PMLE480W-R Datasheet by KYOCERA AVX

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Messrs. Shock Sensor Sgecification 16.Dec. 2010 Aggroved by Kazuki Shimizu Checked by Yasuhiro Nakai Issued by Akira Oikawa
CIRCUIT COMPONENT DIVISION
PIZ SECTION
EQM08-4KC-F5AS101-00
Messrs.
Shock Sensor Specification
Part No. : PMLE480W-R
RoHS Compliant
Halogen-Free Compliant
16.Dec. 2010
Approved by Kazuki Shimizu
Checked by Yasuhiro Nakai
Issued by Akira Oikawa
KYOCERA CORPORATION
Preliminary
CIRCUIT COMPONENT DIVISION
PIZ SECTION
EQM08-4KC-F5AS101 -00
Modification Table
No.
Date Change Apploved Checked Issued
00 16.Dec
2010
The first edition Kazuki
Shimizu
Yasuhiro
Nakai
Akira
Oikawa
{1/5) 4.8:02 ‘ Marking of Polarity ’ Characteristic Spec W Manufacturing Day Cede : E 2.0: y y CadeWXYZabcde CadeABCDEFGHJ K CadeLMNPQRSTUV l 9 . ~ ~ k I Manufacturing Momh Cade : I CIRCUIT COMPONENT D] I ION
(1/5)
CIRCUIT COMPONENT DIVISION
PIZ SECTION
EQM08-4KC-F5AS101-00
1.Scope
This specification shall cover the characteristics of the shock sensor.
2.Kyocera’s Type Name
PMLE480W-R
3.Customers Type Name
4.Electrical Characteristics
Items Specifications
4-1 Primary Axis Inclined Angle 0 ± 3degree
4-2 Capacitance 890pF ± 30%, at 1Vrms, 1kHz
4-3 Charge Sensitivity 0.608 pC/G ± 15%
under vibration at 200Hz, 2G
4-4 Insulation Resistance 0.5Gohm minimum, at 10VDC after 1min.
4-5 Resonant Frequency 19.5 ± 3.5kHz
4-6 Non-linearity 5% maximum, under vibration at 25G
4-7 Charge Sensitivity
Temperature Drift
Ta : 70 7.7±3.0%
Ta : 0 -4.2±2.0%
under vibration at 200Hz, 2G
<Measurement Condition>
The reference temperature shall be 25 ºC ±5ºC.
5.Dimensions and Marking
Fig.1
4.8
±
0.2
1.05±0.1
1.7
0 W
2.0±0.2
(0.8)
Unit:mm 0.6 3.7
Marking of Polarity
Characteristic Spec
0: Initial of Primary Axis Inclined Angle.
W: Specification
Manufacturing Month Cade :
2010
Jan.
Z except "O"
2011
Jan.
Dec. : a
m except "i"
2012
Jan.
Dec. : n
z except "o"
2013
Jan.
Dec. : A
M except "I"
Note:These alphabets should be repeated
after Jan.2014.
Manufacturing Day Cade :
Day
1 2
3
4
5
6
7
8
9
10
Cade
A
B C D
E
F G H
J
K
Day
11
12
13 14
15
16
17
18
19
20
Cade L M N P Q R S T
U
V
Day
21
22
23 24
25
26
27
28
29
30 31
Cade
W
X
Y
Z
a
b
c
d
e
f
g
Preliminary
(2 51
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CIRCUIT COMPONENT DIVISION
PIZ SECTION
EQM08-4KC-F5AS101-00
6.Emvironmental Characteristics
Items Conditions
6-1.High Temperature
Storage Test
Keep in a chamber at 85 ±2°C for 1000 +12/-0 hours, and then keep at room
temperature for 1 hour. The characteristics of shock sensor shall meet the
specifications.
6-2.Low Temperature
Storage Test
Keep in a chamber at –40 ±2°C for 1000 +12/-0 hours, and then keep at
room temperature for 1 hour. The characteristics of shock sensor shall meet
the specifications.
6-3.Moisture
Resistance Test
Keep in a chamber at 90 to 95 % R.H. and 60 ± 2°C for 500 +12/-0 hours,
and then keep at room temperature for 1 hour. The characteristics of shock
sensor shall meet the specifications.
6-4.Temperature
Cycling Test
Apply 100 thermal cycles with the following temperatures:
- upper temperature 85°C for 20 minutes and transfer time 10 minutes
- lower temperature -40°C for 20 minutes and transfer time 10 minutes
- total cycle time is 1hour
and then left at room temperature for 1 hour. The characteristics of shock
sensor shall meet the specifications.
6-5.Mechanical Shock
Test
After applying the acceleration at 29430m/sec2 {3000G} in each of X, Y and
Z axis (each 3 times). The characteristics of shock sensor shall meet the
specifications.
6-6.Solderability Test At first, being soaked in the Methanol solution containing Rosin for 5
seconds and then being dipped in a bath of Pb/Sn solder at 250 ± 5°C for 4
± 0.5 seconds. The surface of the electrode terminal shall be soldered more
than 95%.
6-7.Resistance to
Soldering Heat Test
Pre-heat temperature is 150 to 180°C for 1 minute. High temperature is 250
± 5°C, over 200°C for 20 seconds max.(2times). Then keep at room
temperature for 1 hour. The characteristics of shock sensor shall meet the
specifications.
6-8.Board Flex Test After soldered on the circuit board specified as below, then the load which
cause 3 mm bend to the board is applied. The characteristics of shock
sensor shall meet the specifications. The shock sensor cause no defect in
the appearance. (Circuit Board: FR4, 100 x 40 x 1.6 )
<Measurement Condition>
The reference temperature shall be 25°C±5°C.
