B82559xA013 Datasheet by EPCOS - TDK Electronics

View All Related Products | Download PDF Datasheet
a~í~=pÜÉÉía~í~=pÜÉÉí
SMT power inductors
ERU 13, helically wound
Series/Type: B82559*A013
Date: November 2012
© EPCOS AG 2015. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
EPCOS AG is a TDK Group Company.
@TDK
211/12
Please read Cautions and warnings and
Important notes at the end of this document.
Rated inductance 0.5 ... 3.9 µH
Saturation current 12 ... 30 A
Construction
Ferrite core
Magnetically shielded
Winding: enamel copper flat wire
Self-leaded construction under body termination
Features
Very high rated current
Extremely low DC resistance
Very low profile and smallest possible footprint
Suitable for pick and place processes
Applications
Energy storage chokes for
DC/DC converters
VRM modules
POL converters
Terminals
Lead-free tinned
Marking
Manufacturer, middle block of ordering code,
inductance, date code (YYWW)
Delivery mode and packing units
24-mm blister tape, wound on 330-mm dia. reel
4.95 mm height = 750 pcs./reel
5.95/6.00 mm height = 500 pcs./reel
B82559*A013SMT power inductors
ERU 13
Helically wound
’ibTDK ”:33 4 410 oz N :0 Q o o > c: m 4,, s 9 a 1 m o ' 13:0 02 main m 5520 A mum \ Compone ‘ wums..A Wmflss-P-E
311/12
Please read Cautions and warnings and
Important notes at the end of this document.
Dimensional drawing and layout recommendation
Dimensions in mm
Taping and packing
Blister tape Reel
Dimensions in mm
IND0351-A
62±1.5
22.4 max. 13±0.2
330
2
+0
_
16.4
0
+1.5
_
6.95 max. for component height = 5.95 mm
1)
B-B
B
B
Component
+0.1
0
1.5
_
4±0.1
2±0.1
16±0.1
1.5 min.
12.8
Direction of unreeling
IND0398-P-E
11.5±0.1
24±0.3
1.7±0.1
1)
5.95 max.
11.2
B82559*A013SMT power inductors
ERU 13
Helically wound
{ibTDK
411/12
Please read Cautions and warnings and
Important notes at the end of this document.
Technical data and measuring conditions
Characteristics and ordering codes
Sample kit available. Ordering code: B82559X001
For more information refer to chapter “Sample kits”.
Rated inductance LRMeasured with Wayne-Kerr 3260A/3265B at 10 kHz, 0.1 V, +20 °C
Inductance tolerance 10%
Saturation current Isat Current that will result in approx. 20% drop in inductance value.
Temperature response needs to be verified in specific applications.
Test results on request.
DC resistance Rtyp Measured at +20 °C, tolerance 10%
(closer tolerances on request), typical values
Solderability +235 °C, 5 s, wetting >90% (IEC 60068-2-58)
Resistance to soldering heat To JEDEC J-STD 020D
Operating temperature 40 °C … +130 °C
Storage conditions (packaged) –25 °C … +40 °C, 75% RH
Weight 2.2 g (height = 4.95 mm), 2.6 g (height = 5.95/6.00 mm)
LR
H
Isat
A
Rtyp
m
Height h max.
mm
Ordering code
0.50 30 0.78 4.95 B82559A0501A013
0.95 25 1.12 5.95 B82559A0951A013
1.1 20 1.72 4.95 B82559A0112A013
1.4 22 1.50 6.00 B82559A0142A013
2.15 15 3.20 4.95 B82559A0222A013
2.4 16.5 2.76 5.95 B82559A0242A013
3.0 13 4.00 4.95 B82559A0302A013
3.9 12 4.80 5.95 B82559A0392A013
B82559*A013SMT power inductors
ERU 13
Helically wound
@TDK
511/12
Cautions and warnings
Please note the recommendations in our Inductors data book (latest edition) and in the data
sheets.
Particular attention should be paid to the derating curves given there.
The soldering conditions should also be observed. Temperatures quoted in relation to wave
soldering refer to the pin, not the housing.
If the components are to be washed varnished it is necessary to check whether the washing
varnish agent that is used has a negative effect on the wire insulation, any plastics that are used,
or on glued joints. In particular, it is possible for washing varnish agent residues to have a
negative effect in the long-term on wire insulation.
Washing processes may damage the product due to the possible static or cyclic mechanical
loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,
which might lead to reduced reliability or lifetime.
The following points must be observed if the components are potted in customer applications:
Many potting materials shrink as they harden. They therefore exert a pressure on the plastic
housing or core. This pressure can have a deleterious effect on electrical properties, and in
extreme cases can damage the core or plastic housing mechanically.
It is necessary to check whether the potting material used attacks or destroys the wire
insulation, plastics or glue.
The effect of the potting material can change the high-frequency behaviour of the components.
Ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to
breakage of the core.
Even for customer-specific products, conclusive validation of the component in the circuit can
only be carried out by the customer.
Please read Cautions and warnings and
Important notes at the end of this document.
