ADF4106 Datasheet by Analog Devices Inc.

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ANALOG DEVICES ADF4106
PLL Frequency Synthesizer
Data Sheet
ADF4106
FEATURES
6.0 GHz bandwidth
2.7 V to 3.3 V power supply
Separate charge pump supply (VP) allows extended
tuning voltage in 3 V systems
Programmable dual-modulus prescaler
8/9, 16/17, 32/33, 64/65
Programmable charge pump currents
Programmable antibacklash pulse width
3-wire serial interface
Analog and digital lock detect
Hardware and software power-down mode
APPLICATIONS
Broadband wireless access
Satellite systems
Instrumentation
Wireless LANS
Base stations for wireless radios
GENERAL DESCRIPTION
The ADF4106 frequency synthesizer can be used to implement
local oscillators in the up-conversion and down-conversion
sections of wireless receivers and transmitters. It consists of a
low noise, digital phase frequency detector (PFD), a precision
charge pump, a programmable reference divider, programmable
A counter and B counter, and a dual-modulus prescaler (P/P + 1).
The A (6-bit) counter and B (13-bit) counter, in conjunction
with the dual-modulus prescaler (P/P + 1), implement an N
divider (N = BP + A). In addition, the 14-bit reference counter
(R Counter) allows selectable REFIN frequencies at the PFD
input. A complete phase-locked loop (PLL) can be implemented
if the synthesizer is used with an external loop filter and voltage
controlled oscillator (VCO). Its very high bandwidth means
that frequency doublers can be eliminated in many high
frequency systems, simplifying system architecture and
reducing cost.
FUNCTIONAL BLOCK DIAGRAM
02720-001
CLK
DATA
LE
REF
IN
RF
IN
A
RF
IN
B
24-BIT INPUT
REGISTER
SD
OUT
AV
DD
DV
DD
CE AGND DGND
14-BIT
R COUNTER
R COUNTER
LATCH
22
14
FUNCTION
LATCH
A, B COUNTER
LATCH
FROM
FUNCTION
LATCH
PRESCALER
P/P + 1
N = BP + A
LOAD
LOAD
13-BIT
B COUNTER
6-BIT
A COUNTER
6
19
13
M3 M2 M1
MUX
SD
OUT
AV
DD
HIGH Z
MUXOUT
CPGND R
SET
V
P
CP
PHASE
FREQUENCY
DETECTOR
LOCK
DETECT
REFERENCE
CHARGE
PUMP
CURRENT
SETTING 1
ADF4106
CPI3 CPI2 CPI1 CPI6 CPI5 CPI4
CURRENT
SETTING 2
Figure 1.
Rev. F Document Feedback
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responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
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Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©20012015 Analog Devices, Inc. All rights reserved.
Technical Support www.analog.com
ADF4106 Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Timing Characterisitics ............................................................... 4
Absolute Maximum Ratings ............................................................ 6
ESD Caution .................................................................................. 6
Pin Configurations and Function Descriptions ........................... 7
Typical Performance Characteristics ............................................. 8
General Description ....................................................................... 10
Reference Input Section ............................................................. 10
RF Input Stage ............................................................................. 10
Prescaler (P/P +1) ....................................................................... 10
A Counter and B Counter ......................................................... 10
R Counter .................................................................................... 10
Phase Frequency Detector (PFD) and Charge Pump ............ 11
MUXOUT and Lock Detect ...................................................... 11
Input Shift Register .................................................................... 11
The Function Latch .................................................................... 17
The Initialization Latch ............................................................. 18
Applications ..................................................................................... 19
Local Oscillator for LMDS Base Station Transmitter ............ 19
Interfacing ................................................................................... 20
PCB Design Guidelines for Chip Scale Package .................... 20
Outline Dimensions ....................................................................... 21
Ordering Guide .......................................................................... 22
REVISION HISTORY
4/15—Rev. E to Rev. F
Change to RFINA to RFINB Parameter, Table 3 .............................. 6
Updated Outline Dimensions ....................................................... 21
Changes to Ordering Guide .......................................................... 22
11/12—Rev. D to Rev. E
Changed EVAL-ADF4106EBZ1 to EV-ADF4106SD1Z ...... Universal
Added RFINA to RFINB Parameter, Table 3 .................................... 6
Updated Outline Dimensions ....................................................... 21
Changes to Ordering Guide .......................................................... 22
9/11—Rev. C to Rev. D
Changes to Normalized Phase Noise Floor (PNSYNTH) Parameter,
Table 1 ................................................................................................ 4
Added Normalized 1/f Noise (PN1_f) Parameter and Endnote 12,
Table 1 ................................................................................................ 4
Changes to Ordering Guide .......................................................... 22
2/10—Rev. B to Rev. C
Changes to Figure 4 and Table 4 ..................................................... 6
Changes to Figure 12 ........................................................................ 8
Updated Outline Dimensions ....................................................... 20
Changes to Ordering Guide .......................................................... 21
6/05—Rev. A to Rev. B
Updated Format .................................................................. Universal
Changes to Figure 1 ........................................................................... 1
Changes to Table 1 ............................................................................. 3
Changes to Table 2 ............................................................................. 4
Changes to Table 3 ............................................................................. 5
Changes to Figure 3 and Figure 4 .................................................... 6
Changes to Figure 6 ........................................................................... 7
Changes to Figure 10 ......................................................................... 7
Deleted TPC 13 and TPC 14 ............................................................ 8
Changes to Figure 15 ......................................................................... 8
Changes to Figure 20 Caption ...................................................... 10
Updated Outline Dimensions ....................................................... 20
Changes to Ordering Guide .......................................................... 21
5/03—Rev. 0 to Rev. A
Edits to Specifications ....................................................................... 2
Edits to TPC 11 .................................................................................. 7
Updated Outline Dimensions ....................................................... 19
10/01—Revision 0: Initial Revision
Rev. F | Page 2 of 24
Data Sheet ADF4106
SPECIFICATIONS
AVDD = DVDD = 3 V ± 10%, AVDD ≤ VP ≤ 5.5 V, AGND = DGND = CPGND = 0 V, RSET = 5.1 kΩ, dBm referred to 50 Ω, TA = TMAX to TMIN,
unless otherwise noted.
Table 1.
