TLE493D-A2B6 Datasheet by Infineon Technologies

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Data Sheet 1 Ver. 1.3
www.infineon.com 2019-04-09
TLE493D-A2B6
Low Power 3D Hall Sensor with I2C Interface
1 Overview
Quality Requirement Category: Automotive | Industry
Features
3D magnetic flux density sensing of ±160 mT.
Programmable flux resolution down to 65 µT (typ.).
X-Y angular measurement mode
Power down mode with 7 nA (typ) power consumption
12-bit data resolution for each measurement direction plus 10-bit temperature sensor
Variable update frequencies and power modes (configurable during operation)
Temperature range Tj= -40°C…125°C, supply voltage range = 2.8 V…3.5 V
Triggering by external µC possible via I2C protocol
Interrupt signal to indicate a valid measurement to the microcontroller
Applications
The TLE493D-A2B6 is designed for all kinds of sensing applications, including the following:
•Gear stick position
Control elements in the top column module and multi function steering wheel
Multi function knobs
Pedal/valve position sensing
Benefits
Component reduction due to 3D magnetic measurement principle
Wide application range addressable due to high flexibility
Platform adaptability due to device configurability
Disturbance of smaller stray fields are neglectable compared to the high magnetic flux measurement
range
PG-TSOP6-6-8
@neon
Data Sheet 2 Ver. 1.3
2019-04-09
TLE493D-A2B6
Overview
Table 1 Ordering Information
Product Type Marking Ordering Code Package Default address
write / read
TLE493D-A2B6 EB SP001689848 PG-TSOP6-6-8 6AH / 6BH
@neon
Data Sheet 3 Ver. 1.3
2019-04-09
TLE493D-A2B6
1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1.1 Power mode control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1.2 Sensing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2 Pin Configuration (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.3 Definition of Magnetic Field . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.4 Sensitive Area . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.5 Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3 Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.2 Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.3 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.4 Magnetic Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.5 Temperature Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.6 Overview of Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.7 Interface and Timing Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.1 Package Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.2 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
5 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table of Contents
fl CIIZIF
Data Sheet 4 Ver. 1.3
2019-04-09
TLE493D-A2B6
Functional Description
2 Functional Description
This three dimensional Hall effect sensor can be configured by the microcontroller. The measurement data is
provided in digital format to the microcontroller. The microcontroller is the master and the sensor is the slave.
2.1 General
Description of the Block diagram and its functions.
Figure 1 Block Diagram
The IC consists of three main functional units containing the following building blocks:
The power mode control system, containing a low-power oscillator, basic biasing, accurate restart,
undervoltage detection and a fast oscillator.
The sensing unit, which contains the HALL biasing, HALL probes with multiplexers and successive tracking
ADC, as well as a temperature sensor is implemented.
•The I2C interface, containing the register files and I/O pads
2.1.1 Power mode control
The power mode control provides the power distribution in the IC, a power-on reset function and a specialized
low-power oscillator as the clock source. It also manages the start-up behavior.
On start-up, this unit:
activates the biasing, provides an accurate reset detector and fast oscillator
sensor enters low power mode and can be configured via I2C interface
After re-configuration, a measurement cycle is performed, which consists of the following steps:
activating internal biasing, checking for the restart condition and providing the fast oscillator
HALL biasing
measuring the three HALL probe channels sequentially (including the temperature). This is enabled by
default
reentering configured mode
SCL; /INT
Lateral
Hall plates
Z-Direction Comparator
Digital tracking,
demodulation &
I²C interface
Vertical
Hall plates
X-Direction
Vertical
Hall plates
Y-Direction
MUX ADC
Power Mode Control
Bias
VDD
GND
Temperature
SDA
F-OSC LP-OSC
@neon
Data Sheet 5 Ver. 1.3
2019-04-09
TLE493D-A2B6
Functional Description
In any case functions are only executed if the supply voltage is high enough, otherwise the restart circuit will
halt the state machine until the required level is reached and restart afterwards. The functions are also
restarted if a restart event occurs in between (see parameter ADC restart level).
2.1.2 Sensing
Measures the magnetic field in X, Y and Z direction. Each X-, Y- and Z-Hall probe is connected sequentially to a
multiplexer, which is then connected to an Analog to Digital Converter (ADC). Optional, the temperature
(default = activated) can be determined as well after the three Hall channels.
