ESP32-WROOM-32D,32U Datasheet by Espressif Systems

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ESP32WROOM32D &
ESP32WROOM32U
Datasheet
Version 2.1
Espressif Systems
Copyright © 2021
www.espressif.com
About This Document
This document provides the specifications for the ESP32-WROOM-32D and ESP32-WROOM-32U
modules.
Document Updates
Please always refer to the latest version on https://www.espressif.com/en/support/download/documents.
Revision History
For revision history of this document, please refer to the last page.
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Contents
1 Overview 6
2 Pin Definitions 8
2.1 Pin Layout 8
2.2 Pin Description 8
2.3 Strapping Pins 10
3 Functional Description 12
3.1 CPU and Internal Memory 12
3.2 External Flash and SRAM 12
3.3 Crystal Oscillators 12
3.4 RTC and Low-Power Management 13
4 Peripherals and Sensors 14
5 Electrical Characteristics 15
5.1 Absolute Maximum Ratings 15
5.2 Recommended Operating Conditions 15
5.3 DC Characteristics (3.3 V, 25 °C) 15
5.4 Wi-Fi Radio 16
5.5 BLE Radio 17
5.5.1 Receiver 17
5.5.2 Transmitter 17
5.6 Reflow Profile 18
6 Schematics 19
7 Peripheral Schematics 21
8 Physical Dimensions 23
9 Recommended PCB Land Pattern 25
10 U.FL Connector Dimensions 27
11 Learning Resources 28
11.1 Must-Read Documents 28
11.2 Must-Have Resources 28
Revision History 30
List of Tables
1 ESP32-WROOM-32D vs. ESP32-WROOM-32U 6
2 ESP32-WROOM-32D and ESP32-WROOM-32U Specifications 7
3 Pin Definitions 8
4 Strapping Pins 10
5 Absolute Maximum Ratings 15
6 Recommended Operating Conditions 15
7 DC Characteristics (3.3 V, 25 °C) 15
8 Wi-Fi Radio Characteristics 16
9 Receiver Characteristics – BLE 17
10 Transmitter Characteristics – BLE 17
List of Figures
1 ESP32-WROOM-32D Pin Layout (Top View) 8
2 Reflow Profile 18
3 ESP32-WROOM-32D Schematics 19
4 ESP32-WROOM-32U Schematics 20
5 ESP32-WROOM-32D & ESP32-WROOM-32U Peripheral Schematics 21
6 Physical Dimensions of ESP32-WROOM-32D 23
7 Physical Dimensions of ESP32-WROOM-32U 24
8 Recommended PCB Land Pattern of ESP32-WROOM-32D 25
9 Recommended PCB Land Pattern of ESP32-WROOM-32U 26
10 ESP32-WROOM-32U U.FL Dimensions 27
1 Overview
1 Overview
ESP32-WROOM-32D and ESP32-WROOM-32U are powerful, generic Wi-Fi+BT+BLE MCU modules that target
a wide variety of applications, ranging from low-power sensor networks to the most demanding tasks, such as
voice encoding, music streaming and MP3 decoding.
ESP32-WROOM-32U is different from ESP32-WROOM-32D in that ESP32-WROOM-32U integrates a U.FL
connector. For detailed information of the U.FL connector please see Chapter 10. Note that the information in
this data sheet is applicable to both modules. Any differences between them will be clearly specified in the course
of this document. Table 1lists the difference between ESP32-WROOM-32D and ESP32-WROOM-32U.
Table 1: ESP32WROOM32D vs. ESP32WROOM32U
Module ESP32-WROOM-32D ESP32-WROOM-32U
Core ESP32-D0WD ESP32-D0WD
SPI flash 32 Mbits, 3.3 V 32 Mbits, 3.3 V
Crystal 40 MHz 40 MHz
Antenna onboard antenna U.FL connector (which needs to be connected
to an external IPEX antenna)
Dimensions
(Unit: mm)
(18.00±0.10) × (25.50±0.10) × (3.10±0.10)
(See Figure 6for details)
(18.00±0.10) × (19.20±0.10) × (3.20±0.10)
(See Figure 7for details)
Schematics See Figure 3for details. See Figure 4for details.
At the core of the two modules is the ESP32-D0WD chip that belongs to the ESP32 series* of chips. The chip
embedded is designed to be scalable and adaptive. There are two CPU cores that can be individually controlled,
and the CPU clock frequency is adjustable from 80 MHz to 240 MHz. The chip also has a low-power
co-processor that can be used instead of the CPU to save power while performing tasks that do not require much
computing power, such as monitoring of peripherals. ESP32 integrates a rich set of peripherals, ranging from
capacitive touch sensors, Hall sensors, SD card interface, Ethernet, high-speed SPI, UART, I²S and I²C.
Note:
* For details on the part numbers of the ESP32 family of chips, please refer to the document ESP32 Datasheet.
The integration of Bluetooth®, Bluetooth LE and Wi-Fi ensures that a wide range of applications can be targeted,
and that the module is all-around: using Wi-Fi allows a large physical range and direct connection to the Internet
through a Wi-Fi router, while using Bluetooth allows the user to conveniently connect to the phone or broadcast
low energy beacons for its detection. The sleep current of the ESP32 chip is less than 5 µA, making it suitable for
battery powered and wearable electronics applications. The module supports a data rate of up to 150 Mbps,
and 20 dBm output power at the antenna to ensure the widest physical range. As such the module does offer
industry-leading specifications and the best performance for electronic integration, range, power consumption,
and connectivity.
The operating system chosen for ESP32 is freeRTOS with LwIP; TLS 1.2 with hardware acceleration is built in as
well. Secure (encrypted) over the air (OTA) upgrade is also supported, so that users can upgrade their products
even after their release, at minimum cost and effort.
Table 2provides the specifications of ESP32-WROOM-32D and ESP32-WROOM-32U.
