MAX22195 Datasheet by Maxim Integrated

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MAX22195 High-Speed, Octal, Industrial Digital Input maxim Integrated ,,
General Description
The MAX22195 translates eight 24V industrial digital inputs
to eight CMOS-compatible, parallel outputs. Propagation
delay from input-to-output is less than 300ns for all channels.
Current-limiters on each digital input greatly reduce power
dissipation compared to traditional resistive inputs. The
accuracy of these current-limiters minimizes power
dissipation while ensuring compliance with the IEC
61131-2 standard. A current-setting resistor allows the
MAX22195 to be configured for Type 1, Type 2, or Type
3 inputs. Additionally, the MAX22195 has energyless field-
side LED drivers to meet the indicator light requirement of
IEC 61131-2 with no additional power dissipation.
The MAX22195 provides a 3.3V integrated voltage
regulator. The internal LDO accepts the field supply
VDD24 from 7V to 65V. The internal LDO output can
supply up to 25mA of current in addition to powering the
basic MAX22195 requirements. This MAX22195 LDO
current can be used to power digital isolators and other
field-side circuits. Alternatively, the MAX22195 can be powered
from a 3.0V to 5.5V supply connected to VDD3 pin.
The MAX22195 includes an open-drain READY output
that asserts high to indicate the MAX22195 is functional.
If the VDD24 field-side supply voltage is too low, or a fault
in the current-setting resistor is detected, or the device
reaches an over-temperature condition, the READY sig-
nal is set to high-impedance.
Applications
Programmable Logic Controllers
Industrial Automation
Process Automation
Building Automation
Benefits and Features
High-Speed, Industrial Digital Inputs
300ns Maximum Propagation Delay
±10ns Maximum Channel-to-Channel Skew
Parallel Output for Simultaneous Signal Delivery
High Integration Reduces BOM Count and Board Space
Operates Directly from Field Supply (7V to 65V)
Compatible with 3.3V or 5V Logic
5mm x 5mm, 32-TQFN Package
Low Power and Low Heat Dissipation
Low Quiescent Current (1.2mA Maximum)
Accurate Input Current-Limiters
Energyless Field-Side LED Drivers
Fault Tolerant with Built-In Diagnostics
Integrated Field-Side Supply Monitor
Integrated Over-Temperature Monitor
Current-Setting Resistor Monitor
Configurability Enables Wide Range of Applications
Configurable IEC 61131-2 Types 1, 2, 3 Inputs
Configurable Input Current Limiting from 0.56mA to
3.97mA
Robust Design
±1kV Surge Tolerant using Minimum 1kΩ Resistor
±8kV Contact ESD and ±15kV Air Gap ESD Using
Minimum 1kΩ Resistor
-40°C to +125°C Ambient Operating Temperature
Ordering Information appears at end of data sheet.
19-100330; Rev 6; 3/21
MAX22195 High-Speed, Octal, Industrial Digital Input
with Parallel Output
EVALUATION KIT AVAILABLE
Click here to ask about production status of specific part numbers.
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MAX22195 High-Speed, Octal, Industrial Digital Input
with Parallel Output
Octal Digital Input with Parallel Output
MICROCONTROLLER
V
DD24
OP5
OP2
OP3
V
DD3
GND
MAX22195
24V
IN1
LED1
IN2
LED2
IN8
LED8
EXTVM
INF (INPUT FIELD) INP (IN PUT PI N)
3.3V
V
DD
1µF 0.F 0.F
OP1
OP6
OP7
OP8
GPI4
GPI
READY
OP4
GPI5
GPI6
GPI7
GPI8
GPI3
GPI2
GPI1
RD YEN
GND
1.5k
1.5k
1.5k
4.7k
REFDI
8.6k
1µF
VDD3 to GND .........................................................-0.3V to +6V
VDD24 to GND ....................................................... -0.3V to +70V
OP1–OP8 ..................................................-0.3V to VDD3 + 0.3V
IN1–IN8 to GND .....................................................-40V to +40V
REFDI to GND ...........................................-0.3V to VDD3 + 0.3V
READY, RDYEN to GND ......................................... -0.3V to +6V
EXTVM to GND .......................................................-0.3V to +6V
LED1–LED8 to GND ...............................................-0.3V to +6V
Continuous Power Dissipation
Multilayer Board TA = +70°C .....................................2222mW
Derate above +70°C ............................................27.80mW/°C
Operating Temperature Range ........................................ +125°C
Maximum Junction Temperature ..................................... +150°C
Storage Temperature Range ............................ -65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering(reflow) .............................................................+260°C
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MAX22195 High-Speed, Octal, Industrial Digital Input
with Parallel Output
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.
For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Package Information
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”,
“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
PACKAGE TYPE: 32 TQFN
Package Code T3255+6
Outline Number 21-0140
Land Pattern Number 90-0603
THERMAL RESISTANCE, MULTILAYER BOARD
Junction to Ambient (θJA) 36°C/W
Junction to Case (θJC) 3°C/W
VDD3 to GND = +3.0V to +5.5V, TA = -40°C to +125°C, unless otherwise noted. CL on OP1-OP8 = 15pF. Typical values are at VDD3
to GND = +3.3V, VDD24 to GND = +24V, Field Inputs IN1-IN8 = +24V, and TA = +25°C. (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
POWER SUPPLIES
Supply Voltage VDD24 Normal operation 7 65 V
VDD3 Powered from an external power supply 3.0 5.5 V
Supply Current Powered
from VDD24
IDD24
VDD24 = 24V, IN1-IN8 = 0V,
LED_ = GND, no load on OP1-OP8 0.6 1.2 mA
Supply Current Powered
from VDD3
IDD3
VDD3 = 3.3V, IN1-IN8 = 0V, LED_ = GND,
no load on OP1-OP8, VDD24 floating 0.6 1.2 mA
VDD3 Undervoltage-Lockout
Threshold VUVLO3
Powered from VDD3, VDD3 rising
VDD24 floating 2.4 2.9 V
VDD3 Undervoltage-Lockout
Threshold Hysteresis VUVHYST3 0.07 V