2.2 Pin Configuration (top view)
Figure 2 shows the pinout of the TLE493D-A2B6.
Figure 2 TLE493D-A2B6 pinout
Table 2 TSOP6 pin description and configuration (see Figure 2)
Pin No. Name Description
1SCL
/INT
Interface serial clock pin (input)
Interrupt pin, signals a finished measurement cycle, open-drain
2 GND Connect to GND
3GNDGround Pin
4VDDSupply Pin
5 GND Connect to GND
6 SDA Interface serial data pin (input/output), open-drain
@neon X»Axr5 V»Axis Z-Ast [ENTER OF SENS‘TWE AREA 0 65:005 ZSBOOWSSW‘JSiOW
Data Sheet 6 Ver. 1.3
2019-04-09
TLE493D-A2B6
Functional Description
2.3 Definition of Magnetic Field
A positive field is considered as South-Pole facing the corresponding Hall element.
Figure 3 shows the definition of the magnetic directions X, Y, Z of the TLE493D-A2B6.
Figure 3 Definition of Magnetic Field Direction
2.4 Sensitive Area
The magnetic sensitive area for the Hall measurement is shown in Figure 4.
Figure 4 Center of Sensitive Area (dimensions in mm)
@neon
Data Sheet 7 Ver. 1.3
2019-04-09
TLE493D-A2B6
Functional Description
2.5 Application Circuit
The use of an interrupt line is optional, but highly recommended to ensure proper and efficient readout of the
sensor data.
The pull-up resistor values of the I2C bus have to be calculated in such a way as to fulfill the rise- and fall time
specification of the interface for the given worst case parasitic (capacitive) load of the actual application
setup.
Please note: too small resistive R1/2 values have to be prevented to avoid unnecessary power consumption
during interface transmissions, especially for low-power applications.
Figure 5 Application Circuit with external power supply and µC
For additional EMC precaution in harsh environments, C1 may be implemented by two 100 nF capacitors in
parallel, which should be already given by CBuf near the µC and/or power supply.
TLE493D
V
DD
µC
Power
Supply
SDA
SCL
(/INT)
R
1
R
2
R1 = 1.2kΩ
R2 = 1.2kΩ
C1 = 100nF
Optional (recommended for wire harness): RSDA, RSCL
SDA, SCL capacitance < 200 pF each, including all stray capacitances
GND
C
1
V
DD
GND
V
DD
GND
R
SDA
R
SCL
C
Buf
@neon 1) Characterization of ESD 13 carried out on a sample basis, not subject to production test.
Data Sheet 8 Ver. 1.3
2019-04-09
TLE493D-A2B6
Specification
3 Specification
This sensor is intended to be used in an automotive environment. This chapter describes the environmental
conditions required by the device (magnetic, thermal and electrical).
3.1 Absolute Maximum Ratings
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at these or any other conditions above those
indicated in the operational sections of this specification is not implied. Furthermore, only single error cases
are assumed. More than one stress/error case may also damage the device.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability. During
absolute maximum rating overload conditions the voltage on VDD pin with respect to ground (GND) must not
exceed the values defined by the absolute maximum ratings.
Table 3 Absolute Maximum Ratings
Parameter Symbol min typ max Unit Note/Condition
Junction temperature Tj-40 125 °C
Voltage on VDD VDD -0.3 – 3.5 V
Magnetic field Bmax ––±1T
Voltage range on any pin to
GND
Vmax -0.1 3.5 V open-drain outputs are not
current limited.
Table 4 ESD Protection1)
Ambient temperature TA = 25°C
1) Characterization of ESD is carried out on a sample basis, not subject to production test.
Parameter Symbol Values Unit Note or Test Condition
Min. Typ. Max.
ESD voltage (HBM)2)
2) Human Body Model (HBM) tests according to ANSI/ESDA/JEDEC JS-001.
VESD – – ±2.0 kV R=1.5kΩ, C= 100 pF
ESD voltage (CDM)3)
3) Charged Device Model (CDM), ESD susceptibility according to JEDEC JESD22-C101.