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ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet v2.1
1 Overview
Table 2: ESP32WROOM32D and ESP32WROOM32U Specifications
Categories Items Specifications
Certification
RF Certification FCC/CE-RED/IC/TELEC/KCC/SRRC/NCC
Wi-Fi Certification Wi-Fi Alliance
Bluetooth certification BQB
Green Certification REACH/RoHS
Test Reliablity HTOL/HTSL/uHAST/TCT/ESD
Wi-Fi Protocols
802.11 b/g/n (802.11n up to 150 Mbps)
A-MPDU and A-MSDU aggregation and 0.4 µs guard
interval support
Frequency range 2.4 GHz ~2.5 GHz
Bluetooth
Protocols Bluetooth v4.2 BR/EDR and BLE specification
Radio
NZIF receiver with –97 dBm sensitivity
Class-1, class-2 and class-3 transmitter
AFH
Audio CVSD and SBC
Hardware
Module interfaces
SD card, UART, SPI, SDIO, I2C, LED PWM, Motor
PWM, I2S, IR, pulse counter, GPIO, capacitive touch
sensor, ADC, DAC, Two-Wire Automotive Interface
(TWAI®, compatible with ISO11898-1)
On-chip sensor Hall sensor
Integrated crystal 40 MHz crystal
Integrated SPI flash 14 MB
Operating voltage/Power supply 3.0 V ~3.6 V
Operating current Average: 80 mA
Minimum current delivered by power
supply 500 mA
Recommended operating temperature
range 2–40 °C ~+85 °C
Moisture sensitivity level (MSL) Level 3
Notice:
1. ESP32-WROOM-32D and ESP32-WROOM-32U with 8 MB flash or 16 MB flash are available for custom order.
2. ESP32-WROOM-32D and ESP32-WROOM-32U with high temperature range (–40 °C ~+105 °C) option are avail-
able for custom order. 4 MB SPI flash is supported on the high temperature range version.
3. For detailed ordering information, please see Espressif Product Ordering Information.
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ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet v2.1
,l:|:|:|:|:|:|:|:|:|:|:|:|:|_ 1111111111111] V_H_H_H_H_H_H_H_H_H_\
2 Pin Definitions
2 Pin Definitions
2.1 Pin Layout
Keepout Zone
GND
IO23
IO22
TXD0
RXD0
IO21
NC
IO19
IO18
IO5
IO17
IO16
IO4
IO0
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
IO2
IO15
SD1
SD0
CLK
CMD
SD3
SD2
IO13
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
GND
3V3
EN
SENSOR_VP
SENSOR_VN
IO34
IO35
IO32
IO33
IO25
IO26
IO27
IO14
IO12
39 GND
Figure 1: ESP32WROOM32D Pin Layout (Top View)
Note:
The pin layout of ESP32-WROOM-32U is the same as that of ESP32-WROOM-32D, except that ESP32-WROOM-32U
has no keepout zone.
2.2 Pin Description
The ESP32-WROOM-32D and ESP32-WROOM-32U have 38 pins. See pin definitions in Table 3.
Table 3: Pin Definitions
Name No. Type Function
GND 1 P Ground
3V3 2 P Power supply
EN 3 I Module-enable signal. Active high.
SENSOR_VP 4 I GPIO36, ADC1_CH0, RTC_GPIO0
SENSOR_VN 5 I GPIO39, ADC1_CH3, RTC_GPIO3
IO34 6 I GPIO34, ADC1_CH6, RTC_GPIO4
IO35 7 I GPIO35, ADC1_CH7, RTC_GPIO5
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ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet v2.1
2 Pin Definitions
Name No. Type Function
IO32 8 I/O GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4,
TOUCH9, RTC_GPIO9
IO33 9 I/O GPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output), ADC1_CH5,
TOUCH8, RTC_GPIO8
IO25 10 I/O GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0
IO26 11 I/O GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1
IO27 12 I/O GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV
IO14 13 I/O GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK,
SD_CLK, EMAC_TXD2
IO12 14 I/O GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2,
SD_DATA2, EMAC_TXD3
GND 15 P Ground
IO13 16 I/O GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3,
SD_DATA3, EMAC_RX_ER
SHD/SD2* 17 I/O GPIO9, SD_DATA2, SPIHD, HS1_DATA2, U1RXD
SWP/SD3* 18 I/O GPIO10, SD_DATA3, SPIWP, HS1_DATA3, U1TXD
SCS/CMD* 19 I/O GPIO11, SD_CMD, SPICS0, HS1_CMD, U1RTS
SCK/CLK* 20 I/O GPIO6, SD_CLK, SPICLK, HS1_CLK, U1CTS
SDO/SD0* 21 I/O GPIO7, SD_DATA0, SPIQ, HS1_DATA0, U2RTS
SDI/SD1* 22 I/O GPIO8, SD_DATA1, SPID, HS1_DATA1, U2CTS
IO15 23 I/O GPIO15, ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13, HS2_CMD,
SD_CMD, EMAC_RXD3
IO2 24 I/O GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0,
SD_DATA0
IO0 25 I/O GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK
IO4 26 I/O GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1,
SD_DATA1, EMAC_TX_ER
IO16 27 I/O GPIO16, HS1_DATA4, U2RXD, EMAC_CLK_OUT
IO17 28 I/O GPIO17, HS1_DATA5, U2TXD, EMAC_CLK_OUT_180
IO5 29 I/O GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK
IO18 30 I/O GPIO18, VSPICLK, HS1_DATA7
IO19 31 I/O GPIO19, VSPIQ, U0CTS, EMAC_TXD0
NC 32 - -
IO21 33 I/O GPIO21, VSPIHD, EMAC_TX_EN
RXD0 34 I/O GPIO3, U0RXD, CLK_OUT2
TXD0 35 I/O GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2
IO22 36 I/O GPIO22, VSPIWP, U0RTS, EMAC_TXD1
IO23 37 I/O GPIO23, VSPID, HS1_STROBE
GND 38 P Ground
Notice:
* Pins SCK/CLK, SDO/SD0, SDI/SD1, SHD/SD2, SWP/SD3 and SCS/CMD, namely, GPIO6 to GPIO11 are connected
to the integrated SPI flash integrated on the module and are not recommended for other uses.