VDD24 READY Threshold VREADY_24VR VDD24 rising, EXTVM = GND 13.8 14.6 15.4 V
VREADY_24VF VDD24 falling, EXTVM = GND 13.3 14.1 15.0 V
VDD24 Undervoltage-Lockout
Threshold VUVLO24 VDD24 rising 6.0 6.8 V
VDD24 Undervoltage-Lockout
Threshold Hysteresis VUVHYST24 0.45 V
Regulator Output Voltage VDD3 ILOAD = 1mA, VDD24 = 7V to 65V 3.0 3.3 3.6 V
Line Regulation dVDDLINE ILOAD = 1mA, VDD24 = 12V to 24V 0 mV
Load Regulation dVDDLOAD ILOAD = 1mA to 10mA, VDD24 = 12V 1 mV
Short-Circuit Current Limit IDD24_SC
VDD24 current when VDD3 short to
GND, VDD24 = 12V 28 37.5 50 mA
VDD24 MONITOR
EXTVM Glitch Filter 3 µs
EXTVM Threshold Off to On V24TH_OFF_ON VDD24 rising 0.77 0.81 0.84 V
EXTVM Threshold On to Off V24TH_ON_OFF VDD24 falling 0.74 0.79 0.82 V
External EXTVM Selection
Threshold EXTVM_SEL 0.3 V
External EXTVM Selectable
VDD24 Threshold EXTVM_VDD24 10 30 V
EXTVM Leakage Current IEXTVM_L -1 1 µA
THERMAL SHUTDOWN
Thermal-Shutdown Threshold TSHDN VDD3 internal regulator off 165 °C
Thermal-Shutdown Hysteresis TSHDN_HYS 10 °C
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MAX22195 High-Speed, Octal, Industrial Digital Input
with Parallel Output
DC Electrical Characteristics
VDD3 to GND = +3.0V to +5.5V, TA = -40°C to +125°C, unless otherwise noted. CL on OP1-OP8 = 15pF. Typical values are at VDD3
to GND = +3.3V, VDD24 to GND = +24V, Field Inputs IN1-IN8 = +24V, and TA = +25°C. (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
CURRENT LIMITING SETTING
REFDI Voltage VREFDI 0.61 V
Current-Limit Setting Resistor RREFDI 5.2 8.6 36 kΩ
REFDI Pin Short REFDI_S Increasing current at pin REFDI 550 µA
Decreasing current at pin REFDI 548 µA
REFDI Pin Open REFDI_O Increasing current at pin REFDI 4.46 µA
Decreasing current at pin REFDI 7.21 µA
IC INPUTS (TYPE 1, 2, 3)
Input Current Limit -40V < VIN_ < 0V, VIN_ at IN1 - IN8 pins 100 µA
LED On-State Current ILED_ON RREFDI = 8.6kΩ, VLED = 3V 1.5 mA
DI Leakage, Current Sources
Disabled IDI_LEAK
IN1 – IN8 = 28V 40 58 80 µA
IN1 – IN8 = 6V 8 11.4 16
Input Threshold Low-to-High VTHP+ IN1 – IN8 5.6 6 V
Input Threshold High-to-Low VTHP_ IN1 – IN8 4.4 4.7 V
Input Threshold Hysteresis VINPHYST IN1 – IN8 0.9 V
FIELD INPUTS TYPE 1, 3: (EXTERNAL SERIES RESISTOR RIN = 1.5KΩ, RREFDI = 8.6KΩ)
Field-Input Current Limit IINLIM
6V (VTHP+ MAX) VIN_ at the pin ≤ 28V,
LED on, RREFDI = 8.6kΩ (Note 2) 2.15 2.40 2.65 mA
Field Input Threshold
Low-to-High VINF+
RREFDI = 8.6kΩ, 1.5kΩ external series
resistor 10 V
Field Input Threshold
High-to-Low VINF-
RREFDI = 8.6kΩ, 1.5kΩ external series
resistor 8 V
FIELD INPUTS TYPE 2: (EXTERNAL SERIES RESISTOR RIN = 1KΩ , RREFDI = 5.2KΩ)
Field-Input Current Limit IINLIM
6V (VTHP+ MAX) VIN_ at the pin ≤ 28V,
LED on, RREFDI = 5.2kΩ (Note 2) 3.55 3.97 4.39 mA
Field Input Threshold
Low-to-High VINF+
RREFDI = 5.2kΩ, 1kΩ external series
resistor 10 V
Field Input Threshold
High-to-Low VINF-
RREFDI = 5.2kΩ, 1kΩ external series
resistor 8 V
LOGIC INPUT (RDYEN)
Input Logic-High Voltage VIH
0.7 x
VDD3
V
Input Logic-Low Voltage VIL
0.3 x
VDD3
V
Input Pulldown Resistance RPD 199
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MAX22195 High-Speed, Octal, Industrial Digital Input
with Parallel Output
DC Electrical Characteristics (continued)
VDD3 to GND = +3.0V to +5.5V, TA = -40°C to +125°C, unless otherwise noted. CL on OP1-OP8 = 15pF. Typical values are at VDD3
to GND = +3.3V, VDD24 to GND = +24V, Field Inputs IN1-IN8 = +24V, and TA = +25°C. (Note 1)
Note 1: All units are production tested at TA = +25°C. Specifications over temperature are guaranteed by design.
Note 2: External resistor REFDI is selected to set any desired current limit between 0.56mA to 3.97mA (typical values). The current
limit accuracy of ±10.6% is guaranteed for values greater or equal to 2mA.
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
LOGIC OUTPUT (OP1-OP8, READY)
Output Logic-High Voltage VOH Sourcing 4mA VDD3 -
0.4 V
Output Logic-Low Voltage VOL Sinking 4mA 0.4 V
DYNAMIC CHARACTERISTICS (OP1-OP8)
Propagation Delay
Low-to-High (Figure 1)tPDLH IN_ to OP_, RIN = 1.5kΩ,
IN_ = 11V and 36V 300 ns
Propagation Delay
High-to-Low (Figure 1)tPDHL IN_ to OP_, RIN = 1.5kΩ,
IN_ = 11V and 36V 300 ns
Propagation Delay Skew
Channel-to-Channel (Figure 1)tPDSKEW_CH IN_ to OP_, RIN = 1.5kΩ,
IN_ = 11V and 36V -10 10 ns
Propagation Delay Skew
Part-to-Part (Figure 1)tPDSKEW_PART IN_ to OP_, RIN = 1.5kΩ, IN_ = 11V and 36V,
All conditions are the same between parts -200 +200 ns
Propagation Delay Jitter tPDJ_R Output Rising, VDD3 = 3.3V, IN_ = 24V 40 ps
tPDJ_F Output Falling, VDD3 = 3.3V, IN_ = 24V 50 ps
Detectable Pulse Width
(Figure 1)tPW IN_ to OP_, RIN = 1.5kΩ,
IN_ = 11V and 36V 220 ns
Pulse Width Distortion PWD |tPDLH - tPDHL|0 180 ns
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MAX22195 High-Speed, Octal, Industrial Digital Input
with Parallel Output
DC Electrical Characteristics (continued)
Figure 1. Test Circuit (A) and Timing Diagram (B)
PARAMETER SYMBOL CONDITIONS VALUE UNITS
Surge
Line-to-Line IEC 61000-4-5, 1.2/50µs pulse, minimum 1kΩ resistor in
series with IN1–IN8 ±2
kV
Line-to-Ground IEC 61000-4-5, 1.2/50µs pulse, minimum 1kΩ resistor in
series with IN1–IN8 ±1
ESD
Human Body Model All Pins ±2
Contact Discharge IEC 61000-4-2, minimum 1kΩ resistor in series with IN1–IN8 ±8
Air-Gap Discharge IEC 61000-4-2, minimum 1kΩ resistor in series with IN1–IN8 ±15
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MAX22195 High-Speed, Octal, Industrial Digital Input
with Parallel Output
ESD and EMC Characteristics
IN1, IN2 50% 50%
50% 50%
50%
(A)
0.1µF
1.5k
FIELD INPUT
IN_
C
L
R
L
(B)
50%
MAX22195
OP_
V
DD24
V
DD24
V
DD3
GND
OP1
OP2
GND
GND
GND
t
PDSKEW_CH
t
PDSKEW_CH
t
PULSEMIN
V
DD3
V
DD3
FIELD INPUT
t
PDLH
t
PDHL
1µF
8.6k
REFDI
0.1µF 1µF
(VDD24 = 24V, VDD3 = 3.3V, TA = +25°C, RREFDI = 8.6kΩ or 5.2kΩ, RIN = 1.5kΩ or 1kΩ, unless otherwise noted.)