@TDK
611/12
Important notes
The following applies to all products named in this publication:
1.
Some parts of this publication contain
statements about the suitability of our products for certain
areas of application
. These statements are based on our knowledge of typical requirements that are
often placed on our products in the areas of application concerned. We nevertheless expressly point
out
that such statements cannot be regarded as binding statements about the suitability of our
products for a particular customer application.
As a rule we are either unfamiliar with individual
customer applications or less familiar with them than the customers themselves. For these reasons, it is
always ultimately incumbent on the customer to check and decide whether a product with the properties
described in the product specification is suitable for use in a particular customer application.
2.
We also point out that
in individual cases, a malfunction of electronic components or failure
before the end of their usual service life cannot be completely ruled out in the current state of the
art, even if they are operated as specified.
In customer applications requiring a very high level of
operational safety and especially in customer applications in which the malfunction or failure of an
electronic component could endanger human life or health (e.g. in accident prevention or life-saving
systems), it must therefore be ensured by means of suitable design of the customer application or other
action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or
damage is sustained by third parties in the event of malfunction or failure of an electronic component.
3.
The warnings, cautions and product-specific notes must be observed.
4.
In order to satisfy certain technical requirements,
some of the products described in this publication
may contain substances subject to restrictions in certain jurisdictions (e.g. because they are
classed as hazardous)
. Useful information on this will be found in our Material Data Sheets on the
Internet (www.tdk-electronics.tdk.com/material). Should you have any more detailed questions, please
contact our sales offices.
5.
We constantly strive to improve our products. Consequently,
the products described in this
publication may change from time to time
. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications contained
in this publication are still applicable before or when you place an order.
We also
reserve the right to discontinue production and delivery of products
. Consequently, we
cannot guarantee that all products named in this publication will always be available. The
aforementioned does not apply in the case of individual agreements deviating from the foregoing for
customer-specific products.
6.
Unless otherwise agreed in individual contracts,
all orders are subject to our General Terms and
Conditions of Supply.
7.
Our manufacturing sites serving the automotive business apply the IATF 16949 standard.
The
IATF certifications confirm our compliance with requirements regarding the quality management system
in the automotive industry. Referring to customer requirements and customer specific requirements
(“CSR”) TDK always has and will continue to have the policy of respecting individual agreements. Even
if IATF 16949 may appear to support the acceptance of unilateral requirements, we hereby like to
emphasize that
only requirements mutually agreed upon can and will be implemented in our
Quality Management System.
For clarification purposes we like to point out that obligations from IATF
16949 shall only become legally binding if individually agreed upon.
8.
The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS,
DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, MotorCap,
PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI,
SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap are
trademarks registered or pending
in Europe and in other countries. Further information will be found
on the Internet at www.tdk-electronics.tdk.com/trademarks.
Release 2018-10

Products related to this Datasheet

FIXED IND 500NH 30A 0.78MOHM SMD
Available Quantity: 3,692
Unit Price: 5.6
FIXED IND 2.15UH 15A 3.2MOHM SMD
Available Quantity: 515
Unit Price: 5.6
FIXED IND 950NH 25A 1.12MOHM SMD
Available Quantity: 5,014
Unit Price: 5.6
FIXED IND 2.4UH 16.5A 2.76 MOHM
Available Quantity: 2,950
Unit Price: 5.6
FIXED IND 3UH 13A 4 MOHM SMD
Available Quantity: 959
Unit Price: 5.6
FIXED IND 1.4UH 22A 1.5 MOHM SMD
Available Quantity: 7,020
Unit Price: 5.6
KIT INDUCTOR POWER 82559 SERIES
Available Quantity: 0
Unit Price: 90.33
FIXED IND 1.1UH 20A 1.72MOHM SMD
Available Quantity: 0
Unit Price: 5.6
FIXED IND 3.9UH 12A 4.8 MOHM SMD
Available Quantity: 2,440
Unit Price: 5.6