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2 Pin Definitions
2.3 Strapping Pins
ESP32 has five strapping pins, which can be seen in Chapter 6Schematics:
• MTDI
• GPIO0
• GPIO2
• MTDO
• GPIO5
Software can read the values of these five bits from register ”GPIO_STRAPPING”.
During the chip’s system reset release (power-on-reset, RTC watchdog reset and brownout reset), the latches of
the strapping pins sample the voltage level as strapping bits of ”0” or ”1”, and hold these bits until the chip is
powered down or shut down. The strapping bits configure the device’s boot mode, the operating voltage of
VDD_SDIO and other initial system settings.
Each strapping pin is connected to its internal pull-up/pull-down during the chip reset. Consequently, if a
strapping pin is unconnected or the connected external circuit is high-impedance, the internal weak
pull-up/pull-down will determine the default input level of the strapping pins.
To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host
MCU’s GPIOs to control the voltage level of these pins when powering on ESP32.
After reset release, the strapping pins work as normal-function pins.
Refer to Table 4for a detailed boot-mode configuration by strapping pins.
Table 4: Strapping Pins
Voltage of Internal LDO (VDD_SDIO)
Pin Default 3.3 V 1.8 V
MTDI Pull-down 0 1
Booting Mode
Pin Default SPI Boot Download Boot
GPIO0 Pull-up 1 0
GPIO2 Pull-down Don’t-care 0
Enabling/Disabling Debugging Log Print over U0TXD During Booting
Pin Default U0TXD Active U0TXD Silent
MTDO Pull-up 1 0
Timing of SDIO Slave
Pin Default
FE Sampling
FE Output
FE Sampling
RE Output
RE Sampling
FE Output
RE Sampling
RE Output
MTDO Pull-up 0 0 1 1
GPIO5 Pull-up 0 1 0 1
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2 Pin Definitions
Note:
Firmware can configure register bits to change the settings of ”Voltage of Internal LDO (VDD_SDIO)” and ”Timing
of SDIO Slave” after booting.
Both ESP32-WROOM-32D and ESP32-WROOM-32U integrate a 3.3 V SPI flash, so the pin MTDI cannot be set
to 1 when the modules are powered up.
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ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet v2.1
3 Functional Description
3 Functional Description
This chapter describes the modules and functions integrated in ESP32-WROOM-32D and
ESP32-WROOM-32U.
3.1 CPU and Internal Memory
ESP32-D0WD contains a dual-core Xtensa®32-bit LX6 MCU. The internal memory includes:
448 KB of ROM for booting and core functions.
520 KB of on-chip SRAM for data and instructions.
8 KB of SRAM in RTC, which is called RTC FAST Memory and can be used for data storage; it is accessed
by the main CPU during RTC Boot from the Deep-sleep mode.
8 KB of SRAM in RTC, which is called RTC SLOW Memory and can be accessed by the co-processor
during the Deep-sleep mode.
1 Kbit of eFuse: 256 bits are used for the system (MAC address and chip configuration) and the remaining
768 bits are reserved for customer applications, including flash-encryption and chip-ID.
3.2 External Flash and SRAM
ESP32 supports multiple external QSPI flash and SRAM chips. More details can be found in Chapter SPI in the
ESP32 Technical Reference Manual. ESP32 also supports hardware encryption/decryption based on AES to
protect developers’ programs and data in flash.
ESP32 can access the external QSPI flash and SRAM through high-speed caches.
The external flash can be mapped into CPU instruction memory space and read-only memory space
simultaneously.
When external flash is mapped into CPU instruction memory space, up to 11 MB + 248 KB can be
mapped at a time. Note that if more than 3 MB + 248 KB are mapped, cache performance will be
reduced due to speculative reads by the CPU.
When external flash is mapped into read-only data memory space, up to 4 MB can be mapped at a
time. 8-bit, 16-bit and 32-bit reads are supported.
External SRAM can be mapped into CPU data memory space. Up to 4 MB can be mapped at a time.
8-bit, 16-bit and 32-bit reads and writes are supported.
Both ESP32-WROOM-32D and ESP32-WROOM-32U integrate a 4 MB of external SPI flash. The integrated SPI
flash is connected to GPIO6, GPIO7, GPIO8, GPIO9, GPIO10 and GPIO11. These six pins cannot be used as
regular GPIOs.
3.3 Crystal Oscillators
The module uses a 40-MHz crystal oscillator.
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3 Functional Description
3.4 RTC and LowPower Management
With the use of advanced power-management technologies, ESP32 can switch between different power
modes.
For details on ESP32’s power consumption in different power modes, please refer to section ”RTC and
Low-Power Management” in ESP32 Datasheet.
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4 Peripherals and Sensors
4 Peripherals and Sensors
Please refer to Section Peripherals and Sensors in ESP32 Datasheet.
Note:
External connections can be made to any GPIO except for GPIOs in the range 6-11. These six GPIOs are connected to
the module’s integrated SPI flash. For details, please see Section 6Schematics.
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5 Electrical Characteristics
5 Electrical Characteristics
5.1 Absolute Maximum Ratings
Stresses beyond the absolute maximum ratings listed in Table 5below may cause permanent damage to the
device. These are stress ratings only, and do not refer to the functional operation of the device that should follow
the recommended operating conditions.
Table 5: Absolute Maximum Ratings
Symbol Parameter Min Max Unit
VDD33 Power supply voltage –0.3 3.6 V
Ioutput
1Cumulative IO output current - 1,100 mA
Tstore Storage temperature –40 150 °C
1. The module worked properly after a 24-hour test in ambient temperature at 25 °C, and the IOs in three domains
(VDD3P3_RTC, VDD3P3_CPU, VDD_SDIO) output high logic level to ground. Please note that pins occupied by flash
and/or PSRAM in the VDD_SDIO power domain were excluded from the test.