F
20
50
R230
45 45
1.0
3.0mm
Preliminary
( l5} L_.|| 4—— Peak:245+/- Over 200°C within 80 sec 90 to 120560 ng Direc —>
(3/5)
CIRCUIT COMPONENT DIVISION
PIZ SECTION
EQM08-4KC-F5AS101-00
7. Recommended Land pattern
Unit: (mm)
Fig.2 Recommended Land pattern
8. Recommended Convection Reflow profile
Fig.3 Recommended Convection Reflow profile
9. Taping Specifications
9-1.CarrierTape
9-1-1.Dimensions
Sym
bol
Dimensions Sym
bol
Dimensions
A0 2.25 ± 0.1 P0 4.0 ± 0.1
B0 4.4 ± 0.1 P1 4.0 ± 0.1
W 12.0 +0.3/-0.1
D0 1.5 +0.1/-0
E 1.75 ± 0.1 K 1.25± 0.1
F 5.5± 0.05 T 0.3 ± 0.05
250
100
50
150
200
0
300
Preheat
Reflow
150 to 180ºC
Temperature (
ºC
)
Time(Sec)
Peak:245+/-5ºC
250
100
50
150
200
0
300
250
100
50
150
200
0
300
90 to 120sec Over 200ºC
within 80 sec
Temperature (
ºC
)
(Over 230ºC,30 to 40sec)
250
100
50
150
200
0
300
250
100
50
150
200
0
300
Preheat
Reflow
150 to 180ºC
Temperature (
ºC
)
Time(Sec)
Peak:245+/-5ºC
250
100
50
150
200
0
300
250
100
50
150
200
0
300
90 to 120sec Over 200ºC
within 80 sec
Temperature (
ºC
)
(Over 230ºC,30 to 40sec)
Unit: (mm)
Fig.4 Emboss Carrier Tape Dimensions
(Over 230,less than 40sec)
Marking of Polarity
Pulling DirectionPulling Direction
K
KK
K
T
TT
T
2
22
2
A
AA
A
0
00
0
B
BB
B
0
00
0
P
PP
P
1
11
1
P
PP
P
0
00
0
P
PP
P
2
22
2
D
DD
D
0
00
0
D
DD
D
1
11
1
E
EE
E
F
FF
F
W
WW
W
T
TT
T
B
0
6.32
2.57
2.2
1.94
4.14
Preliminary
(4/51 DEEEEIEEE H EDDDEDDDD so is J 165°Io180° = ng Direc , \ r \ \ r ‘ 7‘, r, ' \ ‘ ,", I
(4/5)
CIRCUIT COMPONENT DIVISION
PIZ SECTION
EQM08-4KC-F5AS101-00
9-2. Taping
9-2-1. Taping Quantity
One reel of the carrier tape shall pack 3500 pcs. Shock sensor shall be contained in pocket
continuously.
9-2-2. Dimensions
Fig.5 Reel
Unit: (mm)
Symbol
A N W
1
W
2
Dimensions 180±5.0 60min. 12.5 +2.0/-0.0
20.5 max.
Symbol
C D E
Dimensions 13.0±0.2 21.0±0.8 2.0±0.5
9-2-3. Leader and Blank Pocket
Package shall consist of leader, blank pocket and loaded pocket as follows. (fig.6)
A) Leader
B) Blank Pocket (160mm Min.)
A+B: 400mm to 560mm
C) Load Pocket
D) Blank Pocket (40 to 190mm )
Fig.6 Packing Method
Peeling load of top tape shall be 0.1N {10gf} to 0.7N {70gf} from Carrier Tape.
Fig.7 Peeling Strength
D
C
E
A
N
W1
W2
Pulling DirectionPulling Direction
Carrier Tape
Top Tape
165º to 180º
Carrier Tape
Top Tape
165º to 180º
ABCD
Pulling Direction
Preliminary
(5 51
(5/5)
CIRCUIT COMPONENT DIVISION
PIZ SECTION
EQM08-4KC-F5AS101-00
9-2-4. Reel label
A reel label shall be contained as below: (Based on EIAJ C-3 format)
A) Customer P/N
B) Lot No.
C) Quantity
D) Shipping date
E) Vender Name
9-2-5. Exterior Package label
Shock sensor shall be packed properly to avoid defect in transportation and the marking of
exterior package shall be contained as below:
A) Name of Customer
B) P/O No.
C) Customer P/N
D) Lot No.
E) Quantity
F) Shipping Date
G) Vender Name
10. The agreement of this specifications
Should any part of the content of this specification become questionable, it shall be settled by mutual
deliberations.
11. Remarks on Usage
A) This part can use only reflow soldering.
B) Not washable
C) Maximum temperature is 280 degree.
12.RoHS Compliant
A) Sensor Case: LCP(liquid crystal polymer)
B) Terminal: Bronze with phosphate (thickness 100 um)
Plating: Cu(1-2um), Ag(1-3 um)
C) Elememt: Piezo Ceramic, contains lead-oxide, however, piezo-electronic devices
are exempted from RoHS compliant requirement of article 4(1).
(Refer to Annex, Section 7)
All materials meet to RoHS Compliant.
13.Halogen-Free Compliant
A) BromineBr 900ppm0.09%)
B) ChlorineCl 900ppm0.09%
C)Total concentration of ChlorineCl)+BromineBr 1500ppm0.15%)
D)Antimony TrioxideSb2O3 1000ppm0.1%)
E)Red Phosphorus 1000ppm0.1%)
All materials meet to
Halogen-Free
Compliant.
Preliminary

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