIONS ARE
2. UNLESS OTHERWISE SPECIFIED TOLERANCES ARE:
X.X [X.XX] = ±0.25 [0.01]; X.XX [X.XXX] = ±0.13 [0.005]
3. RoHS COMPLIANT PER CST-0001 LATEST REVISION
DXF and PDF files are available on vicorpower.com
inch
(mm).
NOTES:
1. DIMENSIONS ARE
2. UNLESS OTHERWISE SPECIFIED TOLERANCES ARE:
X.X [X.XX] = ±0.25 [0.01]; X.XX [X.XXX] = ±0.13 [0.005]
3. RoHS COMPLIANT PER CST-0001 LATEST REVISION
DXF and PDF files are available on vicorpower.com
inch
(mm).
RECOMMENDED HOLE PATTERN
( COMPONENT SIDE SHOWN )
TOP VIEW ( COMPONENT SIDE )
BOTTOM VIEW
NOTES:
1. DIMENSIONS ARE
2. UNLESS OTHERWISE SPECIFIED TOLERANCES ARE:
X.X [X.XX] = ±0.25 [0.01]; X.XX [X.XXX] = ±0.13 [0.005]
3. RoHS COMPLIANT PER CST-0001 LATEST REVISION
DXF and PDF files are available on vicorpower.com
inch
(mm).
NOTES:
1. DIMENSIONS ARE
2. UNLESS OTHERWISE SPECIFIED TOLERANCES ARE:
X.X [X.XX] = ±0.25 [0.01]; X.XX [X.XXX] = ±0.13 [0.005]
3. RoHS COMPLIANT PER CST-0001 LATEST REVISION
DXF and PDF files are available on vicorpower.com
inch
(mm).
RECOMMENDED HOLE PATTERN
( COMPONENT SIDE SHOWN )
Through Hole Package Recommended Land Pattern
mm
(inch)
Through Hole Package Mechanical Drawing
.My lam ad Em f .. , Ea VICOR’
BCM® Bus Converter Rev 2.0 vicorpower.com
Page 20 of 21 08/2016 800 927.9474
BCM352x125y300A00
Notes:
1. Maintain 3.50 (0.138) Dia. keep-out zone
free of copper, all PCB layers.
2. (A) Minimum recommended pitch is 39.50 (1.555).
This provides 7.00 (0.275) component
edge-to-edge spacing, and 0.50 (0.020)
clearance between Vicor heat sinks.
(B) Minimum recommended pitch is 41.00 (1.614).
This provides 8.50 (0.334) component
edge-to-edge spacing, and 2.00 (0.079)
clearance between Vicor heat sinks.
3. VI Chip® module land pattern shown for reference
only; actual land pattern may differ.
Dimensions from edges of land pattern
to push–pin holes will be the same for
all full-size VI Chip® products.
4. RoHS compliant per CST–0001 latest revision.
(NO GROUNDING CLIPS) (WITH GROUNDING CLIPS)
5. Unless otherwise specified:
Dimensions are mm (inches)
tolerances are:
x.x (x.xx) = ±0.3 (0.01)
x.xx (x.xxx) = ±0.13 (0.005)
6. Plated through holes for grounding clips (33855)
shown for reference, heat sink orientation and
device pitch will dictate final grounding solution.
Recommended Heat Sink Push Pin Location
VICOR
BCM® Bus Converter Rev 2.0 vicorpower.com
Page 21 of 21 08/2016 800 927.9474
BCM352x125y300A00
Vicor’s comprehensive line of power solutions includes high density AC-DC and DC-DC modules and ac-
cessory components, fully configurable AC-DC and DC-DC power supplies, and complete custom power
systems.
Information furnished by Vicor is believed to be accurate and reliable. However, no responsibility is assumed by Vicor for its use. Vicor makes no
representations or warranties with respect to the accuracy or completeness of the contents of this publication. Vicor reserves the right to make
changes to any products, specifications, and product descriptions at any time without notice. Information published by Vicor has been checked and
is believed to be accurate at the time it was printed; however, Vicor assumes no responsibility for inaccuracies. Testing and other quality controls
are used to the extent Vicor deems necessary to support Vicor’s product warranty. Except where mandated by government requirements, testing of
all parameters of each product is not necessarily performed.
Specifications are subject to change without notice.
Vicor’s Standard Terms and Conditions
All sales are subject to Vicor’s Standard Terms and Conditions of Sale, which are available on Vicor’s webpage or upon request.
Product Warranty
In Vicor’s standard terms and conditions of sale, Vicor warrants that its products are free from non-conformity to its Standard Specifications (the
“Express Limited Warranty”). This warranty is extended only to the original Buyer for the period expiring two (2) years after the date of shipment
and is not transferable.
UNLESS OTHERWISE EXPRESSLY STATED IN A WRITTEN SALES AGREEMENT SIGNED BY A DULY AUTHORIZED VICOR SIGNATORY, VICOR DIS-
CLAIMS ALL REPRESENTATIONS, LIABILITIES, AND WARRANTIES OF ANY KIND (WHETHER ARISING BY IMPLICATION OR BY OPERATION OF LAW)
WITH RESPECT TO THE PRODUCTS, INCLUDING, WITHOUT LIMITATION, ANY WARRANTIES OR REPRESENTATIONS AS TO MERCHANTABILITY,
FITNESS FOR PARTICULAR PURPOSE, INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT, OR ANY OTHER
MATTER.
This warranty does not extend to products subjected to misuse, accident, or improper application, maintenance, or storage. Vicor shall not be liable
for collateral or consequential damage. Vicor disclaims any and all liability arising out of the application or use of any product or circuit and assumes
no liability for applications assistance or buyer product design. Buyers are responsible for their products and applications using Vicor products and
components. Prior to using or distributing any products that include Vicor components, buyers should provide adequate design, testing and operat-
ing safeguards.
Vicor will repair or replace defective products in accordance with its own best judgment. For service under this warranty, the buyer must contact
Vicor to obtain a Return Material Authorization (RMA) number and shipping instructions. Products returned without prior authorization will be
returned to the buyer. The buyer will pay all charges incurred in returning the product to the factory. Vicor will pay all reshipment charges if the
product was defective within the terms of this warranty.
Life Support Policy
VICOR’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS
PRIOR WRITTEN APPROVAL OF THE CHIEF EXECUTIVE OFFICER AND GENERAL COUNSEL OF VICOR CORPORATION. As used herein, life support
devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and whose failure to perform
when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in a significant injury to the
user. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or system or to affect its safety or effectiveness. Per Vicor Terms and Conditions of Sale, the user of Vicor products
and components in life support applications assumes all risks of such use and indemnifies Vicor against all liability and damages.
Intellectual Property Notice
Vicor and its subsidiaries own Intellectual Property (including issued U.S. and Foreign Patents and pending patent applications) relating to the
products described in this data sheet. No license, whether express, implied, or arising by estoppel or otherwise, to any intellectual property rights is
granted by this document. Interested parties should contact Vicor’s Intellectual Property Department.
The products described on this data sheet are protected by the following U.S. Patents Numbers:
5,945,130; 6,403,009; 6,710,257; 6,911,848; 6,930,893; 6,934,166; 6,940,013; 6,969,909; 7,038,917; 7,166,898; 7,187,263; 7,361,844;
D496,906; D505,114; D506,438; D509,472; and for use under 6,975,098 and 6,984,965.
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