2. Please see Appendix IO_MUX of ESP32 Datasheet for IO’s power domain.
5.2 Recommended Operating Conditions
Table 6: Recommended Operating Conditions
Symbol Parameter Min Typical Max Unit
VDD33 Power supply voltage 3.0 3.3 3.6 V
IV DD Current delivered by external power supply 0.5 - - A
T Operating temperature –40 - 85 °C
5.3 DC Characteristics (3.3 V, 25 °C)
Table 7: DC Characteristics (3.3 V, 25 °C)
Symbol Parameter Min Typ Max Unit
CIN Pin capacitance - 2 - pF
VIH High-level input voltage 0.75×VDD1- VDD1+0.3 V
VIL Low-level input voltage –0.3 - 0.25×VDD1V
IIH High-level input current - - 50 nA
IIL Low-level input current - - 50 nA
VOH High-level output voltage 0.8×VDD1- - V
VOL Low-level output voltage - - 0.1×VDD1V
IOH
High-level source current VDD3P3_CPU power domain 1,2- 40 - mA
(VDD1= 3.3 V, VOH >= 2.64 V, VDD3P3_RTC power domain 1,2- 40 - mA
output drive strength set to the
maximum) VDD_SDIO power domain 1,3- 20 - mA
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5 Electrical Characteristics
Symbol Parameter Min Typ Max Unit
IOL
Low-level sink current
(VDD1= 3.3 V, VOL = 0.495 V,
output drive strength set to the maximum)
- 28 - mA
RP U Resistance of internal pull-up resistor - 45 - k
RP D Resistance of internal pull-down resistor - 45 - k
VIL_nRST Low-level input voltage of CHIP_PU to power off the chip - - 0.6 V
Notes:
1. Please see Appendix IO_MUX of ESP32 Datasheet for IO’s power domain. VDD is the I/O voltage for a particular power
domain of pins.
2. For VDD3P3_CPU and VDD3P3_RTC power domain, per-pin current sourced in the same domain is gradually reduced
from around 40 mA to around 29 mA, VOH >=2.64 V, as the number of current-source pins increases.
3. Pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test.
5.4 WiFi Radio
Table 8: WiFi Radio Characteristics
Parameter Condition Min Typical Max Unit
Operating frequency range note1- 2412 - 2484 MHz
Output impedance note2- - note 2 -
TX power note311n, MCS7 12 13 14 dBm
11b mode 17.5 18.5 20 dBm
Sensitivity 11b, 1 Mbps - –98 - dBm
11b, 11 Mbps - –89 - dBm
11g, 6 Mbps - –92 - dBm
11g, 54 Mbps - –74 - dBm
11n, HT20, MCS0 - –91 - dBm
11n, HT20, MCS7 - –71 - dBm
11n, HT40, MCS0 - –89 - dBm
11n, HT40, MCS7 - –69 - dBm
Adjacent channel rejection 11g, 6 Mbps - 31 - dB
11g, 54 Mbps - 14 - dB
11n, HT20, MCS0 - 31 - dB
11n, HT20, MCS7 - 13 - dB
1. Device should operate in the frequency range allocated by regional regulatory authorities. Target operating frequency
range is configurable by software.
2. For the modules that use IPEX antennas, the output impedance is 50 . For other modules without IPEX antennas,
users do not need to concern about the output impedance.
3. Target TX power is configurable based on device or certification requirements.
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5 Electrical Characteristics
5.5 BLE Radio
5.5.1 Receiver
Table 9: Receiver Characteristics – BLE
Parameter Conditions Min Typ Max Unit
Sensitivity @30.8% PER - - –97 - dBm
Maximum received signal @30.8% PER - 0 - - dBm
Co-channel C/I - - +10 - dB
Adjacent channel selectivity C/I
F = F0 + 1 MHz - –5 - dB
F = F0 – 1 MHz - –5 - dB
F = F0 + 2 MHz - –25 - dB
F = F0 – 2 MHz - –35 - dB
F = F0 + 3 MHz - –25 - dB
F = F0 – 3 MHz - –45 - dB
Out-of-band blocking performance
30 MHz ~2000 MHz –10 - - dBm
2000 MHz ~2400 MHz –27 - - dBm
2500 MHz ~3000 MHz –27 - - dBm
3000 MHz ~12.5 GHz –10 - - dBm
Intermodulation - –36 - - dBm
5.5.2 Transmitter
Table 10: Transmitter Characteristics – BLE
Parameter Conditions Min Typ Max Unit
RF transmit power - - 0 - dBm
Gain control step - - 3 - dBm
RF power control range - –12 - +9 dBm
Adjacent channel transmit power
F = F0 ± 2 MHz - –52 - dBm
F = F0 ± 3 MHz - –58 - dBm
F = F0 ± > 3 MHz - –60 - dBm
f1avg - - - 265 kHz
f2max - 247 - - kHz
f2avg/f1avg - - –0.92 - -
ICFT - - –10 - kHz
Drift rate - - 0.7 - kHz/50 µs
Drift - - 2 - kHz
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5 Electrical Characteristics
5.6 Reflow Profile
50 150
0
25
1 ~ 3 /s
0
200
250
200
–1 ~ –5 /s
Cooling zone
100
217
50
100 250
Reflow zone
217 60 ~ 90 s
Temperature ()
Preheating zone
150 ~ 200 60 ~ 120 s
Ramp-up zone
Peak Temp.
235 ~ 250
Soldering time
> 30 s
Time (sec.)
Ramp-up zone — Temp.: 25 ~ 150 Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 /s
Preheating zone — Temp.: 150 ~ 200 Time: 60 ~ 120 s
Reflow zone — Temp.: >217 60 ~ 90 s; Peak Temp.: 235 ~ 250 Time: 30 ~ 70 s
Cooling zone — Peak Temp. ~ 180 Ramp-down rate: –1 ~ –5 /s
Solder — Sn-Ag-Cu (SAC305) lead-free solder alloy
Figure 2: Reflow Profile
Note:
Solder the module in a single reflow.
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ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet v2.1
6 Schematics us: of c) a“; cz Vary mm act, a: (he cxyfinfl, L L l l in” J_ TL} ; u L ALALAL” J_ W i ll; 1 D1“ "“rgg 7 T Figure 3: ESPSZ-WROOM-GZD Schematics
6 Schematics
6 Schematics
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
The values of C1 and C2 vary with
the selection of the crystal.