Parameter B Version1 B Chips2 (typ) Unit Test Conditions/Comments
RF CHARACTERISTICS
See Figure 18 for input circuit
RF Input Frequency (RFIN) 0.5/6.0 0.5/6.0 GHz min/max For lower frequencies, ensure
slew rate (SR) > 320 V/µs
RF Input Sensitivity –10/0 –10/0 dBm min/max
Maximum Allowable Prescaler
Output Frequency3
300 300 MHz max P = 8
325 325 MHz max P = 16
REFIN CHARACTERISTICS
REF
IN
Input Frequency
20/300
20/300
MHz min/max
For f < 20 MHz, ensure SR > 50 V/µs
REFIN Input Sensitivity4 0.8/VDD 0.8/VDD V p-p min/max Biased at AVDD/2 (see Note 55)
REFIN Input Capacitance 10 10 pF max
REFIN Input Current ±100 ±100 µA max
PHASE DETECTOR
Phase Detector Frequency6 104 104 MHz max ABP = 0, 0 (2.9 ns antibacklash pulse width)
CHARGE PUMP
Programmable, see Table 9
ICP Sink/Source
High Value 5 5 mA typ With RSET = 5.1 k
Low Value 625 625 µA typ
Absolute Accuracy 2.5 2.5 % typ With RSET = 5.1 kΩ
RSET Range 3.0/11 3.0/11 kΩ typ See Table 9
ICP Three-State Leakage 2 2 nA max 1 nA typical; TA = 25°C
Sink and Source Current Matching 2 2 % typ 0.5 V ≤ VCP ≤ VP 0.5 V
ICP vs. VCP 1.5 1.5 % typ 0.5 V ≤ VCP ≤ VP 0.5 V
ICP vs. Temperature 2 2 % typ VCP = VP/2
LOGIC INPUTS
VIH, Input High Voltage 1.4 1.4 V min
VIL, Input Low Voltage 0.6 0.6 V max
IINH, IINL, Input Current ±1 ±1 µA max
CIN, Input Capacitance 10 10 pF max
LOGIC OUTPUTS
VOH, Output High Voltage 1.4 1.4 V min Open-drain output chosen, 1 kΩ pull-up
resistor to 1.8 V
VOH, Output High Voltage VDD − 0.4 VDD − 0.4 V min CMOS output chosen
IOH 100 100 µA max
VOL, Output Low Voltage 0.4 0.4 V max IOL = 500 µA
POWER SUPPLIES
AVDD 2.7/3.3 2.7/3.3 V min/V max
DVDD AVDD AVDD
VP AVDD/5.5 AVDD/5.5 V min/V max AVDD ≤ VP ≤ 5.5V
IDD7 (AIDD + DIDD) 11 9.0 mA max 9.0 mA typ
IDD8 (AIDD + DIDD) 11.5 9.5 mA max 9.5 mA typ
I
DD9
(AI
DD
+ DI
DD
)
13
10.5
mA max
10.5 mA typ
IP 0.4 0.4 mA max TA = 25°C
Power-Down Mode10
(AIDD + DIDD)
10 10 µA typ
Rev. F | Page 3 of 24
ADF4106 Data Sheet
Parameter B Version1 B Chips2 (typ) Unit Test Conditions/Comments
NOISE CHARACTERISTICS
Normalized Phase Noise Floor
(PNSYNTH)11
–223 –223 dBc/Hz typ PLL loop B/W = 500 kHz, measured at 100 kHz
offset
Normalized 1/f Noise (PN1_f)12 122 −122 dBc/Hz typ 10 kHz offset; normalized to 1 GHz
Phase Noise Performance13 @ VCO output
900 MHz14 –92.5 −92.5 dBc/Hz typ @ 1 kHz offset and 200 kHz PFD frequency
5800 MHz15 −76.5 −76.5 dBc/Hz typ @ 1 kHz offset and 200 kHz PFD frequency
5800 MHz16 −83.5 −83.5 dBc/Hz typ @ 1 kHz offset and 1 MHz PFD frequency
Spurious Signals
900 MHz14 –90/–92 –90/–92 dBc typ @ 200 kHz/400 kHz and 200 kHz PFD frequency
5800 MHz15
–65/–70
–65/–70
dBc typ
@ 200 kHz/400 kHz and 200 kHz PFD frequency
5800 MHz16 –70/–75 –70/–75 dBc typ @ 1 MHz/2 MHz and 1 MHz PFD frequency
1 Operating temperature range (B Version) is 40°C to +85°C.
2 The B chip specifications are given as typical values.
3 This is the maximum operating frequency of the CMOS counters. The prescaler value should be chosen to ensure that the RF input is divided down to a frequency that
is less than this value.
4 AVDD = DVDD = 3 V.
5 AC coupling ensures AVDD/2 bias.
6 Guaranteed by design. Sample tested to ensure compliance.
7 TA = 25°C; AVDD = DVDD = 3 V; P = 16; RFIN = 900 MHz.
8 TA = 25°C; AVDD = DVDD = 3 V; P = 16; RFIN = 2.0 GHz.
9 TA = 25°C; AVDD = DVDD = 3 V; P = 32; RFIN = 6.0 GHz.
10 TA = 25°C; AVDD = DVDD = 3.3 V; R = 16383; A = 63; B = 891; P = 32; RFIN = 6.0 GHz.
11 The synthesizer phase noise floor is estimated by measuring the in-band phase noise at the output of the VCO and subtracting 20 log N (where N is the N divider
value) and 10 log FPFD. PNSYNTH = PNTOT − 10 log FPFD − 20 log N.
12 The PLL phase noise is composed of 1/f (flicker) noise plus the normalized PLL noise floor. The formula for calculating the 1/f noise contribution at an RF frequency, fRF,
and at a frequency offset, f, is given by PN = PN1_f + 10 log(10 kHz/f) + 20 log(fRF/1 GHz). Both the normalized phase noise floor and flicker noise are modeled in
ADIsimPLL.
13 The phase noise is measured with the EV-ADF4106SD1Z evaluation board and the Agilent E4440A Spectrum Analyzer. The spectrum analyzer provides the REFIN for
the synthesizer (fREFOUT = 10 MHz @ 0 dBm).
14 fREFIN = 10 MHz; fPFD = 200 kHz; Offset Frequency = 1 kHz; fRF = 900 MHz; N = 4500; Loop B/W = 20 kHz.
15 fREFIN = 10 MHz; fPFD = 200 kHz; Offset Frequency = 1 kHz; fRF = 5800 MHz; N = 29000; Loop B/W = 20 kHz.
16 fREFIN = 10 MHz; fPFD = 1 MHz; Offset Frequency = 1 kHz; fRF = 5800 MHz; N = 5800; Loop B/W = 100 kHz.
TIMING CHARACTERISITICS
AVDD = DVDD = 3 V ± 10%, AVDD ≤ VP ≤ 5.5 V, AGND = DGND = CPGND = 0 V, RSET = 5.1 kΩ, dBm referred to 50 Ω, TA = TMAX to TMIN,
unless otherwise noted.
Table 2.
Parameter Limit1 (B Version) Unit Test Conditions/Comments
t1 10 ns min DATA to CLOCK Setup Time
t2 10 ns min DATA to CLOCK Hold Time
t3 25 ns min CLOCK High Duration
t4 25 ns min CLOCK Low Duration
t5 10 ns min CLOCK to LE Setup Time
t6 20 ns min LE Pulse Width
1 Operating temperature range (B Version) is 40°C to +85°C.
Rev. F | Page 4 of 24
Data Sheet ADF4106
Rev. F | Page 5 of 24
02720-002
CLOCK
DB22 DB2
DATA
LE
t
1
LE
DB23 (MSB)
t
2
DB1 (CONTROL
BIT C2) DB0 (LSB)
(CONTROL BIT C1)
t
3
t
4
t
6
t
5
Figure 2. Timing Diagram
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ADF4106 Data Sheet
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter Rating
AVDD to GND1 0.3 V to + 3.6 V
AVDD to DVDD 0.3 V to + 0.3 V
VP to GND 0.3 V to + 5.8 V
VP to AVDD 0.3 V to + 5.8 V
Digital I/O Voltage to GND 0.3 V to VDD + 0.3 V
Analog I/O Voltage to GND 0.3 V to VP + 0.3 V
IN
IN
IN
0.3 V to V
DD
+ 0.3 V
RFINA to RFINB ±600 mV
Operating Temperature Range
Industrial (B Version) 40°C to +85°C
Storage Temperature Range 65°C to +125°C
Maximum Junction Temperature 150°C
JA
112°C/W
LFCSP θJA Thermal Impedance
(Paddle Soldered)
30.4°C/W
Reflow Soldering
Peak Temperature 260°C
Time at Peak Temperature 40 sec
Transistor Count
CMOS 6425
Bipolar 303
1 GND = AGND = DGND = 0 V.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
This device is a high performance RF integrated circuit with an
ESD rating of <2 kV, and it is ESD sensitive. Proper precautions
should be taken for handling and assembly.
ESD CAUTION
Rev. F | Page 6 of 24
E E _l__l:l:l:|:|:|:J m _|__|:|:|:|:|:|:L
Data Sheet ADF4106
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
02720-003
R
SET
CP
CPGND
AGND
1
2
3
4
5
6
7
8
RF
IN
B
RF
IN
A
AV
DD
REF
IN
MUXOUT
LE
DATA
CLK
CE
DGND
16
15
14
13
12
11
10
9
V
P
DV
DD
TOP VIEW
(Not to Scale)
ADF4106
NOTE: TRANSISTOR COUNT 6425 (CMOS),
303 (BIPOLAR).
