Tflex™ 200 V0 Series Datasheet by Laird Technologies - Thermal Materials

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TflexTM 200 V0 Series
Thermal Gap Filler
SOFT, FREESTANDING GAP FILLER
Tflex™ 200 V0 is a very soft, freestanding gap filler that is more compliant than most other
gap fillers. Combining good thermal conductivity of 1.1 W/mK with high conformability, this
gap filler produces low thermal resistance. The alumina filler allows the product to remain a
cost effective solution where moderate thermal performance is acceptable.
Naturally tacky and not requiring additional adhesive coating, the Tflex™ 200 V0 can inhibit
thermal performance. This gap filler is both electrically insulating and stable from -40°C to
160°C and meets UL 94 VO rating.
FEATURES AND BENEFITS
• Soft and compressible for low stress applications
• Naturally tacky needing no further adhesive coating
• 1.1 W/mK thermal conductivity
• Available in thicknesses from 0.010” (0.25mm) to 0.200” (5.0mm)
APPLICATIONS
• Cooling components to the chassis or frame
• High speed mass storage drives
• RDRAM memory modules
• Heat pipe thermal solutions
• Automotive engine control units
• Wireless communication hardware
Americas: +1.800.843.4556
Europe: +49.8031.2460.0
Asia: +86.755.2714.1166
CLV-customerservice@lairdtech.com
www.lairdtech.com/thermal
gm!)
Innovative Technology
for a Connected World
TflexTM 200 V0 Series
Thermal Gap Filler
THR-DS-Tflex-200V0 0710
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and ap-
plication of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness,
merchantability or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All
Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2010 Laird
Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company
thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.
A14175-00 Rev. G, 08/13/08
Tflex™ 220 V0 Tflex™ 240 V0 Tflex™ 260 V0 Tflex™ 280 V0 Tflex™ 2100 V0 TEST METHOD
Construction &
Composition
Reinforced ceramic filled
silicone elastomer
Ceramic filled
silicone elastomer
Ceramic filled
silicone elastomer
Ceramic filled
silicone elastomer
Ceramic filled
silicone elastomer
Color Light Gray Light Gray Light Gray Light Gray Light Gray Visual
Thickness 0.02" (0.508mm) 0.04" (1.016mm) 0.06" (1.524mm) 0.08" (2.032mm) 0.10"(2.54mm)
Thickness Tolerance ± 0.002"
(± 0.05mm)
± 0.004"
(± 0.10mm)
± 0.006"
(± 0.15mm)
± 0.008"
(± 0.20mm)
± 0.010"
(± 0.25mm)
Density 1.75 g/cm31.73 g/cm31.73 g/cm31.73 g/cm31.73 g/cm3Helium Pycnometer
Hardness 50 Shore 00 45 Shore 00 45 Shore 00 45 Shore 00 45 Shore 00 ASTM D2240
Tensile Strength 464 psi 48 psi 48 psi 48 psi 48 psi ASTM D412
% Elongation 10.5 63.0 60.6 60.6 60.6 ASTM D412
Outgassing TML
(Post Cured) 0.34% 0.34% 0.34% 0.34% 0.34% ASTM E595
Outgassing CVCM
(Post Cured) 0.10% 0.10% 0.10% 0.10% 0.10% ASTM E595
UL Flammability Rating 94 VO 94 VO 94 VO 94 VO 94 VO E180840
Temperature Range -45°C to 160°C -45°C to 160°C -45°C to 160°C -45°C to 160°C -45°C to 160°C
Thermal Conductivity 1.1 W/mK 1.1 W/mK 1.1 W/mK 1.1 W/mK 1.1 W/mK ASTM D5470
(modified)
Total Thermal
Resistance
@ 10 psi
@ 69KPa
0.80 °C-in2/W
5.13 °C-cm2/W
1.57 °C-in2/W
10.13 °C-cm2/W
2.05 °C-in2/W
13.23 °C-cm2/W
2.51 °C-in2/W
16.19 °C-cm2/W
2.93 °C-in2/W
18.90 °C-cm2/W
ASTM D5470
(modified)
Coefficient of
Thermal Expansion
229 ppm/°C
35°C to 130°C
229 ppm/°C
35°C to 130°C
229 ppm/°C
35°C to 130°C
229 ppm/°C
35°C to 130°C
229 ppm/°C
35°C to 130°C
IPC-TM-650
2.4.24
Breakdown Voltage 12,000 Volts AC >27,000 Volts >27,000 Volts >27,000 Volts >27,000 Volts ASTM D149
Volume Resistivity 4 x 1013 ohm-cm 4 x 1013 ohm-cm 4 x 1013 ohm-cm 4 x 1013 ohm-cm 4 x 1013 ohm-cm ASTM D257
Dielectric Constant
@ 1MHz 5.5 5.5 5.5 5.5 5.5
STANDARD THICKNESSES
0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm)
0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm)
0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm) 0.170" (4.32mm)
0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory for alternate thicknesses
STANDARD SHEET SIZES
9" x 9" (229mm x 229mm) Tflex™ 200V0 may be die cut into individual
shapes. Pressure sensitive adhesive is not applicable for Tflex™ products.
REINFORCEMENT
0.020" (0.51mm) and 0.030" (0.762mm) are fiberglass reinforced.
Data for design engineer guidance only. Observed performance varies in
application. Engineers are reminded to test the material in application.

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