Pin.1
GND Pin.15
GND
Pin.2
3V3
Pin.3
CHIP_PU/EN
Pin.38
GND
Pin.4
SENSOR_VP
Pin.5
SENSOR_VN
Pin.6
IO34
Pin.7
IO35
Pin.8
IO32
Pin.9
IO33
Pin.10
IO25
Pin.11
IO26
Pin.12
IO27
Pin.13
IO14
Pin.16
IO13
Pin.14
IO12
Pin.17
SD2
Pin.20
CLK
Pin.19
CMD
Pin.18
SD3
Pin.23
IO15
Pin.22
SD1
Pin.21
SD0
Pin.24
IO2
Pin.37
IO23
Pin.36
IO22
Pin.28
IO17
Pin.27
IO16
Pin.25
IO0
Pin.32
NC
Pin.30
IO18
Pin.26
IO4
Pin.34
U0RXD
Pin.29
IO5
Pin.35
U0TXD
Pin.31
IO19
Pin.33
IO21
Pin.39
GND
The values of C14
L4 and C15
vary with the actual PCB board.
CHIP_PU
GPIO35
SCK/CLK
SCS/CMD
SENSOR_VP
SHD/SD2 SWP/SD3
SDI/SD1
SDO/SD0
SENSOR_VN
GPIO34
GPIO23GPIO13
GPIO32
U0TXD
GPIO33
GPIO25
GPIO26
GPIO27
GPIO14
GPIO12
GPIO15
GPIO13
GPIO2
GPIO0
GPIO4
GPIO16
GPIO17
SDO/SD0
SDI/SD1
SCK/CLK
SWP/SD3
SCS/CMD
SHD/SD2
GPIO18
GPIO5
GPIO23
GPIO19
GPIO22
U0RXD
GPIO21
CHIP_PU
SENSOR_VP
SENSOR_VN
GPIO34
GPIO32
GPIO35
GPIO33
GPIO25
GPIO26
GPIO27
GPIO14
GPIO12
SHD/SD2
SWP/SD3
SCS/CMD
SCK/CLK
SDO/SD0
SDI/SD1
GPIO15
GPIO2
GPIO22
U0TXD
U0RXD
GPIO21
GPIO19
GPIO18
GPIO5
GPIO17
GPIO16
GPIO4
GPIO0
VDD33
GND
VDD33
GND
VDD33
GND
GND
VDD_SDIO
GND
VDD33
GND
GND GND
VDD33
GND
GNDGND
GNDGNDGND
GND
GND
GND
VDD_SDIO
VDD33
GND
GNDGND
GND
GND
GND
GND
GND
Title
Size Document Number Re v
Date: Sheet o f
<Doc>
ESP32-WROOM-32D
A2
11
Thursday, May 31, 2018
2.2
Title
Size Document Number Re v
Date: Sheet o f
<Doc>
ESP32-WROOM-32D
A2
11
Thursday, May 31, 2018
2.2
Title
Size Document Number Re v
Date: Sheet o f
<Doc>
ESP32-WROOM-32D
A2
11
Thursday, May 31, 2018
2.2
R1 20K(5%)
C14
TBD
C18
1uF
L4 TBD
C17
NC
C5
10nF/6.3V(10%)
L5 2.0nH
C3
100pF
C20
1uF
C2
22pF/6.3V(10%)
C11
1uF
C9
0.1uF
R2 0R
C21
NC
C16
NC
C15
TBD
C6
3.3nF/6.3V(10%)
C4
0.1uF
D1
LESD8D3.3CAT5G
ANT1
PCB ANT
1
2
C13
10uF
R3 499R
C19
0.1uF
U1
40MHz+/-10ppm
XIN
1
GND
2XOUT 3
GND 4
C10
0.1uF
C12
NC
U3
FLASH
/CS
1
DO 2
/WP 3
GND
4
DI 5
CLK
6
/HOLD
7
VCC 8
C1
22pF/6.3V(10%)
U2 ESP32-D0WD
VDDA
1
LNA_IN
2
VDD3P3
3
VDD3P3
4
SENSOR_VP
5
SENSOR_CAPP
6
SENSOR_CAPN
7
SENSOR_VN
8
CHIP_PU
9
VDET_1
10
VDET_2
11
32K_XP
12
32K_XN
13
GPIO25
14
GPIO26
15
GPIO27
16
MTMS
17
MTDI
18
VDD3P3_RTC
19
MTCK
20
MTDO
21
GPIO2
22
GPIO0
23
GPIO4
24
VDD_SDIO 26
GPIO16 25
GPIO17 27
SD_DATA_2 28
SD_DATA_3 29
SD_CMD 30
SD_CLK 31
SD_DATA_0 32
GND 49
SD_DATA_1 33
GPIO5 34
GPIO18 35
GPIO19 38
CAP2 47
VDDA 43
XTAL_N 44
XTAL_P 45
GPIO23 36
U0TXD 41
GPIO22 39
GPIO21 42
VDD3P3_CPU 37
CAP1 48
VDDA 46
U0RXD 40
Figure 3: ESP32WROOM32D Schematics
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no: at n, and (,2 vary hum AL 1; AL l ;;ALJ_LAL ill; l L“"1J_ 111%; " J Figure 4: ESPSZ—WROOM-GZU Schematics
6 Schematics
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
Pin.1
GND Pin.15
GND
Pin.2
3V3
Pin.3
CHIP_PU/EN
Pin.38
GND
Pin.4
SENSOR_VP
Pin.5
SENSOR_VN
Pin.6
IO34
Pin.7
IO35
Pin.8
IO32
Pin.9
IO33
Pin.10
IO25
Pin.11
IO26
Pin.12
IO27
Pin.13
IO14
Pin.16
IO13
Pin.14
IO12
Pin.17
SD2
Pin.20
CLK
Pin.19
CMD
Pin.18
SD3
Pin.23
IO15
Pin.22
SD1
Pin.21
SD0
Pin.24
IO2
Pin.37
IO23
Pin.36
IO22
Pin.28
IO17
Pin.27
IO16
Pin.25
IO0
Pin.32
NC
Pin.30
IO18
Pin.26
IO4
Pin.34
U0RXD
Pin.29
IO5
Pin.35
U0TXD
Pin.31
IO19
Pin.33
IO21
Pin.39
GND
The values of C1 and C2 vary with
the selection of the crystal.