Figure 3. 16-Lead TSSOP Pin Configuration
02720-004
14
13
12
1
3
4
LE
15 MUXOUT
DATA
CLK
11 CE
CPGND
AGND
2
AGND
RF
IN
B
5
RF
IN
A
7
AV
DD
6
AV
DD
8
REF
IN
9
DGND
10
DGND
19 R
SET
20 CP
18 V
P
17 DV
DD
16 DV
DD
ADF4106
TOP VIEW
(Not to Scale)
NOTES
1. TRANSISTOR COUNT 6425 (CMOS),
303 (BIPOLAR).
2. THE EXPOSED PAD MUST BE
CONNECTED TO AGND.
Figure 4. 20-Lead LFCSP_WQ Pin Configuration
Table 4. Pin Function Descriptions
Pin No.
TSSOP
Pin No.
LFCSP Mnemonic Function
1 19 RSET Connecting a resistor between this pin and CPGND sets the maximum charge pump output current.
The nominal voltage potential at the RSET pin is 0.66 V. The relationship between ICP and RSET is
SET
MAXCP
R
I5.25
=
So, with RSET = 5.1 kΩ, ICP MAX = 5 mA.
2 20 CP Charge Pump Output. When enabled, this provides ±ICP to the external loop filter, which in turn
drives the external VCO.
3 1 CPGND Charge Pump Ground. This is the ground return path for the charge pump.
4 2, 3 AGND Analog Ground. This is the ground return path of the prescaler.
5
4
RF
IN
B
Complementary Input to the RF Prescaler. This point must be decoupled to the ground plane with
a small bypass capacitor, typically 100 pF. See Figure 18.
6 5 RFINA Input to the RF Prescaler. This small signal input is ac-coupled to the external VCO.
7 6, 7 AVDD Analog Power Supply. This may range from 2.7 V to 3.3 V. Decoupling capacitors to the analog ground
plane should be placed as close as possible to this pin. AVDD must be the same value as DVDD.
8 8 REFIN Reference Input. This is a CMOS input with a nominal threshold of VDD/2 and a dc equivalent input
resistance of 100 kΩ. See Figure 18. This input can be driven from a TTL or CMOS crystal oscillator or
it can be ac-coupled.
9 9, 10 DGND Digital Ground.
10 11 CE Chip Enable. A logic low on this pin powers down the device and puts the charge pump output
into three-state mode. Taking the pin high powers up the device, depending on the status of the
power-down bit, F2.
11 12 CLK Serial Clock Input. This serial clock is used to clock in the serial data to the registers. The data is latched
into the 24-bit shift register on the CLK rising edge. This input is a high impedance CMOS input.
12 13 DATA Serial Data Input. The serial data is loaded MSB first with the two LSBs being the control bits.
This input is a high impedance CMOS input.
13 14 LE Load Enable, CMOS Input. When LE goes high, the data stored in the shift registers is loaded into one
of the four latches with the latch being selected using the control bits.
14 15 MUXOUT This multiplexer output allows either the lock detect, the scaled RF, or the scaled reference frequency
to be accessed externally.
15 16, 17 DVDD Digital Power Supply. This may range from 2.7 V to 3.3 V. Decoupling capacitors to the digital ground
plane should be placed as close as possible to this pin. DVDD must be the same value as AVDD.
16
18
V
P
Charge Pump Power Supply. This should be greater than or equal to V
DD
. In systems where V
DD
is 3 V,
it can be set to 5.5 V and used to drive a VCO with a tuning range of up to 5 V.
EP Exposed Pad. The exposed pad must be connected to AGND.
Rev. F | Page 7 of 24
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ADF4106 Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
02720-005
FREQ MAGS11 ANGS11
0.500 0.89148 –17.2820
0.600 0.88133 – 20.6919
0.700 0.87152 – 24.5386
0.800 0.85855 –27.3228
0.900 0.84911 –31.0698
1.000 0.83512 – 34.8623
1.100 0.82374 –38.5574
1.200 0.80871 –41.9093
1.300 0.79176 – 45.6990
1.400 0.77205 –49.4185
1.500 0.75696 –52.8898
1.600 0.74234 –56.2923
1.700 0.72239 –60.2584
1.800 0.69419 –63.1446
1.900 0.67288 –65.6464
2.000 0.66227 –68.0742
2.100 0.64758 –71.3530
2.200 0.62454 –75.5658
2.300 0.59466 –79.6404
2.400 0.55932 –82.8246
2.500 0.52256 –85.2795
2.600 0.48754 –85.6298
2.700 0.46411 –86.1854
2.800 0.45776 –86.4997
2.900 0.44859 –88.8080
3.000 0.44588 –91.9737
3.100 0.43810 –95.4087
3.200 0.43269 99.1282
FREQ MAGS11 ANGS11
3.300 0.42777 –102.748
3.400 0.42859 –107.167
3.500 0.43365 –111.883
3.600 0.43849 –117.548
3.700 0.44475 –123.856
3.800 0.44800 –130.399
3.900 0.45223 136.744
4.000 0.45555 142.766
4.100 0.45313 –149.269
4.200 0.45622 –154.884
4.300 0.45555 –159.680
4.400 0.46108 –164.916
4.500 0.45325 –168.452
4.600 0.45054 –173.462
4.700 0.45200 –176.697
4.800 0.45043 178.824
4.900 0.45282 174.947
5.000 0.44287 170.237
5.100 0.44909 166.617
5.200 0.44294 162.786
5.300 0.44558 158.766
5.400 0.45417 153.195
5.500 0.46038 147.721
5.600 0.47128 139.760
5.700 0.47439 132.657
5.800 0.48604 125.782
5.900 0.50637 121.110
6.000 0.52172 115.400
FREQ UNIT GHz KEYWORD R
PARAM TYPE S IMPEDANCE 50
DATA FORMAT MA
Figure 5. S-Parameter Data for the RF Input
0
–30
–5
10
25
–20
15
02720-006
654
32
10
RF INPUT FREQUENCY (GHz)
RF INPUT POWER (dBm)
V
DD
= 3V
V
P
= 3V
T
A
= +85°C
T
A
= –40°C
T
A
= +25°C
Figure 6. Input Sensitivity
0
–100
90
80
–70
–60
–50
–40
–30
–20
–10
02720-007
–2kHz –1kHz 900MHz 1kHz 2kHz
FREQUENCY
OUTPUT POWER (dB)
V
DD
= 3V, V
P
= 5V
I
CP
= 5mA
PFD FREQUENCY = 200kHz
LOOP BANDWIDTH = 20kHz
RES BANDWIDTH = 10Hz
VIDEO BANDWIDTH = 10Hz
SWEEP = 1.9 SECONDS
AVERAGES = 10
93.0dBc/Hz
REF LEVEL = 14.3dBm
Figure 7. Phase Noise (900 MHz, 200 kHz, and 20 kHz)
–40
–140
–130
–120
–110
–100
–90
–80
–70
–60
–50
02720-008
100Hz 1MHz
FREQUENCY OFFSET FROM 900MHz CARRIER
OUTPUT POWER (dB)
10dB/DIV
R
L
= –40dBc/Hz
RMS NOISE = 0.36°
Figure 8. Integrated Phase Noise (900 MHz, 200 kHz, and 20 kHz)
0
–100
–90
–80
70
60
50
40
–30
–20
–10
02720-009
400kHz –200kHz 900MHz 200kHz 400kHz
FREQUENCY
OUTPUT POWER (dB)
REF LEVEL = –14.0dBm V
DD
= 3V, V
P
= 5V
I
CP
= 5mA
PFD FREQUENCY = 200kHz
LOOP BANDWIDTH = 20kHz
RES BANDWIDTH = 1kHz
VIDEO BANDWIDTH = 1kHz