±0.75 kV for corner pins
±0.5 kV all pins
@neon
Data Sheet 9 Ver. 1.3
2019-04-09
TLE493D-A2B6
Specification
3.2 Operating Range
To achieve ultra low power consumption, the chip does not use a conventional, power-consuming restart
procedure. The focus of the restart procedure implemented is to ensure a proper supply for the ADC operation
only. So it inhibits the ADC until the sensor supply is high enough.
The sensor relies on a proper supply ramp defined with tPUP, VOUS and IDD-PUP, see Figure 6. The I2C reset feature
of the sensor shall be used by the µC after Power Up. If supply monitoring is used in the system (e.g. brown-
out detector etc.), it is also recommended to use the I2C reset of the sensor following events detected by this
monitor.
In any case, an external supply switch (either provided by a System-Basis-Chip solution which includes a
supply-enable feature, a Bias-Resistor-Transistor device, a capable µC GPIO pin, etc.) shall allow a power-
cycle of the sensor as backup for high availability applications to cope with any form of VDD ramps (including
potential EMC influences), see Figure 6.
At Power Up, SDA and SCL shall be pulled to VDD using R1 and R2 of Figure 5 and not be driven to low by any
device or µC on SDA and SCL.
Figure 6 VDD power up and power-cycle for high availability
Table 5 Operating Range
Parameter Symbol min typ max Unit Note/Condition
Operating temperature Tj-40 125 °C Tj = Ta +3 K in fast mode
Supply voltage VDD 2.8 3.3 3.5 V Supply voltage must be above
restart level
ADC restart level Vres 2.2 2.5 2.8 V min. ADC operating level
ADC restart hysteresis Vres-hys –50–mV
Register stable level Vreg 2.5 V Register values are stable above
this voltage level
V
DD
t
3.3V
t
PUP
t
APC
V
OUS
@neon 1) Not subject to production test - verified by design. 1) Currents at puli up resistors (Figure 5) needs to be considered for power supply dimensioning.
Data Sheet 10 Ver. 1.3
2019-04-09
TLE493D-A2B6
Specification
3.3 Electrical Characteristics
This sensor provides different operating modes and a digital communication interface. The corresponding
electrical parameters are listed in Table 7. Regarding current consumption more information are available in
Chapter 3.6.
Table 6 VDD power up and power-cycle
Parameter Symbol min typ max Unit Note/Condition
Power Up ramp time tPUP ––10µs
Availability power cycle1)
1) Not subject to production test - verified by design.
tAPC 150 400 µs
Power Up over-
undershoot
VOUS 3 3.3 3.5 V Envelope which must not be
exceeded at the end of a Power Up.
Power Up current
consumption
IDD-PUP 10 mA Current consumption during tPUP
Table 7 Electrical Setup
Values for VDD = 3.3 V ±5 %, Tj= -40°C to +125°C (unless otherwise specified)
Parameter Symbol min typ max Unit Note/Condition
Supply current 1)
1) Currents at pull up resistors (Figure 5) needs to be considered for power supply dimensioning.
IDD_pd 7 130 nA Tj = 25°C; power down mode
IDD_fm 13.45mAFast mode
Input voltage low threshold2)
2) Based on I2C standard 1995 for VDD related input levels
VIL ––30%VDD all input pads
Input voltage high threshold2) VIH 70 %VDD all input pads
Input voltage hysteresis2) VIHYS 5– %VDD all input pads
Output voltage low level @ 3 mA load VOL 0.4 V all output pads, static load
@neon 1) Magnetic test on waierlevel. it is assumed that initiai variations are stored and compensated in the external LAC during 5x —Sy Sx+5y 5x+5y —2 -Sz 5x+5y+2 -Sz
Data Sheet 11 Ver. 1.3
2019-04-09
TLE493D-A2B6
Specification
3.4 Magnetic Characteristics
The magnetic parameters are specified for an end of line production scenario and for an application life time
scenario.
The magnetic measurement values are provided in the two’s complement with 12 bit or 8 bit resolution in the
registers with the symbols Bx, By and Bz. Two examples, how to calculate the magnetic flux are shown in
Table 11 and Table 12.
Equation for parameter “X to Y magnetic matching”: (3.1)
Equation for parameter “X/Y to Z magnetic matching”: (3.2)
Table 8 Initial Magnetic Characteristics1)
Values for Tj = +25°C, 0 h and VDD = 3.3 V (unless otherwise specified)
1) Magnetic test on wafer level. It is assumed that initial variations are stored and compensated in the external µC during
module test and calibration.