The values of C14
L4 and C15
vary with the actual PCB board.
CHIP_PU
GPIO35
SCK/CLK
SCS/CMD
SENSOR_VP
SHD/SD2 SWP/SD3
SDI/SD1
SDO/SD0
SENSOR_VN
GPIO34
GPIO32
U0TXD
GPIO33
GPIO25
GPIO26
GPIO27
GPIO14
GPIO12
GPIO15
GPIO13
GPIO2
GPIO0
GPIO4
GPIO16
GPIO17
SDO/SD0
SDI/SD1
SCK/CLK
SWP/SD3
SCS/CMD
SHD/SD2
GPIO18
GPIO5
GPIO23
GPIO19
GPIO22
U0RXD
GPIO21
CHIP_PU
SENSOR_VP
SENSOR_VN
GPIO34
GPIO32
GPIO35
GPIO33
GPIO25
GPIO26
GPIO27
GPIO14
GPIO12
SHD/SD2
SWP/SD3
SCS/CMD
SCK/CLK
SDO/SD0
SDI/SD1
GPIO15
GPIO2
GPIO22
U0TXD
U0RXD
GPIO21
GPIO19
GPIO18
GPIO5
GPIO17
GPIO16
GPIO4
GPIO0
GPIO23GPIO13
VDD33
GND
VDD33
VDD33
GND
GND
VDD_SDIO
VDD33
GND
GNDGND
GNDGNDGND
GND
GND
GND
VDD_SDIO
VDD33
GND
GNDGND
GND
GND
GND
GND GND
VDD33
GND
GND
GND GND
GND
Title
Size Document Number Re v
Date: Sheet o f
<Doc>
ESP32-WROOM-32U
A2
11
Thursday, May 31, 2018
2.1
Title
Size Document Number Re v
Date: Sheet o f
<Doc>
ESP32-WROOM-32U
A2
11
Thursday, May 31, 2018
2.1
Title
Size Document Number Re v
Date: Sheet o f
<Doc>
ESP32-WROOM-32U
A2
11
Thursday, May 31, 2018
2.1
C14
TBD
C18
1uF
R1 20K(5%)
C5
10nF/6.3V(10%)
L4 TBD
C20
1uF
C17
NC
C3
100pF
L5 2.0nH
C2
22pF/6.3V(10%)
C15
TBD
R2 0R
C9
0.1uF
C13
10uF
C11
1uF
C21
NC
D1
LESD8D3.3CAT5G
C6
3.3nF/6.3V(10%)
C4
0.1uF
C16
NC
J39
IPEX
1
2
3
U1
40MHz+/-10ppm
XIN
1
GND
2XOUT 3
GND 4
C19
0.1uF
R3 499R
C12
NC
C10
0.1uF
U2 ESP32-D0WD
VDDA
1
LNA_IN
2
VDD3P3
3
VDD3P3
4
SENSOR_VP
5
SENSOR_CAPP
6
SENSOR_CAPN
7
SENSOR_VN
8
CHIP_PU
9
VDET_1
10
VDET_2
11
32K_XP
12
32K_XN
13
GPIO25
14
GPIO26
15
GPIO27
16
MTMS
17
MTDI
18
VDD3P3_RTC
19
MTCK
20
MTDO
21
GPIO2
22
GPIO0
23
GPIO4
24
VDD_SDIO 26
GPIO16 25
GPIO17 27
SD_DATA_2 28
SD_DATA_3 29
SD_CMD 30
SD_CLK 31
SD_DATA_0 32
GND 49
SD_DATA_1 33
GPIO5 34
GPIO18 35
GPIO19 38
CAP2 47
VDDA 43
XTAL_N 44
XTAL_P 45
GPIO23 36
U0TXD 41
GPIO22 39
GPIO21 42
VDD3P3_CPU 37
CAP1 48
VDDA 46
U0RXD 40
C1
22pF/6.3V(10%)
U3
FLASH
/CS
1
DO 2
/WP 3
GND
4
DI 5
CLK
6
/HOLD
7
VCC 8
Figure 4: ESP32WROOM32U Schematics
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ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet v2.1
7 Peripheral Schematics vouasvpnsa 0 or «our _ 02 0qu II'GND GND UAR U1 - FLGND :3 sum GND3 m3 m 3 3V3 i023 —36 ‘022 III EN i022 fl ‘ m SENSORA/F' ”DU 34 RXD H“ W SENSOReVN RXDU 33 i021 —ms 7 i034 i021 —32 —W 1832 £13 —M i033 9 so i018 ms—rr 1332 "‘33: ‘23—m? —i026 M 25 ion — i026 i017 — i027 12 m7 "316 27 i016 3 i014 i04 —7§m M i012 iOO 25 ‘00 Hi 3 m D .0 _ N a x o _ F N _ E 9 a 53 E d 53 a 9 9 aezeeamm Boo GND MGR MTMS : D 0R MTDI N m X 0 — N HMVUDR MTCK a E 3 d a 3 9 Mm: woo hould be kept at a low electric level when powering up t Figure 5: ESPSZ-WROOM-SZD & ESPaZ—WROOM-SZU Peripheral Schematics
7 Peripheral Schematics
7 Peripheral Schematics
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
Espressif Systems
MTDI should be kept at a low electric level when powering up the module.