SWEEP = 2.5 SECONDS
AVERAGES = 30
–91.0dBc/Hz
Figure 9. Reference Spurs (900 MHz, 200 kHz, and 20 kHz)
–83.5dBc/Hz
0
–100
–90
–80
–70
–60
–50
–40
–30
–20
–10
02720-010
–2kHz –1kHz 5800MHz 1kHz 2kHz
FREQUENCY
OUTPUT POWER (dB)
REF LEVEL = –10dBm V
DD
= 3V, V
P
= 5V
I
CP
= 5mA
PFD FREQUENCY = 1MHz
LOOP BANDWIDTH = 100kHz
RES BANDWIDTH = 10Hz
VIDEO BANDWIDTH = 10Hz
SWEEP = 1.9 SECONDS
AVERAGES = 10
Figure 10. Phase Noise (5.8 GHz,1 MHz, and 100 kHz)
Rev. F | Page 8 of 24
Data Sheet ADF4106
40
–140
–130
120
–110
100
–90
–80
70
60
50
02720-011
100Hz 1MHz
FREQUENCY OFFSET FROM 5800MHz CARRIER
PHASE NOISE (dBc/Hz)
10dB/DIV
R
L
= 40dBc/Hz
RMS NOISE = 1.8°
Figure 11. Integrated Phase Noise (5.8 GHz,1 MHz, and 100 kHz)
0
–100
–90
–80
–70
–60
–50
–40
–30
–20
–10
02720-012
–2M –1M 5800 1M 2M
FREQUENCY (Hz)
OUTPUT POWER (dB)
REF LEVEL = –10dBm
–65.0dBc
–66.0dBc
V
DD
= 3V, V
P
= 5V
I
CP
= 5mA
PFD FREQUENCY = 1MHz
LOOP BANDWIDTH = 100kHz
RES BANDWIDTH = 1kHz
VIDEO BANDWIDTH = 1kHz
SWEEP = 13 SECONDS
AVERAGES = 1
Figure 12. Reference Spurs (5.8 GHz,1 MHz, and 100 kHz)
–60
–100
–90
–80
–70
02720-013
100–40 –20 0 20 40 60 80
TEMPERATURE (°C)
PHASE NOISE (dBc/Hz)
V
DD
= 3V
V
P
= 3V
Figure 13. Phase Noise (5.8 GHz,1 MHz, and 100 kHz) vs. Temperature
–5
–105
–95
–85
–75
–65
–55
–45
–35
–25
–15
02720-014
501234
TUNNING VOLTAGE (V)
FIRST REFERENCE SPUR (dBc)
V
DD
= 3V
V
P
= 5V
Figure 14. Reference Spurs vs. VTUNE (5.8 GHz,1 MHz, and 100 kHz)
–120
–180
–170
–160
–150
–140
–130
02720-015
100M10k 100k 1M 10M
PHASE ETECTOR FREQUENCY (Hz)
PHASE NOISE (dBc/Hz)
V
DD
= 3V
V
P
= 5V
Figure 15. Phase Noise (Referred to CP Output) vs. PFD Frequency
–6
6
5
4
3
2
1
0
–1
–2
–3
–4
–5
02720-016
5.00 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
V
CP
(V)
I
CP
(mA)
V
PP
= 5V
I
CP
SETTLING = 5mA
Figure 16. Charge Pump Output Characteristics
Rev. F | Page 9 of 24
ADF4106 Data Sheet
Rev. F | Page 10 of 24
GENERAL DESCRIPTION
REFERENCE INPUT SECTION
The reference input stage is shown in Figure 17. SW1 and SW2
are normally closed switches. SW3 is a normally open switch.
When power-down is initiated, SW3 is closed and SW1 and
SW2 are opened. This ensures that there is no loading of the
REFIN pin on power-down.
02720-017
100k
NC
REF
IN
NC
NO
SW1
SW2
BUFFER
SW3
TO R COUNTER
POWER-DOWN
CONTROL
Figure 17. Reference Input Stage
RF INPUT STAGE
The RF input stage is shown in Figure 18. It is followed by a
2-stage limiting amplifier to generate the CML clock levels
needed for the prescaler.
02720-018
500
1.6V
500
AGND
RF
IN
A
RF
IN
B
AV
DD
BIAS
GENERATOR
Figure 18. RF Input Stage
PRESCALER (P/P +1)
The dual-modulus prescaler (P/P + 1), along with the A counter
and B counter, enables the large division ratio, N, to be realized
(N = BP + A). The dual-modulus prescaler, operating at CML
levels, takes the clock from the RF input stage and divides it
down to a manageable frequency for the CMOS A counter and
B counter. The prescaler is programmable. It can be set in soft-
ware to 8/9, 16/17, 32/33, or 64/65. It is based on a synchronous
4/5 core. There is a minimum divide ratio possible for fully
contiguous output frequencies. This minimum is determined by
P, the prescaler value, and is given by (P2 − P).
A COUNTER AND B COUNTER
The A counter and B CMOS counter combine with the dual
modulus prescaler to allow a wide ranging division ratio in the
PLL feedback counter. The counters are specified to work when
the prescaler output is 325 MHz or less. Thus, with an RF input
frequency of 4.0 GHz, a prescaler value of 16/17 is valid, but a
value of 8/9 is not valid.
Pulse Swallow Function
The A counter and B counter, in conjunction with the dual-
modulus prescaler, make it possible to generate output
frequencies that are spaced only by the reference frequency
divided by R. The equation for the VCO frequency is


R
REFIN
f
ABP
VCO
f
where:
fVCO is the output frequency of the external voltage controlled
oscillator (VCO).
P is the preset modulus of the dual-modulus prescaler
(8/9, 16/17, etc.).
B is the preset divide ratio of the binary 13-bit counter
(3 to 8191).
A is the preset divide ratio of the binary 6-bit swallow
counter (0 to 63).
fREFIN is the external reference frequency oscillator.
LOAD
LOAD
FROM RF
INPUT STAGE PRESCALER
P/P + 1
13-BIT B
COUNTER
TO PFD
6-BIT A
COUNTER
N DIVIDER
MODULUS
CONTROL
N = BP + A
02720-019
Figure 19. A and B Counters
R COUNTER
The 14-bit R counter allows the input reference frequency to
be divided down to produce the reference clock to the phase
frequency detector (PFD). Division ratios from 1 to 16,383
are allowed.
Data Sheet ADF4106
PHASE FREQUENCY DETECTOR (PFD) AND
CHARGE PUMP
The PFD takes inputs from the R counter and N counter
(N = BP + A) and produces an output proportional to the
phase and frequency difference between them. Figure 20 is a
simplified schematic. The PFD includes a programmable delay
element that controls the width of the antibacklash pulse. This
pulse ensures that there is no dead zone in the PFD transfer
function and minimizes phase noise and reference spurs. Two
bits in the reference counter latch, ABP2 and ABP1, control the
width of the pulse. See Table 7.
HI
HI
D1
D2
Q1
Q2
CLR2
CP
U1
U2
UP
DOWN
ABP2 ABP1
CPGND
U3
R DIVIDER
PROGRAMMABLE
DELAY
N DIVIDER
V
P
CHARGE
PUMP
02720-020
CLR1
Figure 20. PFD Simplified Schematic
MUXOUT AND LOCK DETECT
The output multiplexer on the ADF4106 allows the user
to access various internal points on the chip. The state of
MUXOUT is controlled by M3, M2, and M1 in the function
latch. Table 9 shows the full truth table. Figure 21 shows the
MUXOUT section in block diagram form.
Lock Detect
MUXOUT can be programmed for two types of lock detect:
digital lock detect and analog lock detect.