Parameter Symbol min typ max Unit Note/Condition
Magnetic linear range2) (full range)
2) Not subject to production test - verified by design/characterization.
Bxyz_LIN ±160 ±200 ±230 mT -40°C < Tj < +125°C
Magnetic linear range2)3) (short range)
3) The short range setting does not have an analogue saturation behavior due to internal offsets and the compensation
thereof.
Bxyz_LINSR ±100 ±135 ±150 mT
Sensitivity X, Y, Z (full range) Sx, Sy, Sz 5.5 7.7 10.5 LSB12/
mT
Sensitivity X, Y, Z (short range) SxSR, SySR, SzSR 11 15.4 21
Z-Offset (full range and short range) B0Z -1.8 ±0.2 +1.8 mT
XY-Offset (full range and short range) B0xy -0.75 ±0.2 +0.75 mT
X to Y magnetic matching4)
4) See the magnetic matching definition in Equation (3.1) and Equation (3.2).
MXY -15 ±1 +15 % Up to min.
Bxyz_LIN or Bxyz_LINSR
X/Y to Z magnetic matching4) MX/YZ -25 0 +25 %
Resolution, 12-bit5) (full range)
5) Resolution is calculated as 1/Sensitivity (and multiplied by 16 for 8-bit value).
Res12 95 130 182 µT/
LSB12
Resolution, 12-bit5) (short range) Res12_SR 47.5 65 91
Resolution, 8-bit5) (full range) Res81.52 2.08 2.91 mT/
LSB8
Resolution, 8-bit5) (short range) Res8_SR 0.76 1.04 1.46
Magnetic initial noise (rms)
(full range and short range)
Bineff 0.1 0.5 mT rms = 1 sigma
Magnetic hysteresis 2)
(full range and short range)
BHYS –1–LSB
12 due to quantization
effects
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@neon 1) Not subject to production test, verified by design/characterization. Drifts are changes from the initial characteristics 1) Not subject to production test, verified by design/characterization.
Data Sheet 12 Ver. 1.3
2019-04-09
TLE493D-A2B6
Specification
Table 9 Sensor Drifts1) valid for both full range and short range (unless indicated)
Values for VDD = 3.3 V ±5 %, Tj= -40°C to 125°C, static magnetic field within full magnetic linear range (unless
otherwise specified)
1) Not subject to production test, verified by design/characterization. Drifts are changes from the initial characteristics
due to external influences.
Parameter Symbol min typ max Unit Note/Condition
Sensitivity drift X, Y, Z SxD, SyD, SzD-15 ±5 +15 % TC0
Offset drift X, Y BO_DXY -0.45 +0.45 mT @ 0 mT, TC0
Offset drift Z BO_DZ -1.6 +1.6 mT @ 0 mT, TC0
X to Y magnetic matching drift2)
2) See the magnetic matching definition in Equation (3.1) and Equation (3.2).
MXY_D -3.5 ±1 +3.5 % TC0
X/Y to Z magnetic matching drift2) MX/YZ_D -15 ±10 +15 % TC0
Table 10 Temperature compensation, non-linearity and noise1)
Values for VDD = 3.3 V ±5 %, Tj= -40°C to 125°C (unless otherwise specified)
1) Not subject to production test, verified by design/characterization.
Parameter Symbol min typ max Unit Note/Condition
Temperature compensation2)
(full range and short range)
2) TCX must be set before magnetic flux trimming and measurements with the same value.