EN
TXD
RXD
IO0
MTMS
MTDI
MTCK
MTDO
IO23
IO22
IO21
IO19
IO18
IO5
IO4
IO2
SD2
SD3
CMD
CLK
SD0
SD1
SENSOR_VP
SENSOR_VN
IO34
IO35
IO32
IO33
IO25
IO26
IO27
IO17
IO16
VDD33
GND
VDD33
GND
GND
GND
GND
GND
GND
Title
Size Document Number Rev
Date: Sheet o f
<Doc> 1.0
Application of ESP32-WROOM-32
A4
1 1Wednesday, August 07, 2019
Title
Size Document Number Rev
Date: Sheet o f
<Doc> 1.0
Application of ESP32-WROOM-32
A4
1 1Wednesday, August 07, 2019
Title
Size Document Number Rev
Date: Sheet o f
<Doc> 1.0
Application of ESP32-WROOM-32
A4
1 1Wednesday, August 07, 2019
R2 100R
R4 100R
C1 10uF
U2
JTAG
MTMS 1
MTDI 2
MTCK 3
MTDO 4
U1
GND1
1
3V3
2
EN
3
SENSOR_VP
4
SENSOR_VN
5
IO34
6
IO35
7
IO32
8
IO33
9
IO25
10
IO26
11
IO27
12
IO14
13
IO12
14
GND3 38
IO23 37
IO22 36
TXD0 35
RXD0 34
IO21 33
NC 32
IO19 31
IO18 30
IO5 29
IO17 28
IO16 27
IO4 26
IO0 25
GND2
15
IO13
16
SD2
17
SD3
18
CMD
19
CLK
20
SD0
21
SD1
22
IO15
23
IO2
24
P_GND 39
R1
TBD
C3 TBD
J1
UART DOWNLOAD
1
2
3
R3 100R
R5 100R
C2 0.1uF
J2
BOOT OPTION
1
2
Figure 5: ESP32WROOM32D & ESP32WROOM32U Peripheral Schematics
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ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet v2.1
Note: - Soldering Pad 39 lo lhe Ground is not necessary for a satisfactory thermal performance If users do want to solder it‘ they need lo ensure lhat the correct quantity of soldering pasle is applied. - To ensure lhe power supply to the ESP32 chip during power-up, ii is adVised to add an RC delay circuit al lhe EN pin. The recommended selting for the RC delay CifCUlI is usually R : 10 km and C : 1 pF. However, specific parameters should be adjusted based on the power»up timing of the module and the power-up and reset sequence timing of the chip. For ESPBZ's power»up and reset sequence timing diagram, please refer lo Section Power Scheme in ESP32 Dy" 4.
7 Peripheral Schematics
Note:
Soldering Pad 39 to the Ground is not necessary for a satisfactory thermal performance. If users do want to solder it, they need to ensure that the correct quantity of soldering
paste is applied.
To ensure the power supply to the ESP32 chip during power-up, it is advised to add an RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is
usually R = 10 kand C = 1 µF. However, specific parameters should be adjusted based on the power-up timing of the module and the power-up and reset sequence timing
of the chip. For ESP32’s power-up and reset sequence timing diagram, please refer to Section Power Scheme in ESP32 Datasheet.
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ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet v2.1
8 Physical Dimensions 3.10:0.15 a ‘ (a 0.80 J, i , = n’ E A, : ew Side View Figure 6: Physical Dimensions of ESPSZ-WROOM-SZD
8 Physical Dimensions
8 Physical Dimensions
18.00±0.15
0.85
0.90
10.50
10.29
3.10±0.15
0.80
Top View Side View Bottom View
0.90
0.85
0.1
Unit: mm
3.60
3.60
25.50±0.15
11.43
8.89
1.50
1.27
16.51
15.80
17.60
Ø0.50
0.90
0.45
6.19
1.05
6.19
Figure 6: Physical Dimensions of ESP32WROOM32D
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ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet v2.1
3.20:0 15 0.80 mm ew Side View Figure 7: Physical Dimensions of ESPSZ-WROOM-SZU
8 Physical Dimensions
Unit: mm
0.85
0.90
10.29
0.80
Top View Side View Bottom View
0.90
0.85
0.1
10.50
3.20±0.15
3.60
3.60
18.00±0.15
11.43
8.89
1.50
1.27
16.51
15.65
17.50
0.90
0.45
19.20±0.15
3.27
3.07
10.75
13.05
1.15
1.18
Figure 7: Physical Dimensions of ESP32WROOM32U
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ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet v2.1
VIA
9 Recommended PCB Land Pattern
9 Recommended PCB Land Pattern
Unit: mm
Copper
Via for thermal pad
Antenna Area
1
1415 24 25
38
18.00
25.50
38x1.50
38x0.90
0.50
1.50
1.27
1.27
3.28
1.50
0.50
0.90
0.50
3.70
0.90
0.50
3.70
7.50
10.29
16.51
6.19
11.43
Figure 8: Recommended PCB Land Pattern of ESP32WROOM32D
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ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet v2.1
VIA
9 Recommended PCB Land Pattern
Unit: mm
Copper
Via for thermal pad
1
1415 24 25
38
18.00
19.20
38x1.50
38x0.90
0.50
1.50
1.27
1.27
3.28
1.50
0.50
0.90
0.50
3.70
0.90
0.50
3.70
7.50
10.29
16.51
11.43
Figure 9: Recommended PCB Land Pattern of ESP32WROOM32U
Espressif Systems 26
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ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet v2.1
125:0‘15 ”é? UTESiUTIU L U35t015 933001005 SECTIDN AiA (310) [1851010 300:0‘15 O SHELL T COPPER ALLOY/Au PLATED OVER Ni (2) CONTACT T COPPER ALLOY/Au PLATED OVER Ni (D HOUSTNG t HTGHT TEMP. PLASTTC UL94er/WHTTE TTE PART NAMEQ'TY MATERTAL/ETNTSH
10 U.FL Connector Dimensions
10 U.FL Connector Dimensions
Unit: mm
Figure 10: ESP32WROOM32U U.FL Dimensions
Espressif Systems 27
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ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet v2.1
11 Learning Resourc .1 Must-Read Docum following link prowdes document ESPSZ Datasheet This document provides an intr pin definitions, functional descr ESPSZ ECO V3 User Guide This document desc bes differ E00 and Workaroun oi Bug This document deta ardwa ESP/DP Programmi uide lt hosts extensive d entat ESPSZ Technica/ R e M The manual orovid ed ESP32 Hardware 5 The Zip files inolu boards. ESPSZ Hard/ware The guidelines 0 based on the E boards. ESPSZ A T mm This documen several com in Espressi/ Pro 2 Must are the ESP ESPSZ BB his is an owled P32 P32 biis le 2
11 Learning Resources
11 Learning Resources
11.1 MustRead Documents
The following link provides documents related to ESP32.
