PHP Series Datasheet by Vishay Dale Thin Film

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PHP
www.vishay.com Vishay Dale Thin Film
Revision: 08-Mar-2021 1Document Number: 60076
For technical questions, contact: thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
High Power Thin Film Wraparound Chip Resistor
LINKS TO ADDITIONAL RESOURCES
PHP series chip resistors are designed with enlarged
backside terminations to reduce the thermal resistance
between the topside resistor layer and the solder joint on the
end users circuit board.
Actual power handling capability is limited by the end user
mounting process. As with any high power chip resistor the
ability to remove the generated heat is critical to the overall
performance of the device.
FEATURES
High purity ceramic substrate
Power rating to 2.5 W
Resistance range 10 Ω to 30.1 kΩ
Resistor tolerance to ± 0.1 %
TCR to ± 25 ppm/°C
Flame resistant UL 94 V-0
APPLICATIONS
Power supplies
Power switching
Braking system
Test and measurement equipment
Motor deflection circuits
TYPICAL PERFORMANCE
Note
(1) Dependent on component mounting by user
3
3
3
D
D
D
3
D
3D Models
Infographics
ABSOLUTE
TCR 25
TOL. 0.1
STANDARD ELECTRICAL SPECIFICATIONS
TEST SPECIFICATIONS CONDITIONS
Material Nichrome -
Resistance Range 10 Ω to 30.1 kΩ-
TCR: Absolute 25 ppm/°C, 50 ppm/°C (standard)
and, 100 ppm/°C -55 °C to +125 °C
Tolerance: Absolute 0.1 %, 0.5 %, 1.0 % and, 5.0 % +25 °C
Power Rating: Resistor 0.375 W to 2.5 W (1) Maximum at +70 °C
Stability: Absolute ΔR 0.1 % 2000 h at +70 °C
Stability: Ratio Not applicable -
Voltage Coefficient < 0.1 ppm/V -
Working Voltage 75 V to 200 V -
Operating Temperature Range -55 °C to +155 °C -
Storage Temperature Range -55 °C to +155 °C -
Noise < -30 dB -
Shelf Life Stability: Absolute ± 0.01 % 1 year at +25 °C
COMPONENT RATINGS
CASE SIZE POWER RATING (mW) WORKING VOLTAGE (V) RESISTANCE RANGE (Ω)
0603 375 (1) 75 10 to 30.1K
0805 625 (1) 100 10 to 30.1K
1206 1000 (1) 200 10 to 30.1K
2512 2500 (1) 200 10 to 30.1K
VISHAY. <> Y <> I A Y I A Y > 4 U V Imnmm®wshay Com www.v\shay.com/doc?91000
PHP
www.vishay.com Vishay Dale Thin Film
Revision: 08-Mar-2021 2Document Number: 60076
For technical questions, contact: thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
ENVIRONMENTAL TESTS (Vishay Performance vs. MIL-PRF-55342 Requirements)
ENVIRONMENTAL TEST LIMITS MIL-PRF-55342
CHARACTERISTIC “E” TYPICAL VISHAY PERFORMANCE
Resistance Temperature Characteristic ± 25 ppm/°C ± 15 ppm/°C
Maximum Ambient Temperature at Rated Wattage +70 °C +70 °C
Maximum Ambient Temperature at Power Derating +150 °C +150 °C
Thermal Shock ± 0.1 % ± 0.04 %
Low Temperature Operation ± 0.1 % ± 0.001 %
Short Time Overload ± 0.1 % ± 0.003 %
High Temperature Exposure ± 0.1 % ± 0.030 %
Resistance to Soldering Heat ± 0.2 % ± 0.007 %
Moisture Resistance ± 0.2 % ± 0.002 %
Life at +70 °C for 2000 h ± 0.5 % ± 0.100 %
DIMENSIONS in inches
CASE SIZE LENGTH WIDTH
W (± 0.005)
THICKNESS
MIN./MAX.