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MAX22195 High-Speed, Octal, Industrial Digital Input
with Parallel Output
Typical Operating Characteristics
0.60
0.70
0.80
0.90
1.00
1.10
1.20
515 25 35 45 55 65
SUPPLY CURRENT (mA)
VDD24 SUPPLY VOLTAGE (V)
VDD24 SUPPLY CURRENT
vs. VDD24 SUPPLY VOLTAGE
toc01
EXTVM = GND, ALL VIN_ = 24V
READY RP ULLDOWN = 10k
0.82
0.85
0.88
0.91
0.94
0.97
-50 -25 025 50 75 100 125
SUPPLY CURRENT (mA)
TEMPERATURE (C)
VDD3 SUPPLY CURRENT
vs. TEMPERATURE
toc04
VDD3 = 3.3V, VDD24 FLOATING,
EXTVM = VDD3, ALL VIN_ = 24V,
READY RP ULLDOWN = 10k
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
510 15 20 25 30 35
INPUT CURRENT LIMIT (mA)
RREFDI (kΩ)
INPUT CURRENT LIMIT IINLIM
vs. RREFDI
toc07
VIN_ = 40V
0.70
0.80
0.90
1.00
1.10
1.20
1.30
1.40
33.5 44.5 55.5
SUPPLY CURRENT (mA)
VDD3 SUPPLY VOLTAGE (V)
VDD3 SUPPLY CURRENT
vs. VDD3 SUPPLY VOLTAGE
toc02
V
DD24
FLOATING, EXTVM = V
DD3
,
ALL VIN_ = 24V, READY R
PULLDOWN
= 10k
0.82
0.86
0.90
0.94
0.98
1.02
0 8 16 24 32 40
SUPPLY CURRENT (mA)
INPUT VOLTAGE (V)
VDD24 SUPPLY CURRENT
vs. VIN_ INPUT VOLTAGE
toc05
VDD24 = 24V, READY RPULLDOWN = 10k
ALL VIN_ SHORTED TOGETHER,
ALL VIN_ MEASURED AT THE PIN,
EXTVM = GND
2.0
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
-50 -25 025 50 75 100 125
INPUT CURRENT LIMIT (mA)
TEMPERATURE (C)
INPUT CURRENT LIMIT IINLIM
vs. TEMPERATURE
toc08
VDD24 = 24V, VIN_ = 24V,
RREFDI = 8.6kΩ
0.70
0.80
0.90
1.00
1.10
1.20
-50 -25 025 50 75 100 125
SUPPLY CURRENT (mA)
TEMPERATURE (C)
VDD24 SUPPLY CURRENT
vs. TEMPERATURE
toc03
VDD24 = 24V, EXTVM = GND,
ALL VIN_ = 24V, READY RPULLDOWN = 10k
0.73
0.76
0.79
0.82
0.85
0.88
0.91
0 8 16 24 32 40
SUPPLY CURRENT (mA)
INPUT VOLTAGE (V)
VDD3 SUPPLY CURRENT
vs. VIN_ INPUT VOLTAGE
toc06
VDD3 = 3.3V, VDD24 FLOATING,
ALL VIN_ SHORTED TOGETHER,
ALL VIN_ MEASURED AT THE PIN,
EXTVM = VDD3, READY RPULLDOWN = 10k
2.336
2.338
2.340
2.342
2.344
2.346
2.348
33.5 44.5 55.5
INPUT CURRENT LIMIT (mA)
VDD3 SUPPLY VOLTAGE (V)
INPUT CURRENT LIMIT IINLIM
vs. VDD3 SUPPLY VOLTAGE
toc09
VDD3 = 3.3V, VDD24 FLOATING,
VIN_ = 24V, RREFDI = 8.6kΩ
(VDD24 = 24V, VDD3 = 3.3V, TA = +25°C, RREFDI = 8.6kΩ or 5.2kΩ, RIN = 1.5kΩ or 1kΩ, unless otherwise noted.)