ESP32 Datasheet
This document provides an introduction to the specifications of the ESP32 hardware, including overview,
pin definitions, functional description, peripheral interface, electrical characteristics, etc.
ESP32 ECO V3 User Guide
This document describes differences between V3 and previous ESP32 silicon wafer revisions.
ECO and Workarounds for Bugs in ESP32
This document details hardware errata and workarounds in the ESP32.
ESP-IDF Programming Guide
It hosts extensive documentation for ESP-IDF ranging from hardware guides to API reference.
ESP32 Technical Reference Manual
The manual provides detailed information on how to use the ESP32 memory and peripherals.
ESP32 Hardware Resources
The zip files include the schematics, PCB layout, Gerber and BOM list of ESP32 modules and development
boards.
ESP32 Hardware Design Guidelines
The guidelines outline recommended design practices when developing standalone or add-on systems
based on the ESP32 series of products, including the ESP32 chip, the ESP32 modules and development
boards.
ESP32 AT Instruction Set and Examples
This document introduces the ESP32 AT commands, explains how to use them, and provides examples of
several common AT commands.
Espressif Products Ordering Information
11.2 MustHave Resources
Here are the ESP32-related must-have resources.
ESP32 BBS
This is an Engineer-to-Engineer (E2E) Community for ESP32 where you can post questions, share
knowledge, explore ideas, and help solve problems with fellow engineers.
ESP32 GitHub
ESP32 development projects are freely distributed under Espressif’s MIT license on GitHub. It is
established to help developers get started with ESP32 and foster innovation and the growth of general
knowledge about the hardware and software surrounding ESP32 devices.
ESP32 Tools
This is a webpage where users can download ESP32 Flash Download Tools and the zip file ”ESP32
Certification and Test”.
Espressif Systems 28
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ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet v2.1
11 Learning Resources
ESP-IDF
This webpage links users to the official IoT development framework for ESP32.
ESP32 Resources
This webpage provides the links to all available ESP32 documents, SDK and tools.
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ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet v2.1
Revision History
Revision History
Date Version Release notes
2021.02 V2.1
Updated Figure 6:Physical Dimensions of ESP32-WROOM-32D, Figure 7:Physical
Dimensions of ESP32-WROOM-32U, Figure 8:Recommended PCB Land Pattern of
ESP32-WROOM-32D, and Figure 9:Recommended PCB Land Pattern of ESP32-
WROOM-32U.
Modified the note below Figure 2:Reflow Profile.
Modified the note below Figure 5:ESP32-WROOM-32D & ESP32-WROOM-32U
Peripheral Schematics.
Updated the trade mark from TWAI™ to TWAI®.
2020.11 V2.0
Added TWAITM in Table 1;
Added a note under Figure 2: Reflow Profile;
Updated the C value in RC delay circuit from 0.1 µF to 1 µF;
Provided feedback link.
2019.09 V1.9
Changed the supply voltage range from 2.7 V ~3.6 V to 3.0 V ~3.6 V;
Added Moisture sensitivity level (MSL) 3 in Table 2ESP32-WROOM-32D and
ESP32-WROOM-32U Specifications;
Added notes about ”Operating frequency range” and ”TX power” under Table
8Wi-Fi Radio Characteristics;
Updated Section 7Peripheral Schematics and added a note about RC delay
circuit under it;
Updated Figure 8and Figure 9Recommended PCB Land Pattern.
2019.01 V1.8 Changed the RF power control range in Table 10 from –12 ~+12 to –12 ~+9 dBm.
2018.10 V1.7
Added notice on module custom options under Table 2;
Added ”Cumulative IO output current” entry to Table 5: Absolute Maximum Ratings;
Added more parameters to Table 7: DC Characteristics.
2018.09 V1.6 Updated the hole diameter in the shield from 1.00 mm to 0.50 mm, in Figure 6.
2018.08 V1.5
Added certifications and reliability test items the module has passed in Table 2:
ESP32-WROOM-32D and ESP32-WROOM-32U Specifications, and removed
software-specific information;
Updated section 3.4: RTC and Low-Power Management;
Changed the modules’ dimensions;
Updated Figure 8and 7: Physical Dimensions;
Updated Table 8: Wi-Fi Radio.
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ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet v2.1
Revision History
Date Version Release notes
2018.06 V1.4
• Deleted Temperature Sensor in Table 2: ESP32-WROOM-32D & ESP32-
WROOM-32U Specifications;
Updated Chapter 3: Functional Description;
Added notes to Chapter 7: Peripheral Schematics;
Added Chapter 8: Recommended PCB Land Pattern;
Changes to electrical characteristics:
Updated Table 5: Absolute Maximum Ratings;
Added Table 6: Recommended Operating Conditions;
Added Table 7: DC Characteristics;
Updated the values of ”Gain control step”, ”Adjacent channel transmit power”
in Table 10: Transmitter Characteristics - BLE.
2018.04 V1.3 Updated Figure 4ESP32-WROOM-32U Schematics and Figure 3ESP32-WROOM-
32D Schematics.
2018.02 V1.2 Update Figure 4ESP32-WROOM-32U Schematics.
2018.02 V1.1
Updated Chapter 6Schematics.
Deleted description of low-noise amplifier.
Replaced the module name ESP-WROOM-32D with ESP32-WROOM-32D.
Added information about module certification in Table 2.
Updated the description of eFuse bits in Section 3.1.
2017.11 V1.0 First release.
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ESP32-WROOM-32D & ESP32-WROOM-32U Datasheet v2.1
www.espressif.com
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