TC0 ±0 ppm/K Bx, By and Bz (default)
TC1 -750 Bx, By and Bz (option 1)
TC2 -1500 Bx, By and Bz (option 2)
TC3 +350 Bx, By and Bz (option 3)
Differential Non Linearity (full range) DNL –±2–LSB
12 Bx, By and Bz
Differential Non Linearity (short range) DNLSR –±4
Integral Non Linearity (full range) INL –±2–LSB
12 Bx, By and Bz
Integral Non Linearity (short range) INLSR –±4–LSB
12 Bx, By and Bz
Magnetic noise (rms) BNeff 1 mT rms = 1 sigma
Z-Magnetic noise (rms) BNeffZ 0.5 mT rms = 1 sigma,
-40°C < Tj < +85°C
XY-Magnetic noise (rms) BNeffXY ––0.25mT
@neon 1) The temperature measurement is not trimmed on the sensor. An external uC can measure the sensorduring module
Data Sheet 13 Ver. 1.3
2019-04-09
TLE493D-A2B6
Specification
Conversion register value to magnetic field value:
The conversion is realized by the two’s complement. Please use following table for transformation:
Example for 12-bit read out: 1111 0000 1111B: -2048 + 1024 + 512 + 256 + 0 + 0 + 0 + 0 + 8 + 4 + 2 +1 = -241 LSB12
Calculation of magnetic flux: -241 LSB12 * 0.13 mT/LSB12 = -31.3 mT
Example for 8-bit read out: 0101 1101B: 0 + 64 + 0 + 16 + 8 + 4 + 0 + 1 = 93 LSB8
Calculation of magnetic flux: 93 LSB8 * 2.08 mT/LSB8 = 193.4 mT
3.5 Temperature Measurement
By default, the temperature measurement is activated. The temperature measurement can be disabled if it is
not needed and to increase the speed of repetition of the magnetic values.
Example for 12-bit calculation: 0110 1010 11B: 0 + 1024 + 0 + 256 + 0 + 0 + 32 + 0 + 8 + 4 = 1324 LSB12
Calculation to temperature: (1324 LSB12 - 1180 LSB12) * 0.24 K/LSB12 + 25°C 60°C
Table 11 Magnetic conversion table for 12Bit
MSB Bit10 Bit9 Bit8 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 LSB
[Dec] -2048 1024 512 256 128 64 32 16 8421
[Bin] e.g.111100001111
Table 12 Magnetic conversion table for 8Bit
MSB Bit10 Bit9 Bit8 Bit7 Bit6 Bit5 LSB
[Dec] -128 64 32 16 8 4 2 1
[Bin] e.g.01011101
Table 13 Temperature Measurement Characteristics1)
1) The temperature measurement is not trimmed on the sensor. An external μC can measure the sensor during module
production and implement external trimming to gain higher accuracies.
Temperature values are based on 12 bit resolution. Please note: only bit 11 ... 2 are listed in the bitmap registers.
Parameter Symbol min typ max Unit Note/Condition
Digital value @ 25°C T25 1000 1180 1360 LSB12
Temperature resolution, 12-bit TRes12 0.21 0.24 0.27 K/LSB12 referring to Tj
Temperature resolution, 8-bit TRes8 –3.84–K/LSB
8referring to Tj
Table 14 Temperature conversion table for 12Bit
The bits MSB to Bit2 are read out from the temperature value registers. Bit1 and LSB are added to get a 12-bit
value for calculation.
MSB Bit10 Bit9 Bit8 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2
[Dec] -2048 1024 512 256 128 64 32 16 8 4
[Bin] e.g.0101001011
@neon 1) Not subject to production test - verified by design/characterization. l :1 -O‘24ms-f
Data Sheet 14 Ver. 1.3
2019-04-09
TLE493D-A2B6
Specification
3.6 Overview of Modes
For a good adaptation on application requirements this sensor is equipped with different modes. An overview
is listed in Table 15.
I2C triggered Master-Controlled Mode typical IDD current consumption estimation formula:
Equation IDD full range (3.3)
Equation IDD short range (3.4)
The average supply current IDDin the 2 Low Power Modes and I2C triggered mode will decrease by about 25 %
if the temperature measurement is disabled and will decrease by about 50 % if the temperature and Bz
measurement is disabled.
Table 15 Overview of modes1)
1) Not subject to production test - verified by design/characterization.
Mode Measurements Typ. fUpdate2)
2) This is the frequency at which specified measurements are updated.
Description
Power Down No measurements Lowest possible supply current IDD.
Low Power Mode
(full range and
short range)
Bx, By, Bz, T 10 Hz or 160 Hz Cyclic measurements and ADC-conversions
with different update rates.
Bx, By, Bz
Bx, By
Fast Mode
(full range)
Bx, By, Bz, T 5.7 kHz Measurements and ADC conversions are
running continuously.
An I2C clock speed 800 kHz and use of the
interrupt /INT is required.