Digital lock detect is active high. When LDP in the R counter
latch is set to 0, digital lock detect is set high when the phase
error on three consecutive phase detector cycles is less than
15 ns. With LDP set to 1, five consecutive cycles of less than
15 ns are required to set the lock detect. It stays set high until a
phase error of greater than 25 ns is detected on any subsequent
PD cycle.
The N-channel, open-drain, analog lock detect should be
operated with an external pull-up resistor of 10 kΩ nominal.
When lock is detected, this output is high with narrow, low-
going pulses.
02720-021
DGND
DV
DD
CONTROL
MUX
ANALOG LOCK DETECT
DIGITAL LOCK DETECT
R COUNTER OUTPUT
N COUNTER OUTPUT
SDOUT
MUXOUT
Figure 21. MUXOUT Circuit
INPUT SHIFT REGISTER
The ADF4106 digital section includes a 24-bit input shift
register, a 14-bit R counter, and a 19-bit N counter, comprising a
6-bit A counter and a 13-bit B counter. Data is clocked into the
24-bit shift register on each rising edge of CLK. The data is
clocked in MSB first. Data is transferred from the shift register
to one of four latches on the rising edge of LE. The destination
latch is determined by the state of the two control bits (C2, C1)
in the shift register. These are the two LSBs, DB1 and DB0, as
shown in the timing diagram of Figure 2. The truth table for
these bits is shown in Table 5. Table 6 shows a summary of how
the latches are programmed.
Table 5. C1, C2 Truth Table
Control Bits
C2 C1 Data Latch
0 0 R Counter
0 1 N Counter (A and B)
1 0 Function Latch (Including Prescaler)
1 1 Initialization Latch
Rev. F | Page 11 of 24
ADF4106 Data Sheet
Table 6. Latch Summary
DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
C2 (0) C1 (0)R1R2R3R4R5
R6
R7R8R9R10R11R12R13R14ABP1ABP2T1T2LDP
DB21DB22DB23
0 0X
DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
C2 (0) C1 (1)
A1A2A3A4A5B1B2B3B4B5B6B7B8B9B10B11B12B13 A6
DB21DB22DB23
G1XX
DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
C2 (1) C1 (0)F1PD1M1M2M3F3P1P2 CPI1CPI2CPI5CPI6 TC4PD2 F2
CPI3CPI4
DB21
TC3 TC2 TC1
DB22DB23
F4F5
DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9
DB8
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
C2 (1) C1 (1)
F1PD1M1M2M3
F3
P1P2 CPI1CPI2
CPI5
CPI6 TC4PD2 F2
CPI3CPI4
DB21
TC3 TC2 TC1
DB22DB23
F4F5
REFERENCE COUNTER LATCH
RESERVED
LOCK
DETECT
PRECISION
TEST
MODE BITS
ANTI-
BACKLASH
WIDTH 14-BIT REFERENCE COUNTER CONTROL
BITS
RESERVED 13-BIT B COUNTER 6-BIT A COUNTER CONTROL
BITS
N COUNTER LATCH
CP GAIN
FUNCTION LATCH
PRESCALER
VALUE
POWER-
DOWN 2
CURRENT
SETTING
2
CURRENT
SETTING
1
TIMER COUNTER
CONTROL
FASTLOCK
MODE
FASTLOCK
ENABLE
CP THREE-
STATE
PD
POLARITY
MUXOUT
CONTROL
POWER-
DOWN 1
COUNTER
RESET
CONTROL
BITS
PRESCALER
VALUE
POWER-
DOWN 2
CURRENT
SETTING
2
CURRENT
SETTING
1
TIMER COUNTER
CONTROL
FASTLOCK
MODE
FASTLOCK
ENABLE
CP THREE-
STATE
PD
POLARITY
MUXOUT
CONTROL
POWER-
DOWN 1
COUNTER
RESET
CONTROL
BITS
INITIALIZATION LATCH
02720-022
Rev. F | Page 12 of 24
Data Sheet ADF4106
Table 7. Reference Counter Latch Map
LDP
0
1
ABP2 ABP1
0 0 2.9ns
0 1 1.3ns
1 0 6.0ns
1 1 2.9ns
R14 R13 R12 .......... R3 R2 R1
0 0 0 .......... 0 0 1 1
0 0 0 .......... 0 1 0 2
0 0 0 .......... 0 1 1 3
0 0 0 .......... 1 0 0 4
. . . .......... . . . .
. . . .......... . . . .
. . . .......... . . . .
1 1 1 .......... 1 0 0 16380
1 1 1 .......... 1 0 1 16381
1 1 1 .......... 1 1 0 16382
1 1 1 .......... 1 1 1 16383
X = DON’T CARE
DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
C2 (0) C1 (0)R1R2R3R4R5R6R7R8R9R10R11R12R13R14ABP1ABP2T1T2LDP
DB21DB22DB23
0 0
X
RESERVED
LOCK
DETECT
PRECISION
TEST
MODE BITS
ANTI-
BACKLASH
WIDTH 14-BIT REFERENCE COUNTER CONTROL
BITS
DIVIDE RATIO
ANTIBACKLASH PULSE WIDTH
TEST MODE BITS
SHOULD BE SET
TO 00 FOR NORMAL
OPERATION.
OPERATION
THREE CONSECUTIVE CYCLES OF PHASE DELAY LESS THAN
15ns MUST OCCUR BEFORE LOCK DETECT IS SET.
FIVE CONSECUTIVE CYCLES OF PHASE DELAY LESS THAN
15ns MUST OCCUR BEFORE LOCK DETECT IS SET.
BOTH OF THESE BITS
MUST BE SET TO 0 FOR
NORMAL OPERATION.
02720-023
Rev. F | Page 13 of 24
ADF4106 Data Sheet
Table 8. N (A, B) Counter Latch Map
DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
C2 (0) C1 (1)A1A2A3A4A5B1B2B3B4B5B6B7B8B9B10B11B12B13 A6
DB21
DB22DB23
G1
0 0
01
10
F4 (FUNCTION LATCH)
FASTLOCK ENABLE
1 1
A6 A5 .......... A2 A1
0 0 .......... 0 0 0
0 0 .......... 0 1 1
0 0 .......... 1 0 2
0 0 .......... 1 1 3
. . .......... . . .
. . .......... . . .
. . .......... . . .
1 1 .......... 0 0 60
1 1 .......... 0 1 61
1 1 .......... 1 0 62
1 1 .......... 1 1 63
X X
B13 B12 B11 B3 B2 B1
0 0 0 .......... 0 0 0
0 0 0 .......... 0 0 1
0 0 0 .......... 0 1 0
0 0 0 .......... 0 1 1 3
. . . .......... . . . .
. . . .......... . . . .
. . . .......... . . . .
1 1 1 .......... 1 0 0 8188
1 1 1 .......... 1 0 1 8189
1 1 1 .......... 1 1 0 8190
1 1 1 .......... 1 1 1 8191
X = DON’T CARE
RESERVED 13-BIT B COUNTER 6-BIT A COUNTER CONTROL
BITS
CP GAIN
A COUNTER
DIVIDE RATIO
B COUNTER DIVIDE RATIO
NOT ALLOWED
NOT ALLOWED
NOT ALLOWED
THESE BITS ARE NOT USED
BY THE DEVICE AND ARE
DON'T CARE BITS.
OPERATIONCP GAIN
CHARGE PUMP CURRENT
SETTING 1 IS PERMANENTLY USED.
CHARGE PUMP CURRENT
SETTING 2 IS PERMANENTLY USED.
CHARGE PUMP CURRENT
SETTING 1 IS USED.