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MAX22195 High-Speed, Octal, Industrial Digital Input
with Parallel Output
Typical Operating Characteristics (continued)
0.0
0.8
1.6
2.4
3.2
4.0
4.8
0 5 10 15 20 25 30 35 40
INPUT CURRENT LIMIT (mA)
INPUT VOLTAGE (V)
INPUT CURRENT LIMIT IINLIM
vs. VIN_ INPUT VOLTAGE
toc10
VDD24 = 24V, RREFDI = 5.2kΩ
VIN_ AT THE PIN
5
6
7
8
9
10
-50 -25 025 50 75 100 125
INPUT VOLTAGE THRESHOLD (V)
TEMPERATURE (C)
INPUT VOLTAGE THRESHOLD
vs. TEMPERATURE
toc13
VDD24 = 24V, RIN = 1kΩ
LOW-TO-HIGH
HIGH-TO-LOW
3.20
3.23
3.26
3.29
3.32
3.35
0 5 10 15 20 25 30
VDD3 OUTPUT VOLTAGE (V)
VDD3 OUTPUT CURRENT (mA)
LDO LOAD REGULATION
toc16
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0 5 10 15 20 25 30 35 40
INPUT CURRENT LIMIT (mA)
INPUT VOLTAGE (V)
INPUT CURRENT LIMIT IINLIM
vs. VIN_ INPUT VOLTAGE
toc11
VDD24 = 24V, RREFDI = 8.6kΩ
VIN_ AT THE PIN
3
4
5
6
7
-50 -25 025 50 75 100 125
INPUT VOLTAGE THRESHOLD (V)
TEMPERATURE (C)
INPUT VOLTAGE THRESHOLD
vs. TEMPERATURE
toc14
VDD24 = 24V, RIN = 0Ω
LOW-TO-HIGH
HIGH-TO-LOW
3.20
3.23
3.26
3.29
3.32
3.35
515 25 35 45 55 65
VDD3 OUTPUT VOLTAGE (V)
VDD24 SUPPLY VOLTAGE (V)
LDO LINE REGULATION
toc17
IVDD3 = 5mA
6
7
8
9
10
11
-50 -25 025 50 75 100 125
INPUT VOLTAGE THRESHOLD (V)
TEMPERATURE (C)
INPUT VOLTAGE THRESHOLD
vs. TEMPERATURE
toc12
VDD24 = 24V, RIN = 1.5kΩ
LOW-TO-HIGH
HIGH-TO-LOW
0.75
0.80
0.85
0.90
0.95
1.00
-50 -25 025 50 75 100 125
INPUT VOLTAGE HYSTERESIS (V)
TEMPERATURE (C)
INPUT VOLTAGE HYSTERESIS
vs. TEMPERATURE
toc15
RIN = 0Ω
RIN = 1kΩRIN = 1.5kΩ
3.20
3.24
3.28
3.32
3.36
3.40
-50 -25 025 50 75 100 125
VDD3 OUTPUT VOLTAGE (V)
TEMPERATURE (C)
LDO OUTPUT VOLTAGE
vs. TEMPERATURE
toc18
IVDD3 = 5mA
IVDD3 = 20mA
MW «WW.— may..." I. I‘VAW
(VDD24 = 24V, VDD3 = 3.3V, TA = +25°C, RREFDI = 8.6kΩ or 5.2kΩ, RIN = 1.5kΩ or 1kΩ, unless otherwise noted.)
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MAX22195 High-Speed, Octal, Industrial Digital Input
with Parallel Output
Typical Operating Characteristics (continued)
10
15
20
25
30
35
40
515 25 35 45 55 65
SHORT-CIRCUIT CURRENT (mA)
SUPPLY VOLTAGE (V)
LDO SHORT-CIRCUIT CURRENT
vs. VDD24 SUPPLY VOLTAGE
toc19
THERMAL SHUTDOWM IS NOT TRIGGERED
0
0.8
1.6
2.4
3.2
4
0
0.5
1
1.5
2
2.5
3
0 8 16 24 32 40
OUTPUT VOLTAGE (V)
INPUT CURRENT LIMIT (mA)
INPUT VOLTAGE (V)
INPUT CURRENT LIMIT IINLIM
AND OUTPUT VOLTAGE
vs. VIN_ INPUT VOLTAGE
toc22
INPUT CURRENT
OUTPUT VOLTAGE
INPUT HIGH-TO-LOW,
VDD24 = 24V, RREFDI = 8.6kΩ,
VIN_ MEASURED AT THE PIN
10V/div
2V/div
toc25
40ns/div
PROPAGATION DEALY
HIGH-TO-LOW
LED PRESENT
FIELD INPUT VIN_
OP_
10
15
20
25
30
35
40
-50 -25 025 50 75 100 125
SHORT-CIRCUIT CURRENT (mA)
TEMPERATURE (C)
LDO SHORT-CIRCUIT CURRENT
vs. TEMPERATURE
toc20
THERMAL SHUTDOWM IS NOT TRIGGERED
8
8.5
9
9.5
10
10.5
11
11.5
12
-50 -25 025 50 75 100 125
EXTVM THRESHOLD (V)
TEMPERATURE (C)
EXTVM THRESHOLD VOLTAGE
vs. TEMPERATURE
toc23
LOW-TO-HIGH
HIGH-TO-LOW
EXTVM EXTERNAL RESISTORS = 11k/1k
10V/div
2V/div
toc26
40ns/div
PROPAGATION DEALY
LOW-TO-HIGH
LED SHORTED TO GND
FIELD INPUT VIN_
OP_
0
0.8
1.6
2.4
3.2
4
0
0.5
1
1.5
2
2.5
3
0 8 16 24 32 40
OUTPUT VOLTAGE (V)
INPUT CURRENT LIMIT (mA)
INPUT VOLTAGE (V)
INPUT CURRENT LIMIT IINLIM
AND OUTPUT VOLTAGE
vs. VIN_ INPUT VOLTAGE
toc21
INPUT CURRENT
OUTPUT VOLTAGE
INPUT LOW-TO-HIGH,
VDD24 = 24V, RREFDI = 8.6kΩ,
VIN_ MEASURED AT THE PIN
10V/div
2V/div
toc24
40ns/div
PROPAGATION DEALY
LOW-TO-HIGH
LED PRESENT
FIELD INPUT VIN_
OP_
10V/div
2V/div
toc27
40ns/div
PROPAGATION DEALY
HIGH-TO-LOW
LED SHORTED TO GND
FIELD INPUT VIN_
OP_
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MAX22195 High-Speed, Octal, Industrial Digital Input
with Parallel Output
Pin Configuration
MAX22195
TQFN
5mm x 5mm
TOP VIEW
LED1
LED2
IN3
LED3
IN4
IN1
LED8
LED7
IN6
IN8
LED6
IN5
1 2
RDYEN
4 5 6 7
READY
VDD24
OP6
OP5
OP4
OP3
IN2 IN7
3
VDD3 OP2
GND OP1
+
EXTVM
OP7
REFDI
OP8
LED4 LED5
8
GND 16
15
14
13
12
11
10
9
1718192021222324
26
25
27
28
29
30
31
32
PIN NAME FUNCTION
POWER SUPPLY
30 VDD24 24V Field Supply. Bypass to GND with 0.1μF capacitor in parallel with 1μF capacitor.
31 VDD3
3.3V output from integrated LDO when powered from VDD24, or 3.0 - 5.5V supply input when
VDD24 not driven. Bypass to GND with 0.1μF capacitor in parallel with 1μF capacitor. If powering
VDD3 from an external supply, leave VDD24 floating. VDD3 output is turned off during thermal shutdown.
25, 32 GND Ground Return for All Signals and the Power Supplies
EP - Exposed Pad. Connect to GND. Solder entire exposed pad area to ground plane with multiple vias
for best thermal performance. EP = exposed pad on the back of the package
ANALOG PINS
27 EXTVM
Connect EXTVM to GND to use internal thresholds (14V, typical) for VDD24 voltage monitoring.
Connect EXTVM to external resistive divider to set external thresholds for VDD24 voltage monitoring.