TOP PAD
D (± 0.005)
BOTTOM PAD
E (± 0.005)
0603 0.064 ± 0.006 0.032 0.020 max. 0.012 0.021
0805 0.080 ± 0.006 0.050 0.015/0.033 0.016 0.025
1206 0.126 ± 0.008 0.063 0.015/0.033 0.020 + 0.005/- 0.010 0.040
2512 0.259 + 0.009/- 0.015 0.124 0.015/0.033 0.02 0.050
LAND PATTERN DIMENSIONS in inches
D
W
T
L
E
0.0920
0.0340
0.0390
0.0140
0603 Land Pattern
0.1050
0.0520
0.0425
0.0200
0805 Land Pattern
0.1730
0.0710
0.0755
0.0220
1206 Land Pattern
0.2910
0.1260
0.0910
0.1090
2512 Land Pattern
VISHAY. , , :2 -o-» :2 4k 805 720 ks! mmmm@wshay com www \shay com/do 91000
PHP
www.vishay.com Vishay Dale Thin Film
Revision: 08-Mar-2021 3Document Number: 60076
For technical questions, contact: thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Note
Chip surface temperature measured using FLIR SC645 thermal
imaging system with an approximate test card surface
temperature of 85 °C
Notes
Chip surface temperature measured using FLIR A40 thermal
imaging system with an approximate test card surface
temperature of 25 °C
•Thermal imaging was conducted under ambient conditions
resulting in a steady state test card surface temperature of 85 °C
over the full range of power levels
Thermal imaging and load life testing was conducted mounting
one device to 2" x 3" test cards with 2.5 mil copper plating on
both surfaces. Thermal vias on 120 mil centers were utilized for
heat transfer between surfaces of the test card
Note
Chip surface temperature measured using FLIR SC645 thermal
imaging system with an approximate test card surface
temperature of 85 °C
Notes
Chip surface temperature measured using FLIR A40 thermal
imaging system with an approximate test card surface
temperature of 25 °C
STANDARD MATERIAL SPECIFICATIONS
Resistive Element Nichrome
Substrate Material Alumina (Al2O3)
Terminations (Tin/Lead) Tin/lead solder over nickel barrier
Terminations (Lead (Pb)-free) Tin/silver/copper (Sn96.5Ag3.0Cu0.5) solder over nickel barrier
PHP CHIP TEMP. VS. APPLIED POWER
PHP CHIP TEMP. VS. APPLIED POWER
70 150 200
Chip Surface Temperature (°C)
0.00
0.50
1.00
1.50
2.00
5.00
Applied Power (W)
2.50
3.00
3.50
4.00
4.50 0603 - 100 Ω
0603 - 5 kΩ
0603 - 18.8 kΩ
Chip Surface Temperature (°C)
70 200
0.00
0.50
1.00
1.50
2.00
5.00
Applied Power (W)
2.50
3.00
3.50
4.00
4.50
150
1206 - 100 Ω
1206 - 5 kΩ
1206 - 10 kΩ
PHP CHIP TEMP. VS. APPLIED POWER
PHP CHIP TEMP. VS. APPLIED POWER
Case Size 2512 2512 2512
Resistance
Value Up to 10 ΩUp to 10 kΩUp to 30 kΩ
Temperature Power (W)
70 2.44 1.81 1.87
150 6.82 4.89 5.19
200 9.33 6.63 7.09
70 150 200
Chip Surface Temperature (°C)
0.00
0.50
1.00
1.50
2.00
5.00
Applied Power (W)
2.50
3.00
3.50
4.00
4.50 0805 - 100 Ω
0805 - 5 kΩ
0805 - 20 kΩ
Chip Surface Temperature (°C)
00207
0.00
1.00
2.00
3.00
4.00
10.00
Applied Power (W)
5.00
6.00
7.00
8.00
9.00
150
2512 - 10 Ω
2512 - 10 kΩ
2512 - 30 kΩ
VISHAY. mmmméiwshay com www \shay com/do 91000
PHP
www.vishay.com Vishay Dale Thin Film
Revision: 08-Mar-2021 4Document Number: 60076
For technical questions, contact: thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SINGLE PULSE CURVES
DERATING CURVE
GLOBAL PART NUMBER INFORMATION
GLOBAL
MODEL SUBSTRATE CASE
SIZE TCR RESISTANCE TOLERANCE TERMINATION PACKAGING
PHP 0 = alumina 0603
0805
1206
2512
E =
± 25 ppm/°C
H =
± 50 ppm/°C
K =
± 100 ppm/°C
The first 3 digits
are significant
figures and the
last digit
specifies the
number of
zeros to follow.
“R” designates
the decimal
point.
Example:
10R0 = 10 Ω
1000 = 100 Ω
1001 = 1 kΩ
B = ± 0.1 %
D = ± 0.5 %
F = ± 1.0 %
G = ± 2.0 %
J = ± 5.0 %
B = wraparound
Sn/Pb solder
w/nickel barrier
S = wraparound
lead (Pb)-free solder
SAC-305
RoHS-compliant - e1
BS = BULK
100 min., 1 mult.
WS = WAFFLE
100 min., 1 mult.
WI = WAFFLE
(item single lot
day code)
100 min., 1 mult.
TAPE AND REEL
T1 = 1000 min.,
1000 mult.
T3 = 300 min., 300 mult.
T5 = 500 min., 500 mult.
TF = full reel
TS = 100 min., 1 mult.
TI = 100 min., 1 mult.
(item single lot
date code)
TP = 100 min., 1 mult.
(package unit
single lot date)
Pulse Duration (s)
Pulse Power (W)
100 Ω - 0805
100 Ω - 0603
0.1
1000
1
10
100
0.00001 100.0001 0.001 0.01 0.1 1
100 Ω - 2512
100 Ω - 1206
Ambient Temperature °C
0155
0
20
40
60
80
100
Percent of Rated Power
70 125
06E1 02B01 BT10PP 2H
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Disclaimer
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RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
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the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
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statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a
particular product with the properties described in the product specification is suitable for use in a particular application.
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over
time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s
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including but not limited to the warranty expressed therein.
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