CHARGE PUMP CURRENT IS
SWITCHED TO SETTING 2. THE
TIME SPENT IN SETTING 2 IS
DEPENDENT ON WHICH FASTLOCK
MODE IS USED. SEE FUNCTION
LATCH DESCRIPTION. N = BP + A, P IS PRESCALER VALUE SET IN THE FUNCTION
LATCH. B MUST BE GREATER THAN OR EQUAL TO A. FOR
CONTINUOUSLY ADJACENT VALUES OF (N × FREF), AT THE
OUTPUT, NMIN IS (P2– P).
02720-024
Rev. F | Page 14 of 24
Data Sheet ADF4106
Table 9. Function Latch Map
P2 P1
0 0 8/9
0 1 16/17
1 0 32/33
1 1 64/65
PD2 PD1 MODE
0XX
1X0
1 0 1
111
CPI6 CPI5 CPI4
CPI3 CPI2 CPI1 3k5.1k11k
0 0 0 1.06 0.625 0.289
0 0 1 2.12 1.25 0.580
0 1 0 3.18 1.875 0.870
0 1 1 4.24 2.5 1.160
1 0 0 5.30 3.125 1.450
1 0 1 6.36 3.75 1.730
1 1 0 7.42 4.375 2.020
11 1 8.50 5.0 2.320
TC4 TC3 TC2 TC1
00003
0001 7
0 0 1 0 11
0 0 1 1 15
0 1 0 0 19
0 1 0 1 23
0 1 1 0 27
011131
1 0 0 0 35
1 0 0 1 39
1 0 1 0 43
1 0 1 1 47
1 1 0 0 51
1 1 0 1 55
111059
111163
F4
0
1
1
M3 M2 M1
0 0 0
0 0 1
0 1 0
0 1 1
1 0 0
1 0 1
1 1 0
1 1 1
F3
0
1
F2
0
1
F1
0
1
DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
C2 (1) C1 (0)
F1
PD1
M1
M2M3
F3P1P2 CPI1CPI2CPI5
CPI6 TC4PD2 F2CPI3CPI4
DB21
TC3 TC2 TC1
DB22DB23
F4
F5
F5
X
0
1
NEGATIVE
POSITIVE
PRESCALER
VALUE
POWER-
DOWN 2
CURRENT
SETTING
2
CURRENT
SETTING
1
TIMER COUNTER
CONTROL
FASTLOCK
MODE
FASTLOCK
ENABLE
CP THREE-
STATE
MUXOUT
CONTROL
POWER-
DOWN 1
COUNTER
RESET
CONTROL
BITS
PHASE DETECTOR
POLARITY COUNTER
OPERATION
NORMAL
R, A, B COUNTERS
HELD IN RESET
CHARGE PUMP
OUTPUT
NORMAL
THREE-STATE
FASTLOCK DISABLED
FASTLOCK MODE 1
FASTLOCK MODE 2
FASTLOCK MODE
THREE-STATE OUTPUT
DIGITAL LOCK DETECT
(ACTIVE HIGH)
N DIVIDER OUTPUT
DV
DD
R DIVIDER OUTPUT
N-CHANNEL OPEN-DRAIN
LOCK DETECT
SERIAL DATA OUTPUT
DGND
OUTPUT
TIMEOUT
(PFD CYCLES)
I
CP
(mA)
ASYNCHRONOUS POWER-DOWN
NORMAL OPERATION
ASYNCHRONOUS POWER-DOWN
SYNCHRONOUS POWER-DOWN
CE PIN
PRESCALER VALUE
PD
POLARITY
02720-025
Rev. F | Page 15 of 24
ADF4106 Data Sheet
Table 10. Initialization Latch Map
P2 P1
0 0 8/9
0 1 16/17
1 0 32/33
1 1 64/65
PD2 PD1 MODE
0XX
1X0
1 0 1
111
CPI6 CPI5 CPI4
CPI3 CPI2 CPI1 3k5.1k11k
0 0 0 1.06 0.625 0.289
0012.12 1.25 0.580
0 1 0 3.18 1.875 0.870
0114.24 2.5 1.160
1 0 0 5.30 3.125 1.450
1 0 1 6.36 3.75 1.730
1 1 0 7.42 4.375 2.020
1 1 1 8.50 5.0 2.320
TC4 TC3 TC2 TC1
00 0 0 3
0001 7
001011
001 1 15
010 0 19
010123
0 1 1 0 27
01 1 1 31
1 0 0 0 35
1001 39
1 0 1 0 43
1 0 1 1 47
1 1 0 0 51
1101 55
1110 59
1 1 1 1 63
F4
0
1
1
M3 M2 M1
0 0 0
0 0 1
0 1 0
0 1 1
1 0 0
1 0 1
1 1 0
1 1 1
F3
0
1
F2
0
1
F1
0
1
DB20 DB19 DB18 DB17 DB16 DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
C2 (1) C1 (1)
F1
PD1
M1
M2M3F3P1P2 CPI1CPI2CPI5
CPI6 TC4PD2 F2
CPI3CPI4
DB21
TC3 TC2 TC1
DB22DB23
F4
F5
THREE-STATE
F5
X
0
1
NEGATIVE
POSITIVE
PRESCALER
VALUE
POWER-
DOWN 2
CURRENT
SETTING
2
CURRENT
SETTING
1
TIMER COUNTER
CONTROL
FASTLOCK
MODE
FASTLOCK
ENABLE
CP THREE-
STATE
MUXOUT
CONTROL
POWER-
DOWN 1
COUNTER
RESET
CONTROL
BITS
PHASE DETECTOR
POLARITY COUNTER
OPERATION
NORMAL
R, A, B COUNTERS
HELD IN RESET
CHARGE PUMP
OUTPUT
NORMAL
FASTLOCK DISABLED
FASTLOCK MODE 1
FASTLOCK MODE 2
FASTLOCK MODE
THREE-STATE OUTPUT
DIGITAL LOCK DETECT
(ACTIVE HIGH)
N DIVIDER OUTPUT
DV
DD
R DIVIDER OUTPUT
N-CHANNEL OPEN-DRAIN
LOCK DETECT
SERIAL DATA OUTPUT
DGND
OUTPUT
TIMEOUT
(PFD CYCLES)
I
CP
(mA)
ASYNCHRONOUS POWER-DOWN
NORMAL OPERATION
ASYNCHRONOUS POWER-DOWN
SYNCHRONOUS POWER-DOWN
CE PIN
PRESCALER VALUE
PD
POLARITY
02720-026
Rev. F | Page 16 of 24
Data Sheet ADF4106
THE FUNCTION LATCH
With C2 and C1 set to 1 and 0, respectively, the on-chip
function latch is programmed. Table 9 shows the input data
format for programming the function latch.
Counter Reset
DB2 (F1) is the counter reset bit. When this is 1, the R counter
and the N (A, B) counter are reset. For normal operation, this
bit should be 0. When powering up, disable the F1 bit (set to 0).
The N counter will then resume counting in close alignment
with the R counter. (The maximum error is one prescaler cycle).
Power-Down
DB3 (PD1) and DB21 (PD2) provide programmable power-
down modes. They are enabled by the CE pin.
When the CE pin is low, the device is immediately disabled
regardless of the states of PD2, PD1.
In the programmed asynchronous power-down, the device
powers down immediately after latching 1 into the PD1 bit,
with the condition that PD2 is loaded with 0.
In the programmed synchronous power-down, the device
power-down is gated by the charge pump to prevent unwanted
frequency jumps. Once the power-down is enabled by writing 1
into the PD1 bit (provided that 1 has also been loaded to PD2),
then the device goes into power-down during the next charge
pump event.
When a power-down is activated (either synchronous or
asynchronous mode, including CE pin activated power-down),
the following events occur:
All active dc current paths are removed.
The R, N, and timeout counters are forced to their load state
conditions.
The charge pump is forced into three-state mode.
The digital clock detect circuitry is reset.
The RFIN input is debiased.
The reference input buffer circuitry is disabled.
The input register remains active and capable of loading and
latching data.