Connect EXTVM to VDD3 to disable VDD24 voltage monitoring at READY pin if the device is powered
by VDD3.
26 REFDI Digital Input Current-Limit Reference Resistor. For 24V Type 1 and Type 3 inputs, place a 8.6kΩ
resistor from REFDI to GND. For Type 2 inputs, place a 5.2kΩ resistor from REFDI to GND.
INPUT PINS
1,3,5,7,18,
20,22,24
IN1-IN8
respectively
Field Inputs. For 24V Type 1 and Type 3 inputs, place a 1.5kΩ resistor between the field input and
IN_ pin. For Type 2 inputs, place a 1kΩ resistor between the field input and IN_ pin. Capacitors for
filtering should not be connected to the IN_ pins. See the Surge Protection of Field Inputs section
for further information.
2,4,6,8,17,
19,21,23
LED1-LED8
respectively Energyless LED Driver Outputs. Connect to GND if LEDs are not used.
LOGIC PINS
9,10,11,12,
13,14,15,16
OP1-OP8
respectively
Logic Outputs. Indicate the state (high or low) of IN1-IN8. High level is VDD3. Low level is GND. If
thermal shutdown is triggered, OP1-OP8 are high-impedance.
28 RDYEN
Ready Enable. Has a weak internal pulldown. Assert high to enable the READY output. Cascade
the READY signal of multiple devices through a single isolator or a microcontroller input pin by
connecting the READY output of each device to the RDYEN input of the next device in the chain.
READY from the last device in the chain drives the isolator input, or the microcontrol GPI.
29 READY
Open-drain output. Connect a pulldown resistor between READY and GND pin. Assert high to
indicate the device is functional and the outputs are valid. The following conditions must be met for
READY to assert high:
1. VDD3 is above the UVLO threshold.
2. REFDI is not open or shorted to GND.
3. MAX22195 is not in Thermal Shutdown.
4. RDYEN is high.
5. VDD24 is valid if the device is powered by VDD24 and EXTVM is not connected to VDD3.
www.maximintegrated.com Maxim Integrated
12
MAX22195 High-Speed, Octal, Industrial Digital Input
with Parallel Output
Pin Description
wsnom DETECHON
www.maximintegrated.com Maxim Integrated
13
MAX22195 High-Speed, Octal, Industrial Digital Input
with Parallel Output
Functional/Block Diagram
OP8
VDD24
IN PUT C HAN NEL 8
CMOS
OUTPU T
VREF
3.3V
REGULATOR
24V
MONITOR
3.3V
MONITOR
IN1
LED1
IN PUT C HAN NEL 1,
TYPICAL OF 8
IN8
LED8
VDD3
REFDI REFERENCE
GENERATORS
VREF
OP1
RDYEN
READY
3.3V
EXTVM
GND
TEMP
MONITOR
IREF
OPEN/SH ORT DE TEC TION
Type 1 lells Type 2 le115 Type 3 Limits DWRegimI Trans 0n OnReginn OflRegicn trans on OnReginn OflRegion lenslllnn DnRegicn VL 1L v'r IT VH 1H VL IL v7 1T VH 1H VL 1L VT 1T VH IH (V 1“) (V) (M W WA) (V) WA) V) M) (V ("W V) (mm M WA) (V) (M Max 15/5 15 15 15 an 15 11/5 so 11 30 am so 11/5 15 11 15 an 15 Min 73 ND 5 05 15 2 73 ND 5 2 11 s 73 ND 5 15 11 2
Detailed Description
The MAX22195 senses the state (on, high or off, low) of
each input (IN1-IN8). The voltages at the IN1–IN8 input
pins are compared against internal references to deter mine
whether the sensor is on (logic 1) or off (logic 0). Placing a
8.6kΩ current-setting resistor between REFDI and GND,
and a 1.5kΩ resistor in series with each input ensures
that the current at the on and off trip points as well as
the voltage at the trip points satisfy the requirements of
IEC 61131-2 for Type 1 and Type 3 inputs (Figure 2). The
current sunk by each input pin rises linearly with input
voltage until the level set by the current-limiter is reached;
any volt age increase beyond this point does not increase
the input current. Limiting the input current ensures
compliance with IEC 61131-2 while significantly reducing
power dissipation compared to traditional resistive inputs.
The current-setting resistor RREFDI can be calculated
using this equation:
IINLIM [mA] = VIN / 517 [V/kΩ] + 20.5 / RREFDI [V/kΩ]
where VIN is 5.6V at the input pin during production test
for the typical value of Type 1 and 3, and Type 2 current
limits.
RDYEN and READY Monitor
The READY output is used to signal a logic-side controller
that the field-side circuit is working. This allows the controller to
distinguish from a valid reading of eight low inputs or an
invalid reading caused by a field-side fault such as loss of
power. The READY output is asserted high when the
following five conditions are met: the UVLO voltage
threshold for VDD3 is exceeded; the VDD24 field supply
requirement is met as set by internal thresholds or EXTVM
external thresholds if enabled; the device is not in thermal
shutdown; current through the REFDI pin is in a reasonable
range (7.21µA to 550µA); and the RDYEN is high.
Ready Enable RDYEN is used to cascade other READY
signals through to a single digital isolation channel or a
microcontroller GPI pin. Connect the READY output of
one device to the RDYEN input of the next device in the
chain. Connect the final READY output to a digital isolator
or a microcontroller GPI pin. All READY signals must be
high for the final READY signal to go high. READY is an
open-drain PMOS output, driven to VDD3 for a high output
and set at high-impedance for a low output. Refer to
Typical Application Circuits for details.
Outputs OP1 - OP8 are high-impedance only when thermal
shutdown is triggered.
Figure 2. Switching Characteristics for IEC 61131-2 Type 1, 2, and 3 24VDC Digital Inputs
www.maximintegrated.com Maxim Integrated
14
MAX22195 High-Speed, Octal, Industrial Digital Input
with Parallel Output
VLMIN
Type
of
Limit
Type 1 Limits
Type 2 Limits
Type 3 Limits
Off Region
On Region
Off Region
Transition
On Region
Off Region
On Region
VL
(V)
IL
(mA)
VT
(V)
IT
(mA)
VH
(V)
IH
(mA)
VL
(V)
IL
(mA)
VT
(V)
IT
(mA)
VH
(V)
IH
(mA)
VL
(V)
IL
(mA)
VT
(V)
IT
(mA)
VH
(V)
IH
(mA)
Max
15/5
15
15
15
30
15
11/5
30
11
30
30
30
11/5
15
11
15
30
15
Min
-3
ND
5
0.5
15
2
-3
ND
5
2
11
6
-3
ND
5
1.5
11
2
0
IIN (mA)
VIN (V)
OFF REGION
ON REGION
TRANSIT ION REGION
VH MAX
VHMIN OR VTMAX
IH MIN IH MAX
ILMIN ILMAX
VLMAX OR VT M I N
ITMI N ITMAX
STANDARD OPERATING RANGE FOR 24V DC DIGITAL INPUTS (C UR REN T SINKI NG)
VLMAX
ND = NOT DEFINED
External VDD24 Voltage Monitor
The EXTVM input controls how the VDD24 field supply
affects the READY output. When EXTVM is connected
to VDD3, the status of the VDD24 field supply becomes a
don’t-care in the decision to assert READY. This is
useful when the MAX22195 is being powered directly
from a 3.3V supply on VDD3 and VDD24 is not in use.