Bx, By, Bz 7.5 kHz
Bx, By 8.4 kHz
Fast Mode
(short range)
Bx, By, Bz, T 4.2 kHz
Bx, By, Bz 5.5 kHz
Bx, By 6.2 kHz
Master-Controlled Mode
(full range and
short range)
Bx, By, Bz, T
Bx, By, Bz
Bx, By
Up to Fast Mode
values.
Measurements triggered by the
microcontroller via I2C.
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@neon 1) Not subject to production test - verified by design/characterization
Data Sheet 15 Ver. 1.3
2019-04-09
TLE493D-A2B6
Specification
3.7 Interface and Timing Description
This chapter refers to how to set the boundary conditions in order to establish a proper interface
communication.
The fast mode, shown in Figure 7, requires a very strict I2C behavior synchronized with the sensor conversions
and high bit rates. In this mode, a fresh measurement cycle is started immediately after the previous cycle was
completed.
Other modes are available for more relaxed timing and also for a synchronous microcontroller operation of
sensor conversions. In these modes, a fresh measurement cycle is only started if it is triggered by an internal
or external trigger source.
In the default measurement configuration (Bx, By, Bz and T), shown in Figure 7, the measurement cycle ends
after the temperature measurement.
In 3-channel measurement configuration (Bx, By and Bz), the temperature channel is not converted and
updated. Thus, the measurement cycle ends after the Bz measurement.
Table 16 Interface and timing1)
1) Not subject to production test - verified by design/characterization
Parameter Symbol min typ max Unit Note/Condition
End of Conversion /INT pulse tINT 1.8 2.5 3.2 μs low-active (when activated)
Time window to read first value
(full range)
tRD1 30 40 50 μs read after rising /INT edge
Time window to read first value
(short range)
tRD1_SR 42 56 70 μs read after rising /INT edge
Time window to read next value
(full range)
tRDn 32 43 54 μsconsecutive reads
Time window to read next value
(short range)
tRDn_SR 44 59 74 μsconsecutive reads
Internal clock accuracy tclk_E -25 +25 %
I2C timings
Allowed I2C bit clock frequency2)
2) Dependent on R-C-combination on SDA and SCL. Ensure reduced capacitive load for speeds above 400 kHz.
fI2C_clk 400 1000 kHz
Low period of SCL clock tL0.5 – – μs1.3μs for 400-kHz mode
High period of SCL clock tH0.4 – – μs0.6μs for 400-kHz mode
SDA fall to SCL fall hold time
(hold time start condition to clock)
tSTA 0.4 – – μs0.6μs for 400-kHz mode
SCL rise to SDA rise su. time
(setup time clock to stop condition)
tSTOP 0.4 – – μs0.6μs for 400-kHz mode
SDA rise to SDA fall hold time
(wait time from stop to start cond.)
tWAIT 0.4 – – μs0.6μs for 400-kHz mode
SDA setup before SCL rising tSU 0.1 – – μs
SDA hold after SCL falling tHOLD 0––μs
Fall time SDA/SCL signal3)
3) Dependent on used R-C-combination.
tFALL 0.25 0.3 µs
Rise time SDA/SCL signal3) tRISE 0.5 µs R = 1.2 k
@ineon <______ :::3________="" 2="" \l]="" ”mnuunuwhl="" z="" x="" ,="" z="" wnw:="" ,="">
Data Sheet 16 Ver. 1.3
2019-04-09
TLE493D-A2B6
Specification
In X/Y angular measurement configuration (Bx and By), the Bz and temperature channel are not converted and
updated. Thus, the measurement cycle ends after the By measurement.
Figure 7 I2C readout frame, ADC conversion and related timing
Figure 8 I2C timing specification
Bx By Bz T
i2c_adr
X[n-1] X[n]
Y[n-1] Y[n]
Z[n-1]
Bx
T[n-1] T[n]
Z[n]
/INT (= SCL pin)
Y value register
Z value register
T value register
ADC conversion
chan. (fast mode)
X value register
t
INT
t
RD1
t
RDn
t
RDn
t
RDn
t
RD1
1 / update_rate (fast mode)
sens_regSX[n-1]MSBs
i2c bus protocol
SCL / SDA Y[n-1]MSB s Z[n-1]MSB s T[n-1]MSB s
X[n-1]
LSBs
Y[ n- 1]LSBs
Z[n-1]LSBs
T[n-1]LSBs
STATUS Pi2 c_ a d r sens_regSX[n-1]MSBs
SCL falling edge
@ ACK bit
reads X[n-1]
SCL falling edge
@ ACK bit
reads Y[n-1]
SCL falling edge
@ ACK bit
reads Z[n-1]
SCL falling edge
@ ACK bit
reads T[n-1 ]
M
Æ
SM
Æ
SS
Æ
MS
Æ
MS
Æ
MS
Æ
MS
Æ
MS
Æ
MS
Æ
Mtransmission direction M
Æ
SM
Æ
SS
Æ
M
corresponds to 10 bit addressing:
two bytes following a S condition
(i2c standard 1995, section 13.1)
status output starts
with odd parity bit of
last 6 bytes transmitted
f
i2 c _c l k
*) setup/hold time for i2c readout to register value.
time must be either: or:
1
t
S/H
*)
t
S/H
*)
t
S/H
*)
t
S/H
*)
t
S/H
-
1
t
S/H
f
i2 c _c l k
shadowed LSBs
from prev .
MSBs read
addressing options ;
R/W bit is 1
first reg ist e r
address is 0,
trigger bits are 0
µC can star t
readout after
/INT (=SCL) is
high again
(update after read) (update before read)
30% V
DD
70% V
DD
30% V
DD
70% V
DD
t
L
t
H
t
STOP
t
WAIT
t
STA
SCL
pin
SDA
pin
t
HOL D
t
SU
1 bit transfer STOP cond. START cond.
t
RISE
t
FALL
@neon l) Accordingto Jedec JESDSl-‘I .L'fi‘ 1.825 WIII
Data Sheet 17 Ver. 1.3
2019-04-09
TLE493D-A2B6
Package Information
4 Package Information
4.1 Package Parameters
Figure 9 Image of TLE493D-A2B6 in TSOP6
Figure 10 Footprint PG-TSOP6-6-8 (compatible to PG-TSOP6-6-5, all dimensions in mm)
Table 17 Package Parameters
Parameter Symbol Limit Values Unit Notes
Min. Typ. Max.
Thermal resistance1)
Junction ambient
1) According to Jedec JESD51-7
RthJA 200 K/W Junction to air
for PG-TSOP-6-6-8
Thermal resistance
Junction lead
RthJL 100 K/W Junction to lead
for PG-TSOP-6-6-8
Soldering moisture level2)
2) Suitable for reflow soldering with soldering profiles according to JEDEC J-STD-020D.1 (March 2008)
MSL 1 260°C
@neon 2L0 2 ME TO nm em 1+ mu 0 35-0 05 095 $-E 2.9, 01 MAX (2251 32: (o 35) 5-. g 3 L ‘ I; g 3F ~ : I R \ 2 Sin IO 1 6mm REMARK WAVE SOLDER‘NG POSS‘BLE DER UN [USTOMERS PROCESS CONDWONS ZSBOOW83695702
Data Sheet 18 Ver. 1.3
2019-04-09
TLE493D-A2B6
Package Information
4.2 Package Outlines
Figure 11 Package Outlines (all dimensions in mm)
@neon 0.23 1.2 REFER TO ZSBO183011702
Data Sheet 19 Ver. 1.3
2019-04-09
TLE493D-A2B6
Package Information
Figure 12 Packing (all dimensions in mm)
Further information about the package can be found here:
http://www.infineon.com/cms/packages/SMD_-_Surface_Mounted_Devices/TSOP/TSOP6.html
@neon
Data Sheet 20 Ver. 1.3
2019-04-09
TLE493D-A2B6
Revision History
5 Revision History
Revision History
Page or Item Subjects (major changes since previous revision)
Ver. 1.3, 2019-04-09
Chapter 3.2 text “I2C reset” updated.
Ver. 1.2, 2019-02-08
Figure 4, Figure 11 and Figure 12 updated.
Ver. 1.1, 2018-05-03
Table 9 updated.
Ver. 1.0, 2018-04-10
Initial version
Trademarks
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Edition 2019-04-09
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2019 Infineon Technologies AG.
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