MUXOUT Control
The on-chip multiplexer is controlled by M3, M2, and M1 on
the ADF4106 family. Table 9 shows the truth table.
Fastlock Enable Bit
DB9 of the function latch is the fastlock enable bit. When this
bit is 1, fastlock is enabled.
Fastlock Mode Bit
DB10 of the function latch is the fastlock mode bit. When
fastlock is enabled, this bit determines which fastlock mode is
used. If the fastlock mode bit is 0, then Fastlock Mode 1 is
selected; and if the fastlock mode bit is 1, then Fastlock Mode 2
is selected.
Fastlock Mode 1
The charge pump current is switched to the contents of Current
Setting 2. The device enters fastlock when 1 is written to the CP
gain bit in the N (A, B) counter latch. The device exits fastlock
when 0 is written to the CP gain bit in the N (A, B) counter
latch.
Fastlock Mode 2
The charge pump current is switched to the contents of Current
Setting 2. The device enters fastlock when 1 is written to the CP
gain bit in the N (A, B) counter latch. The device exits fastlock
under the control of the timer counter. After the timeout
period, which is determined by the value in TC4 to TC1, the CP
gain bit in the N (A, B) counter latch is automatically reset to 0,
and the device reverts to normal mode instead of fastlock. See
Table 9 for the timeout periods.
Timer Counter Control
The user has the option of programming two charge pump
currents. The intent is that Current Setting 1 is used when the
RF output is stable and the system is in a static state. Current
Setting 2 is used when the system is dynamic and in a state of
change (that is, when a new output frequency is programmed).
The normal sequence of events follows.
The user initially decides what the preferred charge pump
currents are going to be. For example, the choice may be
2.5 mA as Current Setting 1 and 5 mA as the Current Setting 2.
Simultaneously, the decision must be made as to how long the
secondary current stays active before reverting to the primary
current. This is controlled by the timer counter control bits,
DB14 to DB11 (TC4 to TC1), in the function latch. The truth
table is given in Table 9.
To program a new output frequency, simply program the N (A,
B) counter latch with new values for A and B. Simultaneously,
the CP gain bit can be set to 1, which sets the charge pump with
the value in CPI6 to CPI4 for a period of time determined by
TC4 to TC1. When this time is up, the charge pump current
reverts to the value set by CPI3 to CPI1. At the same time, the
CP gain bit in the N (A, B) counter latch is reset to 0 and is now
ready for the next time the user wishes to change the frequency.
Note that there is an enable feature on the timer counter. It is
enabled when Fastlock Mode 2 is chosen by setting the fastlock
mode bit (DB10) in the function latch to 1.
Rev. F | Page 17 of 24
ADF4106 Data Sheet
Charge Pump Currents
CPI3, CPI2, and CPI1 program Current Setting 1 for the charge
pump. CPI6, CPI5, and CPI4 program Current Setting 2 for the
charge pump. The truth table is given in Table 9.
Prescaler Value
P2 and P1 in the function latch set the prescaler values. The
prescaler value should be chosen so that the prescaler output
frequency is always less than or equal to 325 MHz. Therefore,
with an RF frequency of 4 GHz, a prescaler value of 16/17 is
valid, but a value of 8/9 is not valid.
PD Polarity
This bit sets the phase detector polarity bit. See Table 9.
CP Three-State
This bit controls the CP output pin. With the bit set high, the
CP output is put into three-state. With the bit set low, the CP
output is enabled.
THE INITIALIZATION LATCH
When C2 and C1 = 1 and 1, respectively, the initialization latch
is programmed. This is essentially the same as the function
latch (programmed when C2 and C1 = 1 and 0, respectively).
However, when the initialization latch is programmed, there is
an additional internal reset pulse applied to the R and N (A, B)
counters. This pulse ensures that the N (A, B) counter is at the
load point when the N (A, B) counter data is latched and the
device begins counting in close phase alignment.
If the latch is programmed for synchronous power-down (CE
pin is high, PD1 bit is high, and PD2 bit is low), the internal
pulse also triggers this power-down. The prescaler reference
and the oscillator input buffer are unaffected by the internal
reset pulse; therefore, close phase alignment is maintained when
counting resumes.
When the first N (A, B) counter data is latched after
initialization, the internal reset pulse is again activated.
However, successive N (A, B) counter loads after this will not
trigger the internal reset pulse.
Device Programming After Initial Power-Up
After initial power up of the device, there are three methods for
programming the device: initialization latch, CE pin, and
counter reset.
Initialization Latch Method
Apply VDD.
Program the initialization latch (11 in two LSBs of input
word). Make sure that the F1 bit is programmed to 0.
Do a function latch load (10 in two LSBs of the control
word), making sure that the F1 bit is programmed to a 0.
Do an R load (00 in two LSBs).
Do an N (A, B) load (01 in two LSBs).
When the initialization latch is loaded, the following occurs:
The function latch contents are loaded.
An internal pulse resets the R, N (A, B), and timeout counters
to load-state conditions and also three-states the charge
pump. Note that the prescaler band gap reference and the
oscillator input buffer are unaffected by the internal reset
pulse, allowing close phase alignment when counting
resumes.
Latching the first N (A, B) counter data after the initialization
word activates the same internal reset pulse. Successive N (A,
B) loads will not trigger the internal reset pulse, unless there
is another initialization.
CE PIN METHOD
Apply VDD.
Bring CE low to put the device into power-down. This is an
asychronous power-down in that it happens immediately.
Program the function latch (10).
Program the R counter latch (00).
Program the N (A, B) counter latch (01).
Bring CE high to take the device out of power-down. The R
and N (A, B) counters now resume counting in close
alignment.
Note that after CE goes high, a 1 µs duration may be required
for the prescaler band gap voltage and oscillator input buffer
bias to reach steady state.
CE can be used to power the device up and down to check for
channel activity. The input register does not need to be
reprogrammed each time the device is disabled and enabled as
long as it is programmed at least once after VDD is initially
applied.
COUNTER RESET METHOD
Apply VDD.
Do a function latch load (10 in two LSBs). As part of this,
load 1 to the F1 bit. This enables the counter reset.
Do an R counter load (00 in two LSBs).
Do an N (A, B) counter load (01 in two LSBs).
Do a function latch load (10 in two LSBs). As part of this,
load 0 to the F1 bit. This disables the counter reset.
This sequence provides the same close alignment as the
initialization method. It offers direct control over the internal
reset. Note that counter reset holds the counters at load point
and three-states the charge pump but does not trigger
synchronous power-down.
Rev. F | Page 18 of 24
Data Sheet ADF4106
APPLICATIONS
LOCAL OSCILLATOR FOR LMDS BASE STATION
TRANSMITTER
Figure 22 shows the ADF4106 being used with a VCO to
produce the LO for an LMDS base station.
The reference input signal is applied to the circuit at FREFIN
and, in this case, is terminated in 50 Ω. A typical base station
system would have either a TCXO or an OCXO driving the
reference input without any 50 Ω termination.
To achieve a channel spacing of 1 MHz at the output, the
10 MHz reference input must be divided by 10, using the
on-chip reference divider of the ADF4106.
The charge pump output of the ADF4106 (Pin 2) drives the
loop filter. In calculating the loop filter component values, a
number of items need to be considered. In this example, the
loop filter was designed so that the overall phase margin for
the system would be 45°.
Other PLL system specifications include:
KD = 2.5 mA
KV = 80 MHz/V
Loop Bandwidth = 50 kHz
FPFD = 1 MHz
N = 5800
Extra Reference Spur Attenuation = 10 dB
These specifications are needed and used to derive the loop
filter component values shown in Figure 22.
The circuit in Figure 22 shows a typical phase noise
performance of −83.5 dBc/Hz at 1 kHz offset from the carrier.
Spurs are better than −62 dBc.