When EXTVM is connected to GND, the voltage on
VDD24 must be above the nominal 14V threshold before
READY asserted high. To use an user-defined VDD24
supply voltage threshold, use an external resistive divider
to apply an analog voltage directly to EXTVM. The
voltage at EXTVM must be greater than the threshold,
0.81V (VREF) nominal, before READY asserted high.
Figure 3 shows an example of the VDD24 being monitored
with the use of external resistive divider to set a nominal
threshold before READY asserted high.
VDD24 = VREF (1 + (R2/R1))
Short/Open Detection at REFDI Pin
Short or open detection at REFDI pin is implemented by
monitoring the current set by REFDI pin.When more than
550µA current is detected, meaning a short at REFDI, the
2mA minimum input current is not guaranteed, and field
input low-to-high and high-to-low thresholds are changed.
When less than 7.21µA current is detected, meaning an
open at REFDI, the 2mA minimum input current is not
guaranteed. When open or short at REFDI pin is detect-
ed, the READY pin is not asserted.
Energyless LED Drivers
When IN_ is determined to be on, its input current is
diverted to the LED_ pin and flows from that pin to GND.
Placing an LED between LED_ and GND provides an
indication of the input state without increasing overall
power dissipation. If the indicator LEDs are not used,
connect LED_ to GND.
Type 2 Sensor Inputs
The additional input current (6mA min) and associated
power dissipation of Type 2 input require the use of two
MAX22195 inputs in parallel. The current of each channel
is set to a nominal 3.97mA (7.9mA total) by placing a 5.2kΩ
resistor from REFDI to GND. The proper voltage drop
across the input resistor is maintained by reducing the
resistance from 1.5kΩ to 1kΩ for each MAX22195
input channel. If lower input current is desired, the
REFDI resistor can be increased to 5.76kΩ or higher
as long as the 6mA minimum input current for Type 2
is met. For proper surge protection, it is important that
each MAX22195 input has its own resistor. Any two
MAX22195 channels may be used; they need not be
continuous (Figure 4). Either channel may be read to
determine the input state. The additional power dissipation
from this Type 2 configuration reduces the maximum
ambient operating temperature to 120°C, when all inputs
are at 30V, and the MAX22195s are powered from a 30V
field supply and there is no additional load on VDD3.
Thermal Considerations
The MAX22195 will operate at an ambient temperature
of 125°C on a properly designed multilayer PC board.
Operating at higher voltages, or with heavy output loads
such as optical isolators will increase power dissipation
and reduce the maximum allowable operating temperature.
See Package Information section and Absolute Maximum
Ratings section for safety operation temperature and maxi-
mum power dissipation.
The MAX22195 is in thermal shutdown when the thermal
shutdown temperature threshold is exceeded. During
thermal shutdown, the internal voltage regulator, input
channels, REFDI circuitry are all turned off, and outputs
OP1-OP8 are high-impedance.
Figure 3. User-Defined VDD24 Threshold Set by EXTVM and
External Resistive Divider
www.maximintegrated.com Maxim Integrated
15
MAX22195 High-Speed, Octal, Industrial Digital Input
with Parallel Output
MAX22195
V
DD24
V
DD3
24V
EXTVM
R2
R1
READY
GND
1µF
0.1µF
3.3V
REFDI
8.6kΩ
RDYEN
0.1µF
1µF
4.7kΩ
LTVWE iTv LTV
Figure 4. Implementing Type 2 Digital Inputs with MAX22195
www.maximintegrated.com Maxim Integrated
16
MAX22195 High-Speed, Octal, Industrial Digital Input
with Parallel Output
MAX22195 IMPLEMENTING 4-CHANNEL TYPE 2 DIGITAL INPUT
MAX22195
REFDI
OP5
IN1
LED1
IN2
LED2
IN7
LED7
IN8
LED8
CH1
CH4
V
DD3
MCU
GPI3
GPI
GPI1
READY
OP1
OP3
OP7 GPI4
GPI2
24V 3.3V
0.F
V
DD24
RD YEN
EXTVM
1µF 0.1µF
5.2k
1k
1k
1k
1k
GND
4.7k
1µF
GND
V
DD
Applications Information
Power Supply Decoupling
To reduce ripple and the chance of introducing data
errors, bypass VDD24 and VDD3 with a 0.1µF low-ESR
ceramic capacitor in parallel with 1µF ceramic capacitor to
GND, respectively. Place the bypass capaci tors as close
as possible to the power supply input pins.
Powering MAX22195 with VDD3
The MAX22195 can alternatively be powered using a 3.0
– 5.5V supply connected to the VDD3 pin. In this case, a
24V supply is no longer needed, the VDD24 pin must be left
unconnected and EXTVM pin is connected to VDD3 to dis-
able the VDD24 voltage monitoring, see Typical Application
Circuits for details. This configuration has lower power
consumption and heat dissipation since the on-chip LDO
voltage regulator is disabled (the VDD24 undervoltage
lockout is below threshold and automatically disables the
LDO).
PCB Layout Recommendations
The PCB designer should follow some critical
recommendations in order to get the best performance
from the design.
Keep the input/output traces as short as possible.
Avoid using vias on the signals to make low-
inductance paths.
Have a solid ground plane underneath the entire
exposed pad (EP) area with multiple thermal vias for
best thermal performance.
In order to achieve the highest EFT performance, it
is recommended to have the GND plane around the
REFDI traces, and isolate the REFDI traces from all
input traces, especially IN8, as much as possible. For
example, route input traces and REFDI traces on two
different layers and have a GND plane on the inner
layers in between.
IEC 61131-2 EMC Requirement
The MAX22195 is required to operate reliably in harsh
industrial environments. The device can meet the tran-
sient immunity requirements as specified in IEC 61131-2,
including Electrostatic Discharge (ESD) per IEC 61000-
4-2, Electrical Fast Transient/Burst (EFT) per IEC 61000-
4-4, and Surge Immunity per IEC 61000-4-5. Maxim’s
proprietary process technology provides robust input
channels and field supply with internal ESD structures
and high Absolute Maximum Ratings (see the Absolute
Maximum Ratings section), but external components are
also required to absorb excessive energy from ESD and
surge transients. The circuit with external components
shown in Figure 5 allows the device to meet and exceed
the transient immunity requirements as specified in IEC
61131-2 and related IEC 61000-4-x standards. The sys-
tem shown in Figure 5, using the components shown in
Table 1, is designed to be robust against ESD, EFT, and
Surge specifications as listed in Table 2. In all these tests,
the part or DUT is soldered onto a properly designed
application board (e.g., the MAX22195EVKIT#) with nec-
essary external components.
Table 1. Recommended Components for EMC compliance
COMPONENT DESCRIPTION REQUIRED/RECOMMENDED
C1 1μF, 100V ceramic capacitor Required
C2 0.1μF, 100V low-ESR ceramic capacitor Required
C3 1μF, 10V ceramic capacitor Required
C4 0.1μF, 10V low-ESR ceramic capacitor Required
C5 3.3nF, safety rated Y capacitor (2220) Recommended
D1 Unidirectional TVS diode SMBJ33A (42Ω) or SM30T39AY (2Ω) Recommended
R1 1.5kΩ or 1kΩ, 1W pulse withstanding resistor (CMB0207 or similar) Required
All other Resistors 0603, 0.1W resistors Required
All LEDs LEDs for visual input status indication Recommended
www.maximintegrated.com Maxim Integrated
17
MAX22195 High-Speed, Octal, Industrial Digital Input
with Parallel Output
LIV iTv LTv LIV
Figure 5. Typical EMC Protection Circuit for the MAX22195
www.maximintegrated.com Maxim Integrated
18
MAX22195 High-Speed, Octal, Industrial Digital Input
with Parallel Output
V
DD24
V
DD3
GND
MAX22195
24V
IN1
LED1
IN8
LED8
READY
REFDI
3.3V
GND
EAR TH
OP1
OP2
OP3
OP4
OP5
OP6
OP7
OP8
RD YEN
EXTVM
D1
C1 C2
8.6k
R1
R1
C5
C4 C3
4.7k
V
DD
GND
GPI1
GPI2
GPI3
GPI4
GPI5
GPI6
GPI7
GPI8
GPI
MICROCONTROLLER
GND
GND
GND
GND
GND
GND GND
GND
GND GND GND
ESD Protection of Field Inputs
The input resistor limits the energy into the MAX22195
IN_ pins and protects the internal ESD structure from
excessive transient energy. An input series resistor is
required and should be rated to withstand such ESD
levels. The MAX22195 input channels can withstand up
to ±8kV ESD contact discharge and ±15kV ESD air-gap
discharge with an input series resistor of 1kΩ or larger.
The input resistor value shifts the field voltage switching
threshold scaled by the input current; thus, it determines
the input characteristics of the application. The package
of the resistor should be large enough to prevent the arc-
ing across the two resistor pads. Arcing depends on the
ESD level applied to the field input and the application
pollution degree.
EFT Protection of Field Inputs
The input channels can withstand up to ±2kV, 5kHz, or
100kHz fast transients (Figure 7) with performance cri-
terion A, normal operation within specification limits. The
MAX22195 outputs OP1–OP8 and READY signal operate
as normal without any loss of function or performance.
With EFT levels up to ±4kV, outputs OP1–OP8 still oper-
ate as normal, but the READY signal is corrupted; thus,
giving a criterion B performance with temporary degrada-
tion of the READY function.
A capacitive coupling clamp is used to couple the fast
transients (burst) from the EFT generator to the field
inputs of the MAX22195 without any galvanic connection
to the MAX22195 input pins.
Surge Protection of Field Inputs
In order to protect the IN_ pins against 1kV/42Ω, 1.2/50µs
surges (Figure 8 and Figure 9), two options exist. The
first option is to use a series pulse-withstanding resistor
as shown in the various application diagrams in the data
sheet. A pulse resistor greater or equal to 1kΩ should be
used for safe operation. The pulse resistor should sup-
port dissipation of the surge energy. Examples of suitable
resistors are CMB0207 MELF or CRCW-IF thick film as
well as others. The resistor value is defined by the Type 1,
2, 3, or other input characteristics. Capacitors for filtering
should not be connected to the IN_ pins.
The second option, which can result in a smaller overall
footprint, is to use a bidirectional TVS to GND at the field
input with a low-power series resistor, greater or equal to
1kΩ. The TVS must be able to absorb the surge energy
and has the function of limiting the peak voltage so that
the resistor only sees a low differential voltage. Suitable
TVS with a small footprint are SPT02-236 or PDFN3-32,
offering protection against 1kV/42Ω surge.
Surge Protection of 24V Supply
In order to protect the VDD24 pin against 500V/42Ω,
1.2/50µs surges (Figure 8), a SMBJ33A TVS can be
applied to the VDD24 pin.
Table 2. Transient Immunity Test Results
TEST RESULT
IEC 61000-4-2 Electrostatic Discharge (ESD) Contact ESD ±8kV
Air-Gap ESD ±15kV
IEC 61000-4-4 Electrical Fast Transient / Burst (EFT) Line-to-Ground
±2kV READY and OP1-OP8 operate without deg-
radation of performance
±4kV OP1-OP8 operate without degradation of
performance; READY signal is corrupted
IEC 61000-4-5 Surge Immunity
Line-to-Ground ±1kV
Line-to-Line ±2kV
Power Supply ±500V
www.maximintegrated.com Maxim Integrated
19
MAX22195 High-Speed, Octal, Industrial Digital Input
with Parallel Output
”111 1 1 > A 1/ > 1<—>1 1 m—u
Figure 7. Electrical Fast Transient/Burst Waveform
Figure 6a. Test Circuit Figure 6b. Test Waveform
www.maximintegrated.com Maxim Integrated
20
MAX22195 High-Speed, Octal, Industrial Digital Input
with Parallel Output
...
V
t
...
EFT/BURST
BURST
DURATION
15ms AT 5kHz
0.75ms AT 100kHz
BURST PERIOD 300ms
V
t
EFT PULSE
REPETITION FREQUENCY
EFT VOLTAGE
EFT VOLTAGE
20s AT 5kHz
10µs AT 100kHz
CHARGE-CURRENT-
LIMIT RESISTOR
DISCHARGE
RESISTANCE
STORAGE
CAPACITOR
Cs
150pF
RC
50M TO 100M
RD
330
HIGH-
VOLTAGE
DC
SOURCE
DEVICE
UNDER
TEST
tr = 0.7ns TO 1ns 30ns
60ns
t
100%
90%
10%
I
PEAK
I
FRONT T‘ME (1:12.15: 30% T‘METO HALF VALUE ‘2 = EDusiZW: Ops Surge Vo/tage Waveform
Figure 8. 1.2/50µs Surge Voltage Waveform
Figure 9. Surge Testing Method
www.maximintegrated.com Maxim Integrated
21
MAX22195 High-Speed, Octal, Industrial Digital Input
with Parallel Output
100%
90%
50%
0
V
t
t
1
t
2
30% MAX
FRONT TIME: t
1
= 1.2µs ± 30%
TIME TO HALF VALUE: t
2
= 50µs ± 20%
0.F
GENERATOR
IN1
IN2
GND
A
B
A = LINE-TO-LINE
B = LINE-TO-GND
COUPLING/DECOUPLING NETWORK
MAX22195
1kΩ
1kΩ
40 Ω
www.maximintegrated.com Maxim Integrated
22
MAX22195 High-Speed, Octal, Industrial Digital Input
with Parallel Output
Typical Application Circuits
V
DD
GNDL
MICRO
CONTROLLER
V
DD24
V
DD3
GND
MAX22195
#1
24V FIELD SUPPLY
IN1
LED1
REFDI
INF (INPUT-FIELD)INP (INPUT-PIN)
3.3V
V
DD24
V
DD3
GND
MAX22195
#2
REFDI
MAX14430
MAX14430
OP1
OP2
OP3
OP4
OP5
OP6
OP7
OP8
OP1
OP2
OP3
OP4
OP5
OP6
OP7
OP8
IN1
IN2
IN3
IN4
IN1
IN2
IN3
IN4
V
DDA
EXTVM
EXTVM
RD YEN
OUT1
OUT2
OUT3
OUT4
OUT1
OUT2
OUT3
OUT4
GPI1
GPI2
GPI3
GPI4
GPI5
GPI6
GPI7
GPI8
GPI9
GPI10
GPI11
GPI12
GPI13
GPI14
GPI15
GPI16
V
DDB
GPI
READY
MAX12930
IN1 OUT1
V
DDA
V
DDB
RD YEN
1.5k
1.5k
1µF 0.1µF
GNDL
GNDL
GNDL
1µF 0.1µF
8.6k
8.6k
4.7k
1.5k
GND
GND
GND
0.1µF
4.7k
ISOLATED 16CHANNEL TYPE 1/3 DIGITAL INPUT
1µF
2.5V
IN2
LED2
IN8
LED8
V
DD24
V
DD24
0.1µF F
READY
IN1
LED1
INF (INPUT-FIELD)INP (INPUT-PIN)
1.5k
1.5k
1.5k
IN2
LED2
IN8
LED8
IN2
0.1µF 0. 1µF
0.1µF
3.3V
0.1µF
2.5V
V
DDA
V
DDB
0.1µF
3.3V 2.5V
0.1µF
MAX14430
IN1
IN2
IN3
IN4
OUT1
OUT2
OUT3
OUT4
GNDL
GND
V
DDA
V
DDB
0.1µF
3.3V 2.5V
0.1µF
MAX14430
IN1
IN2
IN3
IN4
OUT1
OUT2
OUT3
OUT4
GNDL
GND
V
DDA
V
DDB
0.1µF
3.3V 2.5V
0.1µF
iTv LTv
PART TEMP RANGE PIN-PACKAGE
MAX22195ATJ+ -40°C to +125°C 32-TQFN
+Denotes a lead(Pb)-free/RoHS-compliant package.
www.maximintegrated.com Maxim Integrated
23
MAX22195 High-Speed, Octal, Industrial Digital Input
with Parallel Output
Ordering Information Chip Information
PROCESS: BiCMOS
Typical Application Circuits (continued)
MICROCONTROLLER
V
DD24
OP5
OP2
OP3
V
DD3
GND
MAX22195
IN1
LED1
IN2
LED2
IN8
LED8
EXTVM
INF (INPUT FIELD) INP (INPUT PIN)
3.3V
V
DD
0.F
OP1
OP6
OP7
OP8
GPI4
GPI
READY
OP4
GPI5
GPI6
GPI7
GPI8
GPI3
GPI2
GPI1
RDYEN
GND
1.5k
1.5k
1.5k
4.7k
REFDI
8.6k
F
MAX22195 POWERED BY VDD3, VDD24 UNCONNECTED
V
DD24
UNCONNECTED
3.3V
REVISION
NUMBER
REVISION
DATE DESCRIPTION PAGES
CHANGED
0 5/18 Initial release
1 7/18 Updated Benefits and Features section, Electrical Characteristics table, Pin Description
table, Detailed Description section, and Figure 5
1, 4, 5,
11, 14
2 9/18 Updated the ESD and EMC Characteristics table and the Detailed Description section 7, 14
3 1/19 Updated ESD and EMC Characteristics table, and PCB Layout Recommendations,
and IEC61000-4-4 Electrical Fast Transient/Burst (EFT) sections; corrected typos
7, 17,
19–20
4 4/19
Updated the General Description, Electrical Characteristics, Pin Description, RDYEN
and READY Monitor, Short/Open Detection at REFDI Pin, Energyless LED Drivers,
Thermal Considerations, IEC 61000-4-4 Electrical Fast Transient/Burst (EFT) and IEC
61000-4-5 Surge Immunity sections, and Table 1; replaced Table 3.
1, 6, 12, 14
15, 17, 19–21
5 9/20
Updated the Pin Description and Power Supply Decoupling sections, Table 1 and new
Table 2; updated the Octal Digital Input with Parallel Output, Figures 4–5, 7–9, and the
Typical Application Circuits; removed the Surge Protection, EMC Standard Compli-
ance, Test Levels and Methodology, IEC 61000-4-2 Electrostatic Discharge (ESD),
Contact discharge Method, Air Gap Discharge Method, IEC 61000-4-4 Electrical Fast
Transient/Burst (EFT) and IEC 61000-4-5 Surge Immunity sections; removed the
existing Table 2 and renumbered subsequent tables; renamed the Typical Operating
Circuits Typical Application Circuits; added the IEC61131-2 EMC Requirement, ESD
Protection of Field Inputs; EFT Protection of Field Inputs, Surge Protection of Field
Inputs, and Surge Protection of 24V Supply sections
2, 12,
15–23
6 3/21 Updated the Powering MAX22195 with VDD3 Section, Table 1, and
MAX22195 Typical Application Circuit (Powered by VDD3). 17, 23
Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses
are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits)
shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc. © 2021 Maxim Integrated Products, Inc.
24
MAX22195 High-Speed, Octal, Industrial Digital Input
with Parallel Output
Revision History
For pricing, delivery, and ordering information, please visit Maxim Integrated’s online storefront at https://www.maximintegrated.com/en/storefront/storefront.html.

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