The loop filter output drives the VCO, which in turn is fed
back to the RF input of the PLL synthesizer and also drives the
RF output terminal. A T-circuit configuration provides 50
matching between the VCO output, the RF output, and the RFIN
terminal of the synthesizer.
In a PLL system, it is important to know when the system
is in lock. In Figure 22, this is accomplished by using the
MUXOUT signal from the synthesizer. The MUXOUT pin
can be programmed to monitor various internal signals in the
synthesizer. One of these is the LD or lock-detect signal.
ADF4106
CE
CLK
DATA
LE
1000pF 1000pF
REF
IN
100pF
CP
MUXOUT
CPGND
AGND
DGND
100pF
1.5nF
20pF
100pF
51
6.2k
4.3k
100pF
18
NOTE
DECOUPLING CAPACITORS (0.1
µ
F/10pF) ON AV
DD
, DV
DD
, AND
V
P
OF THE ADF4106 AND ON V
CC
OF THE V956ME03 HAVE
BEEN OMITTED FROM THE DIAGRAM TO AID CLARITY.
SPI
®
-COMPATIBLE SERIAL BUS
R
SET
RF
IN
A
RF
IN
B
AV
DD
DV
DD
V
P
FREF
IN
V
DD
V
P
LOCK
DETECT
V
CC
V956ME03
1, 3, 4, 5, 7, 8,
9, 11, 12, 13
18
18
100pF
RF
OUT
5.1k
715 16
8
2
14
6
5
1
9
4
3
14
210
51
02720-027
Figure 22. Local Oscillator for LMDS Base Station
Rev. F | Page 19 of 24
ADF4106 Data Sheet
INTERFACING
The ADF4106 has a simple SPI-compatible serial interface for
writing to the device. CLK, DATA, and LE control the data
transfer. When LE goes high, the 24 bits clocked into the input
register on each rising edge of CLK are transferred to the
appropriate latch. See Figure 2 for the timing diagram and
Table 5 for the latch truth table.
The maximum allowable serial clock rate is 20 MHz. This
means that the maximum update rate for the device is 833 kHz,
or one update every 1.2 µs. This is certainly more than adequate
for systems that have typical lock times in hundreds of
microseconds.
ADuC812 Interface
Figure 23 shows the interface between the ADF4106 and the
ADuC812 MicroConverter®. Since the ADuC812 is based on an
8051 core, this interface can be used with any 8051-based
microcontroller. The MicroConverter is set up for SPI master
mode with CPHA = 0. To initiate the operation, the I/O port
driving LE is brought low. Each latch of the ADF4106 needs a
24-bit word. This is accomplished by writing three 8-bit bytes
from the MicroConverter to the device. When the third byte
is written, the LE input should be brought high to complete
the transfer.
On first applying power to the ADF4106, it needs four writes
(one each to the initialization latch, function latch, R counter
latch, and N counter latch) for the output to become active.
I/O port lines on the ADuC812 are also used to control
power-down (CE input) and to detect lock (MUXOUT
configured as lock detect and polled by the port input).
When operating in the mode described, the maximum
SCLOCK rate of the ADuC812 is 4 MHz. This means that
the maximum rate at which the output frequency can be
changed is 166 kHz.
CLK
DATA
LE
CE
MUXOUT
(LOCK DETECT)
MOSI
ADF4106
SCLOCK
I/O PORTS
ADuC812
02720-028
Figure 23. ADuC812-to-ADF4106 Interface
ADSP-2181 Interface
Figure 24 shows the interface between the ADF4106 and the
ADSP-21xx digital signal processor (DSP). The ADF4106
needs a 24-bit serial word for each latch write. The easiest way
to accomplish this using the ADSP-21xx family is to use the
autobuffered transmit mode of operation with alternate
framing. This provides a means for transmitting an entire block
of serial data before an interrupt is generated. Set up the word
length for 8 bits and use three memory locations for each 24-bit
word. To program each 24-bit latch, store the three 8-bit bytes,
enable the autobuffered mode, and write to the transmit register
of the DSP. This last operation initiates the autobuffer transfer.
CLK
DATA
LE
CE
MUXOUT
(LOCK DETECT)
MOSI
ADF4106
SCLOCK
I/O FLAGS
ADSP-21xx TFS
02720-029
Figure 24. ADSP-21xx-to-ADF4106 Interface
PCB DESIGN GUIDELINES FOR CHIP SCALE
PACKAGE
The lands on the LFCSP (CP-20-6) are rectangular. The printed
circuit board (PCB) pad for these should be 0.1 mm longer than
the package land length and 0.05 mm wider than the package
land width. The land should be centered on the pad. This
ensures that the solder joint size is maximized. The bottom of
the LFCSP has a central thermal pad.
The thermal pad on the PCB should be at least as large as this
exposed pad. On the PCB, there should be a clearance of at least
0.25 mm between the thermal pad and the inner edges of the
pad pattern. This ensures that shorting is avoided.
Thermal vias may be used on the PCB thermal pad to improve
thermal performance of the package. If vias are used, they
should be incorporated in the thermal pad at 1.2 mm pitch grid.
The via diameter should be between 0.3 mm and 0.33 mm, and
the via barrel should be plated with 1 oz. copper to plug the via.
The user should connect the PCB thermal pad to AGND.
Rev. F | Page 20 of 24
Data Sheet ADF4106
Rev. F | Page 21 of 24
OUTLINE DIMENSIONS
16 9
81
PIN 1
SEATING
PLANE
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX 0.20
0.09 0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 25. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
0.50
BSC
0.65
0.60
0.55
0.30
0.25
0.18
COMPLIANT
TO
JEDEC STANDARDS MO-220-WGGD-1.
BOTTOM VIEWTOP VIEW
EXPOSED
PAD
PIN1
INDICATOR
4.10
4.00 SQ
3.90
SEATING
PLANE
0.80
0.75
0.70 0.05 MAX
0.02 NOM
0.20 REF
0.20 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
2.30
2.10 SQ
2.00
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
1
20
6
10
11
15
16
5
08-16-2010-B
Figure 26. 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-20-6)
Dimensions shown in millimeters
ADF4106 Data Sheet
ORDERING GUIDE
Model
1
Temperature Range
Package Description
Package Option
ADF4106BRU 40°C to + 85°C 16-Lead Thin Shrink Small Outline Package (TSSOP) RU-16
ADF4106BRU-REEL
40°C to + 85°C
16-Lead Thin Shrink Small Outline Package (TSSOP)
RU-16
ADF4106BRU-REEL7 40°C to + 85°C 16-Lead Thin Shrink Small Outline Package (TSSOP) RU-16
ADF4106BRUZ –40°C to + 85°C 16-Lead Thin Shrink Small Outline Package (TSSOP) RU-16
ADF4106BRUZ-RL 40°C to + 85°C 16-Lead Thin Shrink Small Outline Package (TSSOP) RU-16
ADF4106BRUZ-R7 40°C to + 85°C 16-Lead Thin Shrink Small Outline Package (TSSOP) RU-16
ADF4106BCPZ 40°C to + 85°C 20-Lead Lead Frame Chip Scale Package (LFCSP_WQ) CP-20-6
ADF4106BCPZ-RL 40°C to + 85°C 20-Lead Lead Frame Chip Scale Package (LFCSP_WQ) CP-20-6
ADF4106BCPZ-R7 40°C to + 85°C 20-Lead Lead Frame Chip Scale Package (LFCSP_WQ) CP-20-6
EV-ADF4106SD1Z Evaluation Board
EV-ADF411XSD1Z Evaluation Board
1 Z = RoHS Compliant.
Rev. F | Page 22 of 24
Data Sheet ADF4106
NOTES
Rev. F | Page 23 of 24
ANALOG DEVICES www.analug.cum
ADF4106 Data Sheet
NOTES
©20012015 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D02720-0-4/15(F)
Rev. F | Page 